JP2011226686A - Heat transporting unit, electronic circuit board, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat transporting unit capable of efficiently transporting the heat of a heating body of small size while exhibiting its maximum performance.SOLUTION: The heat transporting unit includes an upper plate, a lower plate which faces the upper plate, an internal space which is formed by the upper plate and the lower plate and allows a coolant to be sealed up, a first region which is a part of the internal space and includes a first post part forming a plurality of first passages along X-axis direction, and a second region which is a region in the internal space other than the first region and includes a second post part forming a plurality of second passages along the X-axis direction and Y-axis direction. At the border between the first region and the second region, the first passage and the second passage communicate with each other.

Description

  The present invention relates to a heat transport unit and an electronic device that efficiently transports heat received from a heating element such as a semiconductor integrated circuit, an LED element, a power device, and an electronic component.

  Electronic parts such as semiconductor integrated circuits, LED elements, and power devices are used in electronic equipment, industrial equipment, and automobiles. These electronic components are heating elements that generate heat due to a current flowing inside. If the heat generation of the heating element exceeds a certain temperature, there is a problem that the operation cannot be guaranteed, which adversely affects other parts and the housing, and as a result, the performance of the electronic device or the industrial device itself may be deteriorated.

  In order to cool such a heat generating body, the cooling device using the heat pipe which has the cooling effect by vaporization and condensation of the enclosed refrigerant | coolant is proposed.

  The heat pipe takes heat away from the heating element when the refrigerant sealed inside vaporizes. The vaporized refrigerant is cooled and condensed by heat dissipation, and the condensed refrigerant moves again. By repeating this vaporization and condensation, the heat pipe cools the heating element. That is, the heat pipe diffuses and transports heat. Furthermore, when combined with a heat radiating member, the heat pipe cools the diffused or transported heat. Compared to a heat diffusing member made of metal, a heat pipe can diffuse and transport heat more efficiently by using a refrigerant.

  In recent years, electronic components to be cooled are not only relatively large semiconductor integrated circuits such as CPUs (Central Processing Units) and dedicated ICs, but also very small electronic devices such as high-intensity LEDs (Light Emitting Devices). Often parts. Such a small electronic component is not only small in size, but often includes a plurality of electronic components. For this reason, a cooling device using a heat pipe often needs to cool a plurality of small electronic components.

  Such small electronic components are often mounted intensively on a part of an electronic board, and there is no space margin in the place where the electronic parts are mounted, and heat cannot be dissipated or discharged at that place in many cases. . For this reason, it is necessary to remove heat from the electronic component, transport the heat at a high speed in a predetermined direction, and cool the transported part. That is, there is a need for a heat transport member that uses vaporization and condensation of a refrigerant and transports heat in a predetermined direction at high speed.

  In such a situation, a heat pipe that transports heat taken from the heating element in a predetermined direction has been proposed (see, for example, Patent Documents 1, 2, 3, and 4).

JP-A-11-101585 JP 2002-39693 A JP 2010-7905 A JP 2007-111384 A

  A heat pipe capable of transporting heat taken from a heating element in a predetermined direction encloses a refrigerant in an internal space formed by a joined upper plate and lower plate, and the heat cycle of the heating element is determined by the movement cycle of the enclosed refrigerant. To transport. In a cooling device using a heat pipe, improving the heat transport efficiency (determined by the speed of each movement of vaporized refrigerant and condensed refrigerant and the number of cycles per unit period) improves the cooling capacity. Is important to.

  At this time, the refrigerant sealed in the internal space is vaporized by the heat from the heating element and moves in the internal space, and is eventually cooled and condensed to move in the internal space. For this reason, the vaporized refrigerant and the condensed refrigerant interfere with each other while moving in opposite directions in the internal space. When the influence of such interference becomes strong, there is an adverse effect on the cycle speed between the movement of the vaporized refrigerant and the movement of the condensed refrigerant, and there is a problem of lowering the transportation speed and transportation efficiency of heat transportation.

  In order to prevent such interference between the movement of the evaporated refrigerant and the movement of the condensed refrigerant, it is preferable that the internal space is wide and there is no obstacle.

  On the other hand, the configuration without any obstacles in the internal space is a state where everything except the upper plate and the lower plate is in a rugged state, and the strength of the heat pipe becomes extremely weak. Since the heat pipe cools the heating element by repeatedly vaporizing and condensing the refrigerant sealed inside, the heat pipe repeatedly receives a very high internal pressure. In such a harsh operating environment, when the strength of the heat pipe is weak, there is a problem that the heat pipe is damaged by the popcorn phenomenon caused by the vaporization of the refrigerant, and the refrigerant leaks to the electronic component or the electronic substrate. If the refrigerant leaks, there is a problem that the electronic components and the electronic substrate are damaged, causing malfunction and failure of the electronic device.

  For example, it is necessary to increase the strength, but if the strength of the upper plate or the lower plate itself is increased, the cost increases and the thickness increases, which is unsuitable for practical use and difficult to mount. This is because a mounting space such as a light emitting element does not have a space margin, and thus a heat pipe having a large thickness is not suitable.

  For this reason, in order to improve the strength of the heat pipe, it is necessary to provide a reinforcing material such as a column or a partition plate in the internal space of the heat pipe. However, when this reinforcing material is provided, the freedom of movement of the evaporated refrigerant and the condensed refrigerant in the internal space is hindered. Patent Document 1 and Patent Document 2 are intended to transport heat from a heating element in a predetermined direction while improving the strength of a heat pipe.

