JP2011233737A - Method and apparatus for mounting electronic component, and method for creating nozzle data - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent error suction of an electronic component by a suction nozzle as much as possible by selecting a suitable suction nozzle corresponding to a sort of the electronic component.SOLUTION: A type data edition picture of suction nozzles constituting component library data of a selected electronic component is displayed, a narrowing item switch part 35B is displayed by operating a switch part 35 A, and a list of narrowed nozzle types is displayed by operating the narrowing item switch part 35B. When a work manager selects a suction nozzle from the list, a CPU 30 controls to display a selected nozzle graphics NG superposed on a captured image DG of the electronic component on a monitor 34. When a specification switch part 35D is operated, a rectangular graphics HG for specifying a range is displayed to be superposed on the nozzle graphics NG, and a list of nozzle types to be included within the range is displayed. When the work manager selects a required suction nozzle, the nozzle graphics NG is displayed.

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting apparatus in which a suction nozzle takes out an electronic component from a component supply device and mounts it on the substrate, and a kind of suction nozzle to take out the electronic component from the component supply device and mount it on the substrate The present invention relates to a nozzle data creation method for creating nozzle data for specifying a nozzle.

  A technique for imaging and recognizing an electronic component and creating component library data representing the characteristics of the electronic component such as dimensions in the X direction and the Y direction is disclosed in Patent Document 1 and the like.

JP 2008-211009 A

  However, when creating the part library data, data related to the external dimensions in the X direction and the Y direction as described above can be created, but it is clear what type of suction nozzle may be used. I did not understand. For this reason, when the suction nozzle used corresponding to this electronic component is selected and data is created, the suction mistake by the suction nozzle of the electronic component or the surface that should not be sucked is sucked. To happen.

  Therefore, the present invention makes it possible to select a suitable suction nozzle corresponding to the type of electronic component so as not to suck a suction mistake or a surface that should not be sucked by the suction nozzle of the electronic component as much as possible. Objective.

For this reason, the first invention is an electronic component mounting method in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
The picked-up image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the plurality of suction nozzles are displayed on the display means.

A second invention is an electronic component mounting method in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on a substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. .

According to a third aspect of the invention, there is provided an electronic component mounting method in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down by a determination item from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. .

According to a fourth aspect of the present invention, there is provided an electronic component mounting method in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
Displaying the picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range on the display means,
Displaying on the display means a list of the suction nozzles that fall within a range defined by the range designating graphics;
A graphic of the suction nozzle selected from the displayed list of the suction nozzles and a captured image or graphics of the selected electronic component are displayed on a display means. .

A fifth invention is an electronic component mounting apparatus in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
Display means for displaying a picked-up image or graphics of the selected electronic component and graphics of the suction nozzle is provided.

A sixth invention is an electronic component mounting device in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
Display means for displaying a picked-up image or graphics of the selected electronic component and graphics of the suction nozzle selected from the plurality of suction nozzles is provided.

A seventh invention is an electronic component mounting apparatus in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
A selection means for selecting a predetermined electronic component from a plurality of types of the electronic components;
Narrowing means for narrowing down the suction nozzle used for the electronic component selected by the selection means from a plurality of types of suction nozzles;
Display means for displaying a list of suction nozzles narrowed by the narrowing means;
Control is performed so that the captured image or graphics of the electronic component selected by the selection unit and the graphics of the suction nozzle selected from the suction nozzles narrowed down by the narrowing unit are displayed on the display unit. And a control means.

An eighth invention is an electronic component mounting device in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
A selection means for selecting a predetermined electronic component from a plurality of types of the electronic components;
Narrowing means for narrowing down the suction nozzle to be used for the selected electronic component from a plurality of types of suction nozzles by a judgment item;
Display means for displaying a list of suction nozzles narrowed by the narrowing means;
Control is performed so that the captured image or graphics of the electronic component selected by the selection unit and the graphics of the suction nozzle selected from the suction nozzles narrowed down by the narrowing unit are displayed on the display unit. And a control means.

