JP2011129782A - Method of mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the efficiency of production of a substrate by reducing the time required for reading in mounting data and housing as much as possible, even if the production model of the substrate is changed. <P>SOLUTION: A method of mounting electronic components includes a step of selecting the production model composed of mounting data such as mounting coordinates related to electronic component mounting of a plurality kinds of substrates including the substrate to be produced next under the condition that the mounting apparatus is in a stopped state, a step of starting the production by reading in the mounting data related to component mounting to the plurality of substrates concerning the production model selected from an external memory, a step of obtaining the designated mounting model of the substrate to be produced next, and a step of performing mounting action of the electronic component on the substrate in accordance with the corresponding mounting data. The mounting method further includes a step of obtaining a designated mounting model of the substrate to be produced next when it is determined that the planned production number is not reached after the mounting action to the substrate, a step of determining whether the designated mounting model is included in the production model, and a step of performing the mounting action of components on the substrate of the designated mounting model when it is determined that the designated mounting model is included in the production model. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component on a substrate.

  An electronic component mounting apparatus for mounting an electronic component on a board is disclosed in, for example, Patent Document 1 and the like. Generally, when the production operation of a predetermined number of printed circuit boards is completed, the operation of the electronic component mounting apparatus is stopped. The model will be changed according to the printed circuit board to be manufactured.

JP 2007-96176 A

  In this case, conventionally, as shown in the flowchart of FIG. 8, the type of the printed board is switched and the printed board is produced. That is, when the start switch is pressed in the power-on state, when a printed circuit board production model is first selected (step S01), mounting data for each printed circuit board type stored in the external memory (for example, The mounting data of the selected production model out of the mounting coordinates for each mounting order, the component supply unit arrangement number, etc.) is read and stored in its own internal memory (step S02), and the production operation starts. (Step S03).

  When this production operation is started and a plurality of electronic components are mounted on the printed circuit board (step S04), and the number of printed circuit boards to be produced is produced (step S05), the production operation is completed and the electronic circuit is completed. The mounting operation of the component mounting apparatus is stopped (step S06).

  If all the electronic components are mounted on the printed circuit board (step S04), but the planned number of printed circuit boards is not produced (step S05), the production model of the next printed circuit board is determined. Based on whether the selection is made or not, it is determined whether or not it is the same model (step S07).

  In this case, for example, based on the information read by the barcode reader, the barcode representing the production model ID attached to the next printed circuit board is determined to be the same model. Returning to S04, the electronic component is mounted on the next printed circuit board (step S04). Further, it is determined whether or not they are the same model (step S07). If it is determined that they are not the same model, the production operation ends (step S08), the mounting operation is stopped, and the process returns to step S01.

  Returning to step S01, the production model of the printed circuit board is selected (step S01), and the mounting data of the production model read by the barcode reader is read out of the mounting data for each printed circuit board type stored in the external memory. Then (step S02), the product is stored in its own internal memory and the production operation is started (step S03), and electronic components are mounted on the printed circuit board (step S04).

  However, every time a printed circuit board production model is selected, the mounting data of the selected production model out of the mounting data for each printed circuit board type stored in the external memory must be read and stored in its own internal memory. In other words, every time a printed circuit board production model is selected, i.e., every time the printed circuit board production model changes, it takes time to read and store the mounting data. It was a thing.

  Accordingly, an object of the present invention is to improve the production efficiency of a substrate by reducing the time required for reading and storing the mounting data as much as possible even if the production model of the substrate is changed.

Therefore, the first invention is an electronic component mounting method for mounting an electronic component on a substrate.
With the electronic component mounting device stopped, select a production model consisting of mounting data such as mounting coordinates related to electronic component mounting on a board, which is a multiple-type mounting specification model including the board to be produced in the future. ,
From the first storage device, the mounting data related to the component mounting on the board which is the plurality of types of mounting specification models related to the selected production model is read and stored in the second storage device to start production,
Of the production models, obtain the mounting specification model of the board to be produced from now on, according to the corresponding mounting data, the electronic component mounting operation on the mounting specification model board,
After the mounting operation of the specified mounting model to the board, obtain the mounting specified model of the board to be produced next, determine whether the specified mounting model is included in the production model,
When it is determined that the specified mounting model is included in the production model, an electronic component mounting operation is performed on the substrate of the specified mounting model.

