JP2011525432A - 高気孔率超砥粒樹脂製品および製造方法 - Google Patents
高気孔率超砥粒樹脂製品および製造方法 Download PDFInfo
- Publication number
- JP2011525432A JP2011525432A JP2011514584A JP2011514584A JP2011525432A JP 2011525432 A JP2011525432 A JP 2011525432A JP 2011514584 A JP2011514584 A JP 2011514584A JP 2011514584 A JP2011514584 A JP 2011514584A JP 2011525432 A JP2011525432 A JP 2011525432A
- Authority
- JP
- Japan
- Prior art keywords
- superabrasive
- superabrasive product
- component
- product
- grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims description 13
- 239000011347 resin Substances 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title description 7
- 239000002245 particle Substances 0.000 claims abstract description 41
- 239000004604 Blowing Agent Substances 0.000 claims abstract description 33
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 27
- 229920000642 polymer Polymers 0.000 claims abstract description 26
- 239000002243 precursor Substances 0.000 claims abstract description 24
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims abstract description 3
- 229920002239 polyacrylonitrile Polymers 0.000 claims description 23
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims description 20
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 20
- 229920001187 thermosetting polymer Polymers 0.000 claims description 17
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 10
- 239000004634 thermosetting polymer Substances 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 229920000131 polyvinylidene Polymers 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 239000004088 foaming agent Substances 0.000 claims description 2
- -1 polyethylene Polymers 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 238000000227 grinding Methods 0.000 description 26
- 235000012431 wafers Nutrition 0.000 description 16
- 235000013339 cereals Nutrition 0.000 description 10
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 10
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 10
- 239000011148 porous material Substances 0.000 description 9
- 239000004416 thermosoftening plastic Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 5
- 239000001282 iso-butane Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910000267 dualite Inorganic materials 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- PPWPWBNSKBDSPK-UHFFFAOYSA-N [B].[C] Chemical compound [B].[C] PPWPWBNSKBDSPK-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011868 grain product Nutrition 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 229920005553 polystyrene-acrylate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
この出願は、参照により本明細書に組み込まれる、2008年6月23日に出願された米国仮特許出願第61/132,867号に対する優先権を主張する。
本発明を、特に、その好ましい実施形態に関して示し説明してきたが、形態および詳細における様々な変化が、添付の特許請求の範囲で包含される本発明の範囲から逸脱することなくそこでなされ得ることが当業者によって理解される。
Claims (23)
- a)超砥粒粒子成分;および
b)熱可塑性ポリマー成分を含む多孔質連続相
