JP3512634B2 - LASER PROCESSING METHOD, LASER WORKED PRODUCTION METHOD, LASER PROCESSING APPARATUS, AND COMPUTER-READABLE RECORDING MEDIUM CONTAINING A PROGRAM FOR CAUSING COMPUTER TO EXECUTE LASER PROCESSING OR LASER WORKED PRODUCTION METHOD - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention is hardly lowered protective effect by dressing, the laser processing method can be processed in a short time, the method of producing the laser piece, contact and laser processing apparatus, as well as laser processing or the The present invention relates to a computer-readable recording medium that stores a program that causes a computer to execute a method for producing a laser processed product.

[0002]

2. Description of the Related Art When a metal material such as carbon steel, stainless steel or aluminum alloy is laser-processed, a laser beam is applied to an object to be processed and an assist gas such as oxygen gas is jetted to a processed portion. Conventionally, when performing laser processing on a workpiece whose surface is coated with a low melting point substance, the low melting point substance penetrates into the processing range during the processing, causing defects in the processing quality. Further, when the low melting point substance is a sheet made of resin, paper, or the like, the low melting point substance causes expansion or peeling during laser processing. Specifically, as shown in FIG. 12, when the workpiece 2 is irradiated with the laser beam 1 together with the assist gas 3, the assist gas 3 enters between the base material 21 and the covering material 22, The covering material 22 expands and peels off. This has hindered the continuation of the cutting process.

Therefore, according to the prior art disclosed in Japanese Patent Application Laid-Open No. 7-236984, first, the covering material 2 for the workpiece 2 is first disclosed.
2 is removed, and then the workpiece 2 is cut. FIG. 13 is an explanatory view showing a conventional laser processing method described in the publication.

A galvanized layer 22 is formed on the surface of the steel material 21 of the workpiece 2. In the first processing step, the zinc plating layer 22 on the surface of the steel material 21 is removed by using the same program as the cutting shape. The laser beam 1 is guided from a light source to a processing position by a bend mirror (not shown). Then, the condensing optical system (not shown) focuses the laser light 1 to a predetermined spot diameter. The energy density of the laser beam 1 is set to a value that can remove the zinc plating layer 22. The energy density is a value corresponding to the basis weight of the coating material 22 (the thickness of the plating layer) and the physical properties. The value of this energy density is recorded in the control device.

In the first processing step, processing is performed under the condition that the zinc plating layer 22 can be removed. As a result, the removed portion 221 of the galvanized layer 22 is formed on the workpiece. Second
In the processing step, the position of the laser beam 1 is returned to the processing start point of the processing program, the energy density of the laser beam 1 is changed, and the steel material 21 is raised to such an extent that it can be cut. Then, under the conditions, the laser beam 1 is moved along the locus of the program to perform cutting processing of a predetermined shape. Reference numeral 222 indicates a groove already cut.

In the above laser processing method, the galvanized layer 22 is removed in the first processing step, and the steel material 2 is processed in the second processing step.
By performing the cutting of No. 1, expansion and peeling of the galvanized layer 22 are prevented. In the second processing step,
Since the zinc vapor is not generated, the purity of the assist gas 3 is kept high. Therefore, the processing quality of the steel material 21 is improved.

[0007]

However, in the laser processing method described in the above-mentioned Japanese Patent Laid-Open No. 7-236984, as shown in FIG.
The removed portion 221 of the galvanized layer 22 is larger than the width of 2. For this reason, there is a problem that the exposed portion of the steel material 21 becomes large and the effect of protecting the surface decreases.
Further, since the laser beam 1 moves on the same locus during the process of removing the galvanized layer 22 (first working process) and the process of cutting the steel material 21 (second working process), the working time becomes long. There was a point.

[0008] This invention was made in view of the above, the protective effect of the coating material is less likely to decrease, the laser processing method can be processed in a short time, the method of producing the laser piece, contact and laser processing apparatus Another object of the present invention is to obtain a computer-readable recording medium that stores a program that causes a computer to execute the method of producing a laser-processed or laser-processed object.

[0009]

In order to achieve the above-mentioned object, the laser processing method according to the present invention, in processing a workpiece provided with a coating material on the surface by laser light using an assist gas, A first processing step of removing the coating material on the final processing trajectory under processing conditions different from the final processing, and a second processing step of irradiating a laser beam on a predetermined path of the workpiece from which the coating material has been removed to perform processing. In the laser processing method including and, the processing conditions in the first processing step are changed so that the removal range of the coating material on the final processing locus is different in size.