According to a second aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component on a substrate.
With the electronic component mounting device stopped, select a production model consisting of mounting data such as mounting coordinates related to electronic component mounting on a board, which is a multiple-type mounting specification model including the board to be produced in the future. ,
From the first storage device, the mounting data related to the component mounting on the board which is the plurality of types of mounting specification models related to the selected production model is read and stored in the second storage device to start production
Among the production models, obtain the mounting specification model of the board to be produced from now on, and according to the corresponding mounting data, the electronic component mounting operation on the mounting specification model board,
After the mounting operation of the specified mounting model to the board, obtain the mounting specified model of the board to be produced next, determine whether the specified mounting model is included in the production model,
When it is determined that the specified model is not included in the production model, the production operation is terminated.

  According to a third aspect of the present invention, in the first or second aspect of the present invention, it is determined that a production of a substrate of a selected production model is scheduled to determine whether the next production specification model is included in the production model. This is performed when it is determined that the number of produced sheets has not been reached.

  Conventionally, every time a board production model changes, it takes time to read and store the mounting data, and the production efficiency of the board is accordingly reduced. Even if the model is changed, it is possible to reduce the time required for reading and storing the mounting data as much as possible, and to improve the production efficiency of the board.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows component arrangement | positioning information. It is a figure which shows parts library data. It is a figure which shows the mounting data of production model: X. It is a figure which shows the flowchart which concerns on the type switching of a printed circuit board, and the production operation of a printed circuit board. It is a figure which shows the screen of a monitor. It is a figure which shows the flowchart which concerns on the model switching of the conventional printed circuit board, and the production operation of a printed circuit board.

  Hereinafter, embodiments of the present invention will be described. First, in FIG. 1, an electronic component mounting apparatus 1 constituting a board assembly / mounting line includes a transport apparatus 2 that transports a printed board P as a board, and a front side and a back side across the transport apparatus 2. Component supply device 3 for supplying the electronic components to be used, a pair of beams 4A and 4B movable in one direction (Y direction) by a drive source, and a plurality of (for example, twelve) holding means, each of which is suction A nozzle 5 is detachably provided, and a mounting head 6 that is movable and rotatable by each drive source in a direction along each of the beams 4A and 4B is provided.

  The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1, and the substrate supply unit 2 </ b> A that inherits the printed circuit board P from the upstream device and the electrons held by the suction nozzles 5 of the mounting heads 6. A substrate positioning unit 2B for positioning and fixing the printed circuit board P supplied from the substrate supply unit 2A for mounting components, and the printed circuit board P on which electronic components are mounted by the substrate positioning unit 2B are inherited and conveyed to a downstream device. The substrate supply unit 2C, the substrate positioning unit 2B, and the substrate discharge unit 2C can be adjusted in accordance with the width of the printed circuit board P (the width in the direction orthogonal to the transport direction). Consists of a conveyor.

  The component supply device 3 includes a feeder base 3A that is detachably attached to the device main body of the electronic component mounting device 1, and a plurality of detachable electronic components arranged on the feeder base 3A. The component supply unit 3 </ b> B group supplies one by one to the suction position). The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, the electronic components are supplied one by one to the component extraction position of the component supply unit 3B, and are extracted from each storage portion by the suction nozzle 5 of the mounting head 6.

  The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved by sliding the sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 7. Move in the Y direction. The Y-direction linear motor 7 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 9, respectively. A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the component take-out position of the printed board P and the component supply unit 3B on the substrate positioning unit 2B of the transport device 2.

  Each mounting head 6 is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor 10, and the mounting head 6 is rotated around a vertical axis by a θ-axis motor 11. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 8 denotes a component recognition camera that images the electronic component sucked and held by the suction nozzle 5, and reference numeral 12 denotes a substrate recognition camera 12 for imaging recognition marks M1 and M2 for confirming the position of the printed circuit board P. 6 is installed. 13A and 13B are nozzle stockers for storing various suction nozzles 5, and the maximum number of nozzles that can be arranged is 24.