A ninth invention is an electronic component mounting apparatus in which the suction nozzle takes out an electronic component from the component supply device and mounts the electronic component on the substrate.
Display means for displaying a picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range;
First control means for controlling the display means to display a list of the suction nozzles that fall within a range determined by the range designating graphics;
Control is performed so that graphics of the suction nozzle selected from the list of suction nozzles displayed on the display means and a captured image or graphics of the selected electronic component are displayed on the display means. The second control means is provided.

A tenth aspect of the invention is a nozzle data creation method for creating nozzle data for identifying the type of suction nozzle to be taken out from a component supply device and mounted on a substrate.
The picked-up image or graphics of the selected electronic component and the graphics of the suction nozzle are displayed on the display means.

An eleventh aspect of the invention is a nozzle data creation method for creating nozzle data for specifying the type of suction nozzle to be taken out from a component supply device and mounted on a substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. .

A twelfth aspect of the invention is a nozzle data creation method for creating nozzle data for specifying the type of suction nozzle to be taken out from a component supply apparatus and mounted on a substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down by a determination item from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. .

A thirteenth aspect of the invention is a nozzle data creation method for creating nozzle data for specifying the type of suction nozzle to be taken out from a component supply device and mounted on a substrate.
Displaying the picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range on the display means,
Displaying on the display means a list of the suction nozzles that fall within a range defined by the range designating graphics;
A graphic of the suction nozzle selected from the displayed list of the suction nozzles and a captured image or graphics of the selected electronic component are displayed on a display means. .

  According to the present invention, it is possible to select a suitable suction nozzle corresponding to the type of electronic component, and to prevent as much as possible the suction mistake by the suction nozzle of the electronic component and the surface that should not be sucked. .

  An embodiment of an electronic component mounting apparatus constituting a production line for mounting electronic components on a printed circuit board will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and a component supply unit 3 for supplying various electronic components one by one to a component extraction section (component suction extraction position) on a machine base 2 of the mounting apparatus 1. FIG. Are arranged side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 transports a printed circuit board P as a substrate received from an upstream device to the positioning unit 5, and electronic components are mounted on the substrate P positioned and fixed by a positioning mechanism (not shown) in the positioning unit 5. Then, it is conveyed to the discharge conveyor 6, and is conveyed to a downstream apparatus through this discharge conveyor 6.

  8A and 8B are a pair of beams that are long in the X direction. The screw shaft 10 is rotated by driving the Y-axis motor 9, and the component suction / extraction positions of the printed circuit board P and the component supply unit 3 along the pair of left and right guides 11. Move upward in the Y direction individually.

  Each of the beams 8A and 8B is provided with mounting heads 7A and 7B that move along the guide (not shown) by the X-axis motor 12 in the longitudinal direction, that is, the X direction. Each mounting head 7A or 7B is equipped with two vertical axis motors 13 for vertically moving the two suction nozzles 17A, 17B or 17C and 17D, and a θ-axis motor 14 for rotating around the vertical axis. Are installed. Accordingly, the suction nozzles of the two mounting heads 7A and 7B can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 16 denotes a component recognition camera that captures an image of electronic components sucked and held by suction nozzles 17A, 17B, 17C, and 17D as component holders.

  Next, in the control block diagram of FIG. 2, each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 30, and a ROM (Read An only memory (31) and a RAM (random access memory) 32 for storing various data are connected via a bus line 33. Further, a monitor 34 as display means for displaying an operation screen and the like and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. The Y-axis motor 9 and the like are connected to the CPU 30 via a drive circuit 38 and an interface 36. Various settings can be made by pressing the touch panel switch 35.

  The RAM 32 stores mounting data (see FIG. 3) related to mounting of electronic components of the electronic component mounting apparatus 1 for each type of printed circuit board P. For each mounting order (for each step number), printed circuit boards are stored. X coordinate, Y coordinate and angle information, which are mounting coordinates of each electronic component in P, arrangement number information of each component supply unit 3, and the like are stored.

  The RAM 32 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 3 of the electronic component mounting apparatus 1, that is, component arrangement data (see FIG. 4). Yes.

