JP2011508900A5 - - Google Patents

Download PDF

Info

Publication number
JP2011508900A5
JP2011508900A5 JP2010538307A JP2010538307A JP2011508900A5 JP 2011508900 A5 JP2011508900 A5 JP 2011508900A5 JP 2010538307 A JP2010538307 A JP 2010538307A JP 2010538307 A JP2010538307 A JP 2010538307A JP 2011508900 A5 JP2011508900 A5 JP 2011508900A5
Authority
JP
Japan
Prior art keywords
wafer
spacer
stack
cavity
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010538307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011508900A (ja
JP5600598B2 (ja
Filing date
Publication date
Priority claimed from US12/180,175 external-priority patent/US20090159200A1/en
Application filed filed Critical
Publication of JP2011508900A publication Critical patent/JP2011508900A/ja
Publication of JP2011508900A5 publication Critical patent/JP2011508900A5/ja
Application granted granted Critical
Publication of JP5600598B2 publication Critical patent/JP5600598B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010538307A 2007-12-19 2008-12-16 スペーサ要素およびスペーサ要素を製造するための方法 Expired - Fee Related JP5600598B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US1480107P 2007-12-19 2007-12-19
US61/014,801 2007-12-19
US12/180,175 2008-07-25
US12/180,175 US20090159200A1 (en) 2007-12-19 2008-07-25 Spacer element and method for manufacturing a spacer element
PCT/CH2008/000530 WO2009076786A1 (en) 2007-12-19 2008-12-16 Spacer element and method for manufacturing a spacer element

Publications (3)

Publication Number Publication Date
JP2011508900A JP2011508900A (ja) 2011-03-17
JP2011508900A5 true JP2011508900A5 (enExample) 2012-02-02
JP5600598B2 JP5600598B2 (ja) 2014-10-01

Family

ID=40787189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010538307A Expired - Fee Related JP5600598B2 (ja) 2007-12-19 2008-12-16 スペーサ要素およびスペーサ要素を製造するための方法

Country Status (7)

Country Link
US (3) US20090159200A1 (enExample)
EP (1) EP2225596B1 (enExample)
JP (1) JP5600598B2 (enExample)
KR (1) KR101555074B1 (enExample)
CN (1) CN101946199A (enExample)
TW (1) TWI496222B (enExample)
WO (1) WO2009076786A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP5118674B2 (ja) * 2009-08-28 2013-01-16 シャープ株式会社 光学素子モジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
JP5504376B2 (ja) 2010-04-21 2014-05-28 エンパイア テクノロジー ディベロップメント エルエルシー スタック型ウエハアセンブリのための精密スペーシング
JP2013531812A (ja) 2010-06-14 2013-08-08 ヘプタゴン・オサケ・ユキチュア 複数の光学装置の製造方法
WO2011156928A2 (en) 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras
US9168679B2 (en) * 2010-07-16 2015-10-27 Northwestern University Programmable soft lithography: solvent-assisted nanoscale embossing
TWI547730B (zh) 2010-08-17 2016-09-01 新加坡恒立私人有限公司 製造用於攝像機之複數光學裝置的方法、包括複數光學裝置之總成及包括複數具有光學裝置的攝像機之總成
US9067621B2 (en) * 2010-12-06 2015-06-30 Honda Motor Co., Ltd. Subframe structure
DE102011005380A1 (de) * 2011-03-10 2012-09-13 Via Optronics Gmbh Optoelektronische Vorrichtung
DE102011005379A1 (de) * 2011-03-10 2012-09-13 Via Optronics Gmbh Optoelektronische Vorrichtung
US20140307081A1 (en) * 2011-08-25 2014-10-16 Heptagon Micro Optics Pte. Ltd. Wafer-level fabrication of optical devices, in particular of modules for computational cameras
KR101852030B1 (ko) * 2011-08-25 2018-04-25 삼성전자주식회사 마이크로 소자의 웨이퍼 레벨 보호 구조물과 이를 포함하는 마이크로 소자 및 이들의 제조방법
US9063005B2 (en) 2012-04-05 2015-06-23 Heptagon Micro Optics Pte. Ltd. Reflowable opto-electronic module
US10022041B2 (en) * 2012-06-27 2018-07-17 Camplex, Inc. Hydraulic system for surgical applications
WO2014012603A1 (en) 2012-07-17 2014-01-23 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same
TWI627761B (zh) * 2012-07-17 2018-06-21 新加坡恒立私人有限公司 用以感測一量度的感測器模組，其應用器具，其製造方法，裝置的製造方法，及包含光譜計模組的裝置
CN102891155B (zh) * 2012-09-27 2015-08-19 豪威科技(上海)有限公司 用于制作镜头的晶圆级贴合方法
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
WO2014130040A1 (en) * 2013-02-22 2014-08-28 Ion Geophysical Corporation Method and apparatus for multi-component datuming
US10682824B2 (en) 2014-05-16 2020-06-16 Ams Sensors Singapore Pte. Ltd. Wafer-level manufacture of devices, in particular of optical devices
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
JP6967830B2 (ja) * 2015-07-31 2021-11-17 ソニーセミコンダクタソリューションズ株式会社 半導体装置、レンズモジュール及びその製造方法、並びに、電子機器
US10889078B2 (en) * 2015-08-05 2021-01-12 Omnivision Technologies, Inc. Optical spacer including controlled located aperture and method of manufacturing the same
KR102519178B1 (ko) * 2015-09-25 2023-04-06 삼성전자주식회사 색분리 소자를 포함하는 이미지 센서 및 이를 포함하는 촬상 장치
US10018781B1 (en) 2017-01-06 2018-07-10 International Business Machines Corporation Fluid control structure
WO2019054940A1 (en) * 2017-09-12 2019-03-21 Ams Sensors Singapore Pte. Ltd. WAFER LEVEL MANUFACTURE OF MICRO-DEVICES AND ASSOCIATED TWO-PIECE DEVICES, ESPECIALLY MICRO-OPTIC SYSTEMS
CN108654109B (zh) * 2018-04-08 2023-08-04 东莞市安普城塑胶有限公司 一种闪光变色片生产工艺
EP3570103B1 (en) * 2018-05-17 2020-07-01 Axis AB Camera arrangement and method for aligning a sensor board and an optics unit
DE112020001297T5 (de) * 2019-03-12 2021-12-16 Ams Sensors Singapore Pte. Ltd. Verfahren zur herstellung einer vielzahl von optischen elementen und produkt daraus
WO2020185163A1 (en) * 2019-03-12 2020-09-17 Ams Sensors Singapore Pte. Ltd. Wafer alignment features
KR102534260B1 (ko) * 2019-08-30 2023-05-19 삼성전기주식회사 렌즈 조립체
CN112882175B (zh) * 2021-01-20 2022-04-29 拾斛科技(南京)有限公司 晶圆级镜头模组阵列组装结构、镜头模组及其生产方法
EP4386490A1 (fr) * 2022-12-13 2024-06-19 The Swatch Group Research and Development Ltd Composant d'horlogerie résultant de l'assemblage de deux pièces et procédé de fabrication dudit composant
US12309478B2 (en) 2023-01-10 2025-05-20 Omnivision Technologies, Inc. Self-illuminating camera