を含む超砥粒製品であって、前記超砥粒成分が前記多孔質連続相中に分布している、超砥粒製品。 - 前記多孔質連続相が、熱硬化性ポリマー成分をさらに含む、請求項1に記載の超砥粒製品。
- 前記多孔質連続相が、実質的に開放多孔質連続相である、請求項2に記載の超砥粒製品。
- 前記超砥粒が、ダイヤモンド、立方晶窒化ホウ素、ジルコニアおよび酸化アルミニウムからなる群から選択される少なくとも1種のメンバーを含む、請求項3に記載の超砥粒製品。
- 前記熱硬化性ポリマー成分が、フェノール−ホルムアルデヒド、ポリアミド、ポリイミドおよびエポキシ変性フェノール−ホルムアルデヒドからなる群から選択される少なくとも1種のメンバーを含む、請求項4に記載の超砥粒製品。
- 前記熱硬化性樹脂成分が、フェノール−ホルムアルデヒドを含む、請求項5に記載の超砥粒製品。
- 前記超砥粒がダイヤモンドを含む、請求項4に記載の超砥粒製品。
- 前記熱可塑性ポリマー成分が、ポリアクリロニトリル、ポリビニリデン、ポリスチレン、ナイロン、ポリエチレン、ポリプロピレンおよびポリメチルメタクリレートからなる群から選択される少なくとも1種のメンバーを含む、請求項1に記載の超砥粒製品。
- 前記熱可塑性ポリマー成分がポリアクリロニトリルを含む、請求項8に記載の超砥粒製品。
- 前記熱可塑性ポリマーがポリビニリデンを含む、請求項8に記載の超砥粒製品。
- 前記ポリビニリデンがポリ塩化ビニリデンを含む、請求項10に記載の超砥粒製品。
- 前記熱可塑性ポリマーが、ポリアクリロニトリルおよびポリ塩化ビニリデンを含む、請求項8に記載の超砥粒製品。
- 前記熱硬化性樹脂成分がフェノール−ホルムアルデヒドを含む、請求項12に記載の超砥粒製品。
- 前記連続相における熱可塑性ポリマー成分対熱硬化性樹脂成分の比が、容積で約80:15から約80:10の範囲である、請求項13に記載の超砥粒製品。
- 前記連続相対超砥粒成分の比が、容積で約2:1から約1:2の範囲である、請求項14に記載の超砥粒製品。
- 前記超砥粒が、約0.25μmから約30μmの範囲の数平均粒径を有する、請求項15に記載の超砥粒製品。
- 前記超砥粒が、約0.5μmから約1.0μmの範囲の数平均粒径を有する、請求項16に記載の超砥粒製品。
- 前記超砥粒が、約3μmから約6μmの範囲の数平均粒径を有する、請求項16に記載の超砥粒製品。
- 前記超砥粒が、約20μmから約25μmの範囲の数平均粒径を有する、請求項16に記載の超砥粒製品。
- 前記超砥粒製品が、容積で約30%から約80%の範囲の気孔率を有する、請求項16に記載の超砥粒製品。
- ポリアクリロニトリル対ポリ塩化ビニリデンの比が、重量で約1:1から約98:2の範囲である、請求項12に記載の超砥粒製品。
- a)超砥粒粒子成分;
b)結合剤成分;および
c)被包ガスのポリマー発泡剤
を含む、超砥粒製品前駆体。 - 超砥粒製品を形成する方法であって、
a)超砥粒、結合剤成分、および被包ガスのポリマー発泡剤を混合するステップ;および
b)混合した超砥粒、結合成分およびポリマー発泡剤を発泡剤内の被包から少なくとも一部のガスを放出させる温度まで一定時間加熱するステップ
を含む方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13286708P | 2008-06-23 | 2008-06-23 | |
US61/132,867 | 2008-06-23 | ||
US12/387,792 | 2009-05-07 | ||
PCT/US2009/002839 WO2009157969A2 (en) | 2008-06-23 | 2009-05-07 | High porosity superabrasive resin products and method of manufacture |
US12/387,792 US8216325B2 (en) | 2008-06-23 | 2009-05-07 | High porosity superabrasive resin products and method of manufacture |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013078089A Division JP2013173223A (ja) | 2008-06-23 | 2013-04-03 | 高気孔率超砥粒樹脂製品および製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011525432A true JP2011525432A (ja) | 2011-09-22 |
Family
ID=41445137
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514584A Pending JP2011525432A (ja) | 2008-06-23 | 2009-05-07 | 高気孔率超砥粒樹脂製品および製造方法 |
JP2013078089A Pending JP2013173223A (ja) | 2008-06-23 | 2013-04-03 | 高気孔率超砥粒樹脂製品および製造方法 |
JP2014247815A Pending JP2015091618A (ja) | 2008-06-23 | 2014-12-08 | 高気孔率超砥粒樹脂製品および製造方法 |
JP2016140779A Pending JP2016196084A (ja) | 2008-06-23 | 2016-07-15 | 高気孔率超砥粒樹脂製品および製造方法 |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013078089A Pending JP2013173223A (ja) | 2008-06-23 | 2013-04-03 | 高気孔率超砥粒樹脂製品および製造方法 |
JP2014247815A Pending JP2015091618A (ja) | 2008-06-23 | 2014-12-08 | 高気孔率超砥粒樹脂製品および製造方法 |
JP2016140779A Pending JP2016196084A (ja) | 2008-06-23 | 2016-07-15 | 高気孔率超砥粒樹脂製品および製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8216325B2 (ja) |
JP (4) | JP2011525432A (ja) |
KR (2) | KR101333018B1 (ja) |
CN (2) | CN105500139B (ja) |
MY (1) | MY157722A (ja) |