  Furthermore, component library data (FIG. 5) regarding the X- and Y-direction dimensions of the electronic component, the nozzle ID (nozzle data) of the suction nozzle to be used, and the like for each component ID of the electronic component mounted in all the electronic component mounting apparatuses. Reference) is stored. The component library data includes data created by a manufacturer of the electronic component mounting apparatus 1 and data created by a user who uses the electronic component mounting apparatus 1. Further, suction nozzle type data is also stored for each type of suction nozzle (see FIG. 6). The nozzle type data of the suction nozzle includes a display flag, a suction nozzle type, an illumination method, a shape code, suction nozzle outer dimension data, and the like.

  The display flag can be selected from “All”, “Display”, and “Hide”, and “All” lists all nozzle type data from the parts library data created by the manufacturer and user. "Display" means to display a list of nozzle type data set when the user displays from the parts library data created by the manufacturer and user, and "Hide" means user Indicates that the nozzle type data not set is listed and displayed.

  The type of the suction nozzle can be selected from “all”, “high-speed”, and “multifunctional”, and “all” is for the high-speed electronic component mounting device and the suction nozzle of the multi-functional electronic component mounting device. "High speed" means to list suction nozzles for high-speed electronic component mounting devices, and "Multi-function" means suction nozzles for multifunctional electronic component mounting devices Means to list.

  The illumination method can be selected from four types of “all”, “transmission”, “reflection”, and “transmission / reflection (transmission and reflection)”, and “all” is for transmission, reflection, and transmission / reflection. It means that the suction nozzle is listed, “transmission” means that the suction nozzle for transmission is listed, and “reflection” means that the suction nozzle for reflection is listed, “Transmission / reflection” means listing suction nozzles that can be used for both transmission and reflection.

  The shape code can be selected from “All”, “Circle”, and “Rectangle”, and “All” is a list of suction nozzles of all shapes that are circles or rectangles. This means that “circle” means listing suction nozzles whose outer shape is a circle, and “rectangle” means listing suction nozzles whose outer shape is a rectangle.

  The dimension can be selected from three types of “all”, “more than”, and “less than”. “All” means that the suction nozzles of all dimensions are listed, and “more” means X of the outer dimension.・ It means to list suction nozzles whose shorter dimension in the Y direction is greater than or equal to the entered number, and “Following” refers to suction nozzles whose outer dimension of the longer dimension in the X and Y directions is less than the entered number. It means listing.

  A recognition processing device 37 is connected to the CPU 30 via the interface 36. The recognition processing device 37 performs recognition processing of an image captured by the component recognition camera 16, and the processing result is sent to the CPU 30. Is sent out. In other words, the CPU 30 outputs an instruction to the recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16 and receives the recognition processing result from the recognition processing device 37. is there.

  With the above configuration, the editing of the parts library data will be outlined based on the flowchart relating to the editing of the parts library data as shown in FIG. First, the work manager presses the touch panel switch 35 to display a menu selection screen on the monitor 34, selects a setting menu relating to editing of the part library data, and selects an electronic part to be edited (step S01). . Then, the CPU 30 reads, for example, the component library data (FIG. 5) relating to the electronic component having the selected component ID “AAA” from the component library data stored in the RAM 32 (step S02). Further, the CPU 30 reads the nozzle type data (see FIG. 6) of all the suction nozzles stored in the RAM 32 (step S03).

  Then, the CPU controls the selected electronic component to be taken out from the component supply unit 3 by any one of the suction nozzles 17A, 17B, 17C, and 17D of the mounting heads 7A and 7B, and recognizes the taken-out electronic component as a component. Control is performed so that the image is captured by the camera 16 and displayed on the monitor 34 (step S04). Not only the picked-up image DG of the selected electronic component but also graphics are created in advance based on the component library data of the electronic component, and control is performed to display the graphics of the selected electronic component. May be.

  The component library data of the selected electronic component is edited (step S05) until the end switch portion which is the touch panel switch 35 is pressed (step S06). When the end switch portion is pressed, it is determined whether the edited data is stored in the RAM 32 and the process ends (step S07). If the process is ended without saving, the edited part library data is edited and corrected. If the process ends without being reflected as data, and is saved and terminated, the data is edited and corrected and reflected as data.

  Next, editing of the nozzle type data of the suction nozzle constituting the component library data of the electronic component selected as described above will be described based on the flowchart of FIG. First, when the editing of the nozzle type data constituting the part library data is selected by pressing the touch panel switch 35 displayed on the monitor 34, the nozzle type data editing screen shown in FIG. 9 is displayed. When the switch portion 35A is pressed, a suction nozzle type narrowing item switch portion 35B as shown in FIG. 10 is displayed (step S11).

