JP2011520287A - 電子装置を収容するキャビネットのための熱管理システム - Google Patents

電子装置を収容するキャビネットのための熱管理システム Download PDF

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Publication number
JP2011520287A
JP2011520287A JP2011508570A JP2011508570A JP2011520287A JP 2011520287 A JP2011520287 A JP 2011520287A JP 2011508570 A JP2011508570 A JP 2011508570A JP 2011508570 A JP2011508570 A JP 2011508570A JP 2011520287 A JP2011520287 A JP 2011520287A
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JP
Japan
Prior art keywords
evaporator
condenser
cabinet
heat
air flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011508570A
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English (en)
Japanese (ja)
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JP2011520287A5 (enExample
Inventor
フリードリッヒ， ヴィルヘルム デンター，
ヘルベルト アンダース，
マンフレッド バウアー，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2011520287A publication Critical patent/JP2011520287A/ja
Publication of JP2011520287A5 publication Critical patent/JP2011520287A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2011508570A 2008-05-07 2009-05-04 電子装置を収容するキャビネットのための熱管理システム Pending JP2011520287A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08155830A EP2117288A1 (en) 2008-05-07 2008-05-07 Heat-management system for a cabinet containing electronic equipment
EP08155830.6 2008-05-07
PCT/US2009/042672 WO2009137387A1 (en) 2008-05-07 2009-05-04 Heat-management system for a cabinet containing electronic equipment

Publications (2)

Publication Number Publication Date
JP2011520287A true JP2011520287A (ja) 2011-07-14
JP2011520287A5 JP2011520287A5 (enExample) 2012-06-21

Family

ID=39789712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011508570A Pending JP2011520287A (ja) 2008-05-07 2009-05-04 電子装置を収容するキャビネットのための熱管理システム

Country Status (8)

Country Link
US (1) US20110063798A1 (enExample)
EP (1) EP2117288A1 (enExample)
JP (1) JP2011520287A (enExample)
CN (1) CN102077704A (enExample)
IL (1) IL208709A0 (enExample)
RU (1) RU2010142253A (enExample)
TW (1) TW200952617A (enExample)
WO (1) WO2009137387A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210156018A (ko) * 2020-06-17 2021-12-24 김광일 수냉식 옥외 함체
JP2022151214A (ja) * 2021-03-26 2022-10-07 富士通株式会社 冷却装置

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US8434804B2 (en) * 2008-12-04 2013-05-07 I O Data Centers, LLC System and method of providing computer resources
JP5460362B2 (ja) * 2010-02-04 2014-04-02 株式会社日立製作所 電子機器の冷却システム
JP2012190884A (ja) * 2011-03-09 2012-10-04 Panasonic Corp ラック型電子機器の冷却装置
US9226489B2 (en) 2011-03-18 2016-01-05 Ecolab Usa Inc. Heat system for killing pests
CN102256477A (zh) * 2011-07-25 2011-11-23 李俊晖 机房设备并联散热系统
WO2012106927A1 (zh) * 2011-07-26 2012-08-16 华为技术有限公司 通信设备用散热柜
EP2787802A4 (en) * 2011-12-01 2015-09-30 Nec Corp ELECTRONIC CIRCUIT BOARD WITH A DEVICE AND ELECTRONIC DEVICE THEREFOR
CN109195411A (zh) * 2012-08-20 2019-01-11 Adc技术公司 用于在架装设备的导轨和冷却支架外壳的导槽间传导热量的装置，及相关部件、系统和方法
US10240850B1 (en) * 2013-03-15 2019-03-26 Joseph P. Stine Supplemental refrigeration heat sink and related systems and methods
EP2990742A1 (en) * 2014-08-28 2016-03-02 ABB Technology AG Method and apparatus for solidifying a polar substance
CN104470335B (zh) * 2014-12-11 2017-03-15 中国航天空气动力技术研究院 基于热管技术的数据中心节能冷却系统
EP3291494B1 (en) * 2016-08-31 2020-09-30 Corning Optical Communications LLC Distribution point unit to exchange communication data between a service provider and subscribers
CN112229253B (zh) * 2020-10-30 2022-07-08 上海卫星装备研究所 热管支路连接装置与热管系统
CN113099702A (zh) * 2021-04-29 2021-07-09 江西新电汽车空调系统有限公司 一种双柜及多联柜基站空调

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JPS6441792A (en) * 1987-08-07 1989-02-14 Actronics Kk Heat pipe type casing cooler
JP2003287329A (ja) * 2002-03-28 2003-10-10 Mitsubishi Electric Corp 冷却装置
JP2006041024A (ja) * 2004-07-23 2006-02-09 Sharp Corp プリント配線板、およびその製造方法、ならびにプリント配線板を用いた電子機器
JP2006073099A (ja) * 2004-09-02 2006-03-16 Hitachi Ltd ディスクアレイ装置

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US2753195A (en) 1953-07-14 1956-07-03 William D Palmer Self-sealing coupling
US4046193A (en) * 1976-02-18 1977-09-06 Westinghouse Electric Corporation Closed electrical apparatus cabinet embodying a vaporization chamber and cabinet top thereof
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FI981909L (fi) 1998-09-07 2000-03-08 Nokia Networks Oy Lämmönsiirrin
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JP4199018B2 (ja) * 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
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US20060181848A1 (en) * 2005-02-14 2006-08-17 Kiley Richard F Heat sink and heat sink assembly
CN100590377C (zh) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 热管冷却系统及其热传递连接器
EP1859336A2 (de) * 2005-03-07 2007-11-28 Asetek A/S Kühlsystem für elektronische geräte, insbesondere computer
US7686071B2 (en) * 2005-07-30 2010-03-30 Articchoke Enterprises Llc Blade-thru condenser having reeds and heat dissipation system thereof
US7614445B2 (en) * 2005-12-21 2009-11-10 Sun Microsystems, Inc. Enhanced heat pipe cooling with MHD fluid flow
JP2008085144A (ja) * 2006-09-28 2008-04-10 Sanyo Electric Co Ltd 冷却装置
US7963118B2 (en) * 2007-09-25 2011-06-21 International Business Machines Corporation Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6441792A (en) * 1987-08-07 1989-02-14 Actronics Kk Heat pipe type casing cooler
JP2003287329A (ja) * 2002-03-28 2003-10-10 Mitsubishi Electric Corp 冷却装置
JP2006041024A (ja) * 2004-07-23 2006-02-09 Sharp Corp プリント配線板、およびその製造方法、ならびにプリント配線板を用いた電子機器
JP2006073099A (ja) * 2004-09-02 2006-03-16 Hitachi Ltd ディスクアレイ装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210156018A (ko) * 2020-06-17 2021-12-24 김광일 수냉식 옥외 함체
KR102389976B1 (ko) * 2020-06-17 2022-04-22 김광일 수냉식 옥외 함체
JP2022151214A (ja) * 2021-03-26 2022-10-07 富士通株式会社 冷却装置
JP7651903B2 (ja) 2021-03-26 2025-03-27 富士通株式会社 冷却装置

Also Published As

Publication number Publication date
RU2010142253A (ru) 2012-06-20
WO2009137387A1 (en) 2009-11-12
CN102077704A (zh) 2011-05-25
IL208709A0 (en) 2010-12-30
US20110063798A1 (en) 2011-03-17
TW200952617A (en) 2009-12-16
EP2117288A1 (en) 2009-11-11

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