JP5835993B2 - Production management device and component mounting system - Google Patents

Description

  The present invention relates to a production management apparatus for managing an electronic component mounting apparatus mounted on a substrate by sucking and moving an electronic component with a nozzle, and a component mounting system having the same.

  As an apparatus for mounting (mounting) an electronic component on a substrate, there is an electronic component mounting device that has a head having a nozzle and sucks the electronic component held by the component supply device with the nozzle and mounts it on the substrate. . There is also a component mounting system in which one or more electronic component mounting apparatuses are used to mount electronic components on a substrate.

Next, as a device for mounting (mounting) an electronic component on a board, there is a component mounting system having a component mounting device and a production management device that manages a production program for controlling the operation of the electronic component mounting device. The component mounting system downloads a production management program from the production management device to the electronic component mounting device, and mounts the electronic component on the board by executing the production program downloaded by the electronic component mounting device. In addition, the component mounting system can sequentially execute a plurality of production programs and mount components supplied from the feeder unit of the component supply device of the electronic component mounting apparatus on a predetermined board position.
Patent Document 1 discloses a means for dividing a plurality of production programs into clusters so that the types of feeders used in one cluster fall within a predetermined number, and a feeder common to two consecutive clusters. Describes a component mounting system having means for optimizing the cluster by arranging the common feeder at the same mounting position and optimizing the arrangement of the remaining feeders.

Japanese Patent No. 4050524

  As described in Patent Document 1, the component mounting system shares part of the feeder unit and shares the component supply device for a plurality of clusters (a plurality of programs). A plurality of programs can be executed without replacement.

  Here, in the component mounting system, the production program is created with a reference value (default value). For this reason, after downloading the production program to the electronic component mounting apparatus, the component mounting system executes a teaching process that adjusts values according to the characteristics unique to the electronic component mounting apparatus to be driven, and performs the mounting process on the board. Do. Here, in the teaching process, various input values are acquired by detecting an operation by the operator. For this reason, every time the program to be executed is switched, the component mounting system generates a waiting time for inputting each value of teaching processing by the operator.

  The present invention has been made in view of the above, and it is an object of the present invention to provide a data management device and a component mounting system component having the data management device that can more efficiently mount an electronic component on a substrate.

  In order to solve the above-described problems and achieve the object, the present invention provides an electronic component mounting apparatus that sucks and moves an electronic component held by a component supply device and mounts the electronic component on the substrate. A production management apparatus that manages a production program that executes an operation for mounting the electronic component and manages a mounting operation that is executed by the electronic component mounting apparatus, and a communication unit that transmits and receives information to and from the electronic component mounting apparatus; A storage unit for storing a plurality of production programs executed by the component mounting apparatus; a program management unit for managing a production management program transmitted to the electronic component mounting apparatus by the communication unit; and a plurality of production programs stored in the storage unit. Among them, a plurality of production programs that are executed with the same configuration of the electronic components held in the component supply device included in the reservation file extracted A teaching item extraction unit that extracts all teaching items related to electronic components mounted on the board in the production program, and a teaching result input to the teaching item extracted by the teaching item extraction unit, and the teaching result And a control unit including a reflection processing unit for reflecting the above.

  Moreover, it is preferable that the said teaching item extraction part extracts the teaching item which overlaps between several production programs as one teaching item.

  In addition, the control unit further includes a dummy production program generation unit that generates a dummy production program including all teaching items extracted by the teaching item extraction unit, and the program management unit includes the dummy production program in the electronic component mounting apparatus. It is preferable that the production program is transmitted, and the reflection processing unit obtains, as the teaching result, a result input by the electronic component mounting apparatus to the dummy production program.

  In addition, the storage unit has a teaching database that stores the teaching items, the teaching item extraction unit stores the extracted teaching items in the teaching database, and the program management unit includes the electronic component mounting apparatus It is preferable that the database is transmitted to the reflection processing unit, and the reflection processing unit obtains a result input to the database by the electronic component mounting apparatus as the teaching result.

  Preferably, the reflection processing unit reflects the teaching result in the production program of the reservation program, and the program management unit transmits the production program in which the teaching result is reflected in the electronic component mounting apparatus. .

  In order to solve the above-described problems and achieve the object, the present invention is a component mounting system comprising: a head body including a nozzle that sucks an electronic component; and a feeder unit that holds the electronic component sucked by the nozzle. It has at least 1 electronic component mounting apparatus provided with the component supply apparatus provided with two or more, and the production management apparatus in any one of the above.

  In order to solve the above-described problems and achieve the object, the present invention is a component mounting system comprising: a head body including a nozzle that sucks an electronic component; and a feeder unit that holds the electronic component sucked by the nozzle. A plurality of component supply devices, and at least one electronic component mounting device, and the production management device according to any one of the above, wherein the reflection processing unit sends the teaching result to the electronic device using the communication unit. Output to the component mounting apparatus, the electronic component mounting apparatus stores the teaching result supplied from the production management apparatus, and reflects the stored teaching result in the production program supplied from the production management apparatus. It is characterized by.

  Moreover, it is preferable that the electronic component mounting apparatus further includes an operation unit that detects input of teaching data.

  The electronic component mounting system according to the present invention eliminates the operator work at the time of switching the production program by enabling batch teaching processing and efficiently mounts electronic components on the board by enabling continuous production. There is an effect that can be.