  Here, in FIG. 10, the work manager displays the display flag “all”, the suction nozzle type “high-speed (high-speed direction)”, the illumination method “reflection”, and the shape code “all” (the outer shape of the suction nozzle is (Circle and rectangle) ”, when each item switch portion 35C of the touch panel switch 35 is pressed so that the outer dimension data of the suction nozzle is“ 1.0 mm or more ”(step S12), among all kinds of suction nozzles A list of narrowed nozzle types is displayed at the bottom of FIG. 10 (step S13).

  As described above, when the editing of the nozzle type data constituting the component library data of the selected electronic component is selected, the nozzle type data editing screen is displayed. In this case, the selected electronic component When nozzle type data is already stored in the part library data, this list of nozzle type data is displayed at the bottom of FIG.

  Therefore, in any case, the work manager looks at the list of nozzle type data displayed in the lower part of FIG. 10 and presses any position in the corresponding nozzle ID row to select the suction nozzle to be used. When operated (step S14), as shown in FIG. 11, the CPU 30 displays the nozzle graphics NG of the selected suction nozzle on the monitor 34 so as to be superimposed on the captured image DG of the electronic component (or graphics of the electronic component). (Step S15).

  Whether or not the suction nozzle to be used is selected, the CPU 30 determines whether or not the item switch portion 35C of the touch panel switch 35 in the nozzle type data list is pressed (step S16). In this case, when any item switch part 35C is pressed, the nozzle type data list is controlled to be rearranged in ascending order or descending order each time the pressed item switch part 35C is pressed (step S17). ).

  In this way, whether or not the item switch portion 35C is not pressed, or whether the nozzle type data list is displayed in ascending order or descending order after being pressed, and whether or not the suction nozzle graphics is specified next. It is determined by the CPU 30 (step S18). That is, the CPU 30 determines whether or not the designation switch portion 35D that is the touch panel switch 35 has been pressed.

  In this case, when it is determined that the designation switch portion 35D has been pressed, the operation proceeds to the flowchart shown in FIG. That is, as shown in FIG. 13, first, the CPU 30 controls to display the range-designated rectangular graphics HG so as to overlap the captured image DG of the electronic component and the nozzle graphics NG (step S21). The initial size of the rectangular graphics HG for designating the range is the same as the outer size of the selected suction nozzle.

  Next, the CPU 30 controls to display a list of nozzle types that fall within the range (step S22). In this case, control is performed so as to display a list of nozzle types in which the outer shape of the suction nozzle falls within a size within 20% of the X direction and Y direction in this range. When there is a protrusion or the like on the upper surface of the electronic component and the portion cannot be sucked, the range is specified so as to avoid the protrusion.

  Then, the work manager looks at the list of nozzle types that fall within the aforementioned range displayed in the lower part of FIG. 10 and selects one of the corresponding nozzle ID rows in order to select the suction nozzle to be used. It is determined whether or not the position has been pressed (step S23). In this case, if it is determined that any position in the nozzle ID row of the suction nozzle that is desired to be used is pressed, the CPU 30 controls to display the newly selected nozzle graphics NG on the monitor 34 (step S24). .

  Then, when any position in the corresponding nozzle ID row is not pressed or when the newly selected nozzle graphics NG is displayed by the pressing operation, the CPU 30 next displays the rectangular graphics for range designation. It is determined whether or not the HG rectangular size has been changed (step S25).

  In this case, the work manager receives the nozzle graphics NG selected in step S14 or step S24, the captured image DG of the electronic component (or the graphic of the electronic component), and the rectangular graphic HG for designating the range. The rectangle size of the range designating rectangular graphics HG is changed by moving the range designation cursor KS for expanding or contracting the range in order to select a suction nozzle with an appropriate suction position of the electronic component. Sometimes. Accordingly, when such a rectangular size is changed, as described above, the process returns to step S22 whenever it is changed.