In the laser processing using the assist gas, as described above, all the coating material on the final processing locus is uniformly removed. It has been found that good laser processing can be performed without uniformly removing all the materials. That is, if there is a large removal range in part, the removal range in other parts may be small. What you can do this is
This is because during the laser cutting, the gas permeability of the assist gas is improved, and the expansion and peeling of the coating material, which has been a problem in the past, does not easily occur. Therefore, the coating on the final machining path
The removal range of the material can be made different in size, and it is not necessary to largely remove the covering material in a portion where expansion or peeling is unlikely to occur. As a result, since it is possible to leave a sufficient coating material to the machining edge, never protect the surface of the material is significantly decreased.

In the laser processing method according to the next invention, when a workpiece having a coating material on its surface is processed by a laser beam using an assist gas, the coating on the final processing locus is performed under processing conditions different from the final processing. a first processing step of removing the timber, a laser beam is irradiated on a predetermined path of the workpiece removing the dressing, in the laser processing method and a second processing step of performing processing, other on the final machining pass Part of
The portion where the supply amount of assist gas is larger than the first
This is the range for removing the coating material in the processing step.

At a site where the amount of assist gas supplied is large, the covering material is likely to expand and peel. For example, at a processing start or end point or a portion where the laser light changes the moving direction, the processing head is stagnant for a long time as compared with other portions, and the supply amount of assist gas increases. on the other hand,
During cutting, the assist gas can pass through easily, so it is not necessary to remove the coating material. Therefore, the coating material of the portion where the amount of assist gas supplied is larger than the other portions is removed. By doing so, the removal of the coating material can be suppressed to a minimum, so that the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

In the laser processing method according to the next invention, when a workpiece having a coating material on its surface is processed by a laser beam using an assist gas, the coating on the final processing locus is performed under different processing conditions from the final processing. In a laser processing method including a first processing step of removing a material and a second processing step of irradiating a predetermined path of a workpiece from which a covering material is removed with a laser beam to perform processing, processing on a final processing path The start portion and / or the processing end portion is set as the removal range of the coating material in the first processing step.

At the processing start or end point, the processing head is stagnant for a long time as compared with other portions, so that the supply amount of assist gas increases. On the other hand, during cutting, since the assist gas is easily passed therethrough, it is not necessary to remove the coating material. Therefore, the coating material at the processing start portion and the processing end portion is removed. By doing so, the removal of the coating material can be suppressed to a minimum, so that the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

A laser processing method according to the next invention is the same as the above laser processing method, wherein the energy density of the laser beam in the first processing step is further changed according to the degree of bonding of the coating material.

The more strongly the coating material is bonded to the surface of the material, the less likely it is to peel off, and the smaller the removal range of the coating material is, the more the processing in the second processing step can be endured. Therefore, the energy density of the laser beam in the first processing step is changed according to the degree of bonding of the covering material to adjust the removal range.

A laser processing method according to the next invention is the same as the above laser processing method, wherein the energy density of the laser beam in the first processing step is changed according to the thickness of the coating material.

The thicker the covering material is, the more difficult it is to peel off.
Even if the removal range of the covering material is reduced, it is possible to sufficiently withstand the processing in the second processing step. Therefore, the energy density of the laser beam in the first processing step is changed according to the thickness of the coating material to adjust the removal range.

In the method for producing a laser-processed object according to the next invention, when the object to be processed having the coating material on the surface is processed by the laser beam using the assist gas, the final processing is performed under different processing conditions from the final processing. Other part on the locus
The laser-processed object is produced through a processing step in which the coating material in the portion where the supply amount of the assist gas is larger than that in the auxiliary gas is removed.

As described above, the area where the amount of the assist gas supplied is larger than the other areas is likely to cause the coating material to expand or peel. On the other hand, during cutting, since the assist gas is easily passed therethrough, it is not necessary to remove the coating material. So the other
That is, the coating material at the portion where the amount of the assist gas supplied is larger than that at the portion is removed. By doing so, the removal range of the coating material can be suppressed, and thus the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

[0021]

[0022]

A laser processing apparatus according to the next invention is a laser processing apparatus for processing an object to be processed having a coating material provided on the surface thereof, and a laser irradiation means for irradiating the object to be processed with laser light. , The assist gas supply means for supplying the assist gas to the processing portion, and the coating material for the portion where the assist gas supply amount is larger than other portions on the final processing trajectory due to the processing conditions different from the final processing. The first to remove
It is provided with a processing means and a second processing means for performing processing by irradiating a predetermined path of the workpiece from which the coating material has been removed with laser light.

