CN1579697A - Laser working method - Google Patents
Laser working method Download PDFInfo
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- CN1579697A CN1579697A CN 03140143 CN03140143A CN1579697A CN 1579697 A CN1579697 A CN 1579697A CN 03140143 CN03140143 CN 03140143 CN 03140143 A CN03140143 A CN 03140143A CN 1579697 A CN1579697 A CN 1579697A
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- workpiece
- laser
- laser processing
- polyimide layer
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Abstract
The invention refers to a kind of laser processing method. At first a protecting coat which is polyimide layer is laid on the surface of the workpiece. And then the work such as stiletto is carried out at the workpiece, after which scour off the polyimide layer with acetone or phenols solutions. Because of the protection of the polyimide layer, the particles and dusts produced in the laser processing will sediment at the surface of the protection layer but the workpiece. We can get perfect workpiece surface after wipe off the protection layer.
Description
[technical field]
The invention relates to a kind of laser processing, particularly about a kind of laser processing of free of surface defects.
[background technology]
Laser is the new light sources of the sixties in 20th century.Owing to having characteristics such as good directionality, brightness height, monochromaticity be good, laser is used widely.Laser processing is that laser is used one of the most rising field, has developed more than 20 kind of laser processing technology now.The spatial control of laser and time are controlled fine, and is all very big to the degree of freedom of material, shape, size and the processing environment of processing object, is specially adapted to automatization processing.Laser-processing system combines with computer numerical control technology can constitute the high-efficient automatic processing units, has become enterprise and has carried out the gordian technique of in good time producing.
Laser processing be with laser beam irradiation to the surface of workpiece, with the high-energy of laser beam excise, molten material and change body surface performance.Because laser processing is non-contact type processing, instrument can with the direct friction generation resistance in the surface of workpiece, so the speed of laser processing is exceedingly fast, processing object is influenced by heat scope is less and can not produce noise.
Laser processing can be divided into LASER HEAT processing and photochemistry processing (claiming cold working again) substantially.LASER HEAT processing refers to cause rapid heating that when laser beam irradiation arrives body surface heating power changes Properties of Objects or the material fusion is evaporated.
Based on the These characteristics and the advantage of laser processing, laser processing obtains widespread use in field of machining.
Fig. 1 is existing a kind of laser boring synoptic diagram, and laser beam forms hole 12 ' with workpiece 10 ' material melts after directly squeezing into workpiece 10 '.Yet, because when the high-energy-density laser beam is squeezed into workpiece 10 ', hole 12 ' the periphery on workpiece 10 ' surface is because the accumulation of molten material forms nodular texture 101 ', and the material of fusing may spill in the hole 12 ' and form particulate 103 ' at workpiece surface, and influences the smooth finish on workpiece 12 surfaces.
Influence the shortcoming of workpiece surface finish at above-mentioned molten material, the Taiwan patent announcement discloses a kind of design of adopting silicon oxide or silicon nitride to make the workpiece sealer No. 400555.Yet, the protective layer that forms above-mentioned materials is generally reached by chemical vapor deposition (CVD) technology, and in chemical vapor deposition process, can produce some comprise have toxicity, the gas of corrodibility, explosivity, pyrophoricity, combustion-supporting property etc., thereby this processing procedure has certain danger and contaminative, and the chemical vapor depsotition equipment costliness; When removing the protective layer of these silicon oxide or silicon nitride; need by the wet etching processing procedure; the wet etching processing procedure is to use chemical solution; via chemical reaction to reach the etching purpose; yet the chemical solution of etching oxidation silicon or silicon nitride comprises the acidic solution with severe corrosive; can produce some poisonous and corrosive waste liquids, and need special-purpose etching machines.
Moreover existing laser processing generally needs to carry out at the sealing dust-free workshop, its objective is that minimizing dust or other extraneous factor produce detrimentally affect to the metallic surface quality.
[summary of the invention]
Technical problem to be solved by this invention is: provide a kind of manufacturing deficiency or extraneous factor of preventing that workpiece surface is produced dysgenic laser processing.
The present invention solves the problems of the technologies described above by the following technical programs: at first form a protective layer at workpiece surface; this protective layer is a polyimide layer; utilize operations such as laser beam punches again, afterwards with this polyimide layer being removed as acetone, phenol solvent.Because the protection of polyimide layer is arranged, and particulate that produces during laser processing and extraneous dust etc. will be deposited on the protective layer surface, and can not be deposited on workpiece surface, treat to obtain the ideal workpiece surface with after this protective layer removal.
