JP2011527123A - 低粘性流体を用いた粒子除去のための単一基板処理ヘッド - Google Patents

低粘性流体を用いた粒子除去のための単一基板処理ヘッド Download PDF

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Publication number
JP2011527123A
JP2011527123A JP2011516821A JP2011516821A JP2011527123A JP 2011527123 A JP2011527123 A JP 2011527123A JP 2011516821 A JP2011516821 A JP 2011516821A JP 2011516821 A JP2011516821 A JP 2011516821A JP 2011527123 A JP2011527123 A JP 2011527123A
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JP
Japan
Prior art keywords
fluid
substrate
supply
reservoir
main bore
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011516821A
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English (en)
Japanese (ja)
Other versions
JP2011527123A5 (https=
Inventor
ホロデンコ・アーノルド
リン・チェン−ユー
ギンズバーグ・レオン
マンデルボイム・マーク
トマシュ・グレゴリー・エー．
フセイン・アンワル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2011527123A publication Critical patent/JP2011527123A/ja
Publication of JP2011527123A5 publication Critical patent/JP2011527123A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85938—Non-valved flow dividers

Landscapes

  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2011516821A 2008-06-30 2009-06-30 低粘性流体を用いた粒子除去のための単一基板処理ヘッド Pending JP2011527123A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,577 US8584613B2 (en) 2008-06-30 2008-06-30 Single substrate processing head for particle removal using low viscosity fluid
US12/165,577 2008-06-30
PCT/US2009/049280 WO2010002905A1 (en) 2008-06-30 2009-06-30 Single substrate processing head for particle removal using low viscosity fluid

Publications (2)

Publication Number Publication Date
JP2011527123A true JP2011527123A (ja) 2011-10-20
JP2011527123A5 JP2011527123A5 (https=) 2012-08-16

Family

ID=41445969

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011516821A Pending JP2011527123A (ja) 2008-06-30 2009-06-30 低粘性流体を用いた粒子除去のための単一基板処理ヘッド

Country Status (7)

Country Link
US (2) US8584613B2 (https=)
JP (1) JP2011527123A (https=)
KR (2) KR101632974B1 (https=)
CN (1) CN102105967B (https=)
SG (1) SG192443A1 (https=)
TW (1) TWI423366B (https=)
WO (1) WO2010002905A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
MX380822B (es) * 2014-09-11 2025-03-12 Huntsman Int Llc Método para diseñar y fabricar una barra distribuidora para aplicar una mezcla viscosa líquida espumable en un laminador.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109929A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd ウエット処理用ノズルおよびウエット処理装置
JP2005347326A (ja) * 2004-05-31 2005-12-15 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2006501691A (ja) * 2002-09-30 2006-01-12 ラム　リサーチ　コーポレーション 動的液体メニスカスを使用して基板を処理する方法及びシステム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276011A (en) * 1979-02-21 1981-06-30 American Cyanamid Company Spinnerette assembly
US5618566A (en) * 1995-04-26 1997-04-08 Exxon Chemical Patents, Inc. Modular meltblowing die
SG45121A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Apparatus for dispensing fluid in an array pattern
US6220843B1 (en) * 1998-03-13 2001-04-24 Nordson Corporation Segmented die for applying hot melt adhesives or other polymer melts
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
WO2006137800A2 (en) 2005-06-23 2006-12-28 Akzo Nobel Coatings International B.V. Dispenser
JP2007158161A (ja) 2005-12-07 2007-06-21 Elpida Memory Inc ウエハ洗浄装置及びウエハ洗浄方法
US20080038448A1 (en) 2006-08-11 2008-02-14 Lam Research Corp. Chemical resistant semiconductor processing chamber bodies

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109929A (ja) * 2001-09-28 2003-04-11 Alps Electric Co Ltd ウエット処理用ノズルおよびウエット処理装置
JP2006501691A (ja) * 2002-09-30 2006-01-12 ラム　リサーチ　コーポレーション 動的液体メニスカスを使用して基板を処理する方法及びシステム
JP2005347326A (ja) * 2004-05-31 2005-12-15 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
CN102105967B (zh) 2014-10-08
WO2010002905A1 (en) 2010-01-07
TWI423366B (zh) 2014-01-11
KR20110028530A (ko) 2011-03-18
TW201009981A (en) 2010-03-01
SG192443A1 (en) 2013-08-30
US20140041581A1 (en) 2014-02-13
CN102105967A (zh) 2011-06-22
KR101632974B1 (ko) 2016-06-23
US8584613B2 (en) 2013-11-19
US20090320942A1 (en) 2009-12-31
KR20110044327A (ko) 2011-04-28

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