JP2011517016A - 統合型リードスイッチ - Google Patents
統合型リードスイッチ Download PDFInfo
- Publication number
- JP2011517016A JP2011517016A JP2011500937A JP2011500937A JP2011517016A JP 2011517016 A JP2011517016 A JP 2011517016A JP 2011500937 A JP2011500937 A JP 2011500937A JP 2011500937 A JP2011500937 A JP 2011500937A JP 2011517016 A JP2011517016 A JP 2011517016A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- reed switch
- lead
- anchor portion
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 235000014676 Phragmites communis Nutrition 0.000 title claims abstract description 142
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims abstract description 19
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- 238000005304 joining Methods 0.000 claims description 11
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- 230000008021 deposition Effects 0.000 description 9
- 238000013461 design Methods 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000013459 approach Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
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- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
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- 244000089486 Phragmites australis subsp australis Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000003708 ampul Substances 0.000 description 1
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- 230000001276 controlling effect Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
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- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/64—Protective enclosures, baffle plates, or screens for contacts
- H01H1/66—Contacts sealed in an evacuated or gas-filled envelope, e.g. magnetic dry-reed contacts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
Landscapes
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
- Micromachines (AREA)
- Contacts (AREA)
- Manufacture Of Switches (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3834008P | 2008-03-20 | 2008-03-20 | |
| US61/038,340 | 2008-03-20 | ||
| PCT/US2009/037575 WO2009117526A2 (en) | 2008-03-20 | 2009-03-18 | Integrated reed switch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011517016A true JP2011517016A (ja) | 2011-05-26 |
| JP2011517016A5 JP2011517016A5 (enExample) | 2012-04-12 |
Family
ID=41088298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011500937A Withdrawn JP2011517016A (ja) | 2008-03-20 | 2009-03-18 | 統合型リードスイッチ |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8327527B2 (enExample) |
| EP (1) | EP2269202A4 (enExample) |
| JP (1) | JP2011517016A (enExample) |
| KR (1) | KR101434280B1 (enExample) |
| CN (1) | CN102067262B (enExample) |
| WO (1) | WO2009117526A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016207262A (ja) * | 2015-04-15 | 2016-12-08 | アルプス電気株式会社 | 磁気リードスイッチ |
| JP2017073230A (ja) * | 2015-10-05 | 2017-04-13 | アルプス電気株式会社 | 磁気リードスイッチ |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8665041B2 (en) | 2008-03-20 | 2014-03-04 | Ht Microanalytical, Inc. | Integrated microminiature relay |
| FR2970111B1 (fr) | 2011-01-03 | 2013-01-11 | Commissariat Energie Atomique | Procede de fabrication d'un micro-contacteur actionnable par un champ magnetique |
| FR2970596B1 (fr) | 2011-01-19 | 2013-02-08 | Commissariat Energie Atomique | Contacteur et interrupteur |
