JP2017531832A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017531832A5 JP2017531832A5 JP2017519894A JP2017519894A JP2017531832A5 JP 2017531832 A5 JP2017531832 A5 JP 2017531832A5 JP 2017519894 A JP2017519894 A JP 2017519894A JP 2017519894 A JP2017519894 A JP 2017519894A JP 2017531832 A5 JP2017531832 A5 JP 2017531832A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- stack
- optical element
- optical elements
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 claims 40
- 238000000034 method Methods 0.000 claims 22
- 238000002347 injection Methods 0.000 claims 5
- 239000007924 injection Substances 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000011230 binding agent Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462063532P | 2014-10-14 | 2014-10-14 | |
| US62/063,532 | 2014-10-14 | ||
| PCT/SG2015/050387 WO2016060615A1 (en) | 2014-10-14 | 2015-10-14 | Optical element stack assemblies |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017531832A JP2017531832A (ja) | 2017-10-26 |
| JP2017531832A5 true JP2017531832A5 (enExample) | 2018-11-22 |
| JP6843745B2 JP6843745B2 (ja) | 2021-03-17 |
Family
ID=55747026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017519894A Active JP6843745B2 (ja) | 2014-10-14 | 2015-10-14 | 光学要素スタックアセンブリ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10741613B2 (enExample) |
| EP (1) | EP3207416B1 (enExample) |
| JP (1) | JP6843745B2 (enExample) |
| KR (1) | KR102433712B1 (enExample) |
| CN (1) | CN106817910B (enExample) |
| SG (1) | SG11201702556TA (enExample) |
| TW (1) | TWI684802B (enExample) |
| WO (1) | WO2016060615A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10241244B2 (en) | 2016-07-29 | 2019-03-26 | Lumentum Operations Llc | Thin film total internal reflection diffraction grating for single polarization or dual polarization |
| DE102017123798B4 (de) * | 2017-10-12 | 2022-03-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaser und Herstellungsverfahren für optoelektronische Halbleiterbauteile |
| TWI645637B (zh) * | 2017-10-18 | 2018-12-21 | 華立捷科技股份有限公司 | 面射型雷射裝置及其製造方法 |
| CN112714692B (zh) * | 2018-09-17 | 2023-08-11 | ams传感器新加坡私人有限公司 | 光学光导和制作光学光导的方法 |
| US11262644B1 (en) | 2019-05-10 | 2022-03-01 | Facebook Technologies, Llc | Structured light projector with solid optical spacer element |
| US11551963B2 (en) * | 2020-02-14 | 2023-01-10 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package and method of manufacturing the same |
| DE102023102291A1 (de) * | 2023-01-31 | 2024-08-01 | Lpkf Laser & Electronics Se | Umformverfahren zur Herstellung von Nanostrukturen sowie eine zur Durchführung bestimmte Vorrichtung |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235141B1 (en) * | 1996-09-27 | 2001-05-22 | Digital Optics Corporation | Method of mass producing and packaging integrated optical subsystems |
| US6669803B1 (en) * | 1997-10-03 | 2003-12-30 | Digital Optics Corp. | Simultaneous provision of controlled height bonding material at a wafer level and associated structures |
| US6074725A (en) * | 1997-12-10 | 2000-06-13 | Caliper Technologies Corp. | Fabrication of microfluidic circuits by printing techniques |
| US6381072B1 (en) * | 1998-01-23 | 2002-04-30 | Proxemics | Lenslet array systems and methods |
| US6770503B1 (en) * | 1999-10-21 | 2004-08-03 | The Charles Stark Draper Laboratory, Inc. | Integrated packaging of micromechanical sensors and associated control circuits |
| US7329611B2 (en) | 2002-04-11 | 2008-02-12 | Nec Corporation | Method for forming finely-structured parts, finely-structured parts formed thereby, and product using such finely-structured part |
| JP3888223B2 (ja) * | 2002-05-13 | 2007-02-28 | ソニー株式会社 | 液晶表示素子の製造方法 |
| US7300812B2 (en) * | 2004-10-29 | 2007-11-27 | Hewlett-Packard Development Coompany, L.P. | Micro electrical mechanical system |
| US7482193B2 (en) * | 2004-12-20 | 2009-01-27 | Honeywell International Inc. | Injection-molded package for MEMS inertial sensor |
| JP2007279222A (ja) | 2006-04-04 | 2007-10-25 | Hitachi Maxell Ltd | 表示パネル用基板の製造方法 |
| JP2007294336A (ja) | 2006-04-27 | 2007-11-08 | Seiko Epson Corp | 発光装置、発光装置の製造方法及び電子機器 |
| US20080118241A1 (en) * | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
