JP6315634B2 - Combined machining system and laser cutting method - Google Patents

Description

  The present invention relates to a combined processing system and a laser cutting processing method for performing laser cutting processing on a part to be cut of a work (sheet metal with a coating material) whose back surface is coated with a coating material such as a protective film made of resin.

2. Description of the Related Art In recent years, in the field of sheet metal processing, laser processing machines that perform laser cutting on a portion to be cut of a plate-like workpiece (sheet metal) are widely used. The outline of a general laser beam machine will be described as follows.

  A general laser processing machine includes a processing machine base (processing machine main body), and the processing machine base includes a table unit (table portion) that supports a workpiece so as to be movable in a horizontal direction. Further, the laser processing machine includes a laser irradiation unit (laser irradiation unit) that irradiates laser light toward the surface side of the workpiece to be cut above the table unit. Furthermore, the laser processing machine includes a workpiece moving unit (work moving unit) that moves the workpiece in the horizontal direction relative to the irradiation position of the laser irradiation unit.

  Therefore, the work supplied to the laser processing machine is supported by the table unit so as to be movable in the horizontal direction. And while moving a workpiece | work relatively to a horizontal direction with respect to the irradiation position of a laser irradiation unit by a workpiece moving unit, a laser beam is irradiated toward the to-be-cut | disconnected part of a workpiece | work by a laser irradiation unit. Thereby, the laser cutting process can be performed on the part to be cut of the workpiece.

  In addition, there exist some which are shown to patent document 1 and patent document 2 as a prior art relevant to this invention.

International Publication No. 2007/000915 International Publication No. 2011/158617

  By the way, for reasons such as preventing the back surface of the workpiece (sheet metal) from being damaged, a protective film made of resin may be coated (attached) to the back surface of the workpiece as an example of a coating material. In addition, when laser cutting is performed on the workpiece to be cut (sheet metal with a covering material) whose protective film is coated on the back side, dross is generated on the back side and cut surface of the work. Removal of dross is necessary as a post-processing afterwards, resulting in complicated operations.

  On the other hand, by slowing down the cutting speed, it is possible to suppress dross from occurring on the back side and the cut surface of the work (sheet metal with covering material) to some extent, but it is not possible to prevent it from occurring completely. In addition, by reducing the cutting speed, the productivity of laser cutting processing of the workpiece is reduced.

  The technique described in Patent Document 1 suppresses dross with a protective film made of a specific material, and does not suppress dross without depending on the material of the protective film. In the technique described in Patent Document 2, laser cutting is performed twice (rough machining and finishing) on the workpiece along substantially the same movement path (machining path), leading to an increase in machining cost. Like the technique described in Patent Document 1, the technique described in Patent Document 2 does not depend on the material of the protective film and does not suppress dross.

  The above-described problem is also caused when laser cutting is performed on a part to be cut of a workpiece (sheet metal with a coating material) whose back surface is coated with another coating material such as a black skin or a plating film instead of the protective film. It happens in the same way.

  Accordingly, an object of the present invention is to provide a composite processing system and a laser cutting processing method having a novel configuration that can solve the above-described problems.

  As a result of repeated trial and error, the inventor of the present application, as a result of repeating trial and error, before irradiating a laser beam toward a cut portion of a work (sheet metal with a covering material) coated with a protective film on the back surface By forming a notch on the back side of the cut part of the work and exposing the base material part of the work from the covering material, the cutting speed is slowed down or a covering material of a specific material is used. In addition, a new finding that dross can be prevented from occurring on the back side and the cut surface of the workpiece can be obtained, and the present invention has been completed (see Examples described later).

A first aspect of the present invention is a combined processing system that performs laser cutting on a part to be cut of a workpiece (sheet metal with a covering material) coated with a coating material on the back surface side of the workpiece to be cut. A laser irradiation unit (laser irradiation unit) that irradiates a laser beam toward the surface, a cut formation unit (cut formation unit) that forms a cut on the back side of the cut portion of the workpiece by a cutter, and a workpiece of the laser irradiation unit Before irradiating the laser beam toward the surface side of the workpiece to be cut, the workpiece moving unit (work moving unit) that moves in the horizontal direction relative to the irradiation position and the formation position of the notch forming unit, forming a notch on the back side of the cut portion of the workpiece by the cutter to expose the base metal portion of the workpiece from the coating material, the operation of the cut forming unit and the workpiece movement unit Gosuru control unit (control unit), is that provided with the.

  According to the first aspect of the present invention, before the laser beam is irradiated toward the surface side of the workpiece to be cut, the control unit controls the operations of the incision forming unit and the workpiece moving unit as described above. To do. Then, while moving the workpiece in the horizontal direction relative to the formation position of the notch forming portion by the workpiece moving portion, the notch forming portion forms a notch on the back side of the workpiece to be cut. The base material portion can be exposed from the covering material on the back side of the cut portion.

  Subsequently, while moving the workpiece in the horizontal direction relative to the irradiation position of the laser irradiation unit by the workpiece moving unit, the laser irradiation unit irradiates a laser beam toward the workpiece to be cut. it can. Thereby, the laser cutting process can be performed on the part to be cut of the workpiece.

  As described above, after the base material portion on the back surface side of the workpiece to be cut is exposed from the covering material, the laser beam is irradiated toward the workpiece to be cut. Therefore, even if the cutting speed is not slowed down, it is possible to perform laser cutting on the cut portion of the workpiece while preventing dross from occurring on the back surface side and the cutting surface of the workpiece.

According to a second aspect of the present invention, there is provided a laser cutting method for performing a laser cutting process on a part to be cut of a workpiece (sheet metal with a coating material) whose back surface is coated with a coating material, the workpiece being cut by a cutter. By forming a notch on the back side of the workpiece, the base material portion of the workpiece to be cut is exposed from the coating material on the back side of the workpiece to be cut, and laser light is emitted toward the surface of the workpiece to be cut. It is to irradiate.

According to the 2nd aspect of this invention, after exposing the base material part of a workpiece | work from a coating | covering material in the back surface side of the to-be-cut | disconnected part of a workpiece | work, the laser beam is irradiated toward the to-be-cut | disconnected part of a workpiece | work. Therefore, even if the cutting speed is not slowed down, laser cutting is performed on the workpiece to be cut while preventing dross from occurring on the back side and cutting surface of the workpiece regardless of the material of the covering material. It can be carried out.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that a dross generate | occur | produces on the back surface side of a workpiece | work, a cut surface, etc. by laser cutting, and can improve the process quality of a workpiece | work. In addition, according to the present invention, it is possible to improve work efficiency by reducing post-processing after laser cutting of a workpiece while increasing productivity of workpiece cutting. Furthermore, according to the present invention, it is not necessary to use a specific covering material, and the processing cost of laser cutting can be reduced.

FIG. 1 is a side view of a multi-tasking machine according to the first and second embodiments of the present invention, in which a part of a support frame is broken. FIG. 2 is a view taken along line II-II in FIG. 3A is a view of the work (sheet metal with a covering material) as viewed from the front surface side, and FIG. 3B is a view of the work as viewed from the back surface side. FIG. 4 is a cross-sectional view along the Y-axis direction around the mold set of the cut forming unit in the multi-tasking machine according to the first embodiment of the present invention, and the upper mold for forming the cut is represented by the appearance. Yes. FIG. 5 is a cross-sectional view along the X-axis direction around the mold set of the cut forming unit in the multi-tasking machine according to the first embodiment of the present invention, and the upper mold for forming the cut is represented by the appearance. Yes. FIG. 6A is a view showing a state in which the base material portion is exposed from the covering material on the back surface side of the cut portion of the workpiece (sheet metal with covering material), and FIG. 6B is a view in FIG. FIG. 6C is an enlarged view of the arrow view part VIB, and is a view along the VIC-VIC in FIG. FIG. 7 is a control block diagram showing a control unit according to the first and second embodiments of the present invention. FIGS. 8A, 8B, 8C, 8D, and 8E are schematic views showing the operation of the die set in the incision forming unit, and the upper die for incision formation is represented by the appearance. FIG. 9 is a flowchart for explaining a laser cutting method according to the first and second embodiments of the present invention. FIG. 10 is a cross-sectional view along the Y-axis direction around the mold set of the cut forming unit in the multi-task machine according to the second embodiment of the present invention, and the upper mold for forming the cut is represented by the appearance. Yes. FIG. 11 is a cross-sectional view along the X-axis direction around the die set of the notch forming unit in the multi-tasking machine according to the second embodiment of the present invention, and the upper die for forming the notch is represented by appearance. Yes. FIG. 12 is a schematic diagram showing a characteristic part of the second embodiment of the present invention. FIG. 13 is a schematic diagram showing a characteristic part of Modification 1 of the second embodiment of the present invention. FIG. 14 is a schematic diagram showing a characteristic part of Modification 2 of the second embodiment of the present invention. FIG. 15 shows a state in which a pre-cut is formed at the end point position on the back side of the cut portion of the work (sheet metal with a covering material) or a position in front of it as a characteristic part of the third modification of the second embodiment of the present invention. FIG. FIG. 16 is a table showing the results of Examples (Examples 1 to 5) and Comparative Examples.

