JP2011522769A5 - - Google Patents

Download PDF

Info

Publication number
JP2011522769A5
JP2011522769A5 JP2011511598A JP2011511598A JP2011522769A5 JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5 JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5
Authority
JP
Japan
Prior art keywords
laser beam
laser
optical head
focus
waist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011511598A
Other languages
English (en)
Japanese (ja)
Other versions
JP5563562B2 (ja
JP2011522769A (ja
Filing date
Publication date
Priority claimed from US12/220,948 external-priority patent/US8053704B2/en
Application filed filed Critical
Publication of JP2011522769A publication Critical patent/JP2011522769A/ja
Publication of JP2011522769A5 publication Critical patent/JP2011522769A5/ja
Application granted granted Critical
Publication of JP5563562B2 publication Critical patent/JP5563562B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011511598A 2008-05-27 2009-05-14 非平坦材料の罫書き Expired - Fee Related JP5563562B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12894908P 2008-05-27 2008-05-27
US61/128,949 2008-05-27
US12/220,948 US8053704B2 (en) 2008-05-27 2008-07-30 Scoring of non-flat materials
US12/220,948 2008-07-30
PCT/US2009/002988 WO2009151527A2 (en) 2008-05-27 2009-05-14 Scoring of non-flat materials

Publications (3)

Publication Number Publication Date
JP2011522769A JP2011522769A (ja) 2011-08-04
JP2011522769A5 true JP2011522769A5 (cg-RX-API-DMAC7.html) 2012-06-07
JP5563562B2 JP5563562B2 (ja) 2014-07-30

Family

ID=41378489

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511598A Expired - Fee Related JP5563562B2 (ja) 2008-05-27 2009-05-14 非平坦材料の罫書き

Country Status (6)

Country Link
US (1) US8053704B2 (cg-RX-API-DMAC7.html)
JP (1) JP5563562B2 (cg-RX-API-DMAC7.html)
KR (1) KR101428141B1 (cg-RX-API-DMAC7.html)
CN (1) CN102046545B (cg-RX-API-DMAC7.html)
TW (1) TWI404683B (cg-RX-API-DMAC7.html)
WO (1) WO2009151527A2 (cg-RX-API-DMAC7.html)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010108061A2 (en) * 2009-03-20 2010-09-23 Corning Incorporated Precision laser scoring
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
CN102596831B (zh) * 2009-11-03 2015-01-07 康宁股份有限公司 具有非恒定速度的移动玻璃带的激光刻划
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
US8677783B2 (en) * 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9212081B2 (en) * 2012-11-21 2015-12-15 Corning Incorporated Methods of cutting a laminate strengthened glass substrate
KR102109091B1 (ko) 2012-11-29 2020-05-12 코닝 인코포레이티드 폭 변경의 유리 리본을 제조하기 위한 방법 및 장치
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
WO2014209926A1 (en) 2013-06-26 2014-12-31 Corning Incorporated Glass ribbon breaking devices and methods of producing glass sheets
WO2015048111A1 (en) * 2013-09-24 2015-04-02 Ipg Photonics Corporation Laser processing systems capable of dithering
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
KR20170028943A (ko) * 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
CN208586209U (zh) 2014-07-14 2019-03-08 康宁股份有限公司 一种用于在工件中形成限定轮廓的多个缺陷的系统
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
US10144668B2 (en) * 2014-08-20 2018-12-04 Corning Incorporated Method and apparatus for yielding high edge strength in cutting of flexible thin glass
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
JP2018507154A (ja) 2015-01-12 2018-03-15 コーニング インコーポレイテッド マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
WO2016160391A1 (en) 2015-03-27 2016-10-06 Corning Incorporated Gas permeable window and method of fabricating the same
KR102499697B1 (ko) 2015-07-10 2023-02-14 코닝 인코포레이티드 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
CN106604898B (zh) * 2015-08-10 2021-06-04 法国圣戈班玻璃厂 用于切割薄玻璃层的方法
EP3957611A1 (en) 2016-05-06 2022-02-23 Corning Incorporated Transparent substrates with improved edge surfaces
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018013901A2 (en) * 2016-07-15 2018-01-18 TeraDiode, Inc. Material processing utilizing a laser having a variable beam shape
JP7090594B2 (ja) 2016-07-29 2022-06-24 コーニング インコーポレイテッド レーザ加工するための装置および方法
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
LT3529214T (lt) 2016-10-24 2021-02-25 Corning Incorporated Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP7353171B2 (ja) * 2019-12-26 2023-09-29 株式会社ディスコ レーザー加工装置
DE102021121947B3 (de) 2021-08-24 2023-01-26 Holochrom Gmbh Vorrichtung, System und Verfahren zur Erzeugung beweglicher räumlicher visueller Effekte mittels Laserlicht

