JP2011517113A5 - - Google Patents

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Publication number
JP2011517113A5
JP2011517113A5 JP2011504022A JP2011504022A JP2011517113A5 JP 2011517113 A5 JP2011517113 A5 JP 2011517113A5 JP 2011504022 A JP2011504022 A JP 2011504022A JP 2011504022 A JP2011504022 A JP 2011504022A JP 2011517113 A5 JP2011517113 A5 JP 2011517113A5
Authority
JP
Japan
Prior art keywords
lead frame
die pad
group
depth
extends
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011504022A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011517113A (ja
JP5300158B2 (ja
Filing date
Publication date
Priority claimed from US12/099,446 external-priority patent/US7834431B2/en
Application filed filed Critical
Publication of JP2011517113A publication Critical patent/JP2011517113A/ja
Publication of JP2011517113A5 publication Critical patent/JP2011517113A5/ja
Application granted granted Critical
Publication of JP5300158B2 publication Critical patent/JP5300158B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011504022A 2008-04-08 2009-02-13 成形密着性を向上させたパッケージ化電子デバイス用リードフレーム Active JP5300158B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/099,446 US7834431B2 (en) 2008-04-08 2008-04-08 Leadframe for packaged electronic device with enhanced mold locking capability
US12/099,446 2008-04-08
PCT/US2009/034073 WO2009126367A1 (en) 2008-04-08 2009-02-13 Leadframe for packaged electronic device with enhanced mold locking capability

Publications (3)

Publication Number Publication Date
JP2011517113A JP2011517113A (ja) 2011-05-26
JP2011517113A5 true JP2011517113A5 (enExample) 2012-03-29
JP5300158B2 JP5300158B2 (ja) 2013-09-25

Family

ID=41132492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011504022A Active JP5300158B2 (ja) 2008-04-08 2009-02-13 成形密着性を向上させたパッケージ化電子デバイス用リードフレーム

Country Status (4)

Country Link
US (1) US7834431B2 (enExample)
JP (1) JP5300158B2 (enExample)
TW (1) TW200945531A (enExample)
WO (1) WO2009126367A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8115285B2 (en) * 2008-03-14 2012-02-14 Advanced Semiconductor Engineering, Inc. Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
CN102522375B (zh) * 2008-07-30 2015-04-08 三洋电机株式会社 半导体装置、半导体装置的制造方法及引线框
US8124447B2 (en) 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101882609A (zh) * 2009-05-08 2010-11-10 飞思卡尔半导体公司 用于半导体封装体的引线框
US8742555B2 (en) 2011-08-30 2014-06-03 Jian Wen Lead frame having a flag with in-plane and out-of-plane mold locking features
JP5817513B2 (ja) * 2011-12-27 2015-11-18 大日本印刷株式会社 半導体装置製造用リードフレーム及び半導体装置の製造方法
US9013028B2 (en) * 2013-01-04 2015-04-21 Texas Instruments Incorporated Integrated circuit package and method of making
US9515009B2 (en) 2015-01-08 2016-12-06 Texas Instruments Incorporated Packaged semiconductor device having leadframe features preventing delamination
CN106129035B (zh) 2015-05-05 2021-01-29 恩智浦美国有限公司 具有模制锁定的露出焊盘式集成电路封装件
US10083888B2 (en) * 2015-11-19 2018-09-25 Advanced Semiconductor Engineering, Inc. Semiconductor device package
JP6430422B2 (ja) 2016-02-29 2018-11-28 株式会社東芝 半導体装置
US10998255B2 (en) 2018-07-12 2021-05-04 Nxp Usa, Inc. Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
US11901309B2 (en) 2019-11-12 2024-02-13 Semiconductor Components Industries, Llc Semiconductor device package assemblies with direct leadframe attachment
TWI784474B (zh) * 2021-04-12 2022-11-21 順德工業股份有限公司 導線架料片及其導線架
JP2022190980A (ja) 2021-06-15 2022-12-27 富士電機株式会社 半導体装置
US20230031682A1 (en) * 2021-07-28 2023-02-02 Stmicroelectronics S.R.L. Method of manufacturing substrates for semiconductor devices, corresponding substrate and semiconductor device
IT202100021638A1 (it) 2021-08-10 2023-02-10 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore, dispositivo a semiconduttore e assortimento di dispositivi a semiconduttore corrispondenti
CN115360192A (zh) * 2022-09-15 2022-11-18 华天科技（西安）有限公司 一种通信射频产品引线框架的结构及其制备方法
WO2024247688A1 (ja) * 2023-06-02 2024-12-05 ローム株式会社 半導体装置および車両

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5126820A (en) * 1985-02-01 1992-06-30 Advanced Micro Devices, Inc. Thermal expansion compensated metal lead frame for integrated circuit package
JPH0685132A (ja) * 1992-09-07 1994-03-25 Mitsubishi Electric Corp 半導体装置
JPH08172145A (ja) * 1994-12-16 1996-07-02 Texas Instr Japan Ltd 半導体装置及び放熱性部品
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
JP2000269401A (ja) * 1999-03-16 2000-09-29 Toshiba Microelectronics Corp 半導体装置
KR100335480B1 (ko) * 1999-08-24 2002-05-04 김덕중 칩 패드가 방열 통로로 사용되는 리드프레임 및 이를 포함하는반도체 패키지
US6847103B1 (en) * 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
JP3706533B2 (ja) * 2000-09-20 2005-10-12 三洋電機株式会社 半導体装置および半導体モジュール
US6661083B2 (en) * 2001-02-27 2003-12-09 Chippac, Inc Plastic semiconductor package
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
US7217599B2 (en) * 2003-06-12 2007-05-15 St Assembly Test Services Ltd. Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
US7049683B1 (en) * 2003-07-19 2006-05-23 Ns Electronics Bangkok (1993) Ltd. Semiconductor package including organo-metallic coating formed on surface of leadframe roughened using chemical etchant to prevent separation between leadframe and molding compound
US6984878B2 (en) * 2004-05-24 2006-01-10 Advanced Semiconductor Engineering, Inc. Leadless leadframe with an improved die pad for mold locking
US20080079127A1 (en) * 2006-10-03 2008-04-03 Texas Instruments Incorporated Pin Array No Lead Package and Assembly Method Thereof

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