FIG. 1 is a schematic diagram showing a schematic configuration of a component mounting system. FIG. 2 is a block diagram illustrating a schematic configuration of the production management apparatus. FIG. 3 is a perspective view showing a schematic configuration of the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of a head included in the electronic component mounting apparatus according to the present embodiment. FIG. 5 is a block diagram showing a schematic configuration of the electronic component mounting apparatus. FIG. 6 is an explanatory diagram for explaining an example of a processing operation of the production management apparatus. FIG. 7 is a flowchart showing an example of the processing operation of the production management apparatus. FIG. 8 is a flowchart showing an example of the processing operation of the electronic component mounting apparatus. FIG. 9 is a flowchart showing an example of the processing operation of the production management apparatus. FIG. 10 is a flowchart illustrating an example of processing operations of the production management apparatus and the electronic component mounting apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of a production management device and a component mounting system according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a schematic diagram showing a schematic configuration of a component mounting system.

  FIG. 1 is a schematic diagram showing a schematic configuration of a component mounting system. As shown in FIG. 1, the component mounting system 1 is a system for mounting electronic components on a substrate, and includes a production management device 2, a substrate supply device 4, electronic component mounting devices 10 and 10 a, and a substrate recovery device 11. And a substrate transfer device 12. In addition, the board | substrate conveyance apparatus 12 is between the board | substrate supply apparatus 4 and the electronic component mounting apparatus 10, between the electronic component mounting apparatus 10 and the electronic component mounting apparatus 10a, and between the electronic component mounting apparatus 10a and the board | substrate collection | recovery apparatus 11. And transports the substrate from one device to the other.

  The production management device 2 communicates with the substrate supply device 4, the electronic component mounting devices 10, 10 a, and the substrate collection device 11, and transmits and receives information to manage the operation of each unit. Manage component mounting processes. The production management device 2 supplies a production program for executing the mounting operation of the electronic component on the board to the electronic component mounting devices 10 and 10a. The configuration of the production management device 2 will be described later.

  The substrate supply device 4 stores a substrate before mounting electronic components, and supplies the substrate stored at the time of production. The electronic component mounting apparatuses 10 and 10a are apparatuses for mounting electronic components on a substrate. The electronic component mounting apparatuses 10 and 10a execute operations based on the production program supplied from the production management apparatus 2. The configuration of the electronic component mounting apparatuses 10 and 10a will be described later. The board collection device 11 is a device that collects the board that is discharged from the electronic component mounting apparatus 10a and carried by the board carrying device 12.

  The component mounting system 1 is configured as described above, and when production is started, the substrate supply device 4 supplies the substrate stored therein. The substrate supplied from the substrate supply device 4 is supplied to the electronic component mounting device 10 by the substrate transfer device 12. The electronic component mounting apparatus 10 mounts the electronic component on the transported board and discharges the board that has been mounted. The board discharged from the electronic component mounting apparatus 10 is transferred to the electronic component mounting apparatus 10a by the board transfer apparatus 12. The electronic component mounting apparatus 10a mounts the electronic component on the transported board, and discharges the board that has been mounted. The electronic component mounting apparatuses 10 and 10a execute processing based on the production program supplied from the production management apparatus 2. The board discharged from the electronic component mounting apparatus 10a is transferred to the board collection apparatus 11 by the board transfer apparatus 12. The substrate recovery apparatus 10 conveys the recovered substrate to the next process.

  The component mounting system 1 according to the present embodiment includes two electronic component mounting apparatuses, ie, the electronic component mounting apparatuses 10 and 10a. However, the number of electronic component mounting apparatuses may be at least one and the number is not limited. . Further, the component mounting system 1 may be configured such that the substrate transfer device 12 is not provided as long as the substrate can be delivered between the respective units. Further, the component mounting system 1 can be configured such that the board supply device 4 and the board transfer device 12 are not provided. Further, the board mounting system 1 may be provided with a device for performing a pre-process of the electronic component mounting process upstream of the electronic component mounting apparatus 10 in the board transport direction, or the electronic component mounting in the board transport direction. A device that performs a post-process of an electronic component mounting process, for example, a device that performs reflow may be disposed downstream of the device 10a.

  Next, the production management apparatus 2 will be described with reference to FIG. FIG. 2 is a block diagram illustrating a schematic configuration of the production management apparatus. The production management apparatus 2 shown in FIG. 2 is an arithmetic processing apparatus in which an operator such as a so-called personal computer executes various information processing, and includes a display unit 22, an operation unit 24, a communication unit 26, a control unit 28, and a storage. Part 30.

  The display unit 22 is a display device that displays an operation state of each unit of the component mounting system 1, a setting screen, and information stored in the storage unit 30. The display unit 22 displays an image based on the control of the control unit 28.

  The operation unit 24 is an input device through which an operator (user) inputs an operation, and sends the input operation to the control unit 28 as an operation signal. As the operation unit 24, various input devices such as a controller, an operation panel, a switch, a lever, a keyboard, and a mouse can be used. The display unit 22 and the operation unit 24 may be a touch panel in which both are integrated.

  The communication unit 26 is a communication device that transmits and receives information to and from the substrate supply device 4, the electronic component mounting devices 10 and 10 a, and the substrate collection device 11. Here, the communication unit 26 is connected to the substrate supply device 4, the electronic component mounting devices 10 and 10 a, and the substrate collection device 11 through a wired communication line.