  The heat pipe disclosed in Patent Document 1 discloses a plate heat pipe in which pores (channels rather than pores) are aligned. In the heat pipe disclosed in Patent Document 1, each passage moves the vaporized refrigerant and the condensed refrigerant. With this pore, the heat pipe disclosed in Patent Document 1 can transport heat in a predetermined direction. That is, the vaporized refrigerant moves from the first end to the second end of the pore, and the condensed refrigerant moves from the second end to the first end. The technique disclosed in Patent Document 1 ensures the strength of the entire heat pipe by laminating the passages in the width direction.

  However, in the heat pipe disclosed in Patent Document 1, adjacent passages are completely separated from each other, and the refrigerant moves only in the longitudinal direction of the heat pipe (direction along the passage). For this reason, there exists a problem which does not produce a cooling effect in the width direction with respect to a small heat generating body. In addition, when the heat pipe disclosed in Patent Document 1 cools a small heating element, a cooling burden is generated only in the passage where the heating element directly contacts. That is, the refrigerant only in the passage where the heating element directly contacts is vaporized and moved, and condensed and moved. For this reason, the heat pipe disclosed in Patent Document 1 has a problem in that it cannot exhibit its maximum performance.

  The heat pipe disclosed in Patent Document 2 forms a vaporized refrigerant moving path and a condensed refrigerant moving path by shifting the slits provided in the stacked members. Since the slit is formed in a predetermined direction, the refrigerant is moved and moved in the predetermined direction. As a result, the heat pipe disclosed in Patent Document 2 can transport heat in a predetermined direction.

  Similarly to Patent Document 1, in Patent Document 2, the passages formed by the slits are independent from each other, and have the same problem as in Patent Document 1.

  Patent Document 3 discloses a heat pipe that transports heat by generating a capillary force by stacking a plurality of plate members and stacking a plate member having a groove and a plate member having a hole.

  However, although the heat pipe disclosed in Patent Document 3 can transport heat in the longitudinal direction, it is difficult to diffuse the heat in the short direction. For this reason, when the heating element is small, the heat of the heating element can only be transported in the longitudinal direction only in the vicinity of contact with the heating element. In addition, heat may be diffused omnidirectionally from the heating element due to the holes provided over the entire surface, and it is difficult to transport the heat in a predetermined direction.

  In addition, in any of the techniques of Patent Documents 1 to 3, when heat is transported from end to end, not only can the maximum performance of the heat pipe be exhibited, but heat is also directed from the center toward the end. Even when transporting, the maximum performance of the heat pipe cannot be demonstrated. When cooling the heat transported only in a specific passage, the cooling member that cools the heat transported by the heat pipes cannot be maximized because the passage that is not related to the heat transport is also cooled. Because.

  Further, the end of the heat pipe that transports heat needs to fulfill at least one of the function of receiving heat from the heating element and the function of cooling the heat transported from the opposite end. For this reason, regardless of the size of the heating element and the size of the cooling member, it is required to diffuse the heat received from the heating element and the transported heat in the width direction at the end of the heat pipe.

  However, the heat pipes disclosed in Patent Literature 1 to Patent Literature 3 do not have such a function, and receive heat only at a predetermined portion to cool the heat. For this reason, the heat pipes of Patent Document 1 and Patent Document 2 have a problem that cooling suitable for a small heating element cannot be performed.

  Patent Document 4 discloses a heat pipe in which a plate member provided with a groove in the lateral direction at the end portion and a plate member provided with a passage in the longitudinal direction over the whole are laminated. The heat pipe diffuses heat in the short direction at the end, and moves the heat in the longitudinal direction in the others.

  However, in the heat pipe disclosed in Patent Document 4, the refrigerant can move only in a very narrow range in the longitudinal direction, and the heat transport efficiency is lowered. In addition, the passages provided in the short direction and the passages provided in the longitudinal direction overlap with each other only in part, and there is a problem that heat transfer between the mutual passages is poor. In addition, Patent Document 4 has a problem that the strength is weakened because the passages are formed unbalanced in the heat pipe. As a result, the technique of Patent Document 4 also has a problem that the heat of the heating element cannot be efficiently transported in a predetermined direction. In addition, the heat pipe disclosed in Patent Document 4 has a problem that it is difficult to adapt to an electronic device or an industrial device in which high-density mounting is performed because the contact position with the heating element is limited due to its structure.

  As described above, the heat pipe that transports the heat of the heating element in a predetermined direction in the prior art has a problem that the maximum performance cannot be utilized. In particular, there is a problem that it is insufficient to transport and cool the heat of a small heating element. In addition, it is impossible to ensure both the strength of the heat pipe and to efficiently transport heat while flexibly responding to the size and contact position of the heating element.

  In view of the above problems, the present invention is (1) ensuring strength by a pillar part or a reinforcing part, (2) minimizing obstacles to movement of refrigerant in an enclosed space by the pillar part or the reinforcing part, (3 ) Realizing the movement of the refrigerant in the required direction of the X-axis, Y-axis and Z-axis while minimizing the obstacle of the refrigerant movement, (4) By flexibly responding to the size and contact position of the heating element An object of the present invention is to provide a heat transport unit that can efficiently transport the heat of a small heating element while exhibiting its maximum performance. In addition, a heat pipe that is easy to mount is provided for high-density mounting electronic equipment and industrial equipment.

  The heat transport unit has a heat pipe structure using vaporization and condensation of the enclosed refrigerant.

  In view of the above problems, the heat transport unit of the present invention has a space defined by the X axis, the Y axis, and the Z axis orthogonal to each other, and includes an upper plate, a lower plate facing the upper plate, and an upper plate and a lower plate. An internal space formed and capable of enclosing a refrigerant, a first region that is a partial region of the internal space and includes a first pillar portion that forms a plurality of first passages along the X-axis direction; And a second region including a second pillar portion that forms a plurality of second passages along the X-axis direction and the Y-axis direction. The first region and the second region The first passage and the second passage communicate with each other at the boundary.