WO (1) | WO2009157969A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020131352A (ja) * | 2019-02-19 | 2020-08-31 | 信濃電気製錬株式会社 | 砥石及び砥石の製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110019427A (ko) | 2008-06-23 | 2011-02-25 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 고공극율 유리질 초연마 제품들 및 그 제조 방법 |
WO2011056671A2 (en) * | 2009-10-27 | 2011-05-12 | Saint-Gobain Abrasives, Inc. | Resin bonded abrasive |
KR20150038627A (ko) | 2009-10-27 | 2015-04-08 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 유리질본드 연마재 |
ITVI20110123A1 (it) * | 2011-05-17 | 2011-08-16 | Premier S R L | Utensile diamantato per la rettifica e/o la squadratura dei bordi di piastrelle |
US9266220B2 (en) | 2011-12-30 | 2016-02-23 | Saint-Gobain Abrasives, Inc. | Abrasive articles and method of forming same |
CN103551970A (zh) * | 2013-11-08 | 2014-02-05 | 谢泽 | 含天然纤维和磨料以及发泡剂的抛磨一体轮 |
CN105252431A (zh) * | 2015-10-09 | 2016-01-20 | 芜湖市鸿坤汽车零部件有限公司 | 一种聚苯乙烯粘结树脂砂轮及其制备方法 |
IT201700060693A1 (it) * | 2017-06-01 | 2018-12-01 | Ditech S R L | Composizione abrasiva per la lucidatura di manufatti ceramici e/o pietre naturali e relativo procedimento di fabbricazione |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11156725A (ja) * | 1997-11-28 | 1999-06-15 | Noritake Co Ltd | レジノイド研削砥石 |
JP2000190232A (ja) * | 1998-10-13 | 2000-07-11 | Hitachi Chem Co Ltd | 半導体ウエハ研磨用樹脂砥石、その製造方法、半導体ウエハの研磨方法、半導体素子および半導体装置 |
JP2005522338A (ja) * | 2002-04-11 | 2005-07-28 | サンーゴバン アブレイシブズ,インコーポレイティド | 新規構造を有する研磨用品及び研削方法 |
JP2006334778A (ja) * | 2006-08-17 | 2006-12-14 | Mitsubishi Materials Corp | 砥石 |
JP2007181918A (ja) * | 1993-04-15 | 2007-07-19 | 3M Co | エネルギー硬化ホットメルトメイクコートを組み込んだ被覆研磨用品 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2593829B2 (ja) * | 1990-08-17 | 1997-03-26 | 鐘紡株式会社 | 合成砥石 |
JP2694705B2 (ja) * | 1991-02-08 | 1997-12-24 | 鐘紡株式会社 | 高純材アルミ基盤研磨用合成砥石 |
JPH06278038A (ja) * | 1993-03-31 | 1994-10-04 | Tokyo Jiki Insatsu Kk | 多孔性研磨フィルム |
JP2003011066A (ja) * | 2000-07-25 | 2003-01-15 | Ebara Corp | 研磨工具及びその製造方法 |
US6593391B2 (en) * | 2001-03-27 | 2003-07-15 | General Electric Company | Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation |
EP1310316B1 (de) * | 2001-11-13 | 2008-10-22 | sia Abrasives Industries AG | Sägegarn |
US20040137834A1 (en) * | 2003-01-15 | 2004-07-15 | General Electric Company | Multi-resinous molded articles having integrally bonded graded interfaces |
US20060135045A1 (en) * | 2004-12-17 | 2006-06-22 | Jinru Bian | Polishing compositions for reducing erosion in semiconductor wafers |
US7258705B2 (en) * | 2005-08-05 | 2007-08-21 | 3M Innovative Properties Company | Abrasive article and methods of making same |
JP2009507660A (ja) * | 2005-09-09 | 2009-02-26 | イノプラ インコーポレーテッド | 対象物洗浄装置を利用して対象物を研磨するための装置及び方法 |
-
2009
- 2009-05-07 CN CN201610051417.XA patent/CN105500139B/zh active Active
- 2009-05-07 WO PCT/US2009/002839 patent/WO2009157969A2/en active Application Filing