  A first embodiment, a second embodiment (including modifications 1 to 3), and examples of the present invention will be sequentially described with reference to the drawings.

  In the specification and claims of the present application, “provided” means not only being provided directly but also indirectly provided via a separate member, Is synonymous. “Providing” means to provide indirectly through another member in addition to providing directly, and is synonymous with “providing”. “Composite processing system” means to include both a single composite processing machine and a processing system composed of a plurality of processing machines. The “X-axis direction” is a horizontal direction that is one of the horizontal directions. The “Y-axis direction” is the front-rear direction that is one of the horizontal directions. In the drawings, “FF” is the forward direction, “FR” is the backward direction, “L” is the left direction, “R” is the right direction, “U” is the upward direction, and “D” is the upward direction. Pointing down each.

(First embodiment of the present invention)
A first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 to 3 (a) and 3 (b), the composite processing machine (composite processing system) 1 according to the embodiment of the present invention covers a back surface with a protective film Wf made of resin as an example of a covering material. Laser cutting is performed on a plurality of cut portions Wa of a plate-shaped workpiece (sheet metal with a covering material) W. The plurality of cut portions Wa of the workpiece W are, for example, straight portions that form the contours of the product M taken out from the workpiece W and a part Ma of the product M. Although illustration is omitted, the cut portion Wa of the workpiece W may be a curved portion constituting the contour of the product M or a part Ma of the product M. In addition to the workpiece W, the multi-task machine 1 can be used for laser cutting of a normal workpiece (not shown) that does not have the protective film Wf. FIG. 3A shows a state where the workpiece W is viewed from the front surface side, and FIG. 3B shows a state where the workpiece W is viewed from the back surface side.

  The multi-tasking machine 1 includes a processing machine base (processing machine main body) 3. The processing machine base 3 includes a bridge frame (bridge-type main body frame) 5 extending in the Y-axis direction and an X of the bridge frame 5. It has the support frame 7 provided in the both sides (right-and-left both sides) of an axial direction, respectively. The bridge frame 5 includes a lower frame 9 extending in the Y-axis direction and an upper frame 11 provided facing the lower frame 9 in the vertical direction and extending in the Y-axis direction.

The multi-tasking machine 1 includes a table unit (table unit) 13 that supports the workpiece W so as to be movable in the X-axis direction and the Y-axis direction. The specific configuration of the table unit 13 is as follows.
The lower frame 9 includes a fixed table 15 on the upper side thereof that supports the workpiece W so as to be movable in the X-axis direction and the Y-axis direction. In addition, each support frame 7 includes a movable table 17 that supports the workpiece W so as to be movable in the X-axis direction so as to be movable in the Y-axis direction. In other words, the processing machine base 3 includes the movable tables 17 on both sides of the fixed table 15 in the X-axis direction so as to be movable in the Y-axis direction. The fixed table 15 and each movable table 17 have a large number of brushes (not shown) for supporting the workpiece W and a plurality of free ball bearings (not shown) on their upper surfaces.

  The multi-tasking machine 1 includes a laser irradiation unit (laser irradiation unit) 19 that irradiates a laser beam toward the surface side of the workpiece to be cut. The specific configuration of the laser irradiation unit 19 is as follows.

  The upper frame 11 includes a Y-axis slider 21 above the fixed table 15 so as to be movable in the Y-axis direction. The upper frame 11 includes a first Y-axis motor 23 that moves the Y-axis slider 21 in the Y-axis direction. Further, the Y-axis slider 21 includes a laser irradiation head 25 for irradiating the laser beam while injecting an assist gas toward the cut portion of the workpiece W on a side portion thereof. The irradiation position BP of the laser irradiation head 25, in other words, the laser irradiation unit 19 (laser irradiation head 25) moves in the Y-axis direction integrally with the Y-axis slider 21 by driving the first Y-axis motor 23. ing. The height position of the laser irradiation head 25 in the Z-axis direction (vertical direction) can be adjusted.

The laser irradiation head 25 is optically connected to a fiber laser oscillator 27 that oscillates laser light having a wavelength of 1 μm band. The inside of the laser irradiation head 25 is connected to an assist gas supply source (not shown) for supplying assist gas. The laser irradiation head 25 is optically connected to another laser oscillator (not shown) such as a YAG laser oscillator, a CO ₂ laser oscillator, a disk laser oscillator, or a direct diode laser oscillator in place of the fiber laser oscillator 27. May be.

  The fixed table 15 is provided with a long hole 15h extending in the Y-axis direction at a position vertically opposed to the moving region of the laser irradiation head 25 in the Y-axis direction. The long hole 15h is configured to allow the laser light and the assist gas to pass therethrough. The long hole 15h is connected to a collection unit (not shown) for collecting scraps and the like.

  The multi-tasking machine 1 includes a punching unit 29 that punches a workpiece W. The specific configuration of the punching unit 29 is as follows.

  The upper frame 11 is rotatably provided with a circular upper turret 33 that removably supports a plurality of upper dies (punch dies) 31 at a front portion thereof. In the upper turret 33, a plurality of mold holding holes 33h (see FIG. 4) for holding the upper mold 31 are formed. The upper turret 33 is configured such that an arbitrary upper mold 31 can be indexed (positioned) to the punching position PP by its rotation. The lower frame 9 is rotatably provided with a circular lower turret 37 that detachably supports a plurality of lower molds (die molds) 35 at positions facing the upper turret 33 in the vertical direction. In the lower turret 37, a mold holding hole 37h (see FIG. 4) for holding the lower mold 35 is formed. The lower turret 37 is configured such that an arbitrary lower mold 35 can be indexed (positioned) to the punching position PP by its rotation. The upper turret 33 and the lower turret 37 are rotated in synchronization by driving a turret rotation motor (not shown) provided at an appropriate position of the bridge frame 5.

  The upper frame 11 includes a ram 39 that can move up and down (movable in the vertical direction) above the upper turret 33. The ram 39 is moved up and down by driving a ram lifting motor (not shown) or a ram lifting cylinder (not shown) provided at an appropriate position of the upper frame 11. The ram 39 includes a striker 41 on the lower side thereof for pressing (striking) a predetermined upper mold 31 indexed to the punching position PP from above.

  As shown in FIGS. 4 to 7, the punching unit 29 has a mold set 43 for forming a cut S (see FIG. 6A) on the back side of the cut portion Wa of the workpiece W. Yes. The mold set 43 includes an upper mold 31A for forming cuts that is one of the upper molds 31 and a lower mold 35A for forming cuts that is one of the lower molds 35. The specific configuration of the upper mold 31A for forming cuts and the lower mold 35A for forming cuts is as follows.

  The upper die 31A for forming cuts has a punch body (punch body) 45 provided in an appropriate die holding hole 33h of the upper turret 33 so as to be movable up and down. A part (intermediate part) of the punch body 45 is supported by the upper turret 33 via a lifter spring 47. Further, the punch body 45 is integrally provided with a punch head 49 that is pressed by the striker 41 at an upper end portion thereof. The punch main body 45 is provided with a free roller 51 at its lower end as a pressing member that presses a part of the workpiece Wa (see FIG. 6A) of the workpiece W from above. It is rotatable around a horizontal axis 51s. Instead of the free roller 51, a free ball bearing (not shown) may be used as the pressing member. A plurality of free rollers 51 may press the vicinity of a portion of the workpiece W to be cut (including both sides of a portion of the portion to be cut Wa).