  The heat transport unit of the present invention is provided with different pillars in the first area and the second area in the enclosed space for enclosing the refrigerant, thereby ensuring strength and optimal for each of the X axis, Y axis, and Z axis. Heat diffusion and transport.

  In addition, the heat transport unit, as a heat pipe, transports the diffused heat in the longitudinal direction while diffusing the received heat in the longitudinal direction and the lateral direction at the portion where the heating element is in thermal contact. Heat of the heating element can be transported efficiently while utilizing maximum performance.

  As a result, the heat transport unit of the present invention can efficiently transport heat from a small heating element.

  Further, the heat of the heating element can be transported at a high speed while responding to the change in the arrangement position of the heating element.

It is a perspective view of the heat transport unit in Embodiment 1 of this invention. It is an internal perspective view of the heat transport unit in Embodiment 1 of this invention. It is operation | movement explanatory drawing of the heat transport unit in Embodiment 1 of this invention. It is an operation | movement conceptual diagram of the heat transport unit in Embodiment 1 of this invention. It is an internal perspective view of the heat transport unit in Embodiment 2 of this invention. It is sectional drawing of the edge part of the heat transport unit in Embodiment 2 of this invention. It is an internal schematic diagram of the heat transport unit 1 in Embodiment 2 of this invention. It is an enlarged view near the 2nd field of the heat transport unit in Embodiment 2 of the present invention. It is a front view of the heat transport unit in Embodiment 2 of this invention. It is a perspective view of the heat transport unit in Embodiment 2 of this invention. It is a disassembled perspective view of the heat transport unit in Embodiment 3 of this invention. It is explanatory drawing which arranged the Example and the comparative example. It is a graph which shows the measurement result of an Example and a comparative example. It is a side view of the heat transport unit in Embodiment 4 of this invention. It is a schematic diagram of the electronic device in Embodiment 5 of this invention.

  In the heat transport unit according to the first aspect of the present invention, a space is defined by an X axis, a Y axis, and a Z axis orthogonal to each other, and an upper plate, a lower plate facing the upper plate, an upper plate and a lower plate An internal space that can be filled with a refrigerant, a first region that is a partial region of the internal space, and includes a first pillar portion that forms a plurality of first passages along the X-axis direction; A second region that is a region other than the first region in the space and includes a second pillar portion that forms a plurality of second passages along the X-axis direction and the Y-axis direction, and the first region and the second region The first passage and the second passage communicate with each other at the boundary with the region.

  With this configuration, the heat transport unit can improve its strength, and even in a small heating element, the heat taken from the heating element can be transported in the longitudinal direction evenly using the short direction of the heat transport unit. .

  In the heat transport unit according to the second aspect of the present invention, in addition to the first aspect, in the first passage, the vaporized refrigerant moves and the condensed refrigerant moves along the X-axis direction. In the passage, the vaporized refrigerant moves and the condensed refrigerant moves along the X-axis direction and the Y-axis direction.

  With this configuration, the heat transport unit can transport heat taken from the heating element in the longitudinal direction while maximally utilizing the short direction.

  In the heat transport unit according to the third invention of the present invention, in addition to the first or second invention, in the first passage and the second passage, the vaporized refrigerant moves and the condensed refrigerant moves mutually. To do.

  With this configuration, the heat transport unit can transport heat by effectively using the first region and the second region having different functions.

  In the heat transport unit according to the fourth invention of the present invention, in addition to any of the first to third inventions, the second region is provided at at least one end of both ends of the internal space, The region is provided in a region other than the second region in the internal space.

  With this configuration, the heat transport unit can transport the heat of the heating element disposed at the end thereof to the other end.

  In the heat transport unit according to the fifth aspect of the present invention, in addition to any of the first to fourth aspects of the invention, the second region is provided in the central portion of the internal space, and the first region is in the internal space. It is provided in a region other than the second region.

  With this configuration, the heat transport unit can transport the heat of the heating element disposed in the center toward both ends.

  In the heat transport unit according to the sixth aspect of the present invention, in addition to any of the first to fifth aspects, the second region diffuses heat received from the heating element in the X-axis direction and the Y-axis direction. At the same time, the first region moves to the first region, and the first region transports the heat moved from the second region in the X-axis direction.

  With this configuration, the heat transport unit can transport the heat taken from the heating element in the Y-axis direction and then transport in the X-axis direction evenly using the Y-axis direction.

  In the heat transport unit according to the seventh aspect of the present invention, in addition to the sixth aspect, the second region is provided at the first end of the internal space and the second end opposite to the first end. In this case, the second region on the first end side diffuses the heat received from the heating element in the X-axis direction and the Y-axis direction and moves to the first region, and the first region is on the first end side. The heat transferred from the second region is transported in the X-axis direction, and the second region on the second end side diffuses the heat transported by the first region in the X-axis direction and the Y-axis direction.

  With this configuration, the heat transport unit diffuses the heat taken from the heating element in the X-axis direction and the Y-axis direction using the second region, and then uses the first region in the X-axis direction. transport. Furthermore, the heat transport unit emits heat using the second region where the heating element is not disposed. As a result, the heat transport unit can cool the heating element.

  In the heat transport unit according to the eighth aspect of the present invention, in addition to the sixth aspect, the second region is provided at the center of the internal space, and the first region is the first end of the internal space and the first region. When provided at the second end opposite to the end, the second region diffuses the heat received from the heating element in the X-axis direction and the Y-axis direction and moves the first region to the first region. Transports heat transferred from the second region in the X-axis direction.

  With this configuration, the heat transport unit uses the second region located in the center to diffuse the heat of the heating element in the X-axis direction and the Y-axis direction, and uses the first region located at both ends, And transport to both ends of the heat transport unit. Suitable for transporting heat from the heating element in many directions.