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490608A (en) * 1980-10-21 1984-12-25 Crosfield Electronics Limited Position sensor
JPS6384789A (ja) * 1986-09-26 1988-04-15 Semiconductor Energy Lab Co Ltd 光加工方法
JPH05102561A (ja) * 1991-10-07 1993-04-23 Matsushita Electric Ind Co Ltd ガスレーザ発振装置
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5623473A (en) * 1994-06-30 1997-04-22 Nikon Corporation Method and apparatus for manufacturing a diffraction grating zone plate
US5776220A (en) * 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JP3782212B2 (ja) * 1997-08-07 2006-06-07 株式会社アマダ 光路長可変レーザー加工装置及び同装置のビームコリメーション方法
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
DE19918936A1 (de) * 1999-04-27 2000-11-02 Schott Glas Verfahren und Vorrichtung zur Herstellung von Einzelglasscheiben
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
US8217304B2 (en) * 2001-03-29 2012-07-10 Gsi Group Corporation Methods and systems for thermal-based laser processing a multi-material device
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치
WO2003015976A1 (en) * 2001-08-10 2003-02-27 Mitsuboshi Diamond Industrial Co., Ltd. Brittle material substrate chamfering method and chamfering device
JP2005021964A (ja) * 2003-07-02 2005-01-27 National Institute Of Advanced Industrial & Technology レーザーアブレーション加工方法およびその装置
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
US20060021997A1 (en) * 2004-08-02 2006-02-02 Ario Lin Heat sink for gas-fueled appliance
JP3955587B2 (ja) * 2004-08-20 2007-08-08 住友重機械工業株式会社 レーザ照射装置
JP2006142335A (ja) * 2004-11-19 2006-06-08 National Institute Of Advanced Industrial & Technology レーザー加工装置
JP4222296B2 (ja) * 2004-11-22 2009-02-12 住友電気工業株式会社 レーザ加工方法とレーザ加工装置

Similar Documents

Publication Publication Date Title
JP2011522769A5 (cg-RX-API-DMAC7.html)
WO2009151527A3 (en) Scoring of non-flat materials
CY1122595T1 (el) Διαταξη για τον σχηματισμο ζυμης σε φυλλα απο ενα τεμαχιο ζυμης με συμπιεση
RU2017104427A (ru) Системы и методы резки стекла путем создания перфорации в стеклянных изделиях с применением импульсного оптического квантового генератора
JP6588911B2 (ja) ガラスの3d形成
WO2009148511A3 (en) Laser cutting of glass along a predetermined line
JP2005184032A5 (cg-RX-API-DMAC7.html)
JP5797641B2 (ja) 脆弱材料の切断方法
MX2020002946A (es) Segmento de barra de material generador de aerosol.
WO2009069510A1 (ja) 加工対象物切断方法
MX360043B (es) Dispositivo y procedimiento de marcado laser de una lentilla oftalmica con un pulso laser de longitud de onda y energia por pulsos seleccionados.
MY175976A (en) Ultrasonic welding device and method of producing disposable diaper using same
MY177494A (en) Wafer producing method
CN106773025B (zh) 调焦镜头及振镜式激光扫描系统
BR112014000837A2 (pt) aparelho para a produção de aços recozidos e processo para a produção dos ditos aços
WO2009157994A3 (en) Glass sheet cutting by laser-guided gyrotron beam
CL2017002959A1 (es) Proceso para la producción de papel o carton, productos obtenidos a base de papel o carton y sus usos relacionados.
SG10201800387SA (en) Laser processing apparatus
BRPI0607563A2 (pt) máquina de embalagem para a produção de embalagens retráteis
WO2014121914A3 (de) VERFAHREN ZUR FORMFREIEN HERSTELLUNG EINES GEFORMTEN GLASARTIKELS MIT VORBESTIMMTER GEOMETRIE, VERWENDUNG EINES VERFAHRENSGEMÄß HERGESTELLTEN GLASARTIKELS UND GEFORMTER GLASARTIKEL
BR112017005132A2 (pt) métodos para prover um laminado de película e um material de acondicionamento, laminado de película, material de acondicionamento laminado, embalagem, e, aparelho para prover um laminado de película.
IL264209B (en) Blow mould
JP2016011219A (ja) ガラス基板の切断方法
WO2009115303A8 (de) Adaptiver spiegel und verfahren zu dessen herstellung
PT106292A (pt) Processo de marcação da superfície de uma rolha destinada à obturação de uma garrafa