  The control unit 28 is, for example, a CPU (Central Processing Unit) and controls the operation of each unit based on an operation input to the operation unit 24. In addition, the control unit 28 sends various information, for example, processed information and information stored in the storage unit 30, to the substrate supply device 4, the electronic component mounting devices 10, 10a, and the substrate collection device 11 via the communication unit 26. Supply. The control unit 28 manages and adjusts a production program to be supplied to the electronic component mounting apparatuses 10 and 10a, and controls the electronic component mounting operation in the electronic component mounting apparatuses 10 and 10a as a function of controlling the production program. , A teaching item extraction unit 28b, a dummy production program generation unit 28c, and a reflection processing unit 28d.

  The program management unit 28a manages which production program is transmitted to the electronic component mounting apparatuses 10 and 10a and which production program information is transmitted based on the input operation and conditions. The program management unit 28a also manages a production program stored in a production program database 30a, which will be described later, based on the input operation and conditions.

  The teaching item extraction unit 28b analyzes the production program and extracts various elements that need to be set by the electronic component mounting apparatuses 10 and 10a as the teaching items when the production program is executed. That is, the teaching item extraction unit 28b has a reference value set when the production program is created, and corrects it based on the characteristics of the electronic component mounting apparatus 10, 10a when executed by the electronic component mounting apparatus 10, 10a. Extract the information you need.

  Here, the teaching items include the actual dimensions of the electronic component (component horizontal direction, component vertical direction, component height), the nozzle number of the nozzle most suitable for electronic component mounting, and the actual lead dimensions of the electronic component (lead pitch, (Lead length, number of leads / missing information), vacuum pressure at the time of actual electronic component suction, laser centering at the time of electronic component detection (laser height, chip standing judgment value), vision centering value, lighting setting, coplanarity inspection Various parameters required for actual operation, actual component adsorption coordinates (X coordinate, Y coordinate, Z coordinate), adsorption for each electronic component, head speed setting during mounting operation (XY operation speed, θ rotation speed, Z direction increase during adsorption) Speed, Z-direction lowering speed when mounted) and the like.

  The dummy production program generation unit 28c mixes the target production programs and generates a dummy production program including necessary information. Here, the dummy production program is a program including all teaching items of the target production program.

  The reflection processing unit 28d reflects the teaching result input to the teaching item in the electronic component mounting apparatuses 10 and 10a. The reflection processing unit 28d of the present embodiment reflects the teaching result in a predetermined production program. Let The operation of each part of the control unit 28 will be described together with the operation of the production management device 2.

  The storage unit 30 is a primary storage device (main storage device) such as a memory, or a secondary storage device (auxiliary storage device) such as a storage, and includes a RAM (Random Access Memory), a ROM (Read Only Memory), or a semiconductor storage device. Or a combination of these. The storage unit 30 stores a computer program for controlling the operation of the production management device 2 and various information. The primary storage device may be provided not only in the storage unit 30 but also in the control unit 28. The storage unit 30 includes a production program database 30a, a parts database 30b, a device database 30c, a reservation file 30d, and a teaching database 30e.

  The production program database 30a stores a plurality of production programs as a database. The component database 30 stores various information (size, shape, weight, usage, storage state in the electronic component mounting apparatus, etc.) for a plurality of electronic components mounted on the board as a database. The device database 30c stores various information (individual identification numbers, functions, capabilities, etc.) relating to the electronic component mounting devices 10, 10a as a database. The production program database 30a, the parts database 30b, and the apparatus database 30c may store information on production programs, parts, and apparatuses that are not used in the present embodiment. Thereby, even if the conditions and the control target at the time of use change, it can respond smoothly.

  The reserved file 30d is a file for extracting and storing a production program to be used from a plurality of production programs. That is, the production program information used in the electronic component mounting apparatus 10 or the electronic component mounting apparatus 10a is stored.

  The teaching database 30e stores the teaching results input by the electronic component mounting apparatuses 10 and 10a as a database. The production management device 2 is configured as described above.

  Next, the electronic component mounting apparatuses 10 and 10a will be described with reference to FIGS. FIG. 3 is a perspective view showing a schematic configuration of the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of a head included in the electronic component mounting apparatus according to the present embodiment. FIG. 5 is a block diagram showing a schematic configuration of the electronic component mounting apparatus. The electronic component mounting apparatus 10 and the electronic component mounting apparatus 10a have basically the same configuration except for the arrangement position. Hereinafter, the electronic component mounting apparatus 10 will be described as a representative. An electronic component mounting apparatus 10 shown in FIG. 3 is an apparatus for mounting (mounting) electronic components on a substrate 108. As shown in FIG. 3, the electronic component mounting apparatus 10 includes a board transport unit 112, a component supply device 114, a head 115, and an XY moving mechanism 116. The substrate 108 may be a member on which electronic components are mounted, and the configuration thereof is not particularly limited. The substrate 108 of this embodiment is a plate-like member, and a wiring pattern is provided on the surface. A bonding member (solder or the like) for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 108 by reflow.

  The substrate transport unit 112 is a transport mechanism that transports the substrate 108 in the X-axis direction in the drawing. The substrate transport unit 112 includes a rail extending in the X-axis direction, and a transport mechanism that supports the substrate 108 and moves the substrate 108 along the rail. The substrate transport unit 112 transports the substrate 108 in the X-axis direction by moving the substrate 108 along the rails by the transport mechanism in a direction in which the surface (front surface) of the substrate 108 faces the head 115. The board transport unit 112 transports the board 108 supplied from a device that supplies the board 108 to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 115 mounts an electronic component on the surface of the substrate 108 at the predetermined position. When the electronic component is mounted on the substrate 108 that has been transported to the predetermined position, the substrate transport unit 112 transports the substrate 108 to an apparatus that performs the next step (for example, reflow). Note that various configurations can be used as the transport mechanism of the substrate transport section 112. For example, a belt system that integrates a transport mechanism that combines a rail disposed along the transport direction of the substrate 108 and an endless belt that rotates along the rail, and transports the substrate 108 mounted on the endless belt. Can be used.

  The component supply device 114 is detachable from the other components of the electronic component mounting apparatus 10, and is supported by the movable support base 125 and the support base 125, and holds many electronic components to be mounted on the substrate 108. A holding unit 126 and a feeder unit 128 that is supported by the support base 125 and can be supplied to the head 15 by electronic components held by the holding unit 126, that is, a feeder unit 128 that can be sucked by the head 115. In the component supply device 114, the holding unit 126 and the feeder unit 128 constitute a single unit, and a large number are arranged in a row on the support base 125. The unit constituted by the holding unit 126 and the feeder unit 128 can be attached to and detached from the support base 125 and can be replaced for each unit. The holding unit 126 and the feeder unit 126 of the component supply device 114 are configured. Although various configurations can be used for the portion to be provided, in this embodiment, the holding unit 126 in which the electronic component is attached to the tape, the tape is fed by a predetermined amount, and the electronic component is exposed to a predetermined position. It is a tape feeder comprised with the feeder part 128 which makes the state completed.

  The head 115 is a mechanism that sucks an electronic component held by the component supply device 114 and mounts the sucked electronic component on the substrate 108 moved to a predetermined position by the substrate transport unit 112. The head 115 will be described later.

  The XY moving mechanism 116 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 3, that is, on a plane parallel to the surface of the substrate 108, and the X-axis driving unit 122 and the Y-axis driving unit 124. Have The X-axis drive unit 122 is connected to the head 115 and moves the head 115 in the X-axis direction. The Y-axis drive unit 124 is connected to the head 115 via the X-axis drive unit 122, and moves the head 115 in the Y-axis direction by moving the X-axis drive unit 122 in the Y-axis direction. The XY moving mechanism 116 can move the head 115 to the position facing the substrate 108 or the position facing the feeder unit 128 of the component supply device 114 by moving the head 115 in the XY axis direction. Further, the XY moving mechanism 116 adjusts the relative position between the head 115 and the substrate 108 by moving the head 115. Thereby, the electronic component held by the head 115 can be moved to an arbitrary position on the surface of the substrate 108, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 108. As the X-axis drive unit 122, various mechanisms that move the head 115 in a predetermined direction (bidirectional) can be used. As the Y-axis drive unit 124, various mechanisms that move the X-axis drive unit 122 in a predetermined direction (bidirectional) can be used. As a mechanism for moving the object in a predetermined direction (bidirectional), for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a belt, or the like can be used.

  Next, the head 115 will be described with reference to FIG. FIG. 4 is an explanatory diagram of a head included in the electronic component mounting apparatus according to the present embodiment. The head 115 is driven by the X-axis drive unit 122. The head 115 includes a control board 160, a Z-axis motor 161, a θ motor 162, an air control valve 163, a board recognition camera 164, a laser alignment sensor 165, and a nozzle (suction nozzle) that sucks electronic components. Including. The control board 160 has a drive circuit for driving the Z-axis motor 161, the air control valve 163, the θ motor 162, and the like.

  The Z-axis motor 161 moves the suction nozzle in the Z-axis direction. With this function, the Z-axis motor 161 moves the suction nozzle closer to the substrate and moves the suction nozzle closer to the substrate away from the substrate. The Z-axis motor 161 mounts the electronic component on the substrate by bringing the suction nozzle that has attracted the electronic component closer to the substrate and bringing the electronic component into contact with the terminal electrode of the substrate. The θ motor 162 rotates the suction nozzle about the Z axis. The Z axis is orthogonal to the XY plane, but the XY plane is parallel to the surface of the substrate on which the electronic component is mounted, so the θ motor 162 rotates the nozzle about an axis orthogonal to the surface of the substrate. . With this function, the θ motor 162 can adjust the positional relationship between the electronic component and the substrate.

  The air control valve 163 switches between suction of the suction nozzle and suction stop. In other words, the air control valve 163 sucks air from the opening of the suction nozzle, thereby sucking the electronic component into the opening of the suction nozzle. Further, the air control valve 163 opens the electronic component sucked by the opening of the suction nozzle from the opening by stopping the suction. The air control valve 163 controls the suction and release of the electronic component by the suction nozzle by causing the suction nozzle to perform such an operation.

  The substrate recognition camera 64 images the recognition marks provided on the suction position reference in addition to the alignment marks provided on the substrate 108. By this operation, the substrate recognition camera 164 detects information (position information) about the position of the substrate and the stage holding the substrate. The board recognition camera 164 detects the position information while the electronic component is mounted on the board, or detects the position information in teaching of the suction position of the electronic component and inspection of the mounting position. The laser alignment sensor 165 has a laser measurement function. With this function, information such as the distance between the head 115 and the substrate and the inclination of the head 115 is detected. In order to control the Z-axis motor 161 and the θ motor 162 of the head 115, suck air from the suction nozzle, transmit information detected by the substrate recognition camera 164, the head 115 has a flexible cable and a suction tube. The bundled flexible cable group 166 is connected.

  As shown in FIG. 5, the electronic component mounting apparatus 10 includes a substrate transfer unit 112, a component supply device 114, a head 115, an XY movement mechanism 116, a display unit 132, an operation unit 134, and a communication A unit 136, a control unit 138, and a storage unit 140. The substrate transport unit 112, the head 115, and the XY moving mechanism 116 are as described above. As shown in FIG. 5, the component control device 114 includes a supply control unit 129 as a control function in addition to the above-described configuration. The supply control unit 129 controls information on electronic components held in the holding unit 126 and supply operations of components in the feeder unit 128. The supply control unit 129 is configured by a memory or the like that stores operations such as a CPU and various types of information.

  The display unit 132 is a display device that displays information about an image captured by the head 115 and information sent from the control unit 138. The operation unit 134 is an input device through which an operator (user) inputs an operation. As the configuration of the operation unit 134, various input devices can be used similarly to the production management apparatus 2 described above. The operation unit 134 sends the input operation to the control unit 138 as an operation signal. The communication unit 136 is a communication device that transmits and receives information to and from the production management apparatus 2. Here, the communication unit 136 is connected to the production management apparatus 2 via a wired communication line. The communication line may be a wireless communication line.

  The control unit 138 is, for example, a CPU. The control unit 138 controls the operations of the substrate transport unit 112, the component supply device 114, the head 115, and the XY moving mechanism 116 based on various information and operations input to the operation unit 134. The control unit 138 includes a component information detection unit 138a. The control unit 138 is held by the feeder unit 128 of the component supply device 114 based on information sent from the supply control unit 129 of the component supply device 114 and an image photographed by the head 115, and is sucked by the head 115 and mounted on the substrate. Detect possible electronic component information. That is, the component information detection unit 138 detects the arrangement configuration of the feeder unit 128 provided in the component supply device 114 and the electronic component supply system.

  The storage unit 140 is a primary storage device (main storage device) such as a memory, or a secondary storage device (auxiliary storage device) such as a storage, and includes a RAM (Random Access Memory), a ROM (Read Only Memory), or a semiconductor storage device. Or a combination of these. The storage unit 149 stores a computer program for controlling the operation of the electronic component supply apparatus 10, information about the types of boards and electronic components, information necessary for mounting electronic components on the board, and the like. The primary storage device may be provided not only in the storage unit 30 but also in the control unit 28. The component mounting system 1 is configured as described above.

  Next, the processing operation of the component mounting system 1 will be described with reference to FIGS. FIG. 6 is an explanatory diagram for explaining an example of a processing operation of the production management apparatus. FIG. 7 is a flowchart showing an example of the processing operation of the production management apparatus. FIG. 8 is a flowchart showing an example of the processing operation of the electronic component mounting apparatus.

  The component mounting system 1 can execute a plurality of production programs without changing the configurations of the holding unit 126 and the feeder unit 128 of the component supply device 114 of the electronic component mounting apparatuses 10 and 10a. In other words, the component mounting system 1 is configured such that the configuration of the holding unit 126 and the feeder unit 128 of the component supply unit 114 is compatible with a plurality of types of mounting patterns, so that a plurality of types of components can be replaced without replacing the component supply device 114. Electronic components can be mounted on the substrate.

  When the production management apparatus 2 of the present embodiment executes a plurality of production programs without changing the configuration of the component supply apparatus 114, the production management apparatus 2 executes a process in each unit of the control unit 28 and generates a dummy production program. First, the control unit 28 reads a production program from a reservation file in which a production program to be executed is stored. Next, the control unit 28 uses the teaching item extraction unit 28b to extract all teaching items related to electronic components mounted on the board necessary for the processing of the read production program. That is, all teaching items that need to be prepared in order to execute the production program are extracted. The control part 28 produces | generates the dummy production program containing all the extracted teaching items by the dummy production program production | generation part 28c.

  For example, as shown in FIG. 6, when the first production program 210 and the second production program 220 are stored in the reserved file, the control unit 28 causes the dummy production program generation unit 28c to A dummy production program 230 is generated based on the second production program 220.

  The first production program 210 includes a parts data list 212 and a feeder section data list 214. The first production program 210 includes, in addition to the component data list 212 and the feeder unit data list 214, operation instruction information such as in which position on the board and in which order each electronic component is mounted. Yes. The component data list 212 is a list of electronic components to be mounted, and stores an item 212a storing “Compo-A” and various data corresponding thereto, “Compo-B” and various data corresponding thereto. Item 212b, and "Compo-C" and an item 212c in which various data corresponding thereto are stored. “Compo-alphabet” is an example of the name of an electronic component. The feeder section data list 214 is a list of position information of the feeder section that supplies the electronic components stored in the parts data list 212. The position information 214a of the feeder section that supplies "Compo-A", and "Compo-A" Position information 214b of the feeder section that supplies “Compo-B”, position information 214c of the feeder section that supplies “Compo-B”, and position information 214d of the feeder section that supplies “Compo-C”. That is, the component supply apparatus of the present embodiment includes two feeder units that supply “Compo-A”.

  The second production program 220 includes a parts data list 222 and a feeder section data list 224. The second production program 220 also includes operation instruction information such as in which position on the board and in which order each electronic component is mounted in addition to the component data list 222 and the feeder section data list 224. Yes. The component data list 212 includes an item 222a storing “Compo-B” and various data corresponding thereto, an item 222b storing “Compo-C” and various data corresponding thereto, “Compo-D”, and the like. It has an item 222c that stores various data corresponding to it, and an item 222d that stores “Compo-D” and various data corresponding to it. The feeder section data list 224 includes position information 224a of a feeder section that supplies “Compo-B”, position information 224b of a feeder section that supplies “Compo-C”, and information of a feeder section that supplies “Compo-D”. Position information 224c, and position information 224d of the feeder unit that supplies “Compo-E”.

  The dummy production program generation unit 28c compares the part data list 212 and the feeder part data list 214 of the first production program 210 with the part data list 222 and the feeder part data list 224 of the second production program 220, and both When an item is included, a dummy production program 230 including a parts data list 232 and a feeder section data list 234 including both position information is generated.

  The parts data list 232 includes an item 232a storing “Compo-A” and various data corresponding thereto, an item 232b storing “Compo-B” and various data corresponding thereto, “Compo-C”, and the like. An item 232c storing various data corresponding thereto, an item 232d storing “Compo-D” and various data corresponding thereto, an item 232e storing “Compo-E” and various data corresponding thereto, and Have. The feeder section data list 234 includes the position information 234a of the feeder section that supplies “Compo-A”, the position information 234b of the feeder section that supplies “Compo-A”, and the position information 234b of the feeder section that supplies “Compo-B”. Position information 234c, position information 234d of the feeder section that supplies “Compo-C”, position information 234e of the feeder section that supplies “Compo-D”, and position information of the feeder section that supplies “Compo-E” 234f.

  In the dummy production program 234, since the items 212b and 222a and the items 212c and 222b are the same item, the parts data list 232 is organized into items 232b and 232c. Further, since the position information 214c and the position information 224a, and the position information 214d and the position information 224b are the same position information of the feeder section, the feeder section data list 234 is compiled into the position information 234c and the position information 234d.

  In this way, the dummy production program generation unit 28c generates the dummy production program 230 by including the parts data items used in the first production program 210 and the second production program 220 and the position information of the feeder unit. Thereby, the dummy production program generation unit 28 c can make the dummy production program 230 a production program including all teaching items of the first production program 210 and the second production program 220. That is, since the dummy production program generation unit 28c is a production program that uses all of the electronic parts and feeder parts used in the first production program 210 and the second production program 220, the first production program 210 and the second production program 220 are used. Teaching items for all electronic parts and feeders used in the above can be included.

  Next, the processing operation of the control unit 28 of the production management apparatus 2 when executing a plurality of production programs without changing the configuration of the component supply apparatus 114 will be described with reference to FIG. In the process shown in FIG. 7, the control unit 28 executes various processes by operating the program management unit 28a, the teaching item extraction unit 28b, the dummy production program generation unit 28c, and the reflection processing unit 28d. In step S12, the control unit 28 generates a dummy production program from the production program in the reserved file by the teaching item extraction unit 28a and the dummy program generation unit 28c. Specifically, as described with reference to FIG. 6, a plurality of production programs are compared, and a production program that uses all of the electronic parts and feeder units used in the production program in the reservation file is created.

  After generating the dummy production program in step S12, the control unit 28 transmits the dummy production program to the electronic component mounting apparatuses 10 and 10a by the program management unit 28a in step S14. That is, the dummy production program is transmitted to the electronic component mounting apparatuses 10 and 10a that execute the production program stored in the reserved folder. After transmitting the dummy production program in step S14, the control unit 28 executes teaching detection processing in step S16. Specifically, a process for detecting teaching for the transmitted dummy production program is executed. The teaching detection process is executed by the electronic component mounting apparatuses 10 and 10a that have received the dummy production program, and the control unit 28 is on standby during the teaching detection process.

  The electronic component mounting apparatuses 10 and 10a execute processing for detecting teaching. Here, the teaching is a process in which the electronic component mounting apparatus 10 or 10a inputs a value specific to the electronic component mounting apparatus 10 or 10a for the teaching item included in the dummy production program. The input to the teaching item may be an input operation performed by the operator on the operation unit 134 or information acquired by the control unit 138 from each unit.

  The electronic component mounting apparatuses 10 and 10a detect the result of the teaching process as a teaching result. The teaching result is an input result for teaching items that need to be input in order for the electronic component mounting apparatuses 10 and 10a to execute the dummy production program. The electronic component mounting apparatuses 10 and 10a update the dummy production program based on the teaching result, and transmit the updated dummy production program to the production management apparatus 2.

  After executing the teaching detection process in step S16, the control unit 28 receives a dummy production program transmitted from the electronic component mounting apparatus 10, 10a as step S18. That is, the control unit 28 is on standby after transmitting the dummy production program in step S14, and executes the process of step S18 when the dummy production program is transmitted from the electronic component mounting apparatus 10, 10a.

  When the control unit 28 receives the dummy production program (dummy production program in which the teaching item is updated by the electronic component mounting apparatus 10 or 10a) in step S18, the reflection processing unit 28d sets each dummy production program information in step S20. Reflect in production program. That is, the teaching item information updated in the dummy production program received in step S18 is reflected in the teaching item of the production program stored in the reservation file 30d. That is, the reflection processing unit 28d sets the teaching items of the production program stored in the reservation file 30d set as default values based on the teaching result to information corresponding to the unique characteristics of the electronic component mounting apparatuses 10 and 10a. Update to When the control unit 28 reflects the information (teaching result) of the dummy production program in each production program, the process ends.

  Next, the processing operation of the electronic component mounting apparatus 10 during the component mounting process will be described with reference to FIG. The electronic component mounting apparatus 10a also performs the same processing as the electronic component mounting apparatus 10. In addition, it is a process after the process of FIG. 7 is complete | finished rather than showing in FIG. The electronic component mounting apparatus 10 downloads the production program from the production management apparatus 2 in step S32. At this time, the downloaded production program is a production program in which the teaching result is reflected in step S20 of FIG.

  After downloading the production program in step S32, the electronic component mounting apparatus 10 executes production processing as step S34. That is, the electronic component mounting apparatus 10 processes the production program, operates each unit, and mounts the electronic component on the board. After executing the production process in step S34, the electronic component mounting apparatus 10 determines in step S36 whether the production process for the production program in the reservation file has been completed. If the electronic component mounting apparatus 10 determines that the process has not ended (No) in step S36, the electronic component mounting apparatus 10 proceeds to step S32, downloads the next production program, and performs a production process based on the next production program downloaded in step S34. Run. As described above, the electronic component mounting apparatus 10 repeats the processes in steps S32 and S34 until the production process by the production program in the reservation file is completed. If the electronic component mounting apparatus 10 determines that the process has ended (Yes) in step S36, the process ends.

  In this way, the component mounting system 1 creates a dummy production program including all teaching items included in the production program based on the production program in the reservation file by the production management device 2. The component mounting system 1 updates the dummy production program by executing a teaching process for the dummy production program with the electronic component mounting apparatus 10. The component mounting system 1 extracts the teaching result from the dummy production program updated by the production management device 2 and reflects it in the production program. During production processing, the electronic component is mounted using the reflected production program.

  As a result, the component mounting system 1 can perform the teaching process collectively with the dummy production program, and can execute the production program without executing the teaching process every time the production program is switched. As a result, teaching work (setup work) at the time of switching the production program is eliminated, and continuous production is possible without any operator work. Thereby, working efficiency can be improved. In addition, teaching work (setup work) can be performed at one time by performing teaching processing of duplicated part data and suction data between multiple production programs by carrying out teaching processing in a batch with a dummy production program. Time can be shortened and the operator's workload can be reduced.

  In the present embodiment, the dummy production program generation unit 28c may also function as the teaching item extraction unit 28b. That is, the extraction of teaching items may be executed by generating a dummy production program.

  Further, as in this embodiment, by generating a dummy production program and executing the teaching process on the dummy production program, the operator can perform the same operation as the operation executing the teaching process on the production program, Teaching processing for the production program in the reserved folder can be executed. As a result, the operator can perform an operation in the same manner as in normal teaching, can suppress unfamiliar work, and can suppress an increase in work load. In the above embodiment, the dummy production program is generated by the dummy production program production unit 28c, but the invention is not limited to this.

  Here, FIG. 9 is a flowchart showing an example of the processing operation of the production management apparatus. Note that the processing shown in FIG. 9 is executed by the control unit 28 operating the program management unit 28a, the teaching item extraction unit 28b, and the reflection processing unit 28d. In step S40, the control unit 28 uses the teaching item extraction unit 28a to extract items that require teaching from the production program in the reservation file. Specifically, a plurality of production programs are compared, and teaching items for all electronic parts and feeder units used in the production program in the reservation file are extracted.

  After extracting the teaching items in step S40, the control unit 28 stores the teaching items in a database (teaching database) by the teaching item extraction unit 28a in step S42. After performing the process of step S42, the control unit 28 transmits a teaching start command to the mounting apparatus (electronic component mounting apparatus 10) as step S44. The teaching start command is an instruction for the electronic component mounting apparatus 10 to start teaching processing. When receiving the teaching start command, the electronic component mounting apparatus 10 starts the teaching process.

  After transmitting the teaching start command in step S44, the control unit 28 executes teaching detection processing in step S46. Here, in the teaching detection process of step S46, the teaching items stored in the teaching database 30e are transmitted from the control unit 28 to the electronic component mounting apparatus 10, and the teaching items received by the electronic component mounting apparatus 10 are taught. This is a process for detecting the teaching result. The teaching detection process is executed until a teaching result is detected for all teaching items stored in the teaching database 30e.

  After executing the teaching detection process in step S46, the control unit 28 receives the teaching result transmitted from the electronic component mounting apparatus 10 in step S48. When receiving the teaching result in step S48, the control unit 28 reflects teaching information (information corresponding to the teaching result) in each production program by the reflection processing unit 28d in step S50. That is, the teaching item information received in step S48 is reflected in the teaching item of the production program stored in the reservation file 30d. That is, the reflection processing unit 28d sets the teaching items of the production program stored in the reservation file 30d set as default values based on the teaching result to information corresponding to the unique characteristics of the electronic component mounting apparatuses 10 and 10a. Update to When the teaching result is reflected in each production program, the control unit 28 ends this processing.

  The component mounting system 1 (production management device 2) may transmit the teaching items extracted in this way to the electronic component mounting devices 10 and 10a as they are to execute teaching. In other words, without generating the dummy production program, a mode for executing teaching in the electronic component mounting apparatus 10 may be activated, input for teaching items may be executed, and the input result may be reflected in the production program. In this case as well, the same effect can be obtained by batch teaching to the teaching items for the production program stored in the reservation file.

  Further, in the above embodiment, the teaching result detected in a lump is reflected in the production program so that the teaching operation at the time of switching the production program can be omitted. However, the present invention is not limited to this.

  FIG. 10 is a flowchart illustrating an example of processing operations of the production management apparatus and the electronic component mounting apparatus. The process shown in FIG. 10 is an example of the operation when the teaching result is not reflected in the production program. Note that the processing shown in FIG. 10 is executed by the production management device 4 and the electronic component mounting devices 10 and 10a of the component mounting system 1. Note that part of the processing shown in FIG. 10 is the same as the processing shown in FIG.

  The component mounting system 1 executes the processing from step S40 to step S48 by the production management device 4 as in FIG. 9, and receives the teaching result. The processing from step S40 to step S48 is the same as the processing in FIG.

  When the component mounting system 1 receives the teaching result in step S48, in step S60, the reflection processing unit 28d stores teaching information (information corresponding to the teaching result) in the memory of the electronic component mounting apparatus 10. Here, the memory of the control unit 138, the memory of the storage unit 140, or the memory of the supply control unit 129 can be used as the memory. When the memory of the supply control unit 129 is used, teaching information corresponding to the feeder unit can be stored in each feeder unit.

  After storing the teaching information in the memory in step 60, the component mounting system 1 downloads the production program from the production management device 4 to the electronic component mounting device 10 in step S62. After downloading the production program in step S62, the electronic component mounting apparatus 10 executes processing for reflecting the teaching information in the memory in step S64. That is, the teaching information stored in step S60 is reflected on the teaching items of the production program. After performing the reflection process in step S64, the component mounting system 1 executes the production process as step S66. That is, the component mounting system 1 processes the production program by the electronic component mounting apparatus 10 to operate each unit and mount the electronic component on the board. After executing the production process in step S66, the component mounting system 1 determines in step S38 whether the production process for the production program in the reservation file has been completed in the electronic component mounting apparatus 10. If the component mounting system 1 determines that the process has not ended (No) in step S66, the component mounting system 1 proceeds to step 62, downloads the next production program, performs reflection processing in step S64, and performs the next production downloaded in step S66. Execute production processing based on the program. In this way, the component mounting system 1 repeats the processes of step S62, step S64, and step S66 until the production process by the production program in the reservation file is completed. If the component mounting system 1 determines that the process has ended (Yes) in step S68, the process ends.

  In this way, the component mounting system 1 eliminates the need for the operator to perform teaching processing every time the production program is switched, even if the teaching results collectively detected are reflected each time the production program is executed. Teaching for teaching items to be performed can be completed at once, and the same effect as in the above embodiment can be obtained.

DESCRIPTION OF SYMBOLS 1 Component mounting system 2 Production management apparatus 4 Substrate supply apparatus 10 Electronic component mounting apparatus 11 Substrate collection | recovery apparatus 12 Substrate conveyance apparatus 22 Display part 24 Operation part 26 Communication part 28 Control part 28a Program management part 28b Teaching item extraction part 28c Dummy production program Generation unit 28d Reflection processing unit 30 Storage unit 30a Production program database 30b Component database 30c Device database 30d Reservation file 30e Teaching database 108 Substrate 112 Substrate transport unit 114 Component supply device 115 Head 116 XY movement mechanism 122 X-axis drive unit 124 Y-axis drive Part 125 Support stand 126 Holding part 128 Feeder part 129 Supply control part 210 First production program 220 Second production program 230 Dummy production program

Claims (6)

The electronic component mounting apparatus manages the production program for causing the electronic component mounting apparatus that picks up and moves the electronic component held by the component supply apparatus and mounts the electronic component on the board to execute the operation of mounting the electronic component on the board. A production management device for managing the mounting operation executed in
A communication unit for transmitting and receiving information to and from the electronic component mounting apparatus;
A storage unit for storing a plurality of production programs to be executed by the electronic component mounting apparatus;
A program management unit that manages a production management program that is transmitted to the electronic component mounting apparatus by the communication unit, and a configuration of electronic components that are held in the component supply device among the plurality of production programs stored in the storage unit is the same A teaching item extraction unit for extracting all teaching items related to electronic components mounted on the board with a production program included in a reservation file obtained by extracting a plurality of the production programs executed in the configuration, the teaching item extraction unit A dummy production program generation unit that generates a dummy production program that includes all of the extracted teaching items, and a reflection processing unit that acquires the teaching results input to the teaching items extracted by the teaching item extraction unit and reflects the teaching results A control unit comprising:
The dummy production program generation unit generates the dummy production program based on the teaching items extracted by the teaching item extraction unit,
The program management unit transmits the dummy production program to the electronic component mounting apparatus,
The production processing apparatus, wherein the reflection processing unit acquires a result input by the electronic component mounting apparatus to the dummy production program as the teaching result .   The production management apparatus according to claim 1, wherein the teaching item extraction unit extracts teaching items that overlap between a plurality of production programs as one teaching item. The reflection processing unit reflects the teaching result in the production program of the reservation file,
The program management unit, a production management system according to claim 1 or 2, characterized in that transmitting the production program that reflects the teaching results in the electronic component mounting apparatus. At least one electronic component mounting device comprising: a head main body including a nozzle that adsorbs an electronic component; and a component supply device including a plurality of feeder units that hold the electronic component adsorbed by the nozzle;
Component mounting system characterized by having a a production management system according to any one of claims 1 to 3. At least one electronic component mounting device comprising: a head main body including a nozzle that adsorbs an electronic component; and a component supply device including a plurality of feeder units that hold the electronic component adsorbed by the nozzle;
A production management device according to claim 1 or 2 ,
The reflection processing unit outputs the teaching result to the electronic component mounting apparatus by the communication unit,
The electronic component mounting apparatus stores the teaching result supplied from the production management apparatus, and reflects the stored teaching result in the production program supplied from the production management apparatus. . The component mounting system according to claim 4, wherein the electronic component mounting apparatus further includes an operation unit that detects input of teaching data.

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