JP2011508447A5 - - Google Patents

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Publication number
JP2011508447A5
JP2011508447A5 JP2010540693A JP2010540693A JP2011508447A5 JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5 JP 2010540693 A JP2010540693 A JP 2010540693A JP 2010540693 A JP2010540693 A JP 2010540693A JP 2011508447 A5 JP2011508447 A5 JP 2011508447A5
Authority
JP
Japan
Prior art keywords
tpg
filling
mold
foam block
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010540693A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011508447A (ja
Filing date
Publication date
Priority claimed from US11/967,307 external-priority patent/US20090169410A1/en
Application filed filed Critical
Publication of JP2011508447A publication Critical patent/JP2011508447A/ja
Publication of JP2011508447A5 publication Critical patent/JP2011508447A5/ja
Pending legal-status Critical Current

Links

JP2010540693A 2007-12-31 2008-11-15 熱分解グラファイト埋込みヒートシンクの形成方法 Pending JP2011508447A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/967,307 US20090169410A1 (en) 2007-12-31 2007-12-31 Method of forming a thermo pyrolytic graphite-embedded heatsink
PCT/US2008/083709 WO2009088565A2 (en) 2007-12-31 2008-11-15 Method of forming a thermo pyrolytic graphite-embedded heatsink

Publications (2)

Publication Number Publication Date
JP2011508447A JP2011508447A (ja) 2011-03-10
JP2011508447A5 true JP2011508447A5 (zh) 2013-01-10

Family

ID=40328462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010540693A Pending JP2011508447A (ja) 2007-12-31 2008-11-15 熱分解グラファイト埋込みヒートシンクの形成方法

Country Status (6)

Country Link
US (1) US20090169410A1 (zh)
EP (1) EP2232540A2 (zh)
JP (1) JP2011508447A (zh)
KR (1) KR20100105641A (zh)
CN (1) CN101971310B (zh)
WO (1) WO2009088565A2 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2965401B1 (fr) * 2010-09-29 2012-09-14 Valeo Systemes Thermiques Dispositif thermo electrique, notamment destine a générer un courant électrique dans un véhicule automobile.
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
US8663537B2 (en) 2012-05-18 2014-03-04 3M Innovative Properties Company Injection molding apparatus and method
US10028418B2 (en) 2015-01-20 2018-07-17 Microsoft Technology Licensing, Llc Metal encased graphite layer heat pipe
US10108017B2 (en) 2015-01-20 2018-10-23 Microsoft Technology Licensing, Llc Carbon nanoparticle infused optical mount
US9791704B2 (en) 2015-01-20 2017-10-17 Microsoft Technology Licensing, Llc Bonded multi-layer graphite heat pipe
US10444515B2 (en) 2015-01-20 2019-10-15 Microsoft Technology Licensing, Llc Convective optical mount structure
US20180112938A1 (en) * 2016-10-26 2018-04-26 Goodrich Aerospace Services Private Limited Die-cast bodies with thermal conductive inserts
JP7119671B2 (ja) * 2017-11-20 2022-08-17 三菱マテリアル株式会社 複合伝熱部材、及び複合伝熱部材の製造方法

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Publication number Priority date Publication date Assignee Title
JPS61207534A (ja) * 1985-03-11 1986-09-13 Honda Motor Co Ltd 繊維強化金属材料の製造方法
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
JPH03207549A (ja) * 1990-01-11 1991-09-10 Mitsubishi Motors Corp 消失模型鋳造法
JPH079079A (ja) * 1993-06-28 1995-01-13 Tsuchiyoshi:Kk 消失模型鋳造方法
GB9814835D0 (en) * 1998-07-08 1998-09-09 Europ Org For Nuclear Research A thermal management board
US6075701A (en) * 1999-05-14 2000-06-13 Hughes Electronics Corporation Electronic structure having an embedded pyrolytic graphite heat sink material
US6215661B1 (en) * 1999-08-11 2001-04-10 Motorola, Inc. Heat spreader
JP2001259822A (ja) * 2000-03-16 2001-09-25 Tokyo Tekko Co Ltd 複合摺動部材の消失鋳造法
EP1187199A2 (de) * 2000-08-28 2002-03-13 Alcan Technology & Management AG Kühlkörper für Halbleiterbauelemente, Verfahren zu seiner Herstellung sowie Formwerkzeug dafür
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
JP2003183792A (ja) * 2001-12-20 2003-07-03 Mitsubishi Electric Corp 熱伝導基材、及びその製造方法、並びに該熱伝導基材を有する半導体装置
CN1684786A (zh) * 2002-08-20 2005-10-19 美国挤压研磨公司 铸造方法以及用于进行该方法的制品
TWI220467B (en) * 2003-01-21 2004-08-21 Jau-Ming Chen High efficiency heat dissipation sheet and manufacturing method of the same
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