  Next, the CPU 30 determines whether or not the designation switch unit 35D, which is the touch panel switch 35, has been pressed (step S26). If it is determined that the designation switch unit 35D has not been pressed, the process returns to step S22, but the designation switch unit 35D. If it is determined that is pressed, control is performed so that the range-designating rectangular graphics HG is not displayed, that is, not displayed (step S27), and the process proceeds to step S19 shown in FIG.

  That is, next, the CPU 30 determines whether or not the OK switch portion 35E of the touch panel switch 35 is pressed (step S19). In this case, when the work manager determines that it is appropriate to use the selected suction nozzle for the electronic component, the OK switch unit 35E is pressed, so that the suction selected by the pressing operation is performed. The nozzle is reflected (stored) in the part library data as nozzle data, and the nozzle data editing ends. If the OK switch portion 35E is not pressed, the CPU 30 determines whether the Cancel switch portion 35F has been pressed (step S20).

  When it is determined that the Cancel switch unit 35F has been pressed, the nozzle data editing ends. If it is determined that the Cancel switch portion 35F is not pressed, the process returns to step S12 shown in FIG. Therefore, returning to this step S12, when the OK switch portion or the Cancel switch portion 35F is pressed, the nozzle data editing ends.

  As described above, since a suction nozzle suitable for an electronic component can be selected, it is possible to prevent a suction error by the suction nozzle of the electronic component and a surface that should not be sucked from being sucked.

  Next, the production operation of the printed circuit board P will be described. First, when the printed circuit board P is inherited from an upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is positioned. Move to part 5.

  At this time, the printed circuit board P is locked and stopped by a positioning pin (not shown) of the position regulating device as a reference in the substrate transport direction. Then, the Z clamp mechanism (not shown) is operated, and the level of the printed circuit board P is fixed, and the printed circuit board P can be positioned in the vertical direction. Can be fixed.

  Further, backup pins necessary for the printed circuit board P to be produced are inserted into a plurality of concave grooves of the backup base (not shown), and when the backup base rises, the backup pins hit the back surface of the printed circuit board P. The substrate P is pushed up and supported so as to hold the substrate P horizontally.

  Then, according to the mounting data stored in the RAM 32 on the printed circuit board P conveyed to the positioning unit 5, the electronic component to be mounted by any of the suction nozzles 17A, 17B, 17C, 17 is sucked from the predetermined component supply unit 3. Then, the electronic component passes through the component recognition camera 16 and images each electronic component sucked and held by the suction nozzle. The recognition processing device 37 recognizes the component, and based on the result, the component is placed in the mounting coordinates of the mounting data. Each electronic component is mounted on the printed circuit board P while correcting the misalignment in consideration of the recognition result.

  In this case, with respect to the suction nozzle for taking out the electronic component from the component supply unit 3, as described above, an appropriate suction nozzle corresponding to the electronic component is selected and the nozzle ID data of the suction nozzle constituting the component library data. Therefore, by using the suction nozzle selected as an appropriate one, it is possible to prevent the suction mistake of the suction nozzle of the electronic component and the suction of the surface that should not be sucked. .

  Thereafter, electronic components are sequentially mounted on the printed circuit board P, and when all of the electronic components to be mounted on the printed circuit board P are mounted, the printed circuit board P that has been mounted is delivered to the downstream device via the discharge conveyor 6. .

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component automatic placement device. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows component arrangement | positioning data. It is a figure which shows parts library data. It is a figure which shows the type data of a suction nozzle. It is a figure which shows the flowchart which concerns on edit of component library data. It is a figure which shows the flowchart which concerns on edit of nozzle type data. It is a figure which shows the edit screen of nozzle type data. It is a figure which shows the screen for narrowing down the type of a suction nozzle. It is a figure which shows the screen which accumulated and displayed the nozzle graphics NG of the selected suction nozzle, and the captured image DG of the electronic component. It is a figure which shows the flowchart which comprises a part of flowchart of FIG. It is a figure which shows the screen which accumulated and displayed the captured image DG of electronic parts, the nozzle graphics NG, and the rectangle graphics HG for range designation.