In a region where the amount of assist gas supplied is large, the covering material is likely to expand and peel. On the other hand, during cutting, since the assist gas is easily passed therethrough, it is not necessary to remove the coating material. Therefore, the coating material of the portion where the amount of assist gas supplied is larger than the other portions is removed. By performing laser processing with this laser processing device, it is possible to minimize the removal of the covering material,
The surface of the material can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

A laser processing apparatus according to the next invention is a laser processing apparatus for processing a work piece provided with a coating material on the surface thereof, and laser irradiation means for irradiating the work piece with a laser beam with a converging optical system. Depending on the assist gas supply means for supplying the assist gas to the processing portion and the processing conditions different from the final processing, the processing start portion on the final processing locus or /
And a first processing means for removing the coating material at the processing end portion, and a second processing means for performing processing by irradiating a predetermined path of the workpiece from which the coating material is removed with laser light. .

Since a large amount of assist gas is supplied to the processing start portion and the processing end portion, the coating material on those portions is removed. By processing with this laser processing apparatus, the removal of the coating material can be suppressed to a minimum, so that the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

A computer-readable recording medium according to the next invention stores a program for causing a computer to execute the laser processing method or the method for producing a laser-processed object.

By causing the computer to execute this recording medium, the removal of the coating material can be suppressed to the minimum and the surface of the material can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the laser processing method in accordance with the present invention, a method for producing the laser piece, contact and laser processing apparatus, and a program for executing the method of producing laser processing or the laser workpiece computer The stored computer-readable recording medium will be described in detail with reference to the drawings. The present invention is not limited to this embodiment.

Embodiment 1. 1 is a schematic configuration diagram showing a laser processing apparatus according to Embodiment 1 of the present invention.
In this laser processing apparatus 100, a laser beam 1 is applied to a workpiece 2
It includes a laser optical system 50 for irradiating the laser beam, an assist gas supply unit 60 for supplying the assist gas 3, and a control unit 70 for performing various controls such as positioning of the laser optical system 50. The laser optical system 50 includes a laser oscillator 51, a bend mirror 52 that guides the laser light 1 to the processing head 4, and a lens 53 that is provided in the processing head 4 and that collects the laser light 1.
It consists of and. The laser light 1 focused by the lens 53 is applied to the workpiece 2 from the nozzle 41.
The workpiece 2 has a structure in which the surface of a steel plate 21 is covered with a resin sheet 22. The assist gas supply unit 60 is composed of a cylinder 61 containing the assist gas 3 such as oxygen gas, and a valve unit 62 for controlling the supply amount of the assist gas 3. The valve portion 62 and the machining head 4 are the pipe 6
Connected by 3.

The control unit 70 positions the machining head 4 with respect to the workpiece 2 according to the machining program, and the resin sheet 2 covering the surface of the workpiece 2.
A first machining condition setting unit 72 that sets machining conditions for removing 2 and a second machining condition setting unit 73 that sets machining conditions for cutting the steel plate 21 are provided. Control unit 7
0 is a memory 7 in which a program of machining locus is recorded.
4, an input unit 75 such as an operation panel, and a display device 76 such as a CRT are connected. The control unit 70 controls the operations of the laser optical system 50 and the assist gas supply unit 60 according to the processing conditions. The control unit 70 is composed of a central processing unit of a computer and a machining program recorded in the memory 74.

FIG. 2 shows the laser processing apparatus 10 shown in FIG.
It is explanatory drawing which shows the operation | movement of 0. This laser processing device 10
At 0, the resin sheet 2 provided on the surface of the punching start portion 23
After removing 2, the steel material 21 is cut. Drilling start part 2
The resin sheet 22 of No. 3 is removed by the punching start portion 23.
Then, the supply amount of the assist gas 3 increases and the resin sheet 2
This is because 2 easily expands and peels off. On the other hand, the resin sheet 22 on the final processing route other than the punching start portion 23
Is not removed. This is because the assist gas 3 flows into the preprocessed groove 24 to improve the air permeability, and the resin sheet 22 is less likely to peel off. First, in the first processing step, the resin sheet 22 of the workpiece 2 is irradiated with the laser beam 1 under the sheet removal processing conditions (first processing conditions).

