JP2011515855A5 - - Google Patents

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Publication number
JP2011515855A5
JP2011515855A5 JP2011500951A JP2011500951A JP2011515855A5 JP 2011515855 A5 JP2011515855 A5 JP 2011515855A5 JP 2011500951 A JP2011500951 A JP 2011500951A JP 2011500951 A JP2011500951 A JP 2011500951A JP 2011515855 A5 JP2011515855 A5 JP 2011515855A5
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JP
Japan
Prior art keywords
gas
chamber
bias power
etching
substrate
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JP2011500951A
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English (en)
Japanese (ja)
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JP2011515855A (ja
JP5608157B2 (ja
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Priority claimed from PCT/US2009/037647 external-priority patent/WO2009117565A2/fr
Publication of JP2011515855A publication Critical patent/JP2011515855A/ja
Publication of JP2011515855A5 publication Critical patent/JP2011515855A5/ja
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Publication of JP5608157B2 publication Critical patent/JP5608157B2/ja
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JP2011500951A 2008-03-21 2009-03-19 基板エッチングシステム及びプロセスの方法及び装置 Active JP5608157B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US3866408P 2008-03-21 2008-03-21
US61/038,664 2008-03-21
US4057008P 2008-03-28 2008-03-28
US61/040,570 2008-03-28
US9482008P 2008-09-05 2008-09-05
US61/094,820 2008-09-05
PCT/US2009/037647 WO2009117565A2 (fr) 2008-03-21 2009-03-19 Procédé et appareil d’un système de gravure de substrat et traitement

Publications (3)

Publication Number Publication Date
JP2011515855A JP2011515855A (ja) 2011-05-19
JP2011515855A5 true JP2011515855A5 (fr) 2012-05-10
JP5608157B2 JP5608157B2 (ja) 2014-10-15

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Family Applications (1)

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JP2011500951A Active JP5608157B2 (ja) 2008-03-21 2009-03-19 基板エッチングシステム及びプロセスの方法及び装置

Country Status (6)

Country Link
US (1) US20090272717A1 (fr)
JP (1) JP5608157B2 (fr)
KR (1) KR20100128333A (fr)
CN (2) CN102446739B (fr)
TW (1) TWI538045B (fr)
WO (1) WO2009117565A2 (fr)

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