1 Electronic component mounting device 7A, 7B Mounting head 17A, B, C, D Suction nozzle 30 CPU
32 RAM
34 Monitor 35 Touch panel switch DG Captured image of electronic component NG Nozzle graphics HG Rectangular graphics for range specification

Claims (13)

In the electronic component mounting method in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate.
An electronic component mounting method, wherein a picked-up image or graphics of the selected electronic component and graphics of a suction nozzle selected from the plurality of suction nozzles are displayed on a display means. In the electronic component mounting method in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. Electronic component mounting method. In the electronic component mounting method in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate.
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down by a determination item from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. Electronic component mounting method. In the electronic component mounting method in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate.
Displaying the picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range on the display means,
Displaying on the display means a list of the suction nozzles that fall within a range defined by the range designating graphics;
A graphic of the suction nozzle selected from the displayed list of the suction nozzles and a captured image or graphics of the selected electronic component are displayed on a display means. Electronic component mounting method. In the electronic component mounting device in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate,
An electronic component mounting apparatus, comprising: display means for displaying a picked-up image or graphics of the selected electronic component and graphics of the suction nozzle. In the electronic component mounting device in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate,
An electronic component mounting apparatus comprising: display means for displaying a picked-up image or graphics of the selected electronic component and graphics of a suction nozzle selected from the plurality of suction nozzles. In the electronic component mounting device in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate,
A selection means for selecting a predetermined electronic component from a plurality of types of the electronic components;
Narrowing means for narrowing down the suction nozzle used for the electronic component selected by the selection means from a plurality of types of suction nozzles;
Display means for displaying a list of suction nozzles narrowed by the narrowing means;
Control is performed so that the captured image or graphics of the electronic component selected by the selection unit and the graphics of the suction nozzle selected from the suction nozzles narrowed down by the narrowing unit are displayed on the display unit. An electronic component mounting apparatus comprising a control means. In the electronic component mounting device in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate,
A selection means for selecting a predetermined electronic component from a plurality of types of the electronic components;
Narrowing means for narrowing down the suction nozzle to be used for the selected electronic component from a plurality of types of suction nozzles by a judgment item;
Display means for displaying a list of suction nozzles narrowed by the narrowing means;
Control is performed so that the captured image or graphics of the electronic component selected by the selection unit and the graphics of the suction nozzle selected from the suction nozzles narrowed down by the narrowing unit are displayed on the display unit. An electronic component mounting apparatus comprising a control means. In the electronic component mounting device in which the suction nozzle takes out the electronic component from the component supply device and mounts it on the substrate,
Display means for displaying a picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range;
First control means for controlling the display means to display a list of the suction nozzles that fall within a range determined by the range designating graphics;
Control is performed so that graphics of the suction nozzle selected from the list of suction nozzles displayed on the display means and a captured image or graphics of the selected electronic component are displayed on the display means. An electronic component mounting apparatus comprising a second control means. In the nozzle data creation method for creating the nozzle data that identifies the type of suction nozzle to be taken out from the component supply device and mounted on the substrate,
A nozzle data creation method characterized in that a picked-up image or graphics of the selected electronic component and graphics of the suction nozzle are displayed on a display means. In the nozzle data creation method for creating the nozzle data that identifies the type of suction nozzle to be taken out from the component supply device and mounted on the substrate,
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. Nozzle data creation method. In the nozzle data creation method for creating the nozzle data that identifies the type of suction nozzle to be taken out from the component supply device and mounted on the substrate,
A predetermined electronic component is selected from the plurality of types of electronic components,
The suction nozzle to be used for the selected electronic component is narrowed down by a determination item from a plurality of types of suction nozzles, and a list of the narrowed suction nozzles is displayed on the display means.
The captured image or graphics of the selected electronic component and the graphics of the suction nozzle selected from the narrowed list of suction nozzles are displayed on the display means. Nozzle data creation method. In the nozzle data creation method for creating the nozzle data that identifies the type of suction nozzle to be taken out from the component supply device and mounted on the substrate,
Displaying the picked-up image or graphics of the selected electronic component and range designation graphics whose size can be changed to designate the range on the display means,
Displaying on the display means a list of the suction nozzles that fall within a range defined by the range designating graphics;
A graphic of the suction nozzle selected from the displayed list of the suction nozzles and a captured image or graphics of the selected electronic component are displayed on a display means. Nozzle data creation method.

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