  The lower die 35A for forming cuts has a die body (die body) 53 provided in an appropriate die holding hole 37h of the lower turret 37. A concave portion 53 d is formed on one side from the center of the die body 53. A discharge hole 53h for discharging chips C (see FIGS. 8B, 8C, and 8D) is formed on the other side from the center of the die body 53. The discharge hole 53h is formed on the die body 53. It penetrates. The die body 53 includes a chip holder 55 detachably attached to the recess 53d by a set screw 57. The tip holder 55 is provided with a cutting tip 59 as a cutter for cutting the back side of the part to be cut Wa of the workpiece W so as to be attachable and detachable by a set screw 61 at its side. The cutting tip 59 has a blade portion 59 c on its upper end side, and the blade portion 59 c protrudes upward with respect to the upper surface of the die body 53. Instead of the cutting tip 59, for example, another cutter (not shown) having a cutting edge such as a ball end mill may be used.

  The punch main body 45 and the die main body 53 are not shown in the figure, but can be rotated by a mold rotating mechanism (index mechanism) as shown in, for example, Japanese Patent Application Laid-Open Nos. 2007-75889 and 2004-268101. It may be configured.

  Here, the punching unit 29 including the mold set 43 is a cut forming unit that exposes the base material portion Wb of the workpiece W from the protective film Wf by forming a cut S on the back side of the cut portion Wa of the workpiece W. Corresponds to (cut-cut forming portion). The punching position PP of the punching unit 29 corresponds to the forming position of the cut forming unit.

  As shown in FIG. 1 and FIG. 2, the multi-tasking machine 1 makes the workpiece W relative to the irradiation position BP of the laser irradiation unit 19 and the formation position of the notch formation unit 29 (punch processing position of the punch processing unit 29) PP. In particular, a work moving unit (work moving part) 63 for moving in the X-axis direction and the Y-axis direction is provided. The specific configuration of the workpiece moving unit 63 is as follows.

  The pair of movable tables 17 includes a carriage base 65 that can move in the Y-axis direction over the rear part thereof. The carriage base 65 extends in the X-axis direction and is integrally connected to the rear portions of the pair of movable tables 17. The upper frame 11 includes a second Y-axis motor 67 that moves the carriage base 65 in the Y-axis direction integrally with the pair of movable tables 17. Further, the carriage base 65 is provided with a carriage 69 on the front side thereof so as to be movable in the X-axis direction. The carriage base 65 includes an X-axis motor 71 that moves the carriage 69 in the X-axis direction. Furthermore, the carriage 69 is provided with a plurality of clampers 73 for gripping (clamping) the end portion of the workpiece W on the front side thereof.

  As described above, the irradiation position BP of the laser irradiation unit 19 is moved in the Y-axis direction by driving the first Y-axis motor 23. In other words, the first Y-axis motor 23 moves the workpiece W in the Y-axis direction relative to the irradiation position BP of the laser irradiation unit 19, and constitutes a part of the workpiece movement unit 63.

  As shown in FIGS. 1, 2, 6 (a), (b), (c), and FIG. 7, the multi-tasking machine 1 includes an operation of a laser irradiation unit 19, an operation of a punching unit 29, and a workpiece moving unit. A control unit (control unit) 75 for controlling the operation of 63 is provided. The control unit 75 is configured by one or a plurality of computers, and includes a memory that stores a cutting machining program, a laser cutting machining program, and the like, and a CPU that interprets and executes the cutting machining program. Yes. The machining program for cutting is a machining program for forming the cutting S (see FIG. 6A) on the back side of the cut portion Wa of the workpiece W. The laser cutting machining program is a machining program for performing laser cutting on the workpiece Wa of the workpiece W. The machining program for cutting and the machining program for laser cutting are created by an automatic program creation device (not shown).

  The control unit 75 forms a cut S on the back surface side of the cut portion Wa of the workpiece W before irradiating the laser beam toward the surface side of the cut portion Wa of the workpiece W to form a base material portion Wb of the workpiece W. Are controlled from the protective film Wf, the operation of the notch forming unit 29 including the ram lifting motor and the like, and the operation of the workpiece moving unit 63 including the X-axis motor 71 and the second Y-axis motor 67 are controlled.

The control unit 75 has an exposure width j (see FIGS. 6A and 6B) of the base material portion Wb exposed from the protective film Wf on the back surface side of the workpiece Wa to be cut larger than the spot diameter of the laser beam. Thus, the operation of the incision forming unit 29 including the ram lifting motor and the like is controlled. The spot diameter of the laser light is, for example, 0.1 to 0.2 mm in the case of a fiber laser, and m 0.2 to 0.4 mm in the case of a CO ₂ laser. The exposed width j of the base material portion Wb on the back surface side of the workpiece W is smaller than the cut width k of the cut S (see FIG. 6B).

  The control unit 75 controls the operation of the cut forming unit 29 including a ram lifting motor and the like so as to form a cut S that reaches the base material portion Wb on the back side of the cut portion Wa of the workpiece W. In other words, the control unit 75 forms a cut groove Wg (see FIGS. 6B and 6C) having a V-shaped cross section in the base material portion Wb on the back surface side of the cut portion Wa of the workpiece W. It controls the operation of the incision forming unit 29 including a ram lifting motor and the like. Note that the cross-sectional shape of the cut groove Wg may be U-shaped or rectangular instead of V-shaped.

  The control unit 75 controls the X-axis motor so that the relative laser cutting movement path (laser cutting machining path) of the workpiece W is the same as the relative cutting movement path (cutting machining path) of the workpiece W. The operation of the workpiece moving unit 63 including the 71 and the second Y-axis motor 67 is controlled. The relative movement path for laser cutting of the workpiece W refers to the relative movement path of the workpiece W relative to the irradiation position BP of the laser irradiation unit 19 when the laser beam is irradiated toward the workpiece Wa of the workpiece W (processing) Route). In other words, the relative laser cutting movement path of the workpiece W is a relative movement path (laser beam irradiation locus) of the irradiation position BP of the laser irradiation unit 19 with respect to the workpiece W. The relative cutting movement path of the workpiece W is a relative movement path of the workpiece W with respect to the formation position PP of the cutting forming unit 29 when forming the cutting S on the back surface side of the workpiece Wa of the workpiece W (processing) Route). In other words, the relative cutting movement path of the workpiece W is a movement path (trajectory of the cutting S) with respect to the workpiece W at the formation position PP of the cutting formation unit 29.

  Next, the laser cutting method according to the first embodiment of the present invention will be described.

  The laser cutting processing method according to the embodiment of the present invention is a method of performing laser cutting processing on a plurality of cut portions Wa of a plate-like workpiece W whose back surface is covered with a protective film Wf made of resin as an example of a covering material. It is. As shown in FIG. 9, the laser cutting method according to the embodiment of the present invention includes a cut forming process ST1 and a laser irradiation process ST2. And the concrete content of each process in the laser cutting processing method which concerns on embodiment of this invention is as follows.

Cutting formation process ST1
As shown in FIGS. 1, 2, 7, and 9, the workpiece W supplied to the multi-tasking machine 1 is supported by the table unit 13 so as to be movable in the X-axis direction and the Y-axis direction. The end of the workpiece W is gripped by the clamper 73. Further, the control unit 75 controls the turret rotation motor to rotate the upper turret 33 and the lower turret 37 in synchronization with each other so that the upper die 31A and the lower die 35A for incision formation are formed at the position where the incision formation unit 29 is formed. Index (position) PP. Thereby, the preparation for the cutting formation for forming the cutting S in the back surface side of the to-be-cut part Wa of the workpiece | work W can be performed.

  After preparing for the cut formation, as shown in FIGS. 4, 5, 7 and 9, the control unit 75 controls the X-axis motor 71 to move the carriage 69 in the X-axis direction. The control unit 75 controls the second Y-axis motor 67 to move the carriage base 65 integrally with the pair of movable tables 17 in the Y-axis direction. Then, the workpiece W is moved in the X-axis direction and the Y-axis direction with respect to the formation position PP of the incision forming unit 29, and the starting point position on the back surface side of the workpiece Wa of the workpiece W is set to the blade portion 59c of the cutting tip 59. It can be located on the upper side. Note that only one of the X-axis motor 71 and the second Y-axis motor 67 is controlled by the control unit 75, and the workpiece W is cut in the X-axis direction and the Y-axis direction with respect to the formation position PP of the cutting formation unit 29. You may move to either direction.