| CN104217893B (zh) * | 2014-09-26 | 2019-09-06 | 敬德强 | 大电流磁簧开关 |
| US10551215B2 (en) | 2015-06-11 | 2020-02-04 | Analog Devices Global Unlimited Company | Systems, circuits and methods for determining a position of a movable object |
| US10145906B2 (en) | 2015-12-17 | 2018-12-04 | Analog Devices Global | Devices, systems and methods including magnetic structures |
| CN111681895B (zh) * | 2020-06-04 | 2022-12-13 | 四川泛华航空仪表电器有限公司 | 陶瓷干簧管的制备方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000348594A (ja) * | 1998-12-22 | 2000-12-15 | Nec Corp | マイクロマシンスイッチおよびその製造方法 |
| JP2003311698A (ja) * | 2002-04-24 | 2003-11-05 | Oki Sensor Device Corp | 機構デバイスの製造方法、機構デバイス、マイクロリードスイッチおよび静電駆動型スイッチ |
| WO2005015595A1 (ja) * | 2003-08-07 | 2005-02-17 | Fujitsu Limited | マイクロスイッチング素子およびその製造方法 |
| JP2005108471A (ja) * | 2003-09-29 | 2005-04-21 | Oki Sensor Device Corp | 接点機構デバイス及びその製造方法 |
| JP2005317360A (ja) * | 2004-04-28 | 2005-11-10 | Nec Tokin Corp | リードスイッチ |
| US20060197635A1 (en) * | 2005-03-04 | 2006-09-07 | Todd Christenson | Miniaturized switch device |
| JP2008243450A (ja) * | 2007-03-26 | 2008-10-09 | Oki Sensor Device Corp | 接点機構デバイス、接点機構デバイスの製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2497547A (en) * | 1946-04-20 | 1950-02-14 | Hastings Charles Edwin | Magnetic switch |
| US2931872A (en) * | 1958-09-22 | 1960-04-05 | Iron Fireman Mfg Co | Polarized relay |
| US3087125A (en) * | 1961-07-13 | 1963-04-23 | Gen Electric | Coaxial reed relay for interrupting the center conductor and simultaneously terminating its opened ends |
| US3167625A (en) * | 1961-09-26 | 1965-01-26 | Wheelock Signals Inc | Mounting structure for electromagentic sealed relay |
| US3268839A (en) * | 1965-03-05 | 1966-08-23 | Gen Electric | Magnetic reed relay |
| GB1145083A (en) * | 1965-04-30 | 1969-03-12 | Modern Prec Engineering Finchl | Improvements in or relating to electromagnetic switches |
| DE1251869B (de) * | 1966-10-08 | 1967-10-12 | Telefunken Patentverwertungsgesellschaft m.b.H., Ulm/Donau, Elisabethenstr. 3 | Magnetisch gesteurtes Schutzrohrkontakt-Relais |
| US3586809A (en) * | 1969-04-24 | 1971-06-22 | Briggs & Stratton Corp | Reed switch for rapid cycle,high power applications |
| US3579158A (en) * | 1969-07-28 | 1971-05-18 | Clare & Co C P | Armature structure for reed switches |
| US3913054A (en) * | 1973-11-08 | 1975-10-14 | Robertshaw Controls Co | Thermally responsive switch |
| JPS51121170A (en) * | 1975-04-15 | 1976-10-22 | Yaskawa Denki Seisakusho Kk | Reed switch |
| US4011533A (en) * | 1976-01-14 | 1977-03-08 | Briggs & Stratton Corporation | Magnetically actuated switch for precise rapid cycle operation |
| DE69311277T2 (de) * | 1992-12-15 | 1998-01-15 | Asulab Sa | Schutzrohrschalter und Herstellungsverfahren für aufgehängte dreidimensionale metallische Mikrostrukturen |
| US6094116A (en) | 1996-08-01 | 2000-07-25 | California Institute Of Technology | Micro-electromechanical relays |
| CH691559A5 (fr) * | 1997-04-21 | 2001-08-15 | Asulab Sa | Micro-contacteur magnétique et son procédé de fabrication. |
| US6410360B1 (en) | 1999-01-26 | 2002-06-25 | Teledyne Industries, Inc. | Laminate-based apparatus and method of fabrication |
| DE10031569A1 (de) | 1999-07-01 | 2001-02-01 | Advantest Corp | Integrierter Mikroschalter und Verfahren zu seiner Herstellung |
| US6366186B1 (en) * | 2000-01-20 | 2002-04-02 | Jds Uniphase Inc. | Mems magnetically actuated switches and associated switching arrays |