By above-mentioned embodiment, can obtain good workpiece surface, and polyimide is an industry material commonly used, and price is lower; In addition, can be with the common workshop that moves to that needs in the closed job-shop, to process habitually in the past, thus reduced production cost; Moreover, owing to being adopts the chemical solvents dissolving to remove polyimide layer, during can not produce chemical reaction, not pollution and operational safety, and must can not finish by specific equipment.
[description of drawings]
Fig. 1 is the synoptic diagram of existing laser processing workpiece.
Fig. 2 to Fig. 4 is the synoptic diagram that adopts laser processing processing work of the present invention.
[embodiment]
See also Fig. 2; at first at the coating surface layer protective layer of workpiece 10; this protective layer is a polyimide layer 102, and this polyimide layer 102 can be reached by immersion plating (dip-coating) or rotary coating methods such as (spin-coating), and these polyimide layer 102 thickness are 500 dusts to 500 micron.
See also Fig. 3, when utilizing a laser machine 20 on workpiece 10, to carry out perforation processing, laser beam is at first with polyimide layer 102 fusings and gasification, afterwards with 10 fusings of the workpiece under the polyimide layer 102, form hole 12, the molten material of this workpiece 10 scatters and forms particulate 103 to polyimide layer 102 surfaces.
See also Fig. 4, after hole 12 machines, by acetone solvent or phenol solvent such as cresols etc. polyimide layer 102 dissolvings on workpiece 10 surfaces are removed, particulate 103 on this polyimide layer 102 and (or) extraneous dust etc. removed simultaneously, then can obtain the workpiece 10 of defective such as the no particulate 103 in surface.
By above-mentioned embodiment, can obtain good workpiece surface, and owing to be to adopt the chemical solvents dissolving to remove polyimide layer, during can not produce chemical reaction, do not pollute, and operational safety, and must can not finish by specific equipment; And the processing that habitually in the past needs to carry out in the closed job-shop can be moved to common workshop, thereby reduce production cost; Moreover because the polyimide material commonly used that is industry, price is lower and obtain easily, thereby cost is lower.
In the above-mentioned embodiment, this workpiece 10 can be metallic substance or non-metallic material, also can adopt the multiple processing mode that comprises engraving (engraving), cutting (cutting) etc. to workpiece 10.This laser is: Nd:YAG laser, UV YAG laser, Nd:YVO
4And CO
2Laser etc.
Claims (10)
1. laser processing, it may further comprise the steps: a workpiece is provided; On this workpiece, form a protective layer; Utilize laser beam that workpiece is processed; And remove this protective layer, it is characterized in that: this protective layer is a polyimide layer.
2. laser processing as claimed in claim 1 is characterized in that: this polyimide layer thickness is between between 500 dusts to 500 micron.
3. laser processing as claimed in claim 2 is characterized in that: this polyimide layer forms by technologies such as immersion plating or rotary coating.
4. laser processing as claimed in claim 1 is characterized in that: by acetone or phenol solvent this polyimide layer is removed.
5. laser processing as claimed in claim 1 is characterized in that: this laser is: Nd:YAG laser, UV YAG laser, Nd:YVO
4Or CO
2Laser.
6. laser processing, it may further comprise the steps: a workpiece is provided; On this workpiece, form a protective layer; Provide a laser machine that workpiece is processed; And remove this protective layer, it is characterized in that: be by this protective layer of a kind of removal of solvents.
7. laser processing as claimed in claim 6 is characterized in that: this protective layer is a polyimide layer, and this solvent is acetone or phenol solvent.
8. laser processing as claimed in claim 7 is characterized in that: this phenol solvent is a cresols.
9. laser processing as claimed in claim 7 is characterized in that: this polyimide layer forms by technologies such as immersion plating or rotary coating.