| US8546739B2 (en) * | 2007-03-30 | 2013-10-01 | Min-Chih Hsuan | Manufacturing method of wafer level chip scale package of image-sensing module |
| WO2009133756A1 (ja) | 2008-04-28 | 2009-11-05 | コニカミノルタオプト株式会社 | ウエハレンズ集合体の製造方法及びウエハレンズの製造方法 |
| US20090321861A1 (en) * | 2008-06-26 | 2009-12-31 | Micron Technology, Inc. | Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers |
| JP4764942B2 (ja) | 2008-09-25 | 2011-09-07 | シャープ株式会社 | 光学素子、光学素子ウエハ、光学素子ウエハモジュール、光学素子モジュール、光学素子モジュールの製造方法、電子素子ウエハモジュール、電子素子モジュールの製造方法、電子素子モジュールおよび電子情報機器 |
| SG173197A1 (en) * | 2009-02-03 | 2011-09-29 | Digitaloptics Corp East | Optical imaging apparatus and methods of making the same |
| WO2011055655A1 (ja) | 2009-11-05 | 2011-05-12 | コニカミノルタオプト株式会社 | 撮像装置、光学ユニット、ウエハレンズ積層体及びウエハレンズ積層体の製造方法 |
| US20110221950A1 (en) * | 2010-03-12 | 2011-09-15 | Doeke Jolt Oostra | Camera device, wafer scale package |
| US20130037054A1 (en) * | 2010-04-28 | 2013-02-14 | Nobuhiro Saruya | Method for producing imaging lens |
| US8000041B1 (en) * | 2010-09-20 | 2011-08-16 | Visera Technologies Company Limited | Lens modules and fabrication methods thereof |
| KR102123128B1 (ko) | 2011-07-19 | 2020-06-16 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 광전 모듈들 및 그 제조 방법들 |
| US20140307081A1 (en) | 2011-08-25 | 2014-10-16 | Heptagon Micro Optics Pte. Ltd. | Wafer-level fabrication of optical devices, in particular of modules for computational cameras |
| US8388793B1 (en) * | 2011-08-29 | 2013-03-05 | Visera Technologies Company Limited | Method for fabricating camera module |
| US8570669B2 (en) | 2012-01-23 | 2013-10-29 | Optiz, Inc | Multi-layer polymer lens and method of making same |
| US9063005B2 (en) * | 2012-04-05 | 2015-06-23 | Heptagon Micro Optics Pte. Ltd. | Reflowable opto-electronic module |
| US10153179B2 (en) * | 2012-08-24 | 2018-12-11 | Taiwan Semiconductor Manufacturing Company | Carrier warpage control for three dimensional integrated circuit (3DIC) stacking |
| JP6060620B2 (ja) | 2012-10-29 | 2017-01-18 | セイコーエプソン株式会社 | マイクロレンズアレイの製造方法 |
| US9094593B2 (en) * | 2013-07-30 | 2015-07-28 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
| US10153204B2 (en) * | 2014-06-04 | 2018-12-11 | Flir Systems, Inc. | Wafer level packaging of reduced-height infrared detectors |
| WO2017082820A1 (en) * | 2015-11-12 | 2017-05-18 | Heptagon Micro Optics Pte. Ltd. | Optical element stack assemblies |
-
2015
- 2015-10-14 JP JP2017519894A patent/JP6843745B2/ja active Active
- 2015-10-14 SG SG11201702556TA patent/SG11201702556TA/en unknown
- 2015-10-14 TW TW104133747A patent/TWI684802B/zh active
- 2015-10-14 CN CN201580055984.6A patent/CN106817910B/zh active Active
- 2015-10-14 EP EP15850175.9A patent/EP3207416B1/en active Active
- 2015-10-14 KR KR1020177012941A patent/KR102433712B1/ko active Active
- 2015-10-14 US US15/516,692 patent/US10741613B2/en active Active
- 2015-10-14 WO PCT/SG2015/050387 patent/WO2016060615A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017531832A5 (enExample) | ||
| KR102572717B1 (ko) | 마스크 프레임 어셈블리 | |
| JP5289484B2 (ja) | 積層型半導体装置の製造方法 | |
| US11588098B2 (en) | Method of manufacturing a multi-layer PZT microactuator using wafer-level processing | |
| US9773740B2 (en) | Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive | |
| JP2011507284A5 (enExample) | ||
| JP2017028078A5 (enExample) | ||
| CN106817910B (zh) | 光学元件堆叠组件 | |
| CN111384137A (zh) | 显示面板以及显示面板的制造方法 | |
| JP2009164204A (ja) | 光電池装置 | |
| CN111146342A (zh) | 柔性衬底基板、显示面板及显示装置 | |
| JP2011053640A (ja) | ウエハレベルモジュールとその製造方法 | |
| CN103676066B (zh) | 镜头及其制造方法 | |
| JPWO2016143619A1 (ja) | 積層セラミック電子部品及びその製造方法 | |
| US8309433B2 (en) | Method of manufacturing optical sensor | |
| KR20170000596A (ko) | 압전 소자 및 그를 구비하는 압전 스피커 | |
| JP2017157799A (ja) | 半導体受光モジュールおよび半導体受光モジュールの製造方法 | |
| CN103165757A (zh) | 制备msm结构czt探测器的方法 | |
| JP7095226B2 (ja) | フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、および有機elディスプレイの製造方法 | |
| JP2006523920A5 (enExample) | ||
| CN109494194B (zh) | 一种显示面板及其制备方法 | |
| JP2013171943A5 (enExample) | ||
| US8877323B2 (en) | Semiconductor structures and method for fabricating the same | |
| JP6504978B2 (ja) | サブマウントの製造方法 | |
| JP2019007781A (ja) | 放射線検出器及びその製造方法 |