JPH02286327A - Metal plate for laser processing - Google Patents
Metal plate for laser processingInfo
- Publication number
- JPH02286327A JPH02286327A JP1107504A JP10750489A JPH02286327A JP H02286327 A JPH02286327 A JP H02286327A JP 1107504 A JP1107504 A JP 1107504A JP 10750489 A JP10750489 A JP 10750489A JP H02286327 A JPH02286327 A JP H02286327A
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- protective sheet
- processing
- laser processing
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 38
- 230000001681 protective effect Effects 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 239000002341 toxic gas Substances 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
「発明の１」的］
（産業上の利用分野）
本発明は保護シートを備えたレーザ加工用の金属板に関
する。DETAILED DESCRIPTION OF THE INVENTION [First aspect of the invention] (Field of industrial application) The present invention relates to a metal plate for laser processing provided with a protective sheet.
（従来の技術）
金属板の加工前、あるいは加工後に、板材を集積してお
く場合等において、金属板に傷がつかないようにするた
めに、金属板の表面に保護シートを張着することがある
。従来は保護シートとしてビニル樹脂からなるものを使
用していた。(Prior art) When stacking plate materials before or after processing the metal plate, a protective sheet is pasted on the surface of the metal plate to prevent the metal plate from being scratched. There is. Conventionally, protective sheets made of vinyl resin have been used.
（発明が解決しようとする課題）
しかし、前述のごとき金属板に設けた保護シートは、レ
ーザ光の吸収性が良好でないビニル樹脂かららなるもの
であるために、表面にビニル樹脂からなる保護シートを
張岩した状態のもとて金属板の加工を行う場合において
は、保護シートの切断に時間を要し、保護シートを備え
た金属板の加工に時間がかかるという問題点があった。(Problem to be Solved by the Invention) However, since the protective sheet provided on the metal plate as described above is made of vinyl resin, which does not have good laser light absorption properties, the protective sheet made of vinyl resin on the surface is When processing a metal plate in a state where the protective sheet is covered, there is a problem in that it takes time to cut the protective sheet, and it takes time to process the metal plate provided with the protective sheet.
特に、金属板の枚数が多い場合にはその問題点はより顕
著である。In particular, when the number of metal plates is large, the problem becomes more pronounced.
また、保護シートの材質たるビニル樹脂は熱による収縮
が大きいために、レーザ加１のときに、金属板の加工部
近傍の保護シートが金属板からはがれて、加工部近傍の
金属板が裸出し、裸出部分にスパッタ保護シートの溶融
物が付着してしまった。そのために、所望のレーザ加り
終了後、金属板の表面の付着したスパッタ、保護シート
の溶融物を除去する必要があり、その作業が厄介である
という問題点があった。In addition, the vinyl resin that is the material of the protective sheet has a large shrinkage due to heat, so during laser processing 1, the protective sheet near the processed area of the metal plate peels off from the metal plate, exposing the metal plate near the processed area. , the molten material of the sputter protection sheet adhered to the exposed parts. For this reason, it is necessary to remove the spatter adhering to the surface of the metal plate and the melted material of the protective sheet after the desired laser ablation is completed, which poses a problem in that this work is troublesome.
更に、ビニル樹脂からなる保護シートが加工されている
ときに、有害ガスを発生し、レーザ加工の作業能率が悪
くなるという問題点があった。Furthermore, when the protective sheet made of vinyl resin is being processed, harmful gases are generated, resulting in a problem that the working efficiency of laser processing is reduced.
そこで、本発明は前述のごとき従来の問題点を解決する
ために、比較的短時間にレーザ加工することができ、レ
ーザ加工後においてスパッタ等の除去する必要がないレ
ーザ加工用の金属板を提供することを目的とする。Therefore, in order to solve the above-mentioned conventional problems, the present invention provides a metal plate for laser processing that can be laser processed in a relatively short time and does not require removal of spatter etc. after laser processing. The purpose is to
［発明の構成］
（課題を解決するための手段）
前述のごとき従来の問題点を解決するために、本発明に
おいては、レーザ光の吸収性が良好かつ熱による伸縮が
少ない材質からなる保護シートを表面に張着してなるも
のである。[Structure of the Invention] (Means for Solving the Problems) In order to solve the conventional problems as described above, the present invention provides a protective sheet made of a material that has good laser light absorption and little expansion and contraction due to heat. It is made by pasting on the surface.