  Thereafter, as shown in FIGS. 4 to 9, the control unit 75 controls the ram lifting motor and the like to lower the ram 39, thereby pressing the punch head 49 from above with the striker 41. Then, the upper die 31 </ b> A descends against the urging force of the lifter spring 47 and presses a part of the cut portion Wa of the workpiece W by the free roller 51. Then, the operation of the workpiece moving unit 63 is controlled by the control unit 75 as described above, and the workpiece W is moved relative to the forming position PP of the cut forming unit 29 according to the direction along the cut portion Wa. . In other words, the formation position PP of the cut forming unit 29 is moved relative to the workpiece W in a direction along the cut portion Wa of the workpiece W. Then, the cutting S can be formed on the back surface side of the cut portion Wa of the workpiece W by the blade portion 59c of the cutting tip 59 (see FIGS. 8A to 8D). Thereby, the base material part Wb can be exposed from the protective film Wf on the back surface side of the part to be cut Wa of the workpiece W.

  After the cut S is formed on the back surface side of the workpiece Wa of the workpiece W, the ram 39 is lifted by controlling the ram lifting motor and the like by the control unit 75, so that the upper mold 31 </ b> A is moved to the lifter spring 47. It is raised by the urging force (see FIG. 8 (e)).

  Similarly, the operation of the cut forming unit 29 and the operation of the workpiece moving unit 63 are controlled by the control unit 75, so that the workpiece W is moved with respect to the formation position PP of the cut forming unit 29 and all other workpieces W are moved. Cuts S are sequentially formed on the back side of the cut portion Wa. As a result, the base material portion Wb can be exposed from the protective film Wf on the back side of all the cut portions Wa of the workpiece W.

  Here, in the cut forming step ST1, the operation of the cut forming unit 29 is controlled by the control unit 75, and the exposed width j of the base material portion Wb exposed from the protective film Wf on the back surface side of the workpiece W is set to the spot diameter of the laser beam. Is bigger than. Further, the control unit 75 controls the operation of the cut forming unit 29 to form a cut S that reaches the base material portion Wb on the back side of the cut portion Wa of the workpiece W. In other words, the cut groove Wg having a V-shaped cross section is formed in the base material portion Wb on the back surface side of the workpiece Wa to be cut. The chips C generated during the formation of the cut S are discharged (collected) to the outside of the cut forming unit 29 via the discharge hole 53h.

Laser irradiation process ST2
After completion of the notch forming step ST1, as shown in FIGS. 1, 2, 7, and 9, the control unit 75 controls the X-axis motor 71 to move the carriage 69 in the X-axis direction. The first Y-axis motor 23 is controlled by 75 to move the irradiation position BP of the laser irradiation unit 19 in the Y-axis direction. Then, the workpiece W can be moved in the X axis direction and the Y axis direction relative to the irradiation position BP of the laser irradiation unit 19 according to the direction along the cut portion Wa. In other words, the irradiation position BP of the laser irradiation unit 19 can be moved in the X axis direction and the Y axis direction relative to the workpiece W in the direction along the cut portion Wa of the workpiece W. Note that only one of the X-axis motor 71 and the first Y-axis motor 23 is controlled by the control unit 75, and the workpiece W is moved in the X-axis direction relative to the irradiation position BP of the laser irradiation unit 19. It may be moved in any of the Y-axis directions.

  As described above, the operation of the laser irradiation unit 19 is controlled by the control unit 75 while moving the workpiece W relative to the irradiation position BP of the laser irradiation unit 19, and the workpiece W is moved from the tip of the laser irradiation head 25. The laser beam is irradiated while the assist gas is jetted toward the surface side of the part to be cut Wa. At this time, the control unit 75 controls the operation of the workpiece moving unit 63 so that the relative laser cutting movement path of the workpiece W is the same as the relative cutting movement path of the workpiece W. Thereby, the laser cutting process can be performed on the cut portion Wa of the workpiece W while melting the cut portion Wa of the workpiece W and removing the melt.

  Similarly, while moving the workpiece W relative to the irradiation position BP of the laser irradiation unit 19, the operation of the laser irradiation unit 19 is controlled by the control unit 75, and all the other parts to be cut Wa of the workpiece W are controlled. Laser light is sequentially irradiated while assist gas is jetted toward the surface side. Thereby, the laser cutting process can be performed on all the cut portions Wa of the workpiece W. At this time, the product M is detachably connected to the workpiece W by a plurality of joint portions (not shown), or is discharged to the outside of the multi-task machine 1 by a product discharge unit (not shown).

  In the laser cutting processing method according to the embodiment of the present invention, a work W is used by using a cutting machine (not shown) or a cutting tool (not shown) instead of the cutting unit 29. A cut S may be formed on the back side of the cut portion Wa to expose the base material portion Wb from the protective film Wf. Further, if the base material portion Wb can be exposed from the protective film Wf, the cut groove Wg may not be formed in the base material portion Wb on the back surface side of the cut portion Wa of the workpiece W.

  Then, the effect | action and effect of 1st Embodiment of this invention are demonstrated.

  After the base material portion Wb is exposed from the protective film Wf on the back surface side of the workpiece W to be cut, laser light is irradiated toward the surface side of the workpiece W to be cut. Therefore, it is possible to perform laser cutting on the cut portion Wa of the workpiece W while preventing dross from being generated on the back side and the cutting surface of the workpiece W without slowing the cutting speed. Further, laser cutting using the fiber laser oscillator 27 can be performed on the workpiece W without using a protective film dedicated to the fiber laser as the protective film Wf. In particular, since the exposed width j of the base material portion Wb exposed from the protective film Wf in the workpiece W is made larger than the spot diameter of the laser beam, it is ensured that dross is generated on the back surface side and the cut surface of the workpiece W. Can be prevented.

  Since the incision S reaching the base material part Wb is formed on the back surface side of the part to be cut Wa of the work W, the chips C generated during the formation of the incision S include the component of the base material part Wb of the work W. .

  Therefore, according to the first embodiment of the present invention, as described above, it is possible to reliably prevent dross from occurring on the back side and the cut surface of the workpiece W without slowing down the cutting speed. Laser cutting processing can be performed on the cut portion Wa of W. Therefore, according to 1st Embodiment of this invention, the post-process after the laser cutting process of the workpiece | work W can be reduced and the work efficiency can be improved, improving the productivity of the cutting process of the workpiece | work W. FIG.

  In addition, according to the first embodiment of the present invention, as described above, laser cutting using the fiber laser oscillator 27 is performed on the workpiece W without using a protective film dedicated to the fiber laser as the protective film Wf. It can be carried out. Therefore, according to the first embodiment of the present invention, the processing cost of laser cutting using the fiber laser oscillator 27 can be reduced.

  Furthermore, according to the first embodiment of the present invention, as described above, the chips C generated during the formation of the cut S include the component of the base material portion Wb of the workpiece W. Therefore, according to the first embodiment of the present invention, the chips C can be efficiently discharged to the outside from the discharge holes 53h of the die body 53.

  Further, according to the first embodiment of the present invention, the relative laser cutting movement path of the workpiece W is set to be the same as the relative cutting movement path of the workpiece W as described above. Therefore, according to the first embodiment of the present invention, when one machining program of the cutting machining program and the laser cutting machining program is created, the data of the movement path of the other machining program can be used. This makes it possible to shorten the overall machining program creation time. Further, by specifying one relative movement path of the workpiece W, it is possible to create a cutting machining program and a laser cutting machining program.

(Second embodiment of the present invention)
A second embodiment of the present invention will be described with reference to FIGS. 1, 2, 7, and 9 to 12. FIG.

  As shown in FIGS. 1, 2, 10, and 11, the combined processing machine (combined processing system) 1 </ b> A according to the second embodiment of the present invention is the same as the combined processing machine 1 according to the embodiment of the present invention. Of the configuration of the combined processing machine 1A, only the configuration different from the combined processing machine 1 will be described. In addition, about the component corresponding to the component in the multi-function machine 1 among the some component in the multi-function machine 1A, the same code | symbol is attached | subjected in drawing.