The first processing condition is to obtain a circular resin sheet removing portion 25 having a diameter of 10 mm. Therefore, when the film thickness is 90 μm, the laser output is 200 W and the beam irradiation time is 0.
1 second. Nitrogen is used as the assist gas 3 and its gas pressure is 0.05 MPa. The first processing condition setting unit 7 can be used as the first processing condition by inputting the type and thickness of the covering material such as the resin sheet 22 and the type and thickness of the steel material.
Set automatically according to 2. The set first processing condition is recorded in the memory 74. In addition, the operator uses the keyboard 75
You may enter it directly from.

FIG. 3 is a graph showing the relationship between the assist gas pressure and the maximum dross height. The steel material 21 has a thickness of 2 m.
m, and the film thickness of the resin sheet 22 is 60 μm. Generally, when the assist gas pressure is small, the dross generated on the back surface of the workpiece 2 is large, and when the assist gas pressure is large, the dross generated is small. Since the purpose of cutting the steel material 21 is not the purpose in the first processing step, the assist gas pressure may be 0.4 MPa or less. When the assist gas pressure is 0.4 MPa or more, peeling of the coating material occurs.
Therefore, under the first processing conditions, the assist gas pressure is 0.0
The pressure is set to 5 MPa so that peeling of the resin sheet 22 is extremely unlikely to occur.

The punching start section 23 extracts from the machining program recorded in the memory 74. Positioning part 71
Moves the processing head 4 to the drilling start portion 23. The control unit 70 uses the laser oscillator to process under the above conditions.
The output of 51 and the flow rate of the assist gas 3 by the valve portion 62 are controlled. When the workpiece 2 is irradiated with the laser beam 1 under such conditions, a circular resin sheet removing portion 25 as shown in FIG. 2 is obtained. Since the first processing condition is set so as to remove only the resin sheet 22, the lower steel material 21
Is not cut.

Next, in the second processing step, the steel material 21 is cut. When the plate pressure is 1 mm, the laser output is 850 W, the moving speed of the processing head is 3 m / min, and nitrogen gas is used as the assist gas 3, and the gas pressure is It is 0.65 MPa. When the plate thickness is 3 mm, the laser output is 2000 W,
The moving speed of the processing head is 2 m / min, nitrogen gas is used as the assist gas 3, and the gas pressure is 0.65MP.
a. By setting the assist gas pressure to 0.65 MPa, the generation of dross can be made extremely small as shown in FIG. Due to this condition, the drilling start portion 23 of the workpiece 2
The laser beam 1 is irradiated to the laser beam, and laser processing is started from the perforation starting portion 23.

During the laser processing, the steel material 21 is cut as the laser light 1 moves. At the same time, the resin sheet 22 around the cut portion of the steel material 21 is removed by the laser light 1. The width of the removed resin sheet 22 is smaller than the diameter of the resin sheet removing portion 25. Therefore, the amount of the resin sheet 22 removed is reduced as a whole, and the exposed surface area of the steel material is reduced. Most of the assist gas injected to the processing portion flows into the cutting groove 24 and is discharged to the surroundings. According to this laser processing method, since it is not necessary to trace all the final processing paths in the first processing step, the time required for the first processing step can be shortened.

FIG. 4 shows a top view of the workpiece 2a processed by the laser processing apparatus. This workpiece 2a is
Since the resin sheet 22 of the punching start portion 23 is removed in advance, the resin sheet 22 does not expand or peel due to the assist gas pressure at the start of cutting, and laser processing can be performed with good quality.

Further, the resin sheet at the punching end portion 27 may be removed instead of the punching start portion 23.
FIG. 5 is an explanatory diagram showing the work piece 2 from which the resin sheet 22 of the punching end portion 27 has been removed. Also in this case, the first processing condition is set in the same manner as above, and the resin sheet 22 at the punching end portion 27 is removed according to this condition. Ending part 2
The coordinates of 7 are extracted from the machining program. The first processing condition and the second processing condition are the same as above. further,
You may make it remove the resin sheet 22 of the drilling start part 23 and the drilling end part 27.