  In the heat transport unit according to the ninth aspect of the present invention, in addition to any of the first to eighth aspects, at least one of the upper plate and the lower plate further includes a heat receiving portion that is in thermal contact with the heating element. And the heat receiving portion is provided across the boundary between the first region and the second region.

  With this configuration, the heat transport unit can efficiently receive heat from the heating element and transport it in a predetermined direction. In addition, the heat transport efficiency of the heat transport unit is improved.

  In the heat transport unit according to the tenth invention of the present invention, in addition to any one of the first to ninth inventions, the first pillar portion communicates adjacent first passages among the plurality of first passages. Has a notch to let you.

  With this configuration, the first passages can exchange refrigerant.

  In the heat transport unit according to the eleventh invention of the present invention, in addition to any of the first to tenth inventions, the second region has one or more intermediate plates stacked in the Z-axis direction, The intermediate plate forms a second pillar portion that is stacked in the Z-axis direction, and the second pillar portion forms a second passage along the X-axis direction, the Y-axis direction, and the Z-axis direction.

  With this configuration, the second region can diffuse heat three-dimensionally.

  In the heat transport unit according to the twelfth invention of the present invention, in addition to any of the first to eleventh inventions, the second column portion includes a large column member and a small column member smaller than the large column member. Have

  With this configuration, the second passage has a more complicated configuration and produces a high capillary force. As a result, the second passage can efficiently diffuse the vaporized refrigerant and move the condensed refrigerant.

  In the heat transport unit according to the thirteenth aspect of the present invention, in addition to any of the first to twelfth aspects, at least a part of the first passage and the second passage has a capillary force that moves the condensed refrigerant. Have.

  With this configuration, the heat transport unit can move the condensed refrigerant, and can transport the heat of the heating element by a cycle of transport of the vaporized refrigerant and movement of the condensed refrigerant.

  In the heat transport unit according to the fourteenth aspect of the present invention, in addition to any one of the first to thirteenth aspects, at least a part of the upper plate, the lower plate, the first column portion, and the second column portion is formed inside. A groove is formed on the surface exposed to the space.

  With this configuration, the capillary force of the first passage and the second passage is improved.

  In the heat transport unit according to the fifteenth aspect of the present invention, in addition to the first to fourteenth aspects, at least one of the upper plate and the lower plate is a region facing at least a part of the first region and the second region. And further comprising a heat dissipating part for releasing the transported heat.

  With this configuration, the heat transport unit can cool the transported heat at an early stage. As a result, it is possible to increase the cycle efficiency of transport of vaporized refrigerant and movement of condensed refrigerant, and the heat transport unit can transport heat with high efficiency.

  In the heat transport unit according to the sixteenth aspect of the present invention, in addition to any one of the first to fifteenth aspects, at least a part of the upper plate, the lower plate, the first column portion, and the second column portion is formed inside. The surface exposed to the space has metal plating.

  In the heat transport unit according to the seventeenth aspect of the present invention, in addition to any one of the first to sixteenth aspects, the width in the Y-axis direction of the first region and the width in the Y-axis direction of the second region are substantially the same. Are the same.

  With this configuration, the heat transport unit can transport heat by making full use of the short direction. For this reason, the heat transport unit does not require a useless mounting volume.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In addition, the heat pipe in this specification refers to the cooling of the heating element by repeating that the refrigerant sealed in the internal space is vaporized by receiving heat from the heating element and the evaporated refrigerant is cooled and condensed. Means a member, component, apparatus, or device that realizes the function to perform. In addition, the heat transport unit in the present specification means a member, component, apparatus, or device having a function of transporting heat from a heating element by moving a refrigerant.

(Embodiment 1)
(Conceptual explanation of heat pipe)

  Since the heat transport unit of the present invention utilizes the function and operation of the heat pipe, the concept of the heat pipe will be described first.

  The heat pipe encloses a refrigerant inside, and a surface serving as a heat receiving surface is in contact with a heating element such as an electronic component. The internal refrigerant is vaporized by receiving heat from the heating element, and takes the heat of the heating element when vaporized. The vaporized refrigerant moves through the heat pipe. The moved and evaporated refrigerant is cooled and condensed on a heat radiation surface or the like (or by a secondary cooling member such as a heat sink or a cooling fan). The refrigerant that has been condensed into a liquid moves inside the heat pipe and moves to the heat receiving surface again. The refrigerant that has moved to the heat receiving surface is vaporized again and takes the heat of the heating element.

  By repeating the vaporization and condensation of the refrigerant, the heat pipe transports heat from the heating element to cool the heating element. In particular, the heat pipe moves the vaporized refrigerant and moves the condensed refrigerant in a predetermined direction in the internal space in which the refrigerant is sealed, so that the heat pipe removes the heat taken from the heating element. It can be transported in a predetermined direction.

(Overview)
An overall outline of the heat transport unit in the first embodiment will be described with reference to FIGS. 1 and 2.

  FIG. 1 is a perspective view of a heat transport unit according to Embodiment 1 of the present invention. FIG. 2 is an internal perspective view of the heat transport unit according to Embodiment 1 of the present invention, and is a cross-sectional perspective view in which the inside of the knit is visible during heat transport.

