JP2011507219A5 - - Google Patents

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Publication number
JP2011507219A5
JP2011507219A5 JP2010535188A JP2010535188A JP2011507219A5 JP 2011507219 A5 JP2011507219 A5 JP 2011507219A5 JP 2010535188 A JP2010535188 A JP 2010535188A JP 2010535188 A JP2010535188 A JP 2010535188A JP 2011507219 A5 JP2011507219 A5 JP 2011507219A5
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JP
Japan
Prior art keywords
wafer
substrate
optical
electro
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010535188A
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English (en)
Japanese (ja)
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JP2011507219A (ja
JP5580207B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/CH2008/000487 external-priority patent/WO2009067832A1/en
Publication of JP2011507219A publication Critical patent/JP2011507219A/ja
Publication of JP2011507219A5 publication Critical patent/JP2011507219A5/ja
Application granted granted Critical
Publication of JP5580207B2 publication Critical patent/JP5580207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010535188A 2007-11-27 2008-11-18 ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法 Active JP5580207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US99045107P 2007-11-27 2007-11-27
US60/990,451 2007-11-27
PCT/CH2008/000487 WO2009067832A1 (en) 2007-11-27 2008-11-18 Encapsulated lens stack

Publications (3)

Publication Number Publication Date
JP2011507219A JP2011507219A (ja) 2011-03-03
JP2011507219A5 true JP2011507219A5 (enExample) 2012-01-12
JP5580207B2 JP5580207B2 (ja) 2014-08-27

Family

ID=40350035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010535188A Active JP5580207B2 (ja) 2007-11-27 2008-11-18 ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法

Country Status (7)

Country Link
US (1) US20110031510A1 (enExample)
EP (1) EP2220684A1 (enExample)
JP (1) JP5580207B2 (enExample)
KR (1) KR101575915B1 (enExample)
CN (1) CN101990711B (enExample)
TW (1) TWI502693B (enExample)
WO (1) WO2009067832A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP5352392B2 (ja) 2009-09-14 2013-11-27 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
US8982269B2 (en) 2010-09-27 2015-03-17 Omnivision Technologies, Inc. Mechanical assembly for fine focus of a wafer-level camera module, and associated methods
EP2735029B1 (en) 2011-07-19 2022-12-21 Heptagon Micro Optics Pte. Ltd. Method for manufacturing passive optical components, and devices comprising the same
SG2014005805A (en) 2011-08-10 2014-06-27 Heptagon Micro Optics Pte Ltd Opto-electronic module and method for manufacturing the same
US20140307081A1 (en) * 2011-08-25 2014-10-16 Heptagon Micro Optics Pte. Ltd. Wafer-level fabrication of optical devices, in particular of modules for computational cameras
WO2013049947A1 (en) * 2011-10-05 2013-04-11 Hartmut Rudmann Micro-optical system and method of manufacture thereof
SG11201403240UA (en) * 2011-12-22 2014-07-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules, in particular flash modules, and method for manufacturing the same
US8791489B2 (en) * 2012-04-05 2014-07-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module
TWI624040B (zh) * 2012-08-20 2018-05-11 Heptagon Micro Optics Pte. Ltd. 光學晶圓之製造
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
KR102135492B1 (ko) * 2012-12-27 2020-07-20 헵타곤 마이크로 옵틱스 피티이. 리미티드 광학 소자의 제조 및 이를 통합한 모듈
CN103050502A (zh) * 2012-12-28 2013-04-17 格科微电子（上海）有限公司 晶圆级镜头模组阵列、阵列组合及两者的制作方法
US9746349B2 (en) 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9921393B2 (en) * 2014-09-04 2018-03-20 Omnivision Technologies, Inc. Wafer-level methods for making apertured lenses involving sequential layering of biplanar transparent film, opaque layer, spacer wafer, and lens wafer
US11808959B2 (en) * 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

Family Cites Families (21)

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Publication number Priority date Publication date Assignee Title
JPS6242558A (ja) * 1985-08-20 1987-02-24 Matsushita Electronics Corp 固体撮像装置
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6096155A (en) * 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US6381072B1 (en) * 1998-01-23 2002-04-30 Proxemics Lenslet array systems and methods
US6426829B1 (en) * 1998-03-26 2002-07-30 Digital Optics Corp. Integrated micro-optical systems
JPH11330442A (ja) * 1998-05-20 1999-11-30 Sony Corp 光学装置
JP2000314876A (ja) * 1999-04-28 2000-11-14 Hitachi Ltd 液晶表示素子および液晶表示装置
US6285064B1 (en) * 2000-03-28 2001-09-04 Omnivision Technologies, Inc. Chip scale packaging technique for optical image sensing integrated circuits
JP2002252338A (ja) * 2000-12-18 2002-09-06 Canon Inc 撮像装置及び撮像システム
JP2002368235A (ja) 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002290842A (ja) * 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
JP4190204B2 (ja) * 2002-05-16 2008-12-03 オリンパス株式会社 接合レンズアレイ
US7564496B2 (en) 2002-09-17 2009-07-21 Anteryon B.V. Camera device, method of manufacturing a camera device, wafer scale package
JP2004233483A (ja) * 2003-01-29 2004-08-19 Sanyo Electric Co Ltd カメラモジュール
KR20060113902A (ko) * 2003-10-27 2006-11-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 카메라 모듈 및 그 제조 방법과, 이동 전화기 또는 ｐｄａ
KR100539259B1 (ko) * 2004-04-26 2005-12-27 삼성전자주식회사 자동으로 정렬되는 렌즈를 포함하는 이미지 센서 모듈, 그제조방법 및 렌즈의 자동 초점 조절방법
JP4421962B2 (ja) * 2004-07-13 2010-02-24 カンタツ株式会社 携帯電話搭載用小型撮像モジュール
US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
JP5292291B2 (ja) * 2006-07-17 2013-09-18 デジタルオプティクス・コーポレイション・イースト カメラシステムの作製方法
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package

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