TWI496222B - 間隔件及製造間隔件的方法 - Google Patents

間隔件及製造間隔件的方法 Download PDF

Info

Publication number
TWI496222B
TWI496222B TW097148781A TW97148781A TWI496222B TW I496222 B TWI496222 B TW I496222B TW 097148781 A TW097148781 A TW 097148781A TW 97148781 A TW97148781 A TW 97148781A TW I496222 B TWI496222 B TW I496222B
Authority
TW
Taiwan
Prior art keywords
wafer
spacer
stack
adhesive
openings
Prior art date
Application number
TW097148781A
Other languages
English (en)
Chinese (zh)
Other versions
TW200935525A (en
Inventor
馬克思 羅西
哈馬特 盧德曼
尼可拉 史普林
亞歷山大 拜斯奇
Original Assignee
新加坡恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡恒立私人有限公司 filed Critical 新加坡恒立私人有限公司
Publication of TW200935525A publication Critical patent/TW200935525A/zh
Application granted granted Critical
Publication of TWI496222B publication Critical patent/TWI496222B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Lens Barrels (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
TW097148781A 2007-12-19 2008-12-15 間隔件及製造間隔件的方法 TWI496222B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1480107P 2007-12-19 2007-12-19
US12/180,175 US20090159200A1 (en) 2007-12-19 2008-07-25 Spacer element and method for manufacturing a spacer element

Publications (2)

Publication Number Publication Date
TW200935525A TW200935525A (en) 2009-08-16
TWI496222B true TWI496222B (zh) 2015-08-11

Family

ID=40787189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148781A TWI496222B (zh) 2007-12-19 2008-12-15 間隔件及製造間隔件的方法

Country Status (7)