| AU784864B2 (en) * | 2001-03-15 | 2006-07-13 | Micro Relay Holdings Pty Ltd | Telecommunication relay array for DSL network configuration |
| US6917268B2 (en) | 2001-12-31 | 2005-07-12 | International Business Machines Corporation | Lateral microelectromechanical system switch |
| US6924966B2 (en) | 2002-05-29 | 2005-08-02 | Superconductor Technologies, Inc. | Spring loaded bi-stable MEMS switch |
| DE60202058T2 (de) | 2002-07-10 | 2005-11-24 | Kearney-National Netherlands Holding B.V. | Verfahren zur Regelung der Schaltstrecke der Kontaktzungen in einem Reed-Schalter |
| US6909589B2 (en) * | 2002-11-20 | 2005-06-21 | Corporation For National Research Initiatives | MEMS-based variable capacitor |
| US7215229B2 (en) * | 2003-09-17 | 2007-05-08 | Schneider Electric Industries Sas | Laminated relays with multiple flexible contacts |
| CN1601682A (zh) * | 2003-09-28 | 2005-03-30 | 乐金电子(天津)电器有限公司 | 簧片开关组件 |
| US6989500B2 (en) * | 2004-05-28 | 2006-01-24 | Agilent Technologies, Inc. | Liquid metal contact reed relay with integrated electromagnetic actuator |
| US7864006B2 (en) * | 2007-05-09 | 2011-01-04 | Innovative Micro Technology | MEMS plate switch and method of manufacture |
| FR2926922B1 (fr) * | 2008-01-30 | 2010-02-19 | Schneider Electric Ind Sas | Dispositif de commande a double mode d'actionnement |
-
2009
- 2009-03-18 CN CN2009801181783A patent/CN102067262B/zh not_active Expired - Fee Related
- 2009-03-18 US US12/406,937 patent/US8327527B2/en active Active
- 2009-03-18 KR KR1020107023308A patent/KR101434280B1/ko not_active Expired - Fee Related
- 2009-03-18 WO PCT/US2009/037575 patent/WO2009117526A2/en not_active Ceased
- 2009-03-18 EP EP09723618.6A patent/EP2269202A4/en not_active Withdrawn
- 2009-03-18 JP JP2011500937A patent/JP2011517016A/ja not_active Withdrawn
-
2012
- 2012-09-04 US US13/602,805 patent/US20130063233A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000348594A (ja) * | 1998-12-22 | 2000-12-15 | Nec Corp | マイクロマシンスイッチおよびその製造方法 |
| JP2003311698A (ja) * | 2002-04-24 | 2003-11-05 | Oki Sensor Device Corp | 機構デバイスの製造方法、機構デバイス、マイクロリードスイッチおよび静電駆動型スイッチ |
| WO2005015595A1 (ja) * | 2003-08-07 | 2005-02-17 | Fujitsu Limited | マイクロスイッチング素子およびその製造方法 |
| JP2005108471A (ja) * | 2003-09-29 | 2005-04-21 | Oki Sensor Device Corp | 接点機構デバイス及びその製造方法 |
| JP2005317360A (ja) * | 2004-04-28 | 2005-11-10 | Nec Tokin Corp | リードスイッチ |
| US20060197635A1 (en) * | 2005-03-04 | 2006-09-07 | Todd Christenson | Miniaturized switch device |
| JP2008243450A (ja) * | 2007-03-26 | 2008-10-09 | Oki Sensor Device Corp | 接点機構デバイス、接点機構デバイスの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016207262A (ja) * | 2015-04-15 | 2016-12-08 | アルプス電気株式会社 | 磁気リードスイッチ |
| JP2017073230A (ja) * | 2015-10-05 | 2017-04-13 | アルプス電気株式会社 | 磁気リードスイッチ |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1154986A1 (en) | 2012-05-04 |
| EP2269202A4 (en) | 2014-01-22 |
| US8327527B2 (en) | 2012-12-11 |
| US20090237188A1 (en) | 2009-09-24 |
| KR20110031150A (ko) | 2011-03-24 |
| KR101434280B1 (ko) | 2014-09-05 |
| EP2269202A2 (en) | 2011-01-05 |
| WO2009117526A3 (en) | 2009-12-30 |
| CN102067262B (zh) | 2013-11-27 |
| US20130063233A1 (en) | 2013-03-14 |
| CN102067262A (zh) | 2011-05-18 |
| WO2009117526A2 (en) | 2009-09-24 |
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