JP2011512654A5 - - Google Patents

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Publication number
JP2011512654A5
JP2011512654A5 JP2010546083A JP2010546083A JP2011512654A5 JP 2011512654 A5 JP2011512654 A5 JP 2011512654A5 JP 2010546083 A JP2010546083 A JP 2010546083A JP 2010546083 A JP2010546083 A JP 2010546083A JP 2011512654 A5 JP2011512654 A5 JP 2011512654A5
Authority
JP
Japan
Prior art keywords
plenum
fluid
resistance
proximity head
lateral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010546083A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011512654A (ja
JP5427792B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/033499 external-priority patent/WO2009100409A2/en
Publication of JP2011512654A publication Critical patent/JP2011512654A/ja
Publication of JP2011512654A5 publication Critical patent/JP2011512654A5/ja
Application granted granted Critical
Publication of JP5427792B2 publication Critical patent/JP5427792B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010546083A 2008-02-08 2009-02-07 メニスカスによるウエハー表面処理において近接ヘッドに対する流体の流速をほぼ一定にする装置 Expired - Fee Related JP5427792B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6508808P 2008-02-08 2008-02-08
US61/065,088 2008-02-08
PCT/US2009/033499 WO2009100409A2 (en) 2008-02-08 2009-02-07 Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus

Publications (3)

Publication Number Publication Date
JP2011512654A JP2011512654A (ja) 2011-04-21
JP2011512654A5 true JP2011512654A5 (enExample) 2012-03-22
JP5427792B2 JP5427792B2 (ja) 2014-02-26

Family

ID=40952731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010546083A Expired - Fee Related JP5427792B2 (ja) 2008-02-08 2009-02-07 メニスカスによるウエハー表面処理において近接ヘッドに対する流体の流速をほぼ一定にする装置

Country Status (7)

Country Link
US (2) US8317966B2 (enExample)
JP (1) JP5427792B2 (enExample)
KR (1) KR101679432B1 (enExample)
CN (1) CN101971299B (enExample)
SG (1) SG188086A1 (enExample)
TW (1) TWI381473B (enExample)
WO (1) WO2009100409A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849554B2 (en) * 2009-04-28 2010-12-14 Lam Research Corporation Apparatus and system for cleaning substrate
JP5701645B2 (ja) * 2011-03-01 2015-04-15 株式会社Ｓｃｒｅｅｎホールディングス ノズル、基板処理装置、および基板処理方法
JP6061181B2 (ja) 2012-08-20 2017-01-18 ローム株式会社 半導体装置
US9859135B2 (en) * 2014-12-19 2018-01-02 Applied Materials, Inc. Substrate rinsing systems and methods
KR102116534B1 (ko) * 2018-06-25 2020-05-28 주식회사 에이치에스하이테크 기판 세정용 노즐 및 그 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041181A (en) * 1987-10-06 1991-08-20 Integrated Fluidics Company Method of bonding plastics
US7234477B2 (en) * 2000-06-30 2007-06-26 Lam Research Corporation Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
JP2002075947A (ja) * 2000-08-30 2002-03-15 Alps Electric Co Ltd ウェット処理装置
JP3880480B2 (ja) 2001-12-06 2007-02-14 東京エレクトロン株式会社 液処理装置
JP3916491B2 (ja) 2002-03-28 2007-05-16 芝浦メカトロニクス株式会社 基板の処理装置
JP2003324072A (ja) * 2002-05-07 2003-11-14 Nec Electronics Corp 半導体製造装置
US6954993B1 (en) * 2002-09-30 2005-10-18 Lam Research Corporation Concentric proximity processing head
US7240679B2 (en) * 2002-09-30 2007-07-10 Lam Research Corporation System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold
US7329321B2 (en) * 2002-09-30 2008-02-12 Lam Research Corporation Enhanced wafer cleaning method
US7093375B2 (en) 2002-09-30 2006-08-22 Lam Research Corporation Apparatus and method for utilizing a meniscus in substrate processing
US7520285B2 (en) * 2002-09-30 2009-04-21 Lam Research Corporation Apparatus and method for processing a substrate
JP4343031B2 (ja) * 2004-05-31 2009-10-14 東京エレクトロン株式会社 基板処理方法及び基板処理装置
US7003899B1 (en) * 2004-09-30 2006-02-28 Lam Research Corporation System and method for modulating flow through multiple ports in a proximity head
JP5068471B2 (ja) 2006-03-31 2012-11-07 東京エレクトロン株式会社 基板処理装置
US7998304B2 (en) * 2007-12-20 2011-08-16 Lam Research Corporation Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer

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