  A bar code reader 19 reads a bar code representing the model name attached to the printed circuit board, and is disposed in the upstream part of the circuit board supply unit 2A of the transport device 2. The printed circuit board is connected to the electronic component mounting apparatus 1 from the upstream device. When P is delivered, the model name is read.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 21 as a control means and a check processing means, and a ROM (Read Only Memory) for storing a program related to this control. ) 22 and a RAM (Random Access Memory) 23 as a second storage device for storing various data are connected via a bus line 24. Further, a monitor 25 as a display device for displaying an operation screen and the like and a touch panel switch 26 as an input means formed on the display screen of the monitor 25 are connected to the CPU 21 via an interface 27. The Y-direction linear motor 9 and the like are connected to the CPU 21 via a drive circuit 28 and an interface 27.

  As shown in FIG. 3, the RAM 23 stores information on the type (component ID) of each electronic component corresponding to the arrangement number (lane number) of each component supply unit 3B, that is, component arrangement information. This component arrangement information is data relating to which component supply unit 3B is mounted at which position of which feeder base 3A.

  Further, the RAM 23 stores component library data relating to the characteristics of electronic components for each component ID. That is, as shown in FIG. 4, the component library data includes the size in the X direction and the Y direction, the type of the storage tape C (embossed tape, paper tape), and the like for each component ID.

  A recognition processing device 29 is connected to the CPU 21 via the interface 27. The recognition processing device 29 performs recognition processing of an image captured by the board recognition camera 8 or the component recognition camera 12. The processing result is sent to the CPU 21. That is, the CPU 21 performs recognition processing (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 18 or the position of the printed board P positioned) by the image captured by the board recognition camera 8 or the component recognition camera 12. An instruction is output to the recognition processing device 29 and a recognition processing result is received from the recognition processing device 29.

  The CPU 21 includes an external memory 30 as a first storage device, a microcomputer, and the like, and is connected to a management personal computer 31 that performs overall management of each board assembly work apparatus constituting the board assembly / mounting line. The external memory 30 stores mounting data related to component mounting for each production model. For each mounting order (for each step number), the X-coordinate, Y-coordinate and angle information in the printed circuit board P The arrangement number information of each component supply unit 3B is stored.

  For example, the mounting data relating to the production model name: X relates to component mounting on printed circuit board models A, B, C, and D (printed circuit board models that do not need to be changed in accordance with model switching). Mounting data (see FIG. 5), which is composed of mounting data for four types of printed circuit boards. Similarly, the mounting data relating to the production model name: Y includes printed circuit board models A, B, E and F ( Mounting data related to component mounting on a printed circuit board model that does not need to be changed when the work equipment is switched, and similarly, the mounting data related to the production model name: Z is the printed circuit board model. Mounting data related to component mounting on F, G, H, and I (printed circuit board models that do not need to be changed when the work equipment is switched), and mounting data for the four types of printed circuit boards Is not limited to those composed of multiple types of printed circuit board mounting data as described above, but the production model name: A etc. is mounting data related to component mounting on the printed circuit board model A, This is mounting data for a single type of printed circuit board.

  As described above, for example, the mounting data related to the production model name: X is mounting data related to component mounting on the models A, B, C, and D of the printed circuit board. When electronic components are mounted on the substrate, it is not necessary to change the work equipment such as the suction nozzle 5, the backup pin, the transfer device 2, and the component supply unit 3B when the model is switched. That is, the mounting data related to the production model name: X is a collection of the mounting data of the models A, B, C, and D of the printed circuit boards that do not need to be replaced. The same applies to the production model names: Y and Z.

  The mounting data for each production model is not limited to being stored in the external memory 30, but may be stored in the management personal computer 31 or other servers.

  A bar code reader 33 reads a bar code representing a production model ID attached to a printed circuit board. The bar code reader 33 is attached to a board supply unit, and when it is inherited from an upstream device, reads the bar code and specifies a mounting designation model. Specifically, the mounting data related to the production model name: X is mounting data related to component mounting on the printed circuit board models A, B, C, and D. The printed circuit board models A, B, C, and D One of the production model IDs is read out, and the specified installation model is specified. In addition, when reading the bar code when inheriting from the upstream device and specifying the mounting specification model, when the bar code is attached only to the first printed circuit board of the printed circuit board type, the next and subsequent If the printed circuit board that flows through is not attached with a barcode, it may be determined that the printed circuit board is the same type of printed circuit board that flows first.