First, as shown in FIGS. 1 and 2, a three-dimensional space is defined by an X axis, a Y axis, and a Z axis that are orthogonal to each other. The configuration of the heat transport unit 1 will be described using the X axis, the Y axis, and the Z axis. Moreover, although the heat transport unit 1 has various structures inside, it has a flat rectangular parallelepiped appearance as in the example shown in FIG. Of course, various processing may be made on the surface.
The heat transport unit 1 includes an upper plate 2, a lower plate 3 that faces the upper plate 2, and an internal space 4 that can enclose a refrigerant formed by the upper plate 2 and the lower plate 3. The internal space 4 has a first region 5 in a partial region thereof, and second regions 6 and 7 in a region that becomes the remaining portion of the first region 5. In FIG. 2, the first region is provided near the center in the longitudinal direction (X-axis direction) of the heat transport unit 1, and the second regions 6 and 7 are in the longitudinal direction (X-axis direction) of the heat transport unit 1. Provided at both ends. The first region 5 includes a first pillar portion 8 that forms a plurality of first passages 9 along the X-axis direction. The first column portion 8 is a three-dimensional member having a longitudinal direction along the X-axis direction in the first region 5, and a region between the plurality of first column portions 8 is the first passage 9. In this way, the plurality of first pillar portions 8 that are three-dimensional members having the longitudinal direction are arranged side by side along the X-axis direction, whereby the plurality of first passages 9 along the X-axis direction are formed. It is formed.

  On the other hand, the second regions 6 and 7 include a second pillar portion 10 that forms a plurality of second passages 11 along the X-axis direction and the Y-axis direction. The second column part 8 is a plurality of three-dimensional members arranged in the X-axis direction and the Y-axis direction in the second regions 6 and 7. The region sandwiched between the plurality of second columnar portions 10 arranged in the X-axis direction forms a passage along the Y-axis direction, and the region sandwiched between the plurality of second columnar portions 10 aligned in the Y-axis direction is the X-axis direction. The passage along the X-axis direction and the passage along the Y-axis direction are assembled in a lattice shape. This lattice-shaped passage forms the second passage 11.

  The internal space 4 encloses the refrigerant and transports heat from the heating element in a predetermined direction by repeated evaporation and condensation of the encapsulated refrigerant. However, if the internal space 4 is a green space, the internal space 4 expands or contracts due to the pressure increase / decrease caused by the vaporization or condensation of the refrigerant, so that the heat transport unit 1 may be damaged. There is a possibility of bursting. The first pillar portion 8 and the second pillar portion 10 ensure the strength of the heat transport unit 1 and can control the diffusion or transport of heat in the X-axis direction and the Y-axis direction well. 11 can be formed.

  The first passage 9 and the second passage 11 communicate with each other at a boundary 12 between the first region 5 and the second region 6 and a boundary 13 between the first region 5 and the second region 7. By this communication, the refrigerant (at least one of the vaporized refrigerant and the condensed refrigerant) moving from the second passage 11 moves to the first passage 9 and can move through the first passage 9. Further, the width in the Y-axis direction of the first region 5 and the width in the Y-axis direction of the second regions 6 and 7 in the internal space 4 (that is, the width in the short direction) are substantially the same. By being substantially the same, in the internal space 4, the widths of the first region 5 that transports heat in the X-axis direction and the second regions 6 and 7 that diffuse heat in the X-axis direction and the Y-axis direction are The entire internal space 4 in which the outer shape of the heat transport unit 1 can be formed is used for heat transport.

  In FIG. 2, the first pillar portion 8, the second pillar portion 10, the first passage 9, and the second passage 11 are provided with reference numerals only for some elements in order to ensure the clarity of the drawing. However, elements to which no reference is given also correspond to the first pillar portion 8, the second pillar portion 10, the first passage 9, and the second passage 11, respectively. For example, any solid member having the same shape as the first pillar portion 8 in FIG. 2 is the first pillar portion 8 unless otherwise specified. The same applies to FIG. 3 and subsequent figures.

(Operation of heat transport unit)
Next, the operation of the heat transport unit 1 will be described with reference to FIG.

  FIG. 3 is an operation explanatory diagram of the heat transport unit according to Embodiment 1 of the present invention. FIG. 3 illustrates the movement of the refrigerant sealed in the internal space 4 (that is, the diffusion and transport of heat) with arrows while showing the schematic structure inside the heat transport unit 1.

  The upper plate 2 and the lower plate 3 have a flat plate shape having a long direction and a short direction, the X axis direction is along the long direction, and the Y axis direction is along the short direction. Due to the shapes of the upper plate 2 and the lower plate 3, the heat transport unit 1 has a flat plate shape having a longitudinal direction and a short direction.

  A heating element 20 is disposed on the bottom surface of the heat transport unit 1 (the bottom surface of the lower plate 3). Further, the heating element 20 is disposed at a position facing the second region 6 on the bottom surface. The heating element 20 is an element that generates heat, such as an electronic component, an electronic element, a semiconductor integrated circuit, a light emitting element, an electronic substrate, a mechanical component, and a mechanical element. Further, the heating element 20 is disposed at a position facing the second region 6 on the bottom surface. As described above, the first region 5 has the first passage 9 along the X-axis direction, and the second regions 6 and 7 have the second passage 11 along the X-axis direction and the Y-axis direction.

  The heat transport unit 1 takes heat away from the heating element 20 in the second region 6. Since the internal space 4 encloses the refrigerant, the heat from the heating element 20 vaporizes the refrigerant. The vaporized refrigerant moves in the X axis direction and the Y axis direction in the second passage 11 of the second region 6. That is, the second region 6 uses the second passage 11 to diffuse the heat taken from the heating element 20 along the arrow A (X-axis direction) and the arrow B (Y-axis direction). Of course, since the heat transport unit 1 forms a three-dimensional internal space 4 composed of the X axis, the Y axis, and the Z axis, the movement of the vaporized refrigerant and the diffusion of heat are also performed in the Z axis direction. However, in the first embodiment of the present invention, description will be made mainly using the X-axis direction and the Y-axis direction in which the refrigerant moves.

  Next, the second passage 11 communicates with the first passage 9 at the boundary 12 between the second region 6 and the first region 5. For this reason, the vaporized refrigerant moves from the second passage 11 to the first passage 9.