  As shown in FIGS. 10 and 11, the incision forming unit 29 has an upper mold rotating mechanism (upper index mechanism) 77 for rotating the upper mold 31A for incision formation indexed to the formation position PP. . The specific configuration of the upper mold rotating mechanism 77 is as follows.

  The upper turret 33 is provided with a cylindrical (annular) upper rotating holder 79 in an appropriate mold holding hole 33 h so as to be rotatable by a bearing (bush) 81. The upper rotary holder 79 supports the upper mold 31A so that it can be raised and lowered and cannot be rotated by a rotation stop key (not shown) or the like. In other words, the upper mold 31A is provided in an appropriate mold holding hole 33h of the upper turret 33 so as to be movable up and down via the upper rotary holder 79 and the like, and rotates integrally with the upper rotary holder 79. ing. Further, the upper frame 11 is provided with an upper rotation motor (upper index motor) 83 for rotating the upper rotation holder 79 in the vicinity of the formation position PP of the cut forming unit 29. The output shaft 83 s of the upper rotary motor 83 can be disconnected from the upper rotary holder 79 that is indexed to the formation position PP of the incision forming unit 29. The configuration for connecting and disconnecting the output shaft 83s of the upper rotary motor 83 to the upper rotary holder 79 is, for example, a known configuration such as Japanese Patent Application Laid-Open No. 2007-75889 and Japanese Patent Application Laid-Open No. 2004-268101.

  When a free ball bearing (not shown) is used as the pressing member instead of the free roller 51, the upper mold rotating mechanism 77 may be omitted from the components of the cut forming unit 29.

  The cut forming unit 29 has a lower mold rotating mechanism (lower index mechanism) 85 that rotates the lower mold 35A for cutting formed at the formation position PP. The specific configuration of the lower mold rotating mechanism 85 is as follows.

  The lower turret 37 is provided with an annular lower rotating holder 87 in an appropriate mold holding hole 37 h so as to be rotatable by a bearing (bush) 89. The lower rotation holder 87 is configured to support the lower mold 35A in a non-rotatable manner by a turn key (not shown) or the like. In other words, the lower mold 35 </ b> A is provided in an appropriate mold holding hole 37 h of the lower turret 37 via the lower rotation holder 87 and the like, and rotates integrally with the lower rotation holder 87. The lower frame 9 includes a lower rotation motor (lower index motor) 91 for rotating the lower rotation holder 87 in the vicinity of the formation position PP of the cut forming unit 29. The output shaft 91 s of the lower rotary motor 91 can be disconnected from the lower rotary holder 87 indexed to the formation position PP of the incision forming unit 29. The configuration for connecting and disconnecting the output shaft 91s of the lower rotary motor 91 to the lower rotary holder 87 is, for example, a known configuration such as Japanese Patent Application Laid-Open No. 2007-75889 and Japanese Patent Application Laid-Open No. 2004-268101.

  The cut forming unit 29 has a chip collection mechanism 93 that collects the chips C (see FIG. 8) from the discharge holes 53h of the die body 53 by suction force. And the specific structure of the chip collection | recovery mechanism 93 is as follows.

  The lower frame 9 includes a collection box 95 for collecting the chips C below the lower turret 37. Further, the lower frame 9 includes a suction source 97 such as a vacuum pump for generating a suction force in the recovery box 95 in the vicinity of the recovery box 95, and the suction source 97 is connected to the recovery box 95 via a pipe 99. It is connected.

  As shown in FIGS. 7, 10, and 11, the control unit 75 is in a state in which the axis 51 s of the free roller 51 is orthogonal to the direction along the cut portion Wa of the workpiece W (the direction along the cut S). The operation of the incision forming unit 29 including the upper mold rotating mechanism 77 is controlled so as to be held at the top. Further, the control unit 75 rotates the lower mold so as to hold the rake face 59f of the blade part 59c of the cutting tip 59 in a state in which the rake face 59f of the workpiece W is oriented in the direction along the cut part Wa (direction along the cut S). The operation of the notch forming unit 29 including the mechanism 85 is controlled. Furthermore, when the control unit 75 forms the cut S on the back surface side of the cut portion Wa of the work W, the control unit 75 includes the chip forming unit 29 including the chip collection mechanism 93 so as to generate a suction force in the collection box 95. Control the behavior.

  As shown in FIGS. 7 and 10 to 12, the control unit 75 has a trajectory (cutting path) T of the cutting S drawn (formed) on the end point EP side on the back surface side of the workpiece Wa of the workpiece W. , The operation of the incision forming unit 29 including the ram lifting motor and the like, and the operation of the work moving unit 63 including the X-axis motor 71 and the second Y-axis motor 67 are controlled. The predetermined circular trajectory Tc is a circular trajectory (circular trajectory) having a radius smaller than the cut width k of the cut S (see FIG. 6B) centering on the end point position EP.

  The predetermined circular trajectory Tc may be centered on a position before the end position EP (position near the end position EP) instead of centering on the end position EP. The predetermined circular trajectory Tc may be a plurality of concentric circular trajectories, and the plurality of circular trajectories may be a plurality of circular trajectories having the same radius or a plurality of circular trajectories having a gradually increased radius. Moreover, if it is a circular locus | trajectory (circle locus | trajectory) of a radius smaller than the cut width k (refer FIG.6 (b)) of the cut S, the chip C (refer FIG.8 (b) (c) (d)) removed. However, the radius may be larger than the cut width k of the cut S in order to reliably remove the chips C. When the predetermined circular locus Tc is a plurality of circular tracks, a part of the plurality of circular tracks may have a radius larger than the cut width k of the cut S.

  Here, in FIG. 12, the locus T (predetermined circle) of the cut S drawn from the intermediate side (the intermediate side between the start point position and the end point position EP) on the back side of the workpiece Wa of the workpiece W to the end point position EP side. Including the trajectory Tc). FIG. 12 schematically shows the operation of the cut forming unit 29 from the operation state (N1) to the operation state (N4). In FIG. 12, for convenience of explanation, the operation states (N3) and (N4) are illustrated as being shifted from the operation state (N2) so that the cut forming units 29 do not overlap.

  When the control unit 75 draws (forms) the trajectory T (predetermined circular trajectory Tc) of the cut S on the end point EP side, the control unit 75 is in a state in which the axis 51s of the free roller 51 is orthogonal to the direction along the cut S. The operation of the incision forming unit 29 including the upper mold rotating mechanism 77 is controlled so as to be held at the top. Further, when the control unit 75 draws the trajectory of the cut S on the end point EP side, the control unit 75 holds the rake face 59f of the blade portion 59c of the cutting tip 59 in a state facing the direction along the cut S. The operation of the cut forming unit 29 including the mold rotating mechanism 85 is controlled.

  Subsequently, among the configurations of the laser cutting processing method according to the second embodiment of the present invention, only configurations different from the laser processing method according to the embodiment of the present invention will be described.

  As shown in FIG. 7 and FIG. 9 to FIG. 11, in the cut forming step ST1, when the cut S is formed on the back side of the cut portion Wa of the workpiece W by the blade portion 59c of the cutting tip 59, the control unit 75 The operation of the upper mold rotating mechanism 77 is controlled to hold the shaft center 51 s of the free roller 51 in a state orthogonal to the direction along the cut portion Wa of the workpiece W. Further, the operation of the lower mold rotating mechanism 85 is controlled by the control unit 75 to hold the rake face 59f of the blade part 59c of the cutting tip 59 in a state in which the rake face 59f of the work W is directed in the direction along the cut part Wa. Further, the control unit 75 controls the chip collection mechanism 93 (suction source 97) to generate a suction force in the collection box 95, whereby the chip C is collected in the collection box 95 from the discharge hole 53h of the die body 53. .