  Next, the operation will be described with reference to the flowchart relating to the type switching of the printed board and the production operation of the printed board in FIG. First, in a state where the electronic component mounting apparatus 1 is stopped (a state in which the printed circuit board is not requested to the upstream side and in a stopped state; the same applies hereinafter), the work manager mounts the electronic component mounting apparatus 1. The screen shown in FIG. 7 is displayed on the monitor 25 of the apparatus 1, and the touch panel switch 26 is used to select the top model name; X in order to select the production model of the printed circuit board to be produced next (step S11). When the model selection switch section 40A is pressed, the model name: X is displayed on the display section 40B, and then the determination switch section 40C is pressed. Then, since the model switching operation has been performed, the CPU 21 of the electronic component mounting apparatus 1 stores the selected model name: X in the RAM 23.

  Then, the CPU 21 reads the mounting data relating to the model name: X stored in the external memory 30, stores it in the RAM 23 (step S12), and starts the production operation (step S13).

  Then, a model designated for mounting is selected (step S14). Specifically, the bar code reader 33 reads the bar code indicating the production model ID attached to the printed circuit board inherited from the upstream apparatus, and the model stored in the RAM 23 is read. Name: Reads one of the production model IDs from the mounting data (printed circuit board models A, B, C, and D) related to X (obtains the specified mounting model) and selects the specified mounting model. Is done.

  In this case, if the mounting designation model is model A, the command of the step number related to the models B, C, and D of the printed circuit board in the mounting data related to the production model name: X in FIG. "Is written and stored. Then, the CPU 21 performs control so that the electronic component is not attached to the step number related to the model A in which “S” is not written, while the electronic component is not attached to the step number in which “S” is written. . If the specified mounting model is model A, a similar symbol is written and stored in the command of the step number related to the model A of the printed circuit board in the mounting data related to the production model name: X. In other words, the electronic component may be controlled to be mounted only for the step number related to the model A, according to the mounting data corresponding to.

  Therefore, the electronic component mounting operation on the printed circuit board is performed for the step number related to the model A which is the selected mounting specification model (step S15). When all the electronic components to be mounted on the printed circuit board P are mounted, the number counter 34 increments the production number by “1”. Next, based on the count value of the number counter 34, the CPU 21 determines whether or not a printed circuit board for the production number X of the production model X has been produced, or whether or not the production stop button has been operated by the operator. Step S16).

  If it is determined that the number of printed circuit boards to be produced has been produced or the production stop button has been operated, the production operation ends (step S17). If it is determined that the number of printed circuit boards to be produced has not been produced, the designated mounting model for the next printed circuit board is obtained (step S18). In other words, the barcode reader 33 reads the barcode indicating the production model ID attached to the printed circuit board inherited from the upstream device, and obtains the specified installation model.

  It is determined whether or not the obtained mounting designation model is any of the printed circuit board models A, B, C, and D related to the production model name: X (whether they are in the same production model: X) (step S19). . In this case, if it is determined that the model is one of the models A, B, C, and D, the process returns to step S14 to select the mounting designation model, and on the printed circuit board for the step number related to the mounting designation model. The electronic component mounting operation is performed (step S15).

  In this case, even if the obtained mounting designation model is one of the printed circuit board models B, C, and D, the mounting data of the printed circuit board models B, C, and D related to the production model name: X has already been obtained. Since it is stored in the RAM 23, it is not necessary to read the mounting data relating to the model from the external memory 30 without stopping the mounting operation, and to store it in the RAM 23, so that the time required for reading and storing is shortened. be able to.

  When all the electronic components to be mounted on the printed circuit board P are mounted, the number counter 34 increments the production number by “1”. Next, the CPU 21 determines whether or not the number of printed circuit boards to be produced is produced based on the count value of the number counter 34 (step S16).

  Further, when it is determined that the obtained designated mounting model is not any of models A, B, C, and D (step S19), the production operation ends, and the mounting operation of the electronic component mounting apparatus 1 stops (step S20). ). That is, if it is determined that the printed circuit board model A, B, C, or D associated with the production model name: X is not one of the production models, the production operation is terminated and the mounting operation of the electronic component mounting apparatus 1 is stopped. .