- 2009-05-07 KR KR1020117000989A patent/KR101333018B1/ko active IP Right Grant
- 2009-05-07 JP JP2011514584A patent/JP2011525432A/ja active Pending
- 2009-05-07 KR KR1020137001831A patent/KR101546694B1/ko active IP Right Grant
- 2009-05-07 US US12/387,792 patent/US8216325B2/en active Active
- 2009-05-07 MY MYPI2010006127A patent/MY157722A/en unknown
- 2009-05-07 CN CN200980131091XA patent/CN102119202A/zh active Pending
-
2013
- 2013-04-03 JP JP2013078089A patent/JP2013173223A/ja active Pending
-
2014
- 2014-12-08 JP JP2014247815A patent/JP2015091618A/ja active Pending
-
2016
- 2016-07-15 JP JP2016140779A patent/JP2016196084A/ja active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007181918A (ja) * | 1993-04-15 | 2007-07-19 | 3M Co | エネルギー硬化ホットメルトメイクコートを組み込んだ被覆研磨用品 |
JPH11156725A (ja) * | 1997-11-28 | 1999-06-15 | Noritake Co Ltd | レジノイド研削砥石 |
JP2000190232A (ja) * | 1998-10-13 | 2000-07-11 | Hitachi Chem Co Ltd | 半導体ウエハ研磨用樹脂砥石、その製造方法、半導体ウエハの研磨方法、半導体素子および半導体装置 |
JP2005522338A (ja) * | 2002-04-11 | 2005-07-28 | サンーゴバン アブレイシブズ,インコーポレイティド | 新規構造を有する研磨用品及び研削方法 |
JP2006334778A (ja) * | 2006-08-17 | 2006-12-14 | Mitsubishi Materials Corp | 砥石 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020131352A (ja) * | 2019-02-19 | 2020-08-31 | 信濃電気製錬株式会社 | 砥石及び砥石の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
MY157722A (en) | 2016-07-15 |
CN102119202A (zh) | 2011-07-06 |
CN105500139B (zh) | 2018-11-06 |
US20100018126A1 (en) | 2010-01-28 |
KR101333018B1 (ko) | 2013-11-27 |
WO2009157969A3 (en) | 2010-03-25 |
KR101546694B1 (ko) | 2015-08-25 |
KR20110030587A (ko) | 2011-03-23 |
JP2016196084A (ja) | 2016-11-24 |
CN105500139A (zh) | 2016-04-20 |
JP2015091618A (ja) | 2015-05-14 |
WO2009157969A2 (en) | 2009-12-30 |
US8216325B2 (en) | 2012-07-10 |
JP2013173223A (ja) | 2013-09-05 |
KR20130018378A (ko) | 2013-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2016196084A (ja) | 高気孔率超砥粒樹脂製品および製造方法 | |
JP5681201B2 (ja) | 樹脂ボンド砥粒 | |
TW461845B (en) | Abrasive tools for grinding electronic components | |
TWI428204B (zh) | 改良的化學機械研磨墊及其製造及使用方法 | |
TW200906555A (en) | Improved chemical mechanical polishing pad and methods of making and using same | |
KR20060046118A (ko) | 비트리파이드 본드 숫돌 및 그 제조방법 | |
JPH11156725A (ja) | レジノイド研削砥石 | |
KR20230005760A (ko) | Cmp 폴리싱 패드 | |
JP2008137126A (ja) | レジノイド砥石 | |
JP2006297528A (ja) | 塊状砥粒を有するレジノイド砥石の製造方法 | |
JP2001138246A (ja) | 多気孔型エポキシ砥石およびその製造方法 | |
IES85564Y1 (en) | An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20120730 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121204 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20121214 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20121214 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20121228 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130304 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130311 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130604 |