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334473A (en) * 1976-09-10 1978-03-31 Toshiba Corp Manufacture for semiconductor device
DE3777627D1 (de) * 1987-01-26 1992-04-23 Philips Nv Repliklinse mit glaslinsenkoerper.
US6096155A (en) * 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
SE508968C2 (sv) * 1996-12-19 1998-11-23 Ericsson Telefon Ab L M Förfarande för att göra elastiska kulor
US6981804B2 (en) * 1998-06-08 2006-01-03 Arrayed Fiberoptics Corporation Vertically integrated optical devices coupled to optical fibers
US6871544B1 (en) * 1999-03-17 2005-03-29 Input/Output, Inc. Sensor design and process
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
US6798931B2 (en) * 2001-03-06 2004-09-28 Digital Optics Corp. Separating of optical integrated modules and structures formed thereby
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2003095708A (ja) * 2001-09-25 2003-04-03 Olympus Optical Co Ltd 接合レンズアレイの製造方法及び接合レンズの製造方法並びにレンズアレイ
US6962834B2 (en) * 2002-03-22 2005-11-08 Stark David H Wafer-level hermetic micro-device packages
JP4190204B2 (ja) * 2002-05-16 2008-12-03 オリンパス株式会社 接合レンズアレイ
JP2004088713A (ja) * 2002-06-27 2004-03-18 Olympus Corp 撮像レンズユニットおよび撮像装置
US7564496B2 (en) * 2002-09-17 2009-07-21 Anteryon B.V. Camera device, method of manufacturing a camera device, wafer scale package
JP2006246193A (ja) * 2005-03-04 2006-09-14 Matsushita Electric Ind Co Ltd 撮像装置
KR100691184B1 (ko) * 2005-06-28 2007-03-09 삼성전기주식회사 웨이퍼 스케일 렌즈의 적층을 위한 접착방법 및 이에 의해제조된 웨이퍼 스케일 렌즈
TWI289352B (en) * 2005-07-06 2007-11-01 Asia Optical Co Inc Micro lens and its manufacturing method
CN100413042C (zh) * 2005-08-25 2008-08-20 矽格股份有限公司 光感测半导体组件的封装方法
JP2009047949A (ja) * 2007-08-21 2009-03-05 Alps Electric Co Ltd 光学素子の製造方法

Similar Documents

Publication Publication Date Title
JP2011508900A5 (enExample)
TWI667691B (zh) 用於轉移微元件的轉置頭及微元件的轉移方法
CN104883651B (zh) 微机电麦克风装置
JP2013516329A5 (enExample)
CN205016507U (zh) 电子器件
JP2009523915A5 (enExample)
EP2704216A3 (en) Flexible semiconductor devices and methods of manufacturing the same
JP2016033937A5 (ja) 圧電デバイス
WO2008099933A1 (ja) 半導体パッケージ
EP2014366A3 (en) Microfluidic chip and method of fabricating the same
JP2007305810A5 (enExample)
JP2009530135A5 (enExample)
WO2005091820A3 (en) Selective bonding for forming a microvalve
CN108627286B (zh) 具有向边缘通气的埋置腔的微机电系统（mems）力芯片
CN101946199A (zh) 隔离元件和用于制造隔离元件的方法
JP2009508701A5 (enExample)
WO2009042546A3 (en) Stacked dual-die packages, methods of making, and systems incorporating said packages
WO2007107901A3 (en) A system-in-package platform for electronic-microfluidic devices
JP2006283965A5 (enExample)
JP2013512792A5 (enExample)
WO2010138968A3 (en) Method and apparatus for providing high-fill-factor micromirror/micromirror arrays with surface mounting capability
CN105659013B (zh) 微阀装置和微阀装置的制造方法
JP2017531832A5 (enExample)
KR20160103347A (ko) 마이크로 공압 밸브 소자 및 그 제조방법
WO2009018304A3 (en) Semiconductor device