SG192443A1 - Single substrate processing head for particle removal using low viscosity fluid - Google Patents
Single substrate processing head for particle removal using low viscosity fluid Download PDFInfo
- Publication number
- SG192443A1 SG192443A1 SG2013049945A SG2013049945A SG192443A1 SG 192443 A1 SG192443 A1 SG 192443A1 SG 2013049945 A SG2013049945 A SG 2013049945A SG 2013049945 A SG2013049945 A SG 2013049945A SG 192443 A1 SG192443 A1 SG 192443A1
- Authority
- SG
- Singapore
- Prior art keywords
- feeds
- plate
- substrate
- bore
- applicator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3306—Horizontal transfer of a single workpiece
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85938—Non-valved flow dividers
Landscapes
- Coating Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/165,577 US8584613B2 (en) | 2008-06-30 | 2008-06-30 | Single substrate processing head for particle removal using low viscosity fluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG192443A1 true SG192443A1 (en) | 2013-08-30 |
Family
ID=41445969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2013049945A SG192443A1 (en) | 2008-06-30 | 2009-06-30 | Single substrate processing head for particle removal using low viscosity fluid |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8584613B2 (https=) |
| JP (1) | JP2011527123A (https=) |
| KR (2) | KR101632974B1 (https=) |
| CN (1) | CN102105967B (https=) |
| SG (1) | SG192443A1 (https=) |
| TW (1) | TWI423366B (https=) |
| WO (1) | WO2010002905A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7849554B2 (en) * | 2009-04-28 | 2010-12-14 | Lam Research Corporation | Apparatus and system for cleaning substrate |
| MX380822B (es) * | 2014-09-11 | 2025-03-12 | Huntsman Int Llc | Método para diseñar y fabricar una barra distribuidora para aplicar una mezcla viscosa líquida espumable en un laminador. |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4276011A (en) * | 1979-02-21 | 1981-06-30 | American Cyanamid Company | Spinnerette assembly |
| US5618566A (en) * | 1995-04-26 | 1997-04-08 | Exxon Chemical Patents, Inc. | Modular meltblowing die |
| SG45121A1 (en) * | 1995-10-28 | 1998-01-16 | Inst Of Microelectronics | Apparatus for dispensing fluid in an array pattern |
| US6220843B1 (en) * | 1998-03-13 | 2001-04-24 | Nordson Corporation | Segmented die for applying hot melt adhesives or other polymer melts |
| US6689215B2 (en) | 1998-09-17 | 2004-02-10 | Asml Holdings, N.V. | Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface |
| US7000622B2 (en) * | 2002-09-30 | 2006-02-21 | Lam Research Corporation | Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus |
| JP3955197B2 (ja) * | 2001-09-28 | 2007-08-08 | アルプス電気株式会社 | ウエット処理用ノズルおよびウエット処理装置 |
| US7093375B2 (en) | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
| US20050260789A1 (en) * | 2004-05-21 | 2005-11-24 | Texas Instruments Incorporated | Method and system for applying an adhesive substance on an electronic device |
| JP4343031B2 (ja) * | 2004-05-31 | 2009-10-14 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| WO2006137800A2 (en) | 2005-06-23 | 2006-12-28 | Akzo Nobel Coatings International B.V. | Dispenser |
| JP2007158161A (ja) | 2005-12-07 | 2007-06-21 | Elpida Memory Inc | ウエハ洗浄装置及びウエハ洗浄方法 |
| US20080038448A1 (en) | 2006-08-11 | 2008-02-14 | Lam Research Corp. | Chemical resistant semiconductor processing chamber bodies |
-
2008
- 2008-06-30 US US12/165,577 patent/US8584613B2/en not_active Expired - Fee Related
-
2009
- 2009-06-30 KR KR1020117006691A patent/KR101632974B1/ko not_active Expired - Fee Related
- 2009-06-30 CN CN200980125832.3A patent/CN102105967B/zh not_active Expired - Fee Related
- 2009-06-30 TW TW98122048A patent/TWI423366B/zh not_active IP Right Cessation
- 2009-06-30 SG SG2013049945A patent/SG192443A1/en unknown
- 2009-06-30 KR KR1020117002399A patent/KR20110028530A/ko not_active Withdrawn
- 2009-06-30 WO PCT/US2009/049280 patent/WO2010002905A1/en not_active Ceased
- 2009-06-30 JP JP2011516821A patent/JP2011527123A/ja active Pending
-
2013
- 2013-10-11 US US14/052,194 patent/US20140041581A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011527123A (ja) | 2011-10-20 |
| CN102105967B (zh) | 2014-10-08 |
| WO2010002905A1 (en) | 2010-01-07 |
| TWI423366B (zh) | 2014-01-11 |
| KR20110028530A (ko) | 2011-03-18 |
| TW201009981A (en) | 2010-03-01 |
| US20140041581A1 (en) | 2014-02-13 |
| CN102105967A (zh) | 2011-06-22 |
| KR101632974B1 (ko) | 2016-06-23 |
| US8584613B2 (en) | 2013-11-19 |
| US20090320942A1 (en) | 2009-12-31 |
| KR20110044327A (ko) | 2011-04-28 |
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