Further, for example, the movement of the processing head 4 becomes slow in the corner portion of the processing path, so that the supply amount of the assist gas 3 becomes large. Therefore, the portion of the resin sheet 22 where the supply amount of the assist gas 3 is large may be removed in advance. FIG. 6 shows the workpiece 2 from which the resin sheet 22 at a predetermined position on the processing path has been removed.
b is shown. In this way, the resin sheet 22 at the hole-starting portion 23 and the hole-finishing portion 27 is removed, and further, the resin sheet 22 at the corner portion 28 on the processing path is removed. By doing so, expansion or peeling of the resin sheet 22 during cutting can be suppressed.

Embodiment 2. In the second embodiment, the first processing condition is set by the adhesive force of the resin sheet 22. FIG. 7 shows the relationship between the adhesive force of the resin sheet 22 and the diameter of the resin sheet removing portion 25.
It is a graph which shows the presence or absence of peeling. For the workpiece 2,
The surface of a stainless steel plate SUS304 having a plate pressure of 3 mm was coated with a polyolefin sheet having a thickness of 60 μm. As a result of the experiment, the larger the adhesive force of the resin sheet 22, the less the peeling of the resin sheet 22 and the smaller the diameter of the sheet removing portion 25 required for processing. For example, when the adhesive force of the resin sheet 22 is 50 g / 20 mm, the diameter of the resin sheet removing portion 25 is at least 30 mm.
I found it necessary. It was also found that when the adhesive force of the resin sheet 22 is 250 g / 20 mm, the resin sheet removing portion 25 needs to have a diameter of at least 5 mm.

Therefore, if the experimental data is tabulated and recorded in the memory 74, the first processing condition can be set according to the adhesive force of the resin sheet 22. FIG. 8 is a flowchart showing the processing steps of the workpiece 2. Step S
In 801, the operator inputs the adhesive force of the resin sheet 22 from the keyboard 75. In step S802, the first
The processing condition setting unit 72 sets the first processing condition.
The first processing condition setting unit 72 selects the diameter of the resin sheet removing unit 25 corresponding to the input adhesive force of the resin sheet 22 from the data recorded in the memory 74.

Next, the first processing condition is set according to the diameter of the resin sheet removing portion 25. In step S803, the resin sheet 22 is removed under the first processing condition. In step S804, the second processing condition setting unit 73 sets the second processing conditions. The second processing condition is set based on the plate thickness, material and the like. In step S805,
The steel material 21 is cut under the second processing condition. By doing so, it is possible to deal with the workpiece 2 covered with the resin sheets 22 having different adhesive strengths.

Embodiment 3. In the third embodiment, the first processing condition is set according to the thickness of the resin sheet 22. FIG. 9 is a graph showing the presence or absence of peeling of the resin sheet 22 in the relationship between the thickness of the resin sheet 22 and the diameter of the resin sheet removing portion 25. As the workpiece 2, a stainless steel plate SUS304 having a plate pressure of 3 mm and a polyolefin sheet having an adhesive force of 150 gm / 20 mm was used. As a result of the experiment, the larger the thickness of the resin sheet 22, the less the peeling of the resin sheet 22 and the smaller the diameter of the sheet removing portion 25 required for processing. For example, when the thickness of the resin sheet 22 is 40 μm, the diameter of the resin sheet removing portion 25 is at least 30 mm.
I found it necessary. Further, it was found that when the thickness of the resin sheet 22 is 120 μm, the diameter of the resin sheet removing portion 25 needs to be at least 5 mm.

Therefore, similar to the second embodiment, if the experimental data is tabulated and recorded in the memory 74, the first processing condition according to the thickness of the resin sheet 22 can be set. FIG. 10 is a flowchart showing the processing steps of the workpiece 2. In step S1001, the resin sheet 22
The operator inputs the thickness of the key from the keyboard 75. In step S1002, by the first processing condition setting unit 72,
The first processing condition is set. The first processing condition setting unit 72
From the data recorded in the memory 74, the diameter of the resin sheet removing portion 25 corresponding to the inputted thickness of the resin sheet 22 is selected.

Next, the first processing condition is set according to the diameter of the resin sheet removing portion 25. Step S1003
Then, the resin sheet 22 is removed under the first processing condition. In step S1004, the second processing condition setting unit 7
The second processing condition is set according to 3. The second processing condition is
Set based on plate thickness and material. Step S1005
Then, the steel material 21 is cut under the second processing condition.
By doing so, it is possible to deal with the workpiece 2 covered with the resin sheets 22 having different thicknesses.

