JP2011508436A5 - - Google Patents

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Publication number
JP2011508436A5
JP2011508436A5 JP2010539830A JP2010539830A JP2011508436A5 JP 2011508436 A5 JP2011508436 A5 JP 2011508436A5 JP 2010539830 A JP2010539830 A JP 2010539830A JP 2010539830 A JP2010539830 A JP 2010539830A JP 2011508436 A5 JP2011508436 A5 JP 2011508436A5
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Japan
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plate
plenum
assembly
channel
base
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JP2010539830A
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JP2011508436A (ja
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Priority claimed from PCT/US2008/087533 external-priority patent/WO2009086013A2/en
Publication of JP2011508436A publication Critical patent/JP2011508436A/ja
Publication of JP2011508436A5 publication Critical patent/JP2011508436A5/ja
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JP2010539830A 2007-12-21 2008-12-18 基板の温度を制御するための方法及び装置 Pending JP2011508436A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1600007P 2007-12-21 2007-12-21
PCT/US2008/087533 WO2009086013A2 (en) 2007-12-21 2008-12-18 Method and apparatus for controlling temperature of a substrate

Publications (2)

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JP2011508436A JP2011508436A (ja) 2011-03-10
JP2011508436A5 true JP2011508436A5 (enExample) 2014-02-20

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JP2010539830A Pending JP2011508436A (ja) 2007-12-21 2008-12-18 基板の温度を制御するための方法及び装置

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US (1) US20090159566A1 (enExample)
JP (1) JP2011508436A (enExample)
KR (1) KR20100103627A (enExample)
CN (1) CN101903996B (enExample)
TW (1) TW200937563A (enExample)
WO (1) WO2009086013A2 (enExample)

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