（作用）
前記の構成において、保護シートを備えたレーザ加工の
金属板に、レーザ加工を行うべくレーザ光を照射すると
、まずレーザ光の吸収が比較的良好な保護シートが熱さ
れて、次いで保護シートを除いた金属板が熱されてる。(Function) In the above configuration, when a laser beam is irradiated to a laser-processed metal plate provided with a protective sheet to perform laser processing, the protective sheet, which has relatively good laser beam absorption, is first heated, and then the protective sheet is heated. The metal plate except the seat is heated.
したがって、保護シート、保護シートを除いた金属板が
順次レーザ加工されるものである。Therefore, the protective sheet and the metal plate excluding the protective sheet are successively laser processed.
（実施例）
以下、本発明に係る実施例について図面に基づいて説明
する。(Example) Hereinafter, an example according to the present invention will be described based on the drawings.
第１図を参照するに、レーザ加工において、金属板Ｗを
支持するワークテーブル１には、レーザ光ＬＢを照射す
るレーザ加工ヘッド３が設けである。Referring to FIG. 1, in laser processing, a work table 1 that supports a metal plate W is provided with a laser processing head 3 that irradiates a laser beam LB.
レーザ加工前、或はレーザ加工後に金属板Ｗを集積した
場合等において金属板Ｗに傷を付けないために、上記金
属板Ｗの表面にはレーザ光の吸収性が比較的良好かつ熱
による伸縮が少ない材質からなる保護シート５が張着し
である。上記保護シート５は例えばカーボン等を含有し
た紙製の保護シートであり、又はアクリル系のフレキシ
ブル保護シートである。In order to avoid damaging the metal plate W before or after laser processing, when the metal plates W are stacked together, the surface of the metal plate W has a relatively good absorption property for laser light and a material that can be expanded and contracted by heat. A protective sheet 5 made of a material with a small amount of oxidation is attached. The protective sheet 5 is, for example, a paper protective sheet containing carbon or the like, or an acrylic flexible protective sheet.
前述の構成に基づいて本実施例の作用、効果について説
明する。The operation and effects of this embodiment will be explained based on the above-described configuration.
レーザ加工ヘッド３を適宜に操作してワークテーブル１
に支持されたレーザ加工用の金属板Ｗにレーザ光ＬＢを
照射する。これによって、まずレーザ光ＬＢの比較的良
好な保護シート５が熱される。次いで保護シート５を除
いた金属板Ｗが加熱されて加工される。Operate the laser processing head 3 appropriately to set the work table 1.
A laser beam LB is irradiated onto a metal plate W for laser processing supported by a metal plate W for laser processing. As a result, first, the protective sheet 5, which is relatively well received by the laser beam LB, is heated. Next, the metal plate W excluding the protective sheet 5 is heated and processed.
このような作用のもとで、金属板Ｗの表面に張着した保
護シート５が、レーザ光ＬＢの吸収性が比較的良好な材
質からなるものであるために、レーザ光ＬＢを保護シー
ト５に照射すると、比較的短い時間で保護シート５は熱
せられて加工されるものである。したがって、保護シー
ト５の加工に長時間を必要とせず、保護シート５を備え
た金属板Ｗの加工を比較的短時間に行い得るものである
。Under such action, since the protective sheet 5 stuck to the surface of the metal plate W is made of a material that has relatively good absorbency for the laser beam LB, the laser beam LB is absorbed by the protective sheet 5. When exposed to light, the protective sheet 5 is heated and processed in a relatively short period of time. Therefore, processing of the protective sheet 5 does not require a long time, and the metal plate W provided with the protective sheet 5 can be processed in a relatively short time.