Fourth Embodiment In addition, the above-mentioned hole starting section 2
It is also possible to remove the resin sheet 22 not only for example 3 but for the entire final processing locus to increase the removal amount of the portion 28 where the supply amount of the assist gas 3 increases.
FIG. 11 shows the workpiece 2c after the resin sheet 22 is removed in this way. The removal amount of the resin sheet 22 is changed by changing the cutting conditions while the processing head is moving. In the portion 28 where the supply amount of the assist gas 3 is large,
The processing conditions are such that the removal amount becomes large, and the other parts 29
Then, the processing conditions are such that the removal amount is small. By processing in this way, it is possible to prevent the unnecessary resin sheet 22 from being removed. This processing method is performed by the laser processing apparatus shown in FIG.

[0048]

As described above, according to the laser processing method of the present invention, the processing conditions are changed in the step of removing the coating material, and the removal range of the coating material on the final processing locus is made different in size. Since the removal amount of the coating material in the portion where expansion or peeling hardly occurs is small, the coating material can be sufficiently left on the processed edge. Therefore, the protection of the material surface is not significantly reduced.

In the laser processing method of the next invention, the area where the supply amount of the assist gas is larger than the other areas on the final processing locus is set as the coating material removal range, so that the coating material removal is minimized. Therefore, the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

In the laser processing method of the next invention, since the processing start portion and / or the processing end portion on the final processing locus are set as the coating material removal range, it is possible to minimize the removal of the coating material. The surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

In the laser processing method of the next invention, since the energy density of the laser light is changed in accordance with the degree of bonding of the coating material in the step of removing the coating material, the coating material can be wastefully removed. Absent.

In the laser processing method of the next invention, since the energy density of the laser beam is changed according to the thickness of the coating material in the step of removing the coating material, the coating material can be wastefully removed. Absent.

In the method for producing a laser-processed object according to the next invention, the coating material for the portion on the final processing locus where the assist gas supply amount is larger than the other portions due to the processing conditions different from the final processing. It was removed so that a laser-processed object was produced. Therefore, the removal range of the coating material can be suppressed, and the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

[0054]

In the laser processing apparatus of the next invention, the laser irradiation means and the assist gas supply means are provided, and other portions on the final processing locus are processed under processing conditions different from the final processing.
First processing means for removing the coating material in a portion where the supply amount of assist gas is larger than that for the second processing means, and second processing means for irradiating the predetermined path of the workpiece from which the coating material is removed with laser light to perform processing. Equipped with. If the laser processing is performed by this laser processing apparatus, the removal of the coating material can be suppressed to the minimum, so that the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

In the laser processing apparatus of the next invention, the laser irradiation means and the assist gas supply means are provided, and the coating material of the processing start portion and / or the processing end portion on the final processing locus is provided under the processing conditions different from the final processing. The first processing means for removing and the second processing means for performing processing by irradiating the predetermined path of the workpiece from which the coating material has been removed with laser light are provided. By processing with this laser processing apparatus, the removal of the coating material can be suppressed to a minimum, so that the material surface can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

In a computer-readable recording medium of the next invention, a program for causing a computer to execute the laser processing method or the method for producing a laser-processed object is stored. Therefore, by causing the computer to execute this recording medium, the removal of the covering material can be suppressed to the minimum and the surface of the material can be sufficiently protected. Further, since it is not necessary to remove all the coating material on the final processing locus, processing can be performed in a short time.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a laser processing device according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an operation of the laser processing apparatus shown in FIG.

FIG. 3 is a graph showing a relationship between assist gas pressure and maximum dross height.

FIG. 4 is a top view showing a workpiece processed by the laser processing apparatus shown in FIG.

FIG. 5 is an explanatory view showing a work piece from which a resin sheet at a hole drilling end portion is removed.

FIG. 6 is a top view showing a workpiece from which a resin sheet at a predetermined position on a processing path has been removed.

FIG. 7 is a graph showing the presence or absence of peeling of the resin sheet in the relationship between the adhesive force of the resin sheet and the diameter of the resin sheet removing portion.

FIG. 8 is a flowchart showing a processing step of a workpiece.

