CN102105967B - 使用低黏度流体去除颗粒的单基板加工头 - Google Patents

使用低黏度流体去除颗粒的单基板加工头 Download PDF

Info

Publication number
CN102105967B
CN102105967B CN200980125832.3A CN200980125832A CN102105967B CN 102105967 B CN102105967 B CN 102105967B CN 200980125832 A CN200980125832 A CN 200980125832A CN 102105967 B CN102105967 B CN 102105967B
Authority
CN
China
Prior art keywords
fluid
panel
substrate
main bore
applicator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980125832.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102105967A (zh
Inventor
阿诺德·霍洛坚科
林成宇
利昂·金兹伯格
马克·曼德尔保埃姆
格雷戈里·A·托马斯奇
安瓦尔·侯塞因
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN102105967A publication Critical patent/CN102105967A/zh
Application granted granted Critical
Publication of CN102105967B publication Critical patent/CN102105967B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85938—Non-valved flow dividers

Landscapes

  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
CN200980125832.3A 2008-06-30 2009-06-30 使用低黏度流体去除颗粒的单基板加工头 Expired - Fee Related CN102105967B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/165,577 US8584613B2 (en) 2008-06-30 2008-06-30 Single substrate processing head for particle removal using low viscosity fluid
US12/165,577 2008-06-30
PCT/US2009/049280 WO2010002905A1 (en) 2008-06-30 2009-06-30 Single substrate processing head for particle removal using low viscosity fluid

Publications (2)

Publication Number Publication Date
CN102105967A CN102105967A (zh) 2011-06-22
CN102105967B true CN102105967B (zh) 2014-10-08

Family

ID=41445969

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980125832.3A Expired - Fee Related CN102105967B (zh) 2008-06-30 2009-06-30 使用低黏度流体去除颗粒的单基板加工头

Country Status (7)

Country Link
US (2) US8584613B2 (https=)
JP (1) JP2011527123A (https=)
KR (2) KR101632974B1 (https=)
CN (1) CN102105967B (https=)
SG (1) SG192443A1 (https=)
TW (1) TWI423366B (https=)
WO (1) WO2010002905A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
MX380822B (es) * 2014-09-11 2025-03-12 Huntsman Int Llc Método para diseñar y fabricar una barra distribuidora para aplicar una mezcla viscosa líquida espumable en un laminador.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276011A (en) * 1979-02-21 1981-06-30 American Cyanamid Company Spinnerette assembly
US5618566A (en) * 1995-04-26 1997-04-08 Exxon Chemical Patents, Inc. Modular meltblowing die
US6220843B1 (en) * 1998-03-13 2001-04-24 Nordson Corporation Segmented die for applying hot melt adhesives or other polymer melts
WO2006137800A2 (en) * 2005-06-23 2006-12-28 Akzo Nobel Coatings International B.V. Dispenser

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG45121A1 (en) * 1995-10-28 1998-01-16 Inst Of Microelectronics Apparatus for dispensing fluid in an array pattern
US6689215B2 (en) 1998-09-17 2004-02-10 Asml Holdings, N.V. Method and apparatus for mitigating cross-contamination between liquid dispensing jets in close proximity to a surface
US7000622B2 (en) * 2002-09-30 2006-02-21 Lam Research Corporation Methods and systems for processing a bevel edge of a substrate using a dynamic liquid meniscus
JP3955197B2 (ja) * 2001-09-28 2007-08-08 アルプス電気株式会社 ウエット処理用ノズルおよびウエット処理装置
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP2007158161A (ja) 2005-12-07 2007-06-21 Elpida Memory Inc ウエハ洗浄装置及びウエハ洗浄方法
US20080038448A1 (en) 2006-08-11 2008-02-14 Lam Research Corp. Chemical resistant semiconductor processing chamber bodies

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276011A (en) * 1979-02-21 1981-06-30 American Cyanamid Company Spinnerette assembly
US5618566A (en) * 1995-04-26 1997-04-08 Exxon Chemical Patents, Inc. Modular meltblowing die
US6220843B1 (en) * 1998-03-13 2001-04-24 Nordson Corporation Segmented die for applying hot melt adhesives or other polymer melts
WO2006137800A2 (en) * 2005-06-23 2006-12-28 Akzo Nobel Coatings International B.V. Dispenser

Also Published As

Publication number Publication date
JP2011527123A (ja) 2011-10-20
WO2010002905A1 (en) 2010-01-07
TWI423366B (zh) 2014-01-11
KR20110028530A (ko) 2011-03-18
TW201009981A (en) 2010-03-01
SG192443A1 (en) 2013-08-30
US20140041581A1 (en) 2014-02-13
CN102105967A (zh) 2011-06-22
KR101632974B1 (ko) 2016-06-23
US8584613B2 (en) 2013-11-19
US20090320942A1 (en) 2009-12-31
KR20110044327A (ko) 2011-04-28

Similar Documents

Publication Publication Date Title
CN101009204B (zh) 用于清洁衬底的装置和系统
CN100422389C (zh) 基片的电镀装置和电镀方法以及电解处理方法及其装置
KR102399846B1 (ko) 유체를 스프레이 바디들 아래로, 그리고 유입 포트들을 향해 지향시키도록 배향된 유체 배출구들을 이용하는 연마 패드 세정 시스템, 및 관련 방법
CN101495242A (zh) 用于衬底表面处理的装置，设备和方法
TWI648807B (zh) 用以利用具有多孔性材料的支持滾子處理基板之裝置和方法
US10699918B2 (en) Chemical supply unit and apparatus for treating a substrate
WO2003049868A1 (en) Nozzle device, and substrate treating apparatus having the device
CN107251191A (zh) 基板处理装置及基板处理装置的控制方法
CN102105967B (zh) 使用低黏度流体去除颗粒的单基板加工头
AU2006237053B2 (en) Device and method for application of an even thin fluid layer to substrates
KR20070072385A (ko) 기판의 세척 장치 및 방법
WO2019082483A1 (ja) 超音波洗浄装置及び超音波洗浄システム
CN101568995A (zh) 具有可配置输送的接近头
TWI801528B (zh) 塗布器及塗布器之空氣排出方法
JPH08173875A (ja) 塗布装置および塗布方法
CN100476582C (zh) 用于将液体涂覆在基片上的喷嘴装置
JPWO2003103845A1 (ja) ノズル装置及びこれを備えた基板処理装置
JPH10270336A (ja) 液体吐出装置
US8997684B2 (en) Prevention of particle adders when contacting a liquid meniscus over a substrate
TWI450769B (zh) 液體塗布方法及裝置
KR101307006B1 (ko) 기판처리장치
JP2015116542A (ja) 脱泡装置、脱泡方法および塗布装置
CN114798264B (zh) 一种匀胶喷嘴保湿装置及匀胶设备
CN102161034A (zh) 涂装用树脂液的涂敷方法以及涂敷装置
JP6960111B2 (ja) 塗工装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141008