  As shown in FIG. 7 and FIG. 9 to FIG. 12, in the cut forming step ST1, after forming the cut S from the intermediate side on the back surface side of the cut portion Wa of the workpiece W to the end point position EP (the operation state in FIG. N1) and (N2)), the control unit 75 controls the ram lifting motor and the like to temporarily raise the ram 39 at the end point position EP (see the operation state (N3) in FIG. 12). Next, from the state where the formation position PP of the cut forming unit 29 is located at the end point position EP, the operation of the work moving unit 63 is controlled by the control unit 75 to cut the work W by the length of the small radius. Is moved relative to the formation position PP. In other words, the formation position PP of the cut forming unit 29 is moved relative to the workpiece W by the length of the small radius in the direction along the workpiece W, for example, the cut portion Wa. Further, the control unit 75 controls the operation of the upper mold rotating mechanism 77 and the operation of the lower mold rotating mechanism 85 to rotate the upper mold 31A and the lower mold 35A by 90 degrees, and the control unit 75 moves the ram up and down. The ram 39 is lowered by controlling the motor or the like (see the operation state (N4) in FIG. 12). The control unit 75 controls the operation of the incision forming unit 29 and the operation of the workpiece moving unit 63 so that the trajectory T of the incision S drawn on the end point position EP on the back side of the part to be cut Wa of the workpiece W is predetermined. A circular locus Tc is set.

  When drawing the trajectory T (predetermined circular trajectory Tc) of the cut S on the end point EP side on the back surface side of the workpiece Wa to be cut, the control unit 75 controls the operation of the upper mold rotating mechanism 77 for free. The axial center 51s of the roller 51 is held in a state orthogonal to the direction along the cut S. Further, the operation of the lower mold rotating mechanism 85 is controlled by the control unit 75 to hold the rake face 59f of the blade portion 59c of the cutting tip 59 in a state facing the direction along the cut S.

  When the trajectory of the cut S is long, the predetermined circular trajectory Tc is not limited to the end position EP side on the back surface side of the workpiece W to be cut but also on the back surface side of the workpiece Wa of the workpiece W. You may make it draw in a location.

  And in 2nd Embodiment of this invention, there exists the following effect | action and effect other than having the effect | action and effect similar to 1st Embodiment of the above-mentioned this invention.

  As described above, when the cut S is formed on the back surface side of the cut portion Wa of the workpiece W by the blade portion 59c of the cutting tip 59, the chips C are collected in the collection box 95 from the discharge hole 53h of the die body 53. ing. Therefore, it can suppress that a part of protective film Wf remains in the base material part Wb of the workpiece | work W as the chip C.

  In addition, as described above, the trajectory T of the cut S drawn on the end point EP side on the back side of the workpiece Wa of the workpiece W is set to a predetermined circular trajectory Tc. Therefore, part of the protective film Wf is easily separated from the base material part Wb of the workpiece W on the end point position EP side on the back surface side of the cut portion Wa of the workpiece W, and a part of the protective film Wf is cut as the workpiece C. Remaining in the base material portion Wb of W can be more sufficiently suppressed.

  Therefore, according to 2nd Embodiment of this invention, the post-process after the laser cutting process of the workpiece | work W can be reduced as much as possible, and the working efficiency can be improved further.

(Modification 1 of 2nd Embodiment)
In the first modification of the second embodiment of the present invention, only the parts different from the above-described second embodiment of the present invention will be described.

  As shown in FIGS. 7, 10, 11, and 13, the control unit 75 has a trajectory (cutting path) T of the cut S drawn on the end point EP side on the back side of the cut portion Wa of the workpiece W. The operation of the notch forming unit 29 including the ram lifting motor and the like and the operation of the work moving unit 63 including the X-axis motor 71 and the second Y-axis motor 67 are controlled so as to have a predetermined reversing locus Tr. The predetermined reverse trajectory Tr is a reverse trajectory that reverses from the end point position EP side and passes through a position FP before the end point position EP.

  Here, FIG. 13 shows a trajectory T (including a predetermined reverse trajectory Tr) of the cut S drawn from the intermediate side on the back side of the part to be cut Wa of the workpiece W to the end position EP side. In FIG. 13, for the sake of convenience of explanation, the predetermined reversing trajectory Tr and the trajectory T of the portion excluding the predetermined reversing trajectory Tr are illustrated so as not to overlap. FIG. 13 schematically shows the operation of the cut forming unit 29 from the operation state (K1) to the operation state (K5). In FIG. 13, for convenience of explanation, the operation state (K3) is illustrated as being shifted from the operation state (K4) so that the cut forming units 29 do not overlap.

  When the control unit 75 draws the trajectory T (predetermined reversal trajectory Tr) of the cut S on the end point position EP side, the control unit 75 maintains the state in which the axis 51s of the free roller 51 is orthogonal to the direction along the cut S. In addition, the operation of the cut forming unit 29 including the upper mold rotating mechanism 77 is controlled. Further, when the control unit 75 draws the trajectory T of the cut S on the end point position EP side, the control unit 75 keeps the rake face 59f of the cutting edge 59c of the cutting tip 59 facing the direction along the cut S. The operation of the cut forming unit 29 including the mold rotating mechanism 85 is controlled.

  Subsequently, only the configuration different from the laser processing method according to the second embodiment of the present invention among the configurations of the laser cutting processing method according to Modification 1 of the second embodiment of the present invention will be described.

  As shown in FIGS. 7, 9 to 11, and 13, in the notch forming step ST <b> 1, the notch S is formed from the intermediate side on the back side of the part Wa to be cut of the workpiece W to the position FP before the end point position EP. After that (see the operation states (K1) and (K2) in FIG. 13), the control unit 75 controls the ram lifting motor and the like to temporarily raise the ram 39 at the front position FP. Next, the operation of the workpiece moving unit 63 is controlled by the control unit 75 to move the workpiece W relative to the formation position PP of the cut forming unit 29 according to the direction along the cut portion Wa, and the end position. The EP is positioned at the formation position PP of the cut forming unit 29. In other words, the formation position PP of the incision forming unit 29 is moved relative to the workpiece W from the front position FP to the end position EP (see the operation state (K3) in FIG. 13). Furthermore, the control unit 75 controls the operation of the upper mold rotating mechanism 77 and the operation of the lower mold rotating mechanism 85 to rotate the upper mold 31A and the lower mold 35A by 180 degrees, and the control unit 75 moves the ram up and down. The ram 39 is lowered at the end point position EP by controlling the motor or the like (see the operation state (K4) in FIG. 13). Then, the operation of the workpiece moving unit 63 is controlled by the control unit 75 to reverse the relative movement direction of the workpiece W, and the workpiece W is moved relative to the formation position PP of the cut forming unit 29. In other words, the relative movement direction of the formation position PP of the cut formation unit 29 is reversed, and the formation position PP of the cut formation unit 29 is moved relative to the workpiece W (operation state (K5 in FIG. 13). )reference). That is, the control unit 75 controls the operation of the incision forming unit 29 and the operation of the workpiece moving unit 63 so that the locus of the incision S drawn on the end point EP side on the back side of the cut portion Wa of the workpiece W is reversed by a predetermined amount. The trajectory Tr is set.

  When the trajectory of the cut S is long, the predetermined circular trajectory Tc is not limited to the end position EP side on the back surface side of the workpiece W to be cut but also on the back surface side of the workpiece Wa of the workpiece W. You may make it draw in a location.

  And in the modification 1 of 2nd Embodiment of this invention, as mentioned above, the locus | trajectory T of the cut S drawn by the end point position EP side of the back surface side of the to-be-cut | disconnected part Wa of the workpiece | work W is predetermined | prescribed inversion locus | trajectory Tr It is trying to become. Therefore, part of the protective film Wf is easily separated from the base material part Wb of the workpiece W on the end point position EP side on the back surface side of the cut portion Wa of the workpiece W, and a part of the protective film Wf is cut as the workpiece C. Remaining in the base material portion Wb of W can be more sufficiently suppressed.

  Therefore, according to the modification 1 of 2nd Embodiment of this invention, there exists an effect similar to 2nd Embodiment of the above-mentioned this invention.

(Modification 2 of the second embodiment)
In the second modification of the second embodiment of the present invention, only the parts different from the above-described second embodiment of the present invention will be described.