  The first passage 9 is formed along the X axis in the first region 5, and the vaporized refrigerant moves in the direction indicated by the arrow C in the first passage 9. Here, in FIG. 3, the arrow C is drawn only in one first passage 9, but the vaporized refrigerant moves in the other first passages 9 in the same manner as the arrow C. As a result of this movement, the heat of the heating element 20 is transported from the second region 6 which is one end of the heat transport unit 1 to the second region 7 which is the other end.

  The first passage 9 and the second passage 11 communicate with each other at the boundary 13 between the first region 5 and the second region 7. For this reason, as indicated by an arrow C, the vaporized refrigerant that has moved along the first passage 9 moves to the second passage 11 in the second region 7.

  Since the second passage 11 is along the X-axis direction and the Y-axis direction, the vaporized refrigerant that has moved from the first passage 9 moves along the arrow D (X-axis direction) and the arrow E (Y-axis direction). To do. That is, in the second passage 11 of the second region 7, the vaporized refrigerant moves widely in the short side direction and the long side direction.

  The second region 7 can cool the vaporized refrigerant by moving the vaporized refrigerant widely in the X-axis direction and the Y-axis direction using the second passage 11. It is because the vaporized refrigerant | coolant discharges the heat which it contains by moving widely the 2nd area | region 7 in which the heat generating body 20 is not arrange | positioned.

  In this way, the vaporized refrigerant moving in the second region 7 is condensed by being cooled and changed to a refrigerant that is a liquid. As a result, the condensed refrigerant moves in the X-axis direction and the Y-axis direction along the second passage 11 in the second region 7. This is a flow indicated by arrows D and E.

  Here, since the 2nd channel | path 11 of the 2nd area | region 7 is a very fine channel | path, it can exhibit the capillary force which moves a liquid by a capillary phenomenon.

  The condensed refrigerant moves through the plurality of second passages 11 in the second region 7 in the X-axis direction and the Y-axis direction, and then reaches the boundary 13 between the first region 5 and the second region 7. Since the second passage 11 in the second region 7 and the first passage 9 in the first region 5 communicate with each other, the condensed refrigerant moves from the second passage 11 to the first passage 9 as indicated by an arrow F. . At this time, the condensed refrigerant moves not only in the X-axis direction but also in the Y-axis direction in the second passage 11, so that the condensed refrigerant spreads in the short direction of the internal space 4. Therefore, the condensed refrigerant can move to each of the plurality of first passages 9 arranged in the short direction of the internal space 4 at the boundary 13.

  The condensed refrigerant that has moved to the first passage 9 moves along the X-axis direction along the first passage 9 as indicated by an arrow G. That is, the condensed refrigerant moves through the first passage 9 from the end where the second region 7 is located toward the end where the second region 6 is located. The first passage 9 is a narrow passage whose periphery is closed, and the first passage 9 can exert a capillary force. The first passage 9 moves the condensed refrigerant in the X-axis direction by this capillary force.

  The condensed refrigerant that has moved in the X-axis direction through the first passage 9 reaches the second region 6 that is a very fine passage, and vaporizes again by receiving heat from the heating element 20 in the second region 6. The evaporated refrigerant moves through the second passage 11 again in the X-axis direction and the Y-axis direction. Thus, the heat transport unit 1 moves the heat of the heating element 20 from the end where the second region 6 is located to the second region 7 by the cycle of the movement of the evaporated refrigerant and the movement of the condensed refrigerant. Can be transported to the end. At this time, the heat of the heating element 20 is diffused in the second region 6 in the longitudinal direction and the short direction of the heat transport unit 1, and the first region 5 transports heat in the longitudinal direction of the heat transport unit 1. For this reason, the heat transport unit 1 can transport the heat of the heating element 20 while utilizing the entire internal space 4 while ensuring the strength of the heat transport unit 1 by the first pillar portion 8 and the second pillar portion 10.

  Here, the merit and characteristic of the heat transport of the heat transport unit 1 will be described in more detail.

  Depending on the shape and size of the heating element 20, even when the heat transport unit 1 transports heat in the longitudinal direction, the longitudinal direction and the short direction of the internal space 4 (that is, the heat transport unit 1) are maximized. Thus, it is necessary to move the refrigerant.

  The refrigerant vaporized by the heat from the heating element 20 arranged in the second region 6 moves in the Y-axis direction in addition to the X-axis direction by the second passage 11 in the second region 6. The plurality of first passages 9 are arranged along the short direction of the internal space 4. In the second region 6, the refrigerant vaporized in the second axis 11 also moves in the Y-axis direction, so that the vaporized refrigerant is separated from each of the plurality of first channels 9 (all or part of the first channel 9). Although it is, it can move to the several 1st channel | path 9) corresponding to the width | variety wider than the width | variety of the heat generating body 20. FIG. The moved vaporized refrigerant moves uniformly in each of the plurality of first passages 9.

  As a result, the first region 5 uses the plurality of first passages 9 uniformly to transfer heat in the X-axis direction (that is, from the end where the second region 6 is located to the end where the second region 7 is located). Can be transported to.

  Further, in the second region 7, the second passage 11 can three-dimensionally move the vaporized refrigerant moved from the first passage 9 along the X axis and the Y axis. For this reason, in the second region 7, the vaporized refrigerant can move over a wide range in a short time. As a result, the second region 7 can cool and condense the vaporized refrigerant in a short time.

  The refrigerant condensed in the second region 7 moves along the X-axis direction and the Y-axis direction by the second passage 11. For this reason, at the boundary 13 between the second region 7 and the first region 5, the refrigerant condensed from the plurality of second passages 11 to the plurality of first passages 9 can move. That is, at the boundary 13, the condensed refrigerant can move to each of the plurality of first passages 9 arranged in the short direction of the internal space 4 (all or a part). Further, among the plurality of first passages 9, the first passage 9 in which a large amount of the evaporated refrigerant mainly exists enters the first passage 9 a little, and the other first passages in which a large amount of the evaporated refrigerant does not exist. A large amount of condensed refrigerant enters 9.