  In this case, the process returns to step S11, and the work manager selects one of the production models Y, Z, and A as described above. That is, when the electronic component mounting apparatus 1 is stopped (when the printed circuit board is not requested upstream, it is stopped; the same applies hereinafter), the operational manager mounts the electronic component mounting apparatus 1. The screen shown in FIG. 7 is displayed on the monitor 25 of the apparatus 1, and the model selection switch section 40A which is the touch panel switch 26 is pressed to select the production model of the printed circuit board to be produced next (step S11). And the mounting operation as described above is performed.

  The operation of mounting the electronic component on the printed circuit board P is performed as follows. That is, when the printed circuit board P is inherited from the upstream device and exists on the substrate supply unit 2A of the transport device 2, the printed circuit board P on the substrate supply unit 2A is moved to the substrate positioning unit 2B and positioned and fixed. When the printed circuit board P is positioned, one beam 4A provided in the electronic component mounting apparatus 1 moves in the Y direction by driving the Y direction linear motor 7, and is provided in the beam 4A by the X direction linear motor 9. The mounted head 6 is moved in the X direction, moved to the upper position of the corresponding component supply unit 3B, and the suction nozzle 5 provided on the mounting head 6 is lowered by driving the vertical axis motor 10 to supply the components. An electronic component is taken out from the unit 3B.

  After the removal, the suction nozzle 5 of the mounting head 6 is raised, the mounting head 6 of the beam 4A is passed over the component recognition camera 8, and a plurality of suction nozzles 5 are held by suction during this movement. The electronic components are picked up collectively, and the picked-up image is recognized by the recognition processing device 29 so as to grasp the positional deviation with respect to the suction nozzle.

  Further, the board recognition camera 12 provided in each mounting head 6 moves to a position above the printed circuit board P, images the positioning marks M1 and M2 attached to the printed circuit board P, and recognizes the captured images. 29 recognizes and grasps the position of the printed circuit board.

  Then, by adding the recognition processing result of the positioning mark of the printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, the electronic components are mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. To do. When all the electronic components are mounted on the printed board P in this way, the printed board is transferred from the board positioning unit 2B to the downstream device via the board discharging unit 2C, and the electronic components on the printed board P are transferred. The mounting operation ends.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3A Feeder base 3B Component supply unit 5 Suction nozzle 21 CPU
23 RAM
25 Monitor 26 Touch Panel Switch 30 External Memory 33 Barcode Reader 34 Number Counter

Claims (3)

In the mounting method of the electronic component for mounting the electronic component on the substrate,
With the electronic component mounting device stopped, select a production model consisting of mounting data such as mounting coordinates related to electronic component mounting on a board, which is a multiple-type mounting specification model including the board to be produced in the future. ,
From the first storage device, the mounting data related to the component mounting on the board which is the plurality of types of mounting specification models related to the selected production model is read and stored in the second storage device to start production,
Of the production models, obtain the mounting specification model of the board to be produced from now on, according to the corresponding mounting data, the electronic component mounting operation on the mounting specification model board,
After the mounting operation of the specified mounting model to the board, obtain the mounting specified model of the board to be produced next, determine whether the specified mounting model is included in the production model,
An electronic component mounting method, comprising: mounting an electronic component on a substrate of the specified mounting model when it is determined that the specified mounting model is included in the production model. In the mounting method of the electronic component for mounting the electronic component on the substrate,
With the electronic component mounting device stopped, select a production model consisting of mounting data such as mounting coordinates related to electronic component mounting on a board, which is a multiple-type mounting specification model including the board to be produced in the future. ,
From the first storage device, the mounting data related to the component mounting on the board which is the plurality of types of mounting specification models related to the selected production model is read and stored in the second storage device to start production,
Of the production models, obtain the mounting specification model of the board to be produced from now on, according to the corresponding mounting data, the electronic component mounting operation on the mounting specification model board,
After the mounting operation of the specified mounting model to the board, obtain the mounting specified model of the board to be produced next, determine whether the specified mounting model is included in the production model,
A method of mounting an electronic component, characterized in that the production operation is terminated when it is determined that the specified mounting model is not included in the production model.   The determination as to whether the next specified mounting model to be produced is included in the production model is performed when it is determined that the production of the substrate of the selected production model has not reached the planned number of production. The mounting method of the electronic component according to claim 1 or 2.

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