Country Link
US (3) US20090159200A1 (enExample)
EP (1) EP2225596B1 (enExample)
JP (1) JP5600598B2 (enExample)
KR (1) KR101555074B1 (enExample)
CN (1) CN101946199A (enExample)
TW (1) TWI496222B (enExample)
WO (1) WO2009076786A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP5118674B2 (ja) * 2009-08-28 2013-01-16 シャープ株式会社 光学素子モジュールおよびその製造方法、電子素子モジュールおよびその製造方法、電子情報機器
JP5504376B2 (ja) 2010-04-21 2014-05-28 エンパイア テクノロジー ディベロップメント エルエルシー スタック型ウエハアセンブリのための精密スペーシング
JP2013531812A (ja) 2010-06-14 2013-08-08 ヘプタゴン・オサケ・ユキチュア 複数の光学装置の製造方法
WO2011156928A2 (en) 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras
US9168679B2 (en) * 2010-07-16 2015-10-27 Northwestern University Programmable soft lithography: solvent-assisted nanoscale embossing
TWI547730B (zh) 2010-08-17 2016-09-01 新加坡恒立私人有限公司 製造用於攝像機之複數光學裝置的方法、包括複數光學裝置之總成及包括複數具有光學裝置的攝像機之總成
US9067621B2 (en) * 2010-12-06 2015-06-30 Honda Motor Co., Ltd. Subframe structure
DE102011005380A1 (de) * 2011-03-10 2012-09-13 Via Optronics Gmbh Optoelektronische Vorrichtung
DE102011005379A1 (de) * 2011-03-10 2012-09-13 Via Optronics Gmbh Optoelektronische Vorrichtung
US20140307081A1 (en) * 2011-08-25 2014-10-16 Heptagon Micro Optics Pte. Ltd. Wafer-level fabrication of optical devices, in particular of modules for computational cameras
KR101852030B1 (ko) * 2011-08-25 2018-04-25 삼성전자주식회사 마이크로 소자의 웨이퍼 레벨 보호 구조물과 이를 포함하는 마이크로 소자 및 이들의 제조방법
US9063005B2 (en) 2012-04-05 2015-06-23 Heptagon Micro Optics Pte. Ltd. Reflowable opto-electronic module
US10022041B2 (en) * 2012-06-27 2018-07-17 Camplex, Inc. Hydraulic system for surgical applications
WO2014012603A1 (en) 2012-07-17 2014-01-23 Heptagon Micro Optics Pte. Ltd. Optical devices, in particular computational cameras, and methods for manufacturing the same
TWI627761B (zh) * 2012-07-17 2018-06-21 新加坡恒立私人有限公司 用以感測一量度的感測器模組，其應用器具，其製造方法，裝置的製造方法，及包含光譜計模組的裝置
CN102891155B (zh) * 2012-09-27 2015-08-19 豪威科技(上海)有限公司 用于制作镜头的晶圆级贴合方法
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
WO2014130040A1 (en) * 2013-02-22 2014-08-28 Ion Geophysical Corporation Method and apparatus for multi-component datuming
US10682824B2 (en) 2014-05-16 2020-06-16 Ams Sensors Singapore Pte. Ltd. Wafer-level manufacture of devices, in particular of optical devices
JP6619174B2 (ja) * 2015-07-31 2019-12-11 ソニーセミコンダクタソリューションズ株式会社 製造装置および方法
JP6967830B2 (ja) * 2015-07-31 2021-11-17 ソニーセミコンダクタソリューションズ株式会社 半導体装置、レンズモジュール及びその製造方法、並びに、電子機器
US10889078B2 (en) * 2015-08-05 2021-01-12 Omnivision Technologies, Inc. Optical spacer including controlled located aperture and method of manufacturing the same
KR102519178B1 (ko) * 2015-09-25 2023-04-06 삼성전자주식회사 색분리 소자를 포함하는 이미지 센서 및 이를 포함하는 촬상 장치
US10018781B1 (en) 2017-01-06 2018-07-10 International Business Machines Corporation Fluid control structure
WO2019054940A1 (en) * 2017-09-12 2019-03-21 Ams Sensors Singapore Pte. Ltd. WAFER LEVEL MANUFACTURE OF MICRO-DEVICES AND ASSOCIATED TWO-PIECE DEVICES, ESPECIALLY MICRO-OPTIC SYSTEMS
CN108654109B (zh) * 2018-04-08 2023-08-04 东莞市安普城塑胶有限公司 一种闪光变色片生产工艺
EP3570103B1 (en) * 2018-05-17 2020-07-01 Axis AB Camera arrangement and method for aligning a sensor board and an optics unit
DE112020001297T5 (de) * 2019-03-12 2021-12-16 Ams Sensors Singapore Pte. Ltd. Verfahren zur herstellung einer vielzahl von optischen elementen und produkt daraus
WO2020185163A1 (en) * 2019-03-12 2020-09-17 Ams Sensors Singapore Pte. Ltd. Wafer alignment features
KR102534260B1 (ko) * 2019-08-30 2023-05-19 삼성전기주식회사 렌즈 조립체
CN112882175B (zh) * 2021-01-20 2022-04-29 拾斛科技(南京)有限公司 晶圆级镜头模组阵列组装结构、镜头模组及其生产方法
EP4386490A1 (fr) * 2022-12-13 2024-06-19 The Swatch Group Research and Development Ltd Composant d'horlogerie résultant de l'assemblage de deux pièces et procédé de fabrication dudit composant
US12309478B2 (en) 2023-01-10 2025-05-20 Omnivision Technologies, Inc. Self-illuminating camera

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US20040104460A1 (en) * 2002-03-22 2004-06-03 Stark David H. Wafer-level hermetic micro-device packages
US20070200132A1 (en) * 2001-03-06 2007-08-30 Digital Optics Corporation Electrical connection for optoelectronic devices
US7274079B2 (en) * 1999-03-17 2007-09-25 Input/Output, Inc. Sensor design and process