10. laser processing as claimed in claim 9 is characterized in that: this polyimide layer thickness is between between 500 dusts to 500 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03140143 CN1579697A (en) | 2003-08-07 | 2003-08-07 | Laser working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03140143 CN1579697A (en) | 2003-08-07 | 2003-08-07 | Laser working method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1579697A true CN1579697A (en) | 2005-02-16 |
Family
ID=34579259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03140143 Pending CN1579697A (en) | 2003-08-07 | 2003-08-07 | Laser working method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1579697A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980816A (en) * | 2008-03-26 | 2011-02-23 | 伊雷克托科学工业股份有限公司 | Laser micromachining through a sacrificial protective member |
| CN101537534B (en) * | 2009-04-20 | 2011-04-06 | 西安天瑞达光电技术发展有限公司 | Superimposing method of circular light spot laser shock strengthening tracks |
| CN102151999A (en) * | 2011-02-10 | 2011-08-17 | 苏州茂立光电科技有限公司 | Method for manufacturing optical microstructure patterns in light guide plate |
| CN102151998A (en) * | 2011-02-10 | 2011-08-17 | 苏州向隆塑胶有限公司 | Method for leveling laser processing crater |
| CN102555518A (en) * | 2010-12-27 | 2012-07-11 | 无锡华润上华科技有限公司 | Marking method for wafer |
| CN101410218B (en) * | 2005-12-27 | 2012-11-21 | 拜尔保健有限公司 | Method of forming a multilayer test sensor |
| CN102151992B (en) * | 2005-06-27 | 2012-11-21 | 三菱电机株式会社 | Laser machining method and laser machining head |
| CN103028848A (en) * | 2012-12-06 | 2013-04-10 | 中国电子科技集团公司第四十一研究所 | Method for machining medium substrate by utilizing laser |
| CN104384708A (en) * | 2014-10-08 | 2015-03-04 | 中国电子科技集团公司第五十五研究所 | Laser processing method of chip packaging shell |
| CN106271046A (en) * | 2016-09-30 | 2017-01-04 | 纳晶科技股份有限公司 | Laser etching method and device, underlayer electrode and electroluminescent device |
| CN106721371A (en) * | 2016-12-07 | 2017-05-31 | 郑州仁宏医药科技有限公司 | It is a kind of to prevent feed addictive of beaver rabbit clostridium welchii disease and preparation method thereof |
| CN107414289A (en) * | 2017-07-27 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of laser-stripping method and laser lift-off system |
| CN109759728A (en) * | 2019-01-23 | 2019-05-17 | 西安交通大学 | A method for improving micropore morphology by adding protective layer |
-
2003
- 2003-08-07 CN CN 03140143 patent/CN1579697A/en active Pending
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102151992B (en) * | 2005-06-27 | 2012-11-21 | 三菱电机株式会社 | Laser machining method and laser machining head |
| CN101410218B (en) * | 2005-12-27 | 2012-11-21 | 拜尔保健有限公司 | Method of forming a multilayer test sensor |
| CN101980816A (en) * | 2008-03-26 | 2011-02-23 | 伊雷克托科学工业股份有限公司 | Laser micromachining through a sacrificial protective member |
| CN101537534B (en) * | 2009-04-20 | 2011-04-06 | 西安天瑞达光电技术发展有限公司 | Superimposing method of circular light spot laser shock strengthening tracks |
| CN102555518A (en) * | 2010-12-27 | 2012-07-11 | 无锡华润上华科技有限公司 | Marking method for wafer |
| CN102151999A (en) * | 2011-02-10 | 2011-08-17 | 苏州茂立光电科技有限公司 | Method for manufacturing optical microstructure patterns in light guide plate |
| CN102151998A (en) * | 2011-02-10 | 2011-08-17 | 苏州向隆塑胶有限公司 | Method for leveling laser processing crater |
| CN103028848A (en) * | 2012-12-06 | 2013-04-10 | 中国电子科技集团公司第四十一研究所 | Method for machining medium substrate by utilizing laser |
| CN104384708A (en) * | 2014-10-08 | 2015-03-04 | 中国电子科技集团公司第五十五研究所 | Laser processing method of chip packaging shell |
| CN106271046A (en) * | 2016-09-30 | 2017-01-04 | 纳晶科技股份有限公司 | Laser etching method and device, underlayer electrode and electroluminescent device |
| CN106271046B (en) * | 2016-09-30 | 2019-08-23 | 纳晶科技股份有限公司 | Laser etching method and device, underlayer electrode and electroluminescent device |
| CN106721371A (en) * | 2016-12-07 | 2017-05-31 | 郑州仁宏医药科技有限公司 | It is a kind of to prevent feed addictive of beaver rabbit clostridium welchii disease and preparation method thereof |
| CN107414289A (en) * | 2017-07-27 | 2017-12-01 | 京东方科技集团股份有限公司 | A kind of laser-stripping method and laser lift-off system |
| CN107414289B (en) * | 2017-07-27 | 2019-05-17 | 京东方科技集团股份有限公司 | A kind of laser-stripping method and laser lift-off system |
| US11084127B2 (en) | 2017-07-27 | 2021-08-10 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Laser lift off method and laser lift off system |
| CN109759728A (en) * | 2019-01-23 | 2019-05-17 | 西安交通大学 | A method for improving micropore morphology by adding protective layer |
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