JP2011251345A5 - - Google Patents

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Publication number
JP2011251345A5
JP2011251345A5 JP2011204016A JP2011204016A JP2011251345A5 JP 2011251345 A5 JP2011251345 A5 JP 2011251345A5 JP 2011204016 A JP2011204016 A JP 2011204016A JP 2011204016 A JP2011204016 A JP 2011204016A JP 2011251345 A5 JP2011251345 A5 JP 2011251345A5
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JP
Japan
Prior art keywords
beam irradiation
protective sheet
laser beam
assist gas
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011204016A
Other languages
Japanese (ja)
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JP2011251345A (en
JP5360177B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011204016A priority Critical patent/JP5360177B2/en
Priority claimed from JP2011204016A external-priority patent/JP5360177B2/en
Publication of JP2011251345A publication Critical patent/JP2011251345A/en
Publication of JP2011251345A5 publication Critical patent/JP2011251345A5/ja
Application granted granted Critical
Publication of JP5360177B2 publication Critical patent/JP5360177B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (1)

レーザビームの照射およびアシストガスの吹き付けを行う開口部を備え、
表面に保護シートを貼り付けた板状の金属材料を一度のレーザビームの照射により加工を行う際の前記保護シートの粘着力Ｆ［Ｎ／２０ｍｍ］に対し、前記アシストガスの圧力が０．３×Ｆ［ＭＰａ］以下であることを特徴とするレーザ加工ヘッド。
Provided with an opening for laser beam irradiation and assist gas spraying,
The pressure of the assist gas is 0.3 with respect to the adhesive force F [N / 20 mm] of the protective sheet when processing the plate-like metal material with the protective sheet attached to the surface by one-time laser beam irradiation. A laser processing head characterized in that it is equal to or less than F [MPa].
JP2011204016A 2005-06-27 2011-09-20 Laser processing method and laser processing head Expired - Fee Related JP5360177B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011204016A JP5360177B2 (en) 2005-06-27 2011-09-20 Laser processing method and laser processing head

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005186047 2005-06-27
JP2005186047 2005-06-27
JP2011204016A JP5360177B2 (en) 2005-06-27 2011-09-20 Laser processing method and laser processing head

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006551667A Division JP4978195B2 (en) 2005-06-27 2006-06-20 Laser processing method and laser processing head

Publications (3)

Publication Number Publication Date
JP2011251345A JP2011251345A (en) 2011-12-15
JP2011251345A5 true JP2011251345A5 (en) 2012-07-12
JP5360177B2 JP5360177B2 (en) 2013-12-04

Family

ID=37595169

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2006551667A Expired - Fee Related JP4978195B2 (en) 2005-06-27 2006-06-20 Laser processing method and laser processing head
JP2011204015A Expired - Fee Related JP5360176B2 (en) 2005-06-27 2011-09-20 Laser processing method and laser processing head
JP2011204016A Expired - Fee Related JP5360177B2 (en) 2005-06-27 2011-09-20 Laser processing method and laser processing head

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP2006551667A Expired - Fee Related JP4978195B2 (en) 2005-06-27 2006-06-20 Laser processing method and laser processing head
JP2011204015A Expired - Fee Related JP5360176B2 (en) 2005-06-27 2011-09-20 Laser processing method and laser processing head

Country Status (5)

Country Link
JP (3) JP4978195B2 (en)
KR (1) KR100853073B1 (en)
CN (3) CN100513049C (en)
TW (1) TWI295206B (en)
WO (1) WO2007000915A1 (en)

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US20100078418A1 (en) * 2008-09-26 2010-04-01 Electro Scientific Industries, Inc. Method of laser micro-machining stainless steel with high cosmetic quality
CN102510788B (en) 2010-06-14 2014-12-24 三菱电机株式会社 Laser processing device and laser processing method
GB2482190A (en) * 2010-07-23 2012-01-25 New Transducers Ltd Methods of generating a desired haptic sensation in a touch sensitive device
JP6260136B2 (en) * 2013-08-07 2018-01-17 株式会社Ｇｓユアサ Storage element manufacturing method and storage element
CN103978312A (en) * 2014-04-16 2014-08-13 苏州萃田精密机械有限公司 Aluminum sheet surface groove machining device
CN104043904A (en) * 2014-06-09 2014-09-17 江苏大学 Back side-blown gas-assisted laser cutting method and device
DE102015215316A1 (en) * 2015-08-11 2016-06-30 Schuler Automation Gmbh & Co. Kg Method for producing a metal sheet by means of laser cutting and use of a plastic film
JP6315634B2 (en) 2016-05-18 2018-04-25 株式会社アマダホールディングス Combined machining system and laser cutting method
CN109759728B (en) * 2019-01-23 2020-08-14 西安交通大学 Method for improving micropore morphology by adding protective layer
CN109877448A (en) * 2019-03-20 2019-06-14 大族激光科技产业集团股份有限公司 A kind of system of processing and processing method of flexibility membrane material
CN114888454A (en) * 2022-05-25 2022-08-12 深圳市杰普特光电股份有限公司 Cutting method of battery pole piece

Family Cites Families (17)

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Publication number Priority date Publication date Assignee Title
JPH0543994Y2 (en) * 1985-07-19 1993-11-08
JPH02286327A (en) * 1989-04-28 1990-11-26 Amada Co Ltd Metal plate for laser processing
DE4437795C2 (en) * 1993-10-21 1996-12-12 Mitsubishi Electric Corp Processing head with main and auxiliary gas nozzles for a laser processing device and laser processing device
JP3405799B2 (en) * 1994-03-04 2003-05-12 ファナック株式会社 Laser processing method
JP3512634B2 (en) * 1998-05-11 2004-03-31 三菱電機株式会社 LASER PROCESSING METHOD, LASER WORKED PRODUCTION METHOD, LASER PROCESSING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM CONTAINING A PROGRAM FOR CAUSING COMPUTER TO EXECUTE LASER PROCESSING OR LASER WORKED PRODUCTION METHOD
JP4366534B2 (en) * 2000-02-01 2009-11-18 澁谷工業株式会社 Laser processing method
JP4304808B2 (en) * 2000-02-04 2009-07-29 澁谷工業株式会社 Laser processing method
JP4221540B2 (en) * 2000-06-27 2009-02-12 澁谷工業株式会社 Laser processing method and apparatus
JP3425425B2 (en) * 2000-07-07 2003-07-14 日本車輌製造株式会社 Laser cutting machine for ultra-thin metal plates
US6423928B1 (en) * 2000-10-12 2002-07-23 Ase Americas, Inc. Gas assisted laser cutting of thin and fragile materials
JP2002283088A (en) * 2001-03-23 2002-10-02 Sumitomo Heavy Ind Ltd Method for preventing backside flaw in laser beam machining and laser beam machining device
TW524726B (en) * 2001-04-23 2003-03-21 Furukawa Electric Co Ltd Adhesive tape for laser dicing
JP2004322157A (en) * 2003-04-25 2004-11-18 Nitto Denko Corp Working method for work and tacky adhesive sheet used for the same
CN1579697A (en) * 2003-08-07 2005-02-16 鸿富锦精密工业（深圳）有限公司 Laser working method
CN1704213A (en) * 2004-05-28 2005-12-07 宝丽科技集团有限公司 Fragile work piece cutting equipment with double nozzle
JP4873863B2 (en) * 2005-01-14 2012-02-08 日東電工株式会社 Manufacturing method of laser processed product and pressure-sensitive adhesive sheet for laser processing
JP2006255728A (en) * 2005-03-15 2006-09-28 Amada Co Ltd Laser beam-machining apparatus and laser beam-machining method

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