  As shown in FIGS. 7, 10, 11, and 14, the control unit 75 has a trajectory (cutting path) T of the cutting S drawn on the end point EP side on the back surface side of the workpiece Wa of the workpiece W. The operation of the incision forming unit 29 including the ram lifting motor, etc., and the X-axis motor 71 and the second Y-axis motor so as to be temporarily retracted (returned) from the position FP before the end point EP and resumed (continued). The operation of the workpiece moving unit 63 including 67 is controlled. Note that the trajectory of the cut S drawn on the end point position EP side may be temporarily retracted from the end point position EP instead of temporarily retracting from the position FP before the end point position EP.

  Here, FIG. 14 shows a trajectory T of the cut S drawn from the intermediate side on the back surface side of the workpiece Wa of the workpiece W to the end point position EP side. In FIG. 14, for convenience of explanation, the trajectory T of the restart portion and the trajectory T of the portion other than the restart portion are illustrated so as not to overlap. FIG. 14 schematically shows the operation of the cut forming unit 29 from the operation state (M1) to the operation state (M5). In FIG. 14, for convenience of explanation, the operation state (M3) is illustrated as being shifted from the operation state (M4) so that the cut forming units 29 do not overlap.

  Subsequently, only the configuration different from the laser processing method according to the second embodiment of the present invention will be described among the configurations of the laser cutting processing method according to Modification 2 of the second embodiment of the present invention.

  In the notch formation step ST1, after the notch S is formed on the end point EP side on the back surface side of the workpiece Wa of the workpiece W (see operation states (M1) and (M2) in FIG. 14), the control unit 75 uses the ram for The ram 39 is temporarily raised by controlling the lifting motor or the like. Next, the operation of the incision forming unit 29 and the operation of the workpiece moving unit 63 are controlled by the control unit 75 so that the trajectory T of the incision S drawn on the end point position EP side is temporarily retracted from the position FP before the end point position EP ( Operation state (see M3) in FIG. Then, the operation of the workpiece moving unit 63 is controlled by the control unit 75 to move the workpiece W relative to the formation position PP of the cut forming unit 29 according to the direction along the cut portion Wa, and the end position EP Is positioned at the formation position PP of the cut forming unit 29. In other words, the formation position PP of the incision forming unit 29 is moved relative to the workpiece W to the end position EP (see the operation states (M4) and (M5) in FIG. 14). In other words, the control unit 75 controls the operation of the incision forming unit 29 and the operation of the workpiece moving unit 63, and the trajectory T of the incision S on the end point position EP side is temporarily retracted from the position FP before the end point position EP and resumed. (Continued).

  When the trajectory of the cut S is long, the trajectory T of the cut S is temporarily retracted and resumed not only at the end point position EP side but also at a plurality of positions on the back side of the cut portion Wa of the workpiece W. May be.

  And in the modification 2 of 2nd Embodiment of this invention, a part of protective film Wf is cut | disconnected from the base material part Wb of the workpiece | work W in the end point position EP side of the back surface side of the to-be-cut part Wa of the workpiece | work W. It becomes easy and it can suppress more fully that a part of protective film Wf remains in the base material part Wb of the workpiece | work W as the chip C.

  Therefore, according to the modification 2 of 2nd Embodiment of this invention, there exists an effect similar to 2nd Embodiment of the above-mentioned this invention.

(Modification 3 of 2nd Embodiment)
With respect to the third modification of the second embodiment of the present invention, only differences from the second embodiment of the present invention will be described.

  As shown in FIGS. 7, 10, 11, and 15, the control unit 75 has the back surface of the cut portion Wa of the work W before the cut S is formed on the back surface side of the cut portion Wa of the work W. Operation of the notch forming unit 29 including the ram lifting motor and the like and the workpiece movement including the X-axis motor 71 and the second Y-axis motor 67 so as to form the pre-cut S ′ at the end point EP on the side or a position in front of it. The operation of the unit 63 is controlled. The pre-cut S ′ is a cut perpendicular to the direction along the cut portion Wa of the workpiece W (one of the crossed cuts). Note that the pre-cut S ′ may be formed so as to overlap a part of the cut portion Wa of the work W, or may be formed so as to be in contact with the cut portion Wa of the work W.

  When the control unit 75 forms the pre-cut S ′ at the end point position EP or the like, the shaft center 51s of the free roller 51 is orthogonal to the direction along the pre-cut S ′ (the direction along the cut portion Wa). The operation of the notch forming unit 29 including the upper mold rotating mechanism 77 is controlled so as to hold the above. Further, when the control unit 75 forms the pre-cut S ′ at the end point position EP or the like, the control unit 75 keeps the rake face 59f of the blade portion 59c of the cutting tip 59 facing the direction along the pre-cut S ′. The operation of the cut forming unit 29 including the lower mold rotating mechanism 85 is controlled.

  Subsequently, only the configuration different from the laser processing method according to the second embodiment of the present invention among the configurations of the laser cutting processing method according to Modification 3 of the second embodiment of the present invention will be described.

  As shown in FIGS. 7, 9 to 11, and 15, in the cut forming step ST <b> 1, the cut unit 29 is cut by the control unit 75 before the cut S is formed on the back side of the cut portion Wa of the workpiece W. And the movement of the workpiece moving unit 63 are controlled to form a pre-cut S ′ at the end point position EP on the back side of each cut portion Wa of the workpiece W or a position in front thereof. When the pre-cut S ′ is formed at the end point EP or the like on the back side of each workpiece portion Wa of the workpiece W, the control unit 75 controls the operation of the upper mold rotating mechanism 77 to control the axis 51s of the free roller 51. Is held in a state orthogonal to the direction along the pre-cuts S ′. The operation of the lower mold rotating mechanism 85 is controlled by the control unit 75, and the rake face 59f of the blade part 59c of the cutting tip 59 is held in a state facing the direction along the pre-cut S '.

  In addition, when the locus | trajectory of the cutting S is long, you may form the pre-cutting S 'not only in the end point position EP or the position in front of it, but in multiple places on the back side of the cut portion Wa of the workpiece W.

  And in the modification 3 of 2nd Embodiment of this invention, as mentioned above, before forming the cut S in the back surface side of each to-be-cut part Wa of the workpiece | work W, each to-be-cut | disconnected part Wa of the workpiece | work W is formed. A pre-cut S ′ is formed at the end point EP on the back side. Therefore, a part of the protective film Wf is easily separated from the base material part Wb of the workpiece W on the end point EP side on the back side of each cut portion Wa of the workpiece W, and a part of the protective film Wf is formed as chips C. Remaining in the base material portion Wb of the workpiece W can be more sufficiently suppressed.

  In addition, when the pre-cut S ′ is formed at the end position EP or the like on the back surface side of each workpiece portion Wa of the workpiece W, a minus is used instead of the mold set 43 including the upper mold 31A and the lower mold 35A. A stamping die set (not shown) may be used.

  Therefore, according to the modification 3 of 2nd Embodiment of this invention, there exists an effect similar to 2nd Embodiment of the above-mentioned this invention.

  In the second embodiment of the present invention (including modifications 1 to 3), the configuration may be adopted as follows.

  When forming the cut S (or the pre-cut S ′) on the back side of the cut portion Wa of the workpiece W, the cut groove Wg may be formed in the base material portion Wb on the back side of the cut portion Wa of the workpiece W. Good. In this case, a part of the protective film Wf is more easily separated from the base material part Wb of the workpiece W, and a part of the protective film Wf can be efficiently discharged to the outside from the discharge hole 53h of the die body 53. . Further, the cut groove Wg may not be formed in the base material portion Wb on the back surface side of the cut portion Wa of the workpiece W. In this case, the wear of the cutting edge 59c of the cutting tip 59 can be reduced and the life of the cutting tip 59 can be improved.

  As described above, the machining program for cutting and the machining program for laser cutting are created by an automatic program creation device (not shown). At that time, when the process according to any one of the second embodiment of the present invention (including modifications 1 to 3) is selected as the process on the end point EP side on the back surface side of the workpiece Wa of the workpiece W, etc. The automatic program creation device outputs a cutting machining program and a laser cutting machining program.

  In addition, this invention is not restricted to description of the above-mentioned embodiment, For example, it can implement in a various aspect as follows.