  In this way, the first region 5 uses the plurality of first passages 9 uniformly to place the condensed refrigerant in the X-axis direction (that is, from the end where the second region 7 is located to the second region 6). To the end).

  The cycle of the movement of the evaporated refrigerant and the movement of the condensed refrigerant is a heat transport function exhibited by the heat transport unit 1. That is, the heat transport unit 1 does not depend on the size or shape of the heating element 20 and efficiently uses the entire heat transport unit 1 to heat the heating element in a predetermined direction (here, the X-axis direction). Can be transported.

  The term “uniformly” here does not mean that all of the plurality of first passages 9 are used, but the condition that the evaporated refrigerant or the condensed refrigerant easily moves in each of the plurality of first passages 9. That is, the first passage corresponding to (temperature, flow velocity, flow rate, pressure, etc.) is used.

  The heat transport of the heat transport unit 1 is conceptually shown in FIG. FIG. 4 is an operation conceptual diagram of the heat transport unit according to Embodiment 1 of the present invention.

  The heating element 20 is disposed on the bottom surface of the lower plate 3 and on the bottom surface of the second region 6. The heating element 20 and the bottom surface are in thermal contact, and the second region 6 takes heat away from the heating element 20. Due to this heat, the second region 6 vaporizes the liquid refrigerant, and the vaporized refrigerant moves in the first region 5 in the X-axis direction according to the arrow H.

  The vaporized refrigerant that has reached the second region 7 from the first region 5 is cooled and condensed in the second region 7. The cooled refrigerant moves from the second region 7 toward the second region 6 by the capillary force generated by the first passage 9 and the second passage 11. As indicated by arrow I. Thus, as can be seen from the side of the heat transport unit 1, the heat transport unit 1 can efficiently transport the heat of the heating element 20 along the X-axis direction.

  Next, the detail of each part is demonstrated.

(Upper plate)
The upper plate 2 will be described. The perspective view of the upper plate 2 is shown in FIG. The upper plate 2 has a flat plate shape, and preferably has a rectangular shape having a short side direction and a long side direction. Of course, it may have a shape that is partially different from a square, or may be curved or bent. However, since the upper plate 2 is a square having a short direction and a long direction, the heat transport unit 1 is a square having a short direction and a long direction. Heat from the arranged heating element can be transported in a predetermined direction. The upper plate 2 only needs to have a structure that matches the outer shape of the heat transport unit 1.

  The upper plate 2 is made of metal, resin, etc., but is made of metal having high thermal conductivity or high rust prevention (or durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. Preferably it is formed.

  The upper plate 2 forms an internal space 4 together with the lower plate 3. For example, the upper plate 2 and the lower plate 3 have convex portions and wall materials for forming the internal space 4 on the periphery thereof, and the upper plate 2 and the lower plate 3 are formed by these convex portions and wall materials. As a result, the internal space 4 is formed between the upper plate 2 and the lower plate 3. When being joined to the lower plate 3, these convex portions and wall materials become side walls around the internal space 4. Of course, these convex portions and wall materials may be separate members or the same members as the upper plate 2.

  Further, it is also preferable that the upper plate 2 has metal plating on at least a surface in contact with the internal space 4 (a surface in contact with vaporized refrigerant or condensed refrigerant). This is because the surface condition is modified by the metal plating, and the movement of the vaporized refrigerant is promoted. The metal plating may be selected from metals such as gold, silver, copper, aluminum, nickel, cobalt, and alloys thereof. Of course, any of single layer plating, multilayer plating, electrolytic plating, and non-electrolytic plating may be used.

  The upper plate 2 has a name “upper part”, but does not necessarily have to be physically disposed above, but is a name for convenience. The heating element may be in contact with the upper plate 2 or the lower plate 3.

  It is also preferable that the upper plate 2 has an inlet (not shown) for injecting the refrigerant. This is because when the upper plate 2 and the lower plate 3 are joined to form the internal space 4, it is necessary to enclose the refrigerant in the internal space 4. The inlet is sealed after injecting the coolant.

  The refrigerant may be injected from the injection port after the upper plate 2 and the lower plate 3 are joined, or may be injected at the time of joining. Moreover, it is preferable that the refrigerant is sealed under vacuum or reduced pressure. By being performed under vacuum or reduced pressure, the internal space 4 is in a vacuum or reduced pressure state and the refrigerant is sealed. When the pressure is reduced, the refrigerant vaporization / condensation temperature becomes low, and there is an advantage that the refrigerant vaporization / condensation repeats actively.

  In addition, at least one of the upper plate 2 and the lower plate 3 includes the first column portion 8 and the second column portion 10. Since the internal space 4 is formed by the upper plate 2 and the lower plate 3, if at least one of the upper plate 2 and the lower plate 3 includes the first column portion 8 and the second column portion 10, the upper plate 2. By joining the lower plate 3, the internal space 4 can be provided with the first pillar portion 8 and the second pillar portion 10 (that is, the first passage 9 and the second passage 11). The same applies to the lower plate 3 described later.

(Lower plate)
Next, the lower plate 3 will be described. Since the lower plate 3 is a member that serves as a contrast with the upper plate 2 and has the same structure and shape as the upper plate 2, its perspective state is shown in FIG.