FIG. 9 is a graph showing the presence or absence of peeling of the resin sheet in the relationship between the thickness of the resin sheet and the diameter of the resin sheet removal portion.

FIG. 10 is a flowchart showing a processing step of a workpiece.

FIG. 11 shows the work piece after the resin sheet has been removed.

FIG. 12 is an explanatory diagram showing a conventional laser processing method.

FIG. 13 is an explanatory diagram showing a conventional laser processing method.

FIG. 14 is an explanatory diagram showing a problem of a conventional laser processing method.

[Explanation of symbols]

100 laser processing device, 1 laser light, 2 workpiece, 21 steel plate, 22 resin sheet, 3 assist gas,
4 processing heads, 41 nozzles, 50 laser optical system,
51 laser oscillator, 52 bend mirror, 53 lens, 60 assist gas supply unit, 61 cylinder, 62
Valve part, 63 pipe, 70 control part, 71 positioning part, 72 first processing condition setting part, 73 second processing condition setting part, 74 memory, 75 input part, 76 display device.

   ─────────────────────────────────────────────────── ─── Continued front page    (54) [Title of Invention] Laser processing method, method for producing laser-processed object, laser processing apparatus, and laser processing                     Is a computer that stores a program that causes the computer to execute the method for producing a laser-processed object.                     Readable recording medium

Claims (9)

(57) [Claims] 1. A first process for removing a coating material on a final processing locus under a processing condition different from the final processing when processing a workpiece provided with a coating material on its surface by a laser beam using an assist gas. In a laser processing method including a step and a second processing step of irradiating a predetermined path of the workpiece from which the coating material has been removed with laser light to perform processing, the processing conditions in the first processing step are changed, and a final processing step is performed. A laser processing method characterized in that the removal range of the coating material on the processing locus is made different in size. 2. A first process for removing a coating material on a final processing locus under a processing condition different from the final processing when processing a workpiece provided with a coating material on the surface by a laser beam using an assist gas. a step, a laser beam is irradiated on a predetermined path of the workpiece removing the dressing, in the laser processing method and a second processing step for machining, the assist gas than other sites on the final machining pass A laser processing method, wherein a region where the supply amount is large is set as a removal range of the coating material in the first processing step. 3. A first process for removing a coating material on a final processing locus under processing conditions different from the final processing when processing a workpiece having a coating material on its surface by laser light using an assist gas. In a laser processing method including a step and a second processing step of irradiating a predetermined path of a workpiece from which a coating material has been removed with laser light to perform processing, a processing start portion on a final processing locus and / or processing end A laser processing method, characterized in that a portion is set as a removal range of the coating material in the first processing step. 4. The laser according to claim 1, wherein the energy density of the laser beam in the first processing step is changed according to the degree of bonding of the coating material. Processing method. 5. The laser according to claim 1, wherein the energy density of the laser beam in the first processing step is changed according to the thickness of the coating material. Processing method. 6. When processing a workpiece provided with a coating material on the surface with a laser beam using an assist gas, the processing conditions different from the final processing cause the assist on the final processing locus to be higher than that of other portions. A method for producing a laser-processed object, which comprises producing a laser-processed object by performing a processing step of removing a coating material at a portion where a large amount of gas is supplied. 7. A laser processing apparatus for processing a workpiece having a coating material on its surface, comprising laser light irradiation means for irradiating the workpiece with a laser beam, and an assist gas for processing the workpiece. Assist gas supply means for supplying, first processing means for removing a coating material at a portion where the assist gas supply amount is larger than other portions on the final processing trajectory due to processing conditions different from the final processing, and a coating material And a second processing means for performing processing by irradiating a predetermined path of the workpiece, from which the laser beam has been removed, with a laser beam. 8. A laser processing apparatus for processing a workpiece having a coating material on the surface thereof, comprising laser light irradiating means for irradiating the workpiece with a laser beam, and an assist gas for processing the workpiece. Assist gas supply means to be supplied, first processing means for removing the coating material at the processing start portion and / or processing end portion on the final processing trajectory under processing conditions different from the final processing, and the workpiece to be processed with the coating material removed. A laser processing apparatus comprising: a second processing unit that irradiates a predetermined path of an object with laser light to perform processing. 9. A program for causing a computer to execute the laser processing method according to any one of claims 1 to 5 or the method for producing a laser-processed object according to claim 6 is stored. A computer-readable recording medium characterized by the above.