また、保護シート５が熱による伸縮が少ない材質からな
るものであるために、加工部近傍の保護シート５が金属
Ｗからはがれることがなく、加工部近傍の金属板Ｗが裸
出しないものである。そのために、レーザ加工のときに
金属板Ｗにスパッタ等が付着することが少なくなるもの
であり、スパッタを取除く工程を必要としないものであ
る。In addition, since the protective sheet 5 is made of a material that does not expand or contract with heat, the protective sheet 5 near the processed area will not peel off from the metal W, and the metal plate W near the processed area will not be exposed. . Therefore, spatter and the like are less likely to adhere to the metal plate W during laser processing, and there is no need for a step to remove spatter.
更に、レーザ加工のときに、保護シート５は有害ガスを
発生しないものであり、作業能率を妨げないものである
。Furthermore, during laser processing, the protective sheet 5 does not generate harmful gases and does not impede work efficiency.
なお、本発明は前述の実施例の説明に限るものではなく
、適宜の変更を行うことによりその（ｔｔＬ種々の態様
で実施可能である。It should be noted that the present invention is not limited to the description of the embodiments described above, but can be implemented in various forms by making appropriate changes.
［発明の効果］
以上のごとき実施例の説明により理解されるように、本
発明によれば、金属板の表面に張着した保護シートが、
レーザ光の吸収性が比較的良好な材質からなるものであ
るために、レーザ光を保護シートに照射すると、比較的
短い時間で保護シートは熱されて加工されるものである
。したがって、保護シートの加工に長時間を必要とせず
、保護シートを備えた金属板の加工を比較的短時間に行
い得るものである。[Effects of the Invention] As understood from the description of the embodiments above, according to the present invention, the protective sheet stuck to the surface of the metal plate has
Since the protective sheet is made of a material that has relatively good absorption of laser light, when the protective sheet is irradiated with laser light, the protective sheet is heated and processed in a relatively short time. Therefore, it is possible to process a metal plate provided with a protective sheet in a relatively short time without requiring a long time to process the protective sheet.
また、保護シートが熱による伸縮が少ない材質からなる
ものであるために、レーザ加工のときに加工部近傍の保
護シートが金属板からはがれて、加工部近傍の金属板が
裸出してしまうことが比較的少ないものである。したが
って、裸出部分にスパッタ等が付着したりすることが比
較的少なくなり、スパッタ等の除去する工程を必要とし
ないものである。Additionally, since the protective sheet is made of a material that does not expand or contract with heat, the protective sheet near the processed area may peel off from the metal plate during laser processing, exposing the metal plate near the processed area. There are relatively few. Therefore, adhesion of spatter and the like to the exposed portion is relatively reduced, and a process for removing spatter and the like is not required.
図面は本発明に係る実施例を説明するものであり、第１
図は本実施例の要部を示す概略機な図である。The drawings are for explaining embodiments according to the present invention.
The figure is a schematic diagram showing the main parts of this embodiment.
Claims (1)
ない材質からなる保護シートを表面に張着してなること
を特徴とするレーザ加工用の金属板。A metal plate for laser processing, characterized in that a protective sheet made of a material that has relatively good absorption of laser light and little expansion and contraction due to heat is adhered to the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1107504A JPH02286327A (en) | 1989-04-28 | 1989-04-28 | Metal plate for laser processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1107504A JPH02286327A (en) | 1989-04-28 | 1989-04-28 | Metal plate for laser processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02286327A true JPH02286327A (en) | 1990-11-26 |
Family
ID=14460885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1107504A Pending JPH02286327A (en) | 1989-04-28 | 1989-04-28 | Metal plate for laser processing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02286327A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011251345A (en) * | 2005-06-27 | 2011-12-15 | Mitsubishi Electric Corp | Laser beam machining method and laser beam machining head |
-
1989
- 1989-04-28 JP JP1107504A patent/JPH02286327A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011251345A (en) * | 2005-06-27 | 2011-12-15 | Mitsubishi Electric Corp | Laser beam machining method and laser beam machining head |
| JP2011251344A (en) * | 2005-06-27 | 2011-12-15 | Mitsubishi Electric Corp | Laser beam machining method and laser beam machining head |
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