JP2011525158A - 疎水性パターンを有する射出品の射出成形方法及び装置 - Google Patents
疎水性パターンを有する射出品の射出成形方法及び装置 Download PDFInfo
- Publication number
- JP2011525158A JP2011525158A JP2011516162A JP2011516162A JP2011525158A JP 2011525158 A JP2011525158 A JP 2011525158A JP 2011516162 A JP2011516162 A JP 2011516162A JP 2011516162 A JP2011516162 A JP 2011516162A JP 2011525158 A JP2011525158 A JP 2011525158A
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- JP
- Japan
- Prior art keywords
- mold
- injection molding
- cooling
- hydrophobic pattern
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2632—Stampers; Mountings thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/57—Exerting after-pressure on the moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/72—Heating or cooling
- B29C45/73—Heating or cooling of the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
- B29C45/2642—Heating or cooling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0093—Other properties hydrophobic
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
【解決手段】この方法は、疎水性パターンを有するスタンパーが装着されている金型を加熱する段階と、該金型を移動させて金型の内部を密閉する段階と、前記金型の内部に所定の樹脂材料を注入する段階と、該金型を冷却した後、前記金型を分離する段階と、を含む構成とした。
【選択図】図7
Description
Claims (15)
- 複数個の金型のうち、疎水性パターンを有するスタンパーが装着されている金型を加熱する段階と、
前記スタンパーの装着されている金型と他の金型とを密着させてこれら金型の間を密閉させる段階と、
これら金型の間に所定の樹脂材料を注入する段階と、
これら金型を冷却した後、これら金型を分離する段階と、
を含む、疎水性パターンを有する射出品の射出成形方法。 - 前記疎水性パターンは、表面接触角が150゜以上180゜未満の超疎水性パターンとすることを特徴とする、請求項1に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記金型を加熱する段階は、前記金型の内部に設けられたヒーターの発熱によって前記金型の表面温度を所定の設定温度とすることを特徴とする、請求項1に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記設定温度は、120℃と注入される樹脂の溶融温度の範囲であることを特徴とする、請求項3に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記設定温度は、120℃以上180℃以下の範囲であることを特徴とする、請求項4に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記金型の密閉段階は、前記金型の表面温度が前記所定の設定温度に到達した後に行われることを特徴とする、請求項3に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記金型の冷却段階は、樹脂材料が注入された直後から行われることを特徴とする、請求項1に記載の疎水性パターンを有する射出品の射出成形方法。
- 前記金型の冷却段階で、前記金型の冷却は、前記金型と接触可能に設けられる冷却金型と前記金型との接触によって行われることを特徴とする、請求項7に記載の疎水性パターンを有する射出品の射出成形方法。
- キャビティが形成される金型と、
前記キャビティの内部に配置され、疎水性パターンを有するスタンパーと、
前記金型の温度を調節する温度調節装置と、
を含むことを特徴とする、射出成形装置。 - 前記スタンパーの疎水性パターンは、150゜以上180゜以下の液体の表面接触角を有するように形成されることを特徴とする、請求項9に記載の射出成形装置。
- 前記温度調節装置は、
前記金型の内部に配置されるヒーターと、
前記金型と接触可能に配置されて、前記金型を冷却させる冷却金型と、
前記冷却金型を駆動させる冷却金型駆動部と、
を含むことを特徴とする、請求項9に記載の射出成形装置。 - 前記ヒーターは、金型の表面温度が金型に注入される樹脂の溶融温度に到達するまで前記金型を加熱させることを特徴とする、請求項11に記載の射出成形装置。
- 前記金型は、前記キャビティを備える第1金型部と、前記第1金型部と選択的に接触するように設けられる第2金型部と、を含み、
前記冷却金型は、前記第2金型部に収容されるように設けられ、前記第2金型部の内部で移動可能に設けられることを特徴とする、請求項11に記載の射出成形装置。 - 磁力によって前記冷却金型と前記第2金型部とが接離するように、前記第2金型部に設置される第1磁石部及び前記冷却金型に設置される第2磁石部と、
前記冷却金型の移動をガイドするように前記第2金型部の内部に設けられるガイド部材と、
をさらに含むことを特徴とする、請求項13に記載の射出成形装置。 - 前記第1磁石部及び第2磁石部のうちいずれか一方は電磁石で構成され、いずれか他方は永久磁石で構成されることを特徴とする、請求項14に記載の射出成形装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0072817 | 2008-07-25 | ||
KR1020080072817A KR20100011552A (ko) | 2008-07-25 | 2008-07-25 | 소수성 패턴을 구비하는 사출품의 사출성형방법 및사출장치 |
PCT/KR2009/003991 WO2010011061A1 (en) | 2008-07-25 | 2009-07-20 | Device and method for injection molding product having hydrophobic pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011525158A true JP2011525158A (ja) | 2011-09-15 |
JP5059973B2 JP5059973B2 (ja) | 2012-10-31 |
Family
ID=41570462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011516162A Expired - Fee Related JP5059973B2 (ja) | 2008-07-25 | 2009-07-20 | 疎水性パターンを有する射出品の射出成形方法及び装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8142706B2 (ja) |