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5334473A (en) * 1976-09-10 1978-03-31 Toshiba Corp Manufacture for semiconductor device
DE3777627D1 (de) * 1987-01-26 1992-04-23 Philips Nv Repliklinse mit glaslinsenkoerper.
US6096155A (en) * 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
SE508968C2 (sv) * 1996-12-19 1998-11-23 Ericsson Telefon Ab L M Förfarande för att göra elastiska kulor
US6981804B2 (en) * 1998-06-08 2006-01-03 Arrayed Fiberoptics Corporation Vertically integrated optical devices coupled to optical fibers
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2003095708A (ja) * 2001-09-25 2003-04-03 Olympus Optical Co Ltd 接合レンズアレイの製造方法及び接合レンズの製造方法並びにレンズアレイ
JP4190204B2 (ja) * 2002-05-16 2008-12-03 オリンパス株式会社 接合レンズアレイ
JP2004088713A (ja) * 2002-06-27 2004-03-18 Olympus Corp 撮像レンズユニットおよび撮像装置
US7564496B2 (en) * 2002-09-17 2009-07-21 Anteryon B.V. Camera device, method of manufacturing a camera device, wafer scale package
JP2006246193A (ja) * 2005-03-04 2006-09-14 Matsushita Electric Ind Co Ltd 撮像装置
KR100691184B1 (ko) * 2005-06-28 2007-03-09 삼성전기주식회사 웨이퍼 스케일 렌즈의 적층을 위한 접착방법 및 이에 의해제조된 웨이퍼 스케일 렌즈
TWI289352B (en) * 2005-07-06 2007-11-01 Asia Optical Co Inc Micro lens and its manufacturing method
CN100413042C (zh) * 2005-08-25 2008-08-20 矽格股份有限公司 光感测半导体组件的封装方法
JP2009047949A (ja) * 2007-08-21 2009-03-05 Alps Electric Co Ltd 光学素子の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7274079B2 (en) * 1999-03-17 2007-09-25 Input/Output, Inc. Sensor design and process
US6406636B1 (en) * 1999-06-02 2002-06-18 Megasense, Inc. Methods for wafer to wafer bonding using microstructures
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
US20070200132A1 (en) * 2001-03-06 2007-08-30 Digital Optics Corporation Electrical connection for optoelectronic devices
US20040104460A1 (en) * 2002-03-22 2004-06-03 Stark David H. Wafer-level hermetic micro-device packages

Also Published As

Publication number Publication date
EP2225596A1 (en) 2010-09-08
WO2009076786A1 (en) 2009-06-25
US20110039048A1 (en) 2011-02-17
KR101555074B1 (ko) 2015-09-22
US20130280492A1 (en) 2013-10-24
JP2011508900A (ja) 2011-03-17
TW200935525A (en) 2009-08-16
CN101946199A (zh) 2011-01-12
US20090159200A1 (en) 2009-06-25
EP2225596B1 (en) 2024-02-14
JP5600598B2 (ja) 2014-10-01
KR20100109553A (ko) 2010-10-08

Similar Documents

Publication Publication Date Title
TWI496222B (zh) 間隔件及製造間隔件的方法
JP5416753B2 (ja) オーバーフロー体積部を有するツールを使用した光学素子の成形
JP6987907B2 (ja) 装置の、特に光学装置のウェーハレベル方法
EP1837166A1 (en) Molding of miniature structured elements using a tool incorporating spacer elements
US20080054508A1 (en) Method and tool for manufacturing optical elements
NL2013093B1 (en) Method for manufacturing a lens structure.
EP3341974B1 (en) Optical assemblies including a spacer adhering directly to a substrate
CN103975436A (zh) 制造无源光学器件和包含该无源光学器件的装置的方法
CN101266306B (zh) 光学微结构平板以及制作光学微结构构件的模板
NL2015330B1 (en) A method of fabricating an array of optical lens elements
CN109564335B (zh) 层叠透镜结构、相机模块和层叠透镜结构的制造方法
US20130122247A1 (en) Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
JP2022520554A (ja) 大面積シームレスマスター及びインプリントスタンプの製造方法
CN113260499B (zh) 制造多个光学元件的方法
US12276813B2 (en) Method of manufacturing a plurality of optical elements and product thereof
CN113573877B (zh) 晶圆对准特征
WO2025203903A1 (ja) マイクロ流体デバイス
TW202506394A (zh) 在晶圓中嵌入微透鏡陣列之晶圓級光學製造
HK1184235A (en) Spacer wafer for wafer-level camera and method for manufacturing same
WO2018022014A1 (en) Microfluidic device with manifold

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees