JP2011009472A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To readily and rapidly perform work of aligning a captured image of a recognition mark with graphics involving the recognition mark and to increase the accuracy of alignment.SOLUTION: When a re-recognition positioning mode switch part 41 is press-operated and an operation manager press-operates a part in the vicinity of the center of the recognition mark M, a CPU understands that the re-recognition start position is designated and executes re-recognition by setting a recognition range centering on the designated re-recognition start position. Thus, a recognition processing device can perform recognition processing and the CPU updates position information of the recognition mark M according to a result of re-recognition and moves the graphics GM to the position to be displayed in an overlapped state. In this case, the CPU stores the result of re-recognition in a RAM and controls such that an electronic component is mounted on a proper position based on the result of re-recognition by this re-recognition in mounting the taken-out electronic component onto a printed board.

Description

  The present invention captures an image of a recognition mark attached to a printed circuit board with a substrate recognition camera, performs recognition processing by a recognition processing device, and then prints an electronic component held by a holding unit based on the recognition processing result. The present invention relates to an electronic component mounting apparatus mounted on a substrate.

  This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1, but when a board recognition abnormality occurs during the production operation of a printed board on which an electronic component on the printed board is mounted, the work manager After the production operation was stopped, the image of the captured recognition mark and the graphics related to the recognition mark were manually adjusted, and then the production operation was resumed.

JP 2009-105103 A

  However, the alignment work between the image of the recognized recognition mark imaged manually and the graphics associated with this recognition mark is cumbersome and requires a considerable amount of work time, and the accuracy of the alignment itself depends on the work. It becomes a ward and is not stable.

  In view of the above, the present invention is intended to easily and quickly perform the alignment work between the captured image of the recognition mark and the graphics related to the recognition mark, and to increase the accuracy of the alignment itself and to stabilize the alignment. Objective.

  Therefore, in the first invention, the recognition mark attached to the printed circuit board is imaged by the board recognition camera, the recognition processing apparatus performs the recognition process, and the holding means is based on the recognition processing result. In an electronic component mounting apparatus that mounts an electronic component that has been taken out on this printed circuit board, the recognition mark picked up and the recognition mark related to the recognition mark when it is out of the recognition range based on the recognition processing result by the recognition processing device A display device for displaying graphics, a designation means for designating the recognition mark displayed on the display device or the vicinity of the recognition mark, and a new recognition position including the designated position when the re-recognition position is designated by the designation means And a control device for performing control so as to perform re-recognition within a wide recognition range.

  In the second invention, the recognition mark attached to the printed circuit board is imaged by the board recognition camera, the recognition processing apparatus performs the recognition process, and the holding means is taken out from the component supply apparatus based on the recognition processing result. In the electronic component mounting apparatus for mounting the electronic component on the printed circuit board, the captured recognition mark and the graphics associated with the recognition mark when the recognition processing device is out of the recognition range based on the recognition processing result. Display device, a recognition mark displayed on the display device or a touch panel switch provided on the display device for designating the vicinity of the recognition mark, and a re-recognition position is designated by pressing the touch panel switch. Then, there is provided a control device for performing control so as to perform re-recognition within a new recognition range including the designated position.

  According to a third aspect of the present invention, the recognition mark attached to the printed circuit board is imaged by the board recognition camera, the recognition processing apparatus performs the recognition process, and the holding means is taken out from the component supply apparatus based on the recognition processing result. In the electronic component mounting apparatus for mounting the electronic component on the printed circuit board, the substrate recognition camera is moved above the recognition mark on the printed circuit board when it is out of the recognition range based on the recognition processing result by the recognition processing apparatus. When the recognition mark is imaged, a display device that displays the captured recognition mark and graphics related to the recognition mark, and a recognition mark displayed on the display device or a vicinity of the recognition mark are designated. When a re-recognition position is designated by the designation means, control is performed so that re-recognition is performed within a new recognition range including the designated position. Characterized in that a control device.

  According to a fourth aspect of the present invention, the recognition mark attached to the printed circuit board is imaged by the board recognition camera, and the recognition processing device performs the recognition processing, and the holding means is taken out from the component supply device based on the recognition processing result. In the electronic component mounting apparatus for mounting the electronic component on the printed circuit board, the substrate recognition camera is moved above the recognition mark on the printed circuit board when it is out of the recognition range based on the recognition processing result by the recognition processing apparatus. In order to specify the captured recognition mark when the captured recognition mark is imaged and a display device for displaying the graphics related to the recognition mark, and the recognition mark displayed on the display device or the vicinity of the recognition mark. When the re-recognition position is specified by pressing the touch panel switch provided on the display device and pressing this touch panel switch, Characterized in that a control for controlling apparatus to perform re-recognition in the new recognition range including.

  According to the present invention, the alignment operation of the captured image of the recognition mark and the graphics related to the recognition mark is easily and quickly performed, and the accuracy of the alignment itself is increased and stabilized. Can do.

It is a top view of an electronic component mounting apparatus. It is a control block diagram. It is a figure which shows the flowchart which concerns on the production operation of a printed circuit board. It is a figure which shows the flowchart of the position alignment when there exists abnormality in a recognition process. It is a figure which shows the screen on which the graphics of the recognition mark external shape and the captured image of the recognition mark were displayed. It is a figure which shows the screen of the state which selected the re-recognition positioning mode. It is a figure which shows the screen of the state which designated the recognition range in the re-recognition positioning mode. It is a figure which shows the screen of the state which updated the position information of the recognition mark in the re-recognition positioning mode, and moved the graphics to the position.

  Hereinafter, an electronic component mounting apparatus, which is a multifunctional chip mounter including a component supply device and an electronic component mounting apparatus main body, will be described with reference to the accompanying drawings. In FIG. 1, an electronic component mounting apparatus main body 1 includes a machine base 2, a conveyor unit 3 extending in the left-right direction at the center of the machine base 2, a front part (lower side in the figure) and a rear part of the machine base 2. Two sets of component mounting portions 4 and 4 and two sets of component supply portions 5 and 5 respectively disposed on the upper side of the figure are provided. In the component supply unit 5, a plurality of component supply units 6 which are electronic component supply devices are placed on, for example, a cart (not shown) and are detachably incorporated to constitute an electronic component mounting device.

  The conveyor unit 3 includes a central set table 8, a left supply conveyor 9, and a right discharge conveyor 10. The printed circuit board P is supplied from the supply conveyor 9 to the set table 8 and is set to a fixed height to receive the electronic component mounted on the set table 8, and the printed circuit board P on which the electronic component has been mounted is set. It is discharged from the table 8 through the discharge conveyor 10 to the downstream apparatus.

  Each component mounting portion 4 is provided with an XY stage 12 on which a head unit 13 is movably mounted, as well as a component recognition camera 14 and a nozzle stocker 15. The head unit 13 is equipped with two mounting heads 16 and 16 for sucking and mounting electronic components, and one substrate recognition camera 17 for recognizing the position of the printed circuit board P.

  In each XY stage 12, the beam 12A is moved in the Y direction by the Y axis drive motor 12Y, and the head unit 13 is moved in the X direction by the X axis drive motor 12X. As a result, the head unit 13 is moved in the XY direction. It becomes.

  Each component supply unit 5 is provided with a number of component supply units 6 on a feeder base 19 so as to be detachable side by side. Each component supply unit 6 is loaded with a storage tape C in which a large number of electronic components are stored in each storage portion Cd at regular intervals. One electronic component is supplied to the component mounting unit 4 at a time.

  The operation based on the mounting data stored in the RAM 21 of the electronic component mounting apparatus main body 1 is performed by the holding means provided in the mounting head 16 after first driving the XY stage 12 and causing the head unit 13 to face the component supply unit 6. A desired electronic component is taken out by lowering a certain suction nozzle 18. Subsequently, after the mounting head 16 is raised, the XY stage 12 is driven to move the electronic component to a position directly above the component recognition camera 14 to image the electronic component sucked and held by the suction nozzle 18. Next, the mounting head 16 is moved to the position of the printed board P on the set table 8, and after the recognition mark M attached to the board P is diagonally imaged by the board recognition camera 17, the component recognition camera 14 and the board are picked up. Based on the result of recognition processing performed by the recognition processing device 27 on the image captured by the recognition camera 17, the X-axis drive motor 12X, the Y-axis drive motor 12Y of the XY stage 12, and the θ-axis drive motor 18A of the suction nozzle 18 are corrected. The electronic component is mounted on the printed circuit board P by moving it.

  Next, a control block diagram of the electronic component mounting apparatus shown in FIG. 2 will be described. Reference numeral 20 denotes a CPU as a control unit that performs overall control of operations related to electronic component mounting of the electronic component mounting apparatus, 21 denotes a RAM (random access memory) as a storage device, and 22 denotes a ROM (read-only memory). ).

  Mounted on the RAM 21 for each type of printed circuit board P such as X direction, Y direction and angle information in the printed circuit board P, and arrangement number information of each component supply unit 6 for each mounting order (for each step number). Data is stored, and information on the type (component ID) of each electronic component corresponding to the arrangement number (lane number) of each component supply unit 6, that is, component arrangement information is stored. Furthermore, component library data composed of items representing the characteristics of the electronic component for each component ID is also stored. The RAM 21 also stores data relating to the shape and size of the recognition mark M attached to the printed circuit board P for each printed circuit board P.

  The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 rotates the X-axis drive motor 12X through the drive circuit 23, drives the Y-axis drive motor 12Y through the drive circuit 24, and rotates the suction nozzle 18 by θ through the drive circuit 25. The driving of the θ-axis drive motor 18A is controlled, and the drive of the vertical axis drive motor 16A for moving the mounting head 16 up and down is further controlled via the drive circuit 26.

  A recognition processing device 27 is connected to the CPU 20 via an interface 28. The recognition processing device 27 performs recognition processing of an image captured by the component recognition camera 14 or the board recognition camera 17. The processing result is sent to the CPU 20. That is, the CPU 20 performs a recognition process (calculation of a positional deviation amount of the electronic component sucked and held by the suction nozzle 18 or the positioned printed circuit board P) on the image captured by the component recognition camera 14 or the board recognition camera 17. Are output to the recognition processing device 27 and the recognition processing result is received from the recognition processing device 27.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 27, the result is sent to the CPU 20, and the CPU 20 performs the X-axis drive motor 12X, the Y-axis drive motor 12Y and the suction nozzle 18 of the XY stage 12. The θ-axis drive motor 18A is corrected and moved so that the electronic component is mounted on the printed circuit board P.

  The monitor 30 as a display device is provided with various touch panel switches 31 as input means for data setting, and various settings can be performed by an operator operating the touch panel switch 31, and the setting data is stored in the RAM 21. Stored in

  The production operation of the printed circuit board P for mounting the electronic component on the printed circuit board P of the electronic component mounting apparatus will be described below. First, as shown in FIG. 3, when the production operation is started, the printed circuit board P is conveyed from the upstream device to the set table 8 via the supply conveyor 9, and is positioned by the positioning mechanism.

  Then, the head unit 13 is moved in the XY directions, the recognition mark M attached to the printed board P is imaged by the board recognition camera 17, and the recognition processing device 27 performs the recognition process. In this case, if there is no abnormality in the recognition process, the imaging / recognition process is repeated for the number of recognition marks M attached to the printed circuit board P.

  Next, in accordance with the mounting data stored in the RAM 21, the CPU 20 picks up the electronic component to be mounted by the suction nozzle 18 corresponding to the component type of the electronic component from the predetermined component supply unit 6 and takes it out.

  At this time, the Y-axis drive motor 12Y and the X-axis drive motor 12X are controlled by the CPU 20, and the suction nozzle 18 of each mounting head 16 supplies the component suction unit 18 for storing the electronic component to be mounted to the component suction extraction position. The Y-axis drive motor 12Y is driven to move the beam 12A in the Y direction, and the X-axis drive motor 12X is driven to move the head unit 13 in the X direction. As a result, the head unit 13 moves in the XY directions. Since each of the predetermined supply units 6 has already been driven and parts can be taken out at the parts picking and taking out position, the vertical axis driving is performed based on signals output from the CPU 20 via the interface 28 and the driving circuit 26. The suction nozzle 18 is lowered by the motor 16A to pick up and take out the electronic component, and the other suction nozzle 18 is also picked up and taken out of the electronic component from the component supply unit 6 in the same manner as described above.

  Then, the head unit 13 is moved in the X and Y directions, the electronic component held by the suction nozzle 18 is imaged by the component recognition camera 14, the recognition processing device 27 performs recognition processing, and the mounting operation to the printed circuit board P is performed. Do. In this case, the recognition processing device 27 performs recognition processing according to the component library data of the electronic component stored in the RAM 21.

  Then, the CPU 20 takes into consideration the recognition processing results from the recognition processing device 27 for board recognition and component recognition so that the suction nozzle 18 moves to the mounting coordinate position on the printed board P positioned by the set table 8. The X-axis drive motor 12X and the Y-axis drive motor 12Y are controlled, and each beam 12A moves in the Y direction, and each head unit 13 moves in the X direction, and the θ-axis drive motor 18A of the suction nozzle 18 is driven to correct. The suction nozzle 18 is lowered by the vertical axis drive motor 16A and the electronic component is mounted on the printed circuit board P.

  Then, the electronic component is taken out, the component recognition process and the electronic component are mounted for the total number of mounting points on the printed circuit board P, and all the electronic components to be mounted on the printed circuit board P are mounted. P is discharged from the set table 8 to the downstream device via the discharge conveyor 10.

  In accordance with the mounting operation of the electronic components as described above, the board recognition is performed for each printed board P. As described above, the recognition mark M attached to the printed board P is imaged by the board recognition camera 17. The alignment process when the recognition processing device 27 performs the recognition process and there is an abnormality in the recognition process will be described with reference to the flowchart of FIG.

  First, when the recognition processing device 27 performs a recognition process and is abnormal, a captured image of the recognition mark M is displayed on the monitor 30. That is, as shown in FIG. 5, the graphic GM of the recognition mark outline and the captured image of the recognition mark M are displayed on the monitor 30 at the center.

  Note that this recognition abnormality is conveyed from the upstream device to the set table 8 via the supply conveyor 9, and when the printed circuit board P is positioned by the positioning mechanism, the position of the printed circuit board P is excessively shifted, resulting in a predetermined recognition area. This is the case when the recognition mark M does not fit in the AE.

  Here, the work manager selects whether the alignment is performed in the manual positioning mode or the re-recognition positioning mode. That is, in this selection, when the re-recognition positioning mode switch unit 41 which is the touch panel switch 31 displayed in FIG. 5 is pressed, the CPU 20 determines that the re-recognition positioning mode is selected, and the re-recognition positioning mode switch unit 41 is selected. When the arrow switch unit 42 is pressed without being pressed, it is determined that the manual positioning mode is selected.

  First, the case where the manual positioning mode is selected will be described. Since the graphics GM and the captured recognition mark M are displayed on the monitor 30, either the graphics GM or the recognition mark M is overlapped. When the arrow switch part 42 is pressed, the graphic GM changes the movement alignment result position in the direction indicated by the arrow switch part 42 by pressing the arrow switch part 42, and the pressing operation of the arrow switch part 42 is repeated. The graphics GM and the recognition mark M can be overlaid. For example, the graphics GM can be brought closer to the recognition mark M by pressing the left arrow switch unit 42A. If necessary, the graphics GM is eventually recognized as the graphics GM by pressing the other arrow switch unit 42. The mark M can be overlaid.

  Then, when the work manager confirms that the graphics GM and the recognition mark M overlap each other and presses the alignment position determination switch unit 43, the alignment operation in the manual positioning mode is completed.

  Accordingly, the CPU 20 stores in the RAM 21 the amount of movement of the graphics GM that has moved until the graphics GM and the recognition mark M overlap, and the amount of movement resulting from this alignment is the imaging and recognition processing device 27 of the board recognition camera 17 described above. It is grasped as a position when the position of the recognition mark M is recognized by the recognition process by the above.

  Accordingly, when the electronic component is subsequently taken out from the component supply unit 6 and mounted on the printed circuit board P, the movement amount of the graphics GM, that is, the positional deviation amount of the printed circuit board P is taken into account, and the electronic component is properly processed. The CPU 20 controls the X-axis drive motor 12X, the Y-axis drive motor 12Y, and the θ-axis drive motor 18A so as to be mounted at the positions.

  Next, when the re-recognition positioning mode switch unit 41 shown in FIG. 5 is pressed and the re-recognition positioning mode is selected, the screen shown in FIG. 6 is displayed, and the work manager nears the center of the recognition mark M or the recognition mark. When the vicinity of M is pressed, the CPU 20 understands that the re-recognition start position is designated by the touch panel switch 31 as the designation means, and sets the recognition range around the designated re-recognition start position (in the frame WA). It is determined whether or not re-recognition can be executed in the enclosed range), and if it is determined that the recognition mark M is within the recognition range and re-recognition can be executed (see FIG. 7). Note that an arrow may be displayed on the monitor 30 instead of the touch panel switch 31 that is a designation means, and designation may be performed by a mouse operation.

  As described above, it is possible to simplify the workability by automatically setting the recognition range by pressing the vicinity of the center of the recognition mark M (or the vicinity of the recognition mark M) by the operator. If it is determined that the re-recognition cannot be executed, the designation of the re-recognition start position and the execution of the re-recognition are repeated until the alignment position is determined.

  In this way, when the recognition mark M does not fit in the predetermined recognition area AE, the recognition process cannot be performed and the recognition is abnormal, but the recognition range is set (the range surrounded by the frame WA), Re-recognition is performed.

  Accordingly, the recognition processing device 27 can perform the recognition process, and the CPU 20 updates the position information of the recognition mark M according to the re-recognition result, moves the graphics GM to the position, and overlaps it. Display (see FIG. 8).

  In this case, the CPU 20 stores the re-recognition result in the RAM 21, and based on the re-recognition result by the re-recognition, the electronic component is properly used when the electronic component is mounted on the printed circuit board P after the electronic component is taken out from the component supply unit 6. The CPU 20 controls the X-axis drive motor 12X, the Y-axis drive motor 12Y, and the θ-axis drive motor 18A so as to be mounted at various positions.

  If the recognition mark M cannot be captured by the component recognition camera 14 and the CPU 20 determines that the recognition is abnormal, the recognition mark M is not displayed in FIG. In this case, regardless of whether it is performed in the manual positioning mode or the re-recognition positioning mode, the work manager moves the beam 12A and the head unit 13 by pressing the touch panel switch 31 displayed on the monitor 30. Then, the substrate recognition camera 17 is positioned above the recognition mark M on the printed circuit board P, the recognition mark M is imaged, and the recognition processing device 27 performs recognition processing.

  For this reason, as shown in FIG. 5, the recognition mark M is displayed on the monitor 30 in addition to the graphics GM, and as described above, the alignment can be performed in the manual positioning mode or the re-recognition positioning mode. It becomes.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus main body 6 Component supply unit 16 Mounting head 17 Board | substrate recognition camera 18 Suction nozzle 20 CPU
27 Recognition processing device 30 Monitor 31 Touch panel switch

Claims (4)

  After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, a display device that displays the captured recognition mark and graphics related to the recognition mark when the recognition processing device is outside the recognition range based on the recognition processing result by the recognition processing device, and the display device The designation means for designating the recognition mark displayed in the vicinity or the vicinity of the recognition mark, and when the re-recognition position is designated by the designation means, re-recognition is performed within a new recognition range including the designated position. An electronic component mounting apparatus comprising a control device for controlling.   After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, a display device that displays the captured recognition mark and graphics related to the recognition mark when the recognition processing device is outside the recognition range based on the recognition processing result by the recognition processing device, and the display device A touch panel switch provided on the display device for designating the recognition mark displayed in the vicinity of the recognition mark, and when a re-recognition position is designated by pressing the touch panel switch, a new recognition including the designated position is performed. An electronic component mounting apparatus comprising: a control device that performs control so as to perform re-recognition within a range.   After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, when the recognition mark is imaged by moving the board recognition camera above the recognition mark on the printed circuit board when the recognition processing apparatus is outside the recognition range based on the recognition processing result. A display device that displays the captured recognition mark and graphics related to the recognition mark, a designation means for designating the recognition mark displayed on the display device or the vicinity of the recognition mark, and re-recognition by the designation means And a control device that controls to perform re-recognition within a new recognition range including the designated position when the position is designated. That electronic component mounting apparatus.   After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, when the recognition mark is imaged by moving the board recognition camera above the recognition mark on the printed circuit board when the recognition processing apparatus is outside the recognition range based on the recognition processing result. A display device that displays the captured recognition mark and graphics associated with the recognition mark, a touch mark switch provided in the display device for designating the recognition mark displayed on the display device or the vicinity of the recognition mark, When a re-recognition position is specified by pressing this touch panel switch, recognition within a new recognition range including this specified position is performed. An electronic component mounting apparatus characterized by comprising a control device for controlling to perform.

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