EP (1) | EP2303541B1 (ja) |
JP (1) | JP5059973B2 (ja) |
KR (1) | KR20100011552A (ja) |
CN (1) | CN102149529B (ja) |
WO (1) | WO2010011061A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015016597A (ja) * | 2013-07-10 | 2015-01-29 | 東洋製罐グループホールディングス株式会社 | 成形体、成形体の製造方法及びスタンパ |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102138009B1 (ko) * | 2013-12-23 | 2020-07-28 | 코웨이 주식회사 | 물저장탱크 제작방법 |
CN110682499B (zh) * | 2019-11-07 | 2020-06-26 | 四川大学 | 一种聚乙烯疏水材料及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007001181A (ja) * | 2005-06-24 | 2007-01-11 | Sony Corp | 成形装置および成形方法 |
JP2007022064A (ja) * | 2005-07-14 | 2007-02-01 | Hoko Koka Daigakko | 疏水性表面を有する高分子基材製造用鋳型の製造方法 |
WO2009028745A1 (en) * | 2007-08-28 | 2009-03-05 | Lg Electronics Inc. | Injection moldings, injection-molding apparatus and method thereof |
Family Cites Families (11)
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DE10110589A1 (de) * | 2001-03-06 | 2002-09-12 | Creavis Tech & Innovation Gmbh | Geometrische Formgebung von Oberflächen mit Lotus-Effekt |
DE10144259A1 (de) * | 2001-09-08 | 2003-03-27 | Bernd Spaeth | Oberfläche mit verbesserten Eigenschaften |
DE10292713D2 (de) * | 2001-06-23 | 2004-08-05 | Spaeth Bernd | Körper mit verbesserten Oberflächen-Eigenschaften |
KR100436699B1 (ko) * | 2003-09-23 | 2004-06-22 | 주식회사 엘지에스 | 복제몰드 |
JP2005225048A (ja) | 2004-02-12 | 2005-08-25 | Mitsubishi Electric Corp | 射出成形金型 |
US20110018249A1 (en) * | 2004-02-16 | 2011-01-27 | Horst Sonnendorfer | Shopping cart or transport container, and production method |
KR100644920B1 (ko) * | 2005-03-24 | 2006-11-10 | 김동학 | 사출 성형기용 금형장치 |
KR100610257B1 (ko) * | 2005-07-14 | 2006-08-09 | 학교법인 포항공과대학교 | 소수성 표면을 갖는 고분자 기재의 제조 방법 및 이 제조방법으로 제조된 고분자 기재 |
KR100857316B1 (ko) * | 2006-05-16 | 2008-09-05 | 엘지전자 주식회사 | 금형장치 |
KR100824712B1 (ko) * | 2006-09-21 | 2008-04-24 | 포항공과대학교 산학협력단 | 극소수성 표면 구조물을 갖는 고체기재의 가공방법 및 이를이용한 극소수성 유체 이송관 |
KR20090010348A (ko) | 2007-07-23 | 2009-01-30 | 이승욱 | 표면에 나노 패턴을 구비하는 사출성형품 및 그 제조방법 |
-
2008
- 2008-07-25 KR KR1020080072817A patent/KR20100011552A/ko not_active Application Discontinuation
-
2009
- 2009-07-20 EP EP09800542.4A patent/EP2303541B1/en not_active Not-in-force
- 2009-07-20 CN CN200980124188.8A patent/CN102149529B/zh not_active Expired - Fee Related
- 2009-07-20 JP JP2011516162A patent/JP5059973B2/ja not_active Expired - Fee Related
- 2009-07-20 US US13/003,373 patent/US8142706B2/en not_active Expired - Fee Related
- 2009-07-20 WO PCT/KR2009/003991 patent/WO2010011061A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007001181A (ja) * | 2005-06-24 | 2007-01-11 | Sony Corp | 成形装置および成形方法 |
JP2007022064A (ja) * | 2005-07-14 | 2007-02-01 | Hoko Koka Daigakko | 疏水性表面を有する高分子基材製造用鋳型の製造方法 |
WO2009028745A1 (en) * | 2007-08-28 | 2009-03-05 | Lg Electronics Inc. | Injection moldings, injection-molding apparatus and method thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015016597A (ja) * | 2013-07-10 | 2015-01-29 | 東洋製罐グループホールディングス株式会社 | 成形体、成形体の製造方法及びスタンパ |
Also Published As
Publication number | Publication date |
---|---|
EP2303541A1 (en) | 2011-04-06 |
US20110109015A1 (en) | 2011-05-12 |
CN102149529A (zh) | 2011-08-10 |
CN102149529B (zh) | 2014-07-30 |
WO2010011061A1 (en) | 2010-01-28 |
JP5059973B2 (ja) | 2012-10-31 |
US8142706B2 (en) | 2012-03-27 |
EP2303541A4 (en) | 2014-02-19 |
KR20100011552A (ko) | 2010-02-03 |
EP2303541B1 (en) | 2015-09-02 |
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