  The technical idea of the present invention may be applied to a composite processing system including a plurality of processing machines instead of the composite processing system including a single composite processing machine 1. In addition, instead of the protective film Wf, the technical idea of the present invention is applied to laser cutting of a workpiece (not shown) having a plating film (not shown) or a black skin (not shown) on the back as an example of a covering material. May be. Furthermore, the technical idea of the present invention may also be applied when laser cutting is performed on a work (not shown) in which a coating material such as a protective film Wf is coated on the back surface and the front surface. Further, the laser irradiation unit 19 may be disposed on the lower side of the table unit 13 and the cut forming unit 29 may be configured upside down. In this case, the laser cutting process is performed with the workpiece W inverted. There is a need. The scope of rights encompassed by the present invention is not limited to the above-described embodiment.

(Example)
As an example (Examples 1 to 5), the inventor of the present application uses a multi-tasking machine to change the depth of the cut groove in the base material portion of the work (thickness: 1.50 mm) and A cut was formed on the back side of the part to be cut. Next, using a CNC image measuring device, the periphery of the incision of a plurality of workpieces was imaged, and the incision width of the incision and the exposed width of the base material portion were measured based on the plurality of images. Furthermore, using a multi-task machine, laser cutting was performed on the parts to be cut of a plurality of workpieces, and the occurrence of dross was confirmed.

  In addition, as a comparative example, the inventor of the present application formed a cut on the back side of the cut portion of the workpiece to the extent that the base material portion of the workpiece (thickness: 1.50 mm) was damaged using a commercially available cutter. . Next, using a CNC image measuring device, the periphery of the work cut was imaged, and the cut width of the cut and the exposed width of the base material portion were measured based on the image. Furthermore, using a multi-task machine, laser cutting was performed on the workpiece to be cut, and the occurrence of dross was confirmed.

  The results of Examples (Examples 1 to 5) and Comparative Examples are summarized as shown in FIG. In other words, it was found that by forming a cut on the back side of the cut part of the workpiece and exposing the base material part from the covering material, it is possible to prevent dross from occurring on the back side and the cut surface of the workpiece. did. In addition, the spot diameter of the laser beam used in the Example and the comparative example is 0.2 to 0.4 mm.

1 Combined processing machine (combined processing system)
1A combined processing machine (combined processing system)
3 Processing machine base 5 Bridge frame 9 Lower frame 11 Upper frame 13 Table unit (table part)
15 Fixed table 15h Slot 17 Movable table 19 Laser irradiation unit (laser irradiation part)
21 Y-axis slider 23 First Y-axis motor 25 Laser irradiation head 27 Fiber laser oscillator (laser oscillator)
29 Punching unit 29 Incision forming unit (incision forming part)
31 Upper mold 31A Upper mold 33 for cutting formation Upper turret 35 Lower mold 35A Lower mold 37 for cutting formation Lower turret 39 Ram 41 Strike 43 Mold set 45 Punch body 47 Lifter spring 49 Punch head 51 Free roller 51s Axle 53 Die body 53d Recess 53h Discharge hole 55 Tip holder 59 Cutting tip (cutter)
59c Blade part 59f Rake face 63 Work moving unit (work moving part)
65 Carriage base 67 Second Y-axis motor 69 Carriage 71 X-axis motor 73 Clamper 75 Control unit (control unit)
77 Upper mold rotation mechanism (Upper index mechanism)
79 Upper Rotating Holder 83 Upper Rotating Motor (Upper Index Motor)
83s Output shaft 85 Lower mold rotation mechanism (lower index mechanism)
87 Lower Rotation Holder 91 Lower Rotation Motor (Lower Index Motor)
91 s Output shaft 93 Chip collection mechanism 95 Collection box 97 Suction source W Workpiece (sheet metal with coating)
Wa Cut part Wb Base material part Wf Protective film Wg Cut groove M Product BP Laser irradiation unit irradiation position PP Punching unit punching position PP Cutting formation unit forming position S Cutting ST1 Cutting formation process ST2 Laser irradiation process

Claims (11)

A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut by a cutter;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before irradiating the laser beam toward the surface side of the workpiece to be cut, so as to form a cut on the back side of the workpiece to be cut by the cutter to expose the workpiece base material portion from the coating material, A controller that controls operations of the notch forming unit and the workpiece moving unit , and
The control unit is configured such that the incision locus drawn on the end point position on the back side of the workpiece to be cut becomes a circular locus having a radius smaller than the incision width of the incision at or near the end point position. , the combined machining systems that control means controls the operation of the cut forming unit and the workpiece moving part. A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut by a cutter;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before irradiating the laser beam toward the surface side of the workpiece to be cut, so as to form a cut on the back side of the workpiece to be cut by the cutter to expose the workpiece base material portion from the coating material, A controller that controls operations of the notch forming unit and the workpiece moving unit, and
The control unit performs operations of the cut forming unit and the workpiece moving unit so that a cut locus drawn on the end point position side on the back surface side of the workpiece to be cut becomes an inverted locus reversed from the end point position side. combined processing system that is characterized in that control. A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut by a cutter;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before irradiating the laser beam toward the surface side of the workpiece to be cut, so as to form a cut on the back side of the workpiece to be cut by the cutter to expose the workpiece base material portion from the coating material, A controller that controls operations of the notch forming unit and the workpiece moving unit, and
The control unit is configured so that the incision locus drawn on the end point position on the back surface side of the workpiece to be cut is temporarily retracted from the end position or a position in front of the end position and resumed. combined processing systems that control means controls the operation of the mobile unit. A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut by a cutter;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before irradiating the laser beam toward the surface side of the workpiece to be cut, so as to form a cut on the back side of the workpiece to be cut by the cutter to expose the workpiece base material portion from the coating material, A controller that controls operations of the notch forming unit and the workpiece moving unit, and
The control unit crosses the end position on the back side of the workpiece to be cut or the position in front of the workpiece along the direction along the workpiece to be cut before forming the cut on the back side of the workpiece to be cut. combined processing system that is characterized in that to form a pre-cut for, controlling the operation of the cut forming unit and the workpiece moving part. The control unit controls the operation of the incision forming unit so that an exposure width of a base material portion exposed from a coating material on a back surface side of a workpiece to be cut is larger than a spot diameter of a laser beam. The combined machining system according to any one of claims 1 to 4 .
The combined processing system according to item. A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before the laser beam is irradiated toward the surface side of the workpiece to be cut, the incision is formed so that a notch is formed on the back surface side of the workpiece to be cut and the workpiece base material portion is exposed from the covering material. And a control unit for controlling the operation of the workpiece moving unit,
The said control part controls the operation | movement of the said notch formation part so that the notch which reaches a base material part may be formed in the back surface side of the to-be-cut part of a workpiece | work. A combined machining system that performs laser cutting on a workpiece to be cut with a coating material on the back surface,
A laser irradiation unit for irradiating a laser beam toward the surface side of the workpiece to be cut;
A notch forming portion for forming a notch on the back side of the workpiece to be cut;
A workpiece moving unit that moves the workpiece in a horizontal direction relative to the irradiation position of the laser irradiation unit and the formation position of the incision forming unit;
Before the laser beam is irradiated toward the surface side of the workpiece to be cut, the incision is formed so that a notch is formed on the back surface side of the workpiece to be cut and the workpiece base material portion is exposed from the covering material. And a control unit for controlling the operation of the workpiece moving unit,
The notch forming part is
An upper die for forming a notch including a punch body, and a pressing member provided at a lower end portion of the punch body and capable of pressing a part of the workpiece to be cut or its vicinity from above;
A die body in which a discharge hole for discharging chips is formed, and a lower mold for incision formation that includes a cutter that is provided in the die body and that cuts the back side of the cut portion of the workpiece. Combined machining system characterized by that. The notch forming part is
8. The combined machining system according to claim 7 , further comprising a lower mold rotating mechanism that rotates the lower mold for forming the cut. The notch forming part is
Combined processing system according to claim 7 or claim 8, characterized in that had chips recovery mechanism for recovering by suction force chips from the discharge hole of the die body. A laser cutting method for performing a laser cutting process on a workpiece to be cut with a coating material on the back surface,
By forming a notch reaching the base material part on the back side of the workpiece to be cut, the base material part of the work is exposed from the coating material on the back side of the workpiece to be cut,
A laser cutting method characterized by irradiating a laser beam toward a surface side of a part to be cut of a workpiece. The laser cutting processing method according to claim 10 , wherein the covering material is any one of a protective film, a plating film, and a black skin.