  The lower plate 3 has a flat plate shape, and preferably has a rectangular shape having a short side direction and a long side direction. In particular, since the lower plate 3 is joined to face the upper plate 2, it is also preferable that the lower plate 3 has substantially the same shape and the same area as the upper plate 2. However, the lower plate 3 may have an area or shape different from that of the upper plate 2 as long as the upper plate 2 and the internal space 4 can be formed. Of course, it may have a shape that is partially different from a square, or may be curved or bent. Since the lower plate 3 has a rectangular shape having a short side direction and a long side direction like the upper plate 2, the heat transport unit 1 becomes a square shape having a short side direction and a long side direction. 1 can transport the heat from the heating element disposed at the end in a predetermined direction.

  The lower plate 3 is made of metal, resin, etc., but is made of metal having high thermal conductivity or high rust prevention (or durability) such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. Preferably it is formed.

  Since the lower plate 3 is joined to the upper plate 2 to form an internal space, the lower plate 3 may have a convex portion or a wall material for forming the internal space 4 at the periphery thereof. When being joined to the upper plate 2, these convex portions and wall materials become side walls around the internal space 4. Of course, these convex portions and wall materials may be separate members from the lower plate 3 or the same members. Each of the upper plate 2 and the lower plate 3 may have a convex portion or a wall material, or only one of the upper plate 2 and the lower plate 3 has a convex portion or a wall material. May be.

  Further, the lower plate 3 may be provided with a refrigerant inlet as with the upper plate 2.

  The lower plate 3 is joined so as to face the upper plate 2, thereby forming an internal space 4.

  It is also preferable that the lower plate 3 has metal plating on at least a surface in contact with the internal space 4 (surface through which the vaporized refrigerant passes). This is because the metal plating is applied to improve the surface state, and the movement of the evaporated refrigerant promotes the movement of the condensed refrigerant. The metal plating may be selected from metals such as gold, silver, copper, aluminum, nickel, cobalt, and alloys thereof. Of course, any of single layer plating, multilayer plating, electrolytic plating, and non-electrolytic plating may be used.

  The lower plate 3 has a name “lower”, but does not have to face physically downward, but is a name for convenience. The heating element may be in contact with the lower plate 3 or the upper plate 2.

  Further, the provision of the first pillar portion 8 and the second pillar portion 10 is the same as in the case of the upper plate 2.

(Internal space)
The internal space 4 is formed by the upper plate 2 and the lower plate 3.

  The upper plate 2 and the lower plate 3 have protrusions and pillars on the periphery, and the upper plate 2 and the lower plate 3 are joined to face each other, whereby the internal space 4 is formed. Further, when the upper plate 2 and the lower plate 3 are joined, the upper plate 2 and the lower plate that are opposed to the first column portion 8 and the second column portion 10 provided on at least one of the upper plate 2 and the lower plate 3. Touch one of the three. As a result, the first pillar portion 8 and the second pillar portion 10 connect the upper plate 2 and the lower plate 3. The first pillar portion 8 and the second pillar portion 10 are pillars extending from the upper plate 2 to the lower plate 3 in the internal space 4.

  A coolant is sealed in the internal space 4. Antifreeze, alcohol, pure water or the like is used as the refrigerant.

  The internal space 4 has a first region 5 and second regions 6 and 7. In other words, the internal space 4 is divided into a first region 5 and second regions 6 and 7. Since the first region 5 and the second regions 6 and 7 have substantially the same width in the Y-axis direction, the first region 5 and the second regions 6 and 7 have a width in the Y-axis direction at the boundaries 12 and 13. Connect as a whole. That is, the first passage 9 and the second passage 11 communicate with each other over the entire width in the Y-axis direction.

  The internal space 4 transports the heat of the heating element in a predetermined direction by vaporizing or condensing the enclosed refrigerant. At this time, the internal space 4 can efficiently transport the heat of the heating element by including the first region 5 and the second regions 6 and 7 having different functions based on the heat transport direction (the refrigerant moving direction).

(First area)
The first region 5 includes a plurality of first pillar portions 8 that form a plurality of first passages 9 along the X-axis direction. The plurality of first pillar portions 8 are provided along the X-axis direction. The first column portion 8 is a protruding three-dimensional member provided on at least one of the upper plate 2 and the lower plate 3, and when the upper plate 2 and the lower plate 3 are thermally joined, the first member 8 is opposed to the upper plate 2 or the lower plate 3. It is joined to the lower plate 3) and becomes a three-dimensional member that reaches the lower plate 3 from the upper plate 2 inside the internal space 4. As a result, the inner space 4 is reinforced.

  As another configuration, the first column portion 8 is provided on either the upper plate 2 or the lower plate 3, and the upper plate 2 and the lower plate 3 are joined to each other in the internal space 4 from the upper plate 2 to the lower plate. It may be a three-dimensional member that reaches 3. Alternatively, only a part of the necessary first pillar portion 8 is provided on each of the upper plate 2 and the lower plate 3 and the upper plate 2 and the lower plate 3 are joined together, so that all the necessary first parts are provided. The pillar portion 8 may be provided in the internal space 4. Alternatively, each of the upper plate 2 and the lower plate 3 is provided with a part of the first column part 8 at the same position facing each other, and a part of the first column part 8 provided on the upper plate 2 and the lower plate 3 are provided. A part of the provided first pillar portion 8 may be joined and integrated to form the necessary first pillar portion 8.

  As shown in FIGS. 2 and 3, the plurality of first pillar portions 8 are provided along the X-axis direction. Therefore, a plurality of first passages along the X-axis direction are formed by the adjacent first pillar portions 8. 9 is formed. The plurality of first passages 9 are gaps formed by the first column part 8.

  Further, since the first passage 9 is along the X-axis direction in the first region 5, it is preferable that the first passage 9 has a length that is approximately equal to the length of the first region 5 in the X-axis direction. Thereby, the plurality of first passages 5 can move the refrigerant in the first region 5 along the X-axis direction.

  Similarly to the upper plate 2 and the lower plate 3, the first column portion 8 is formed of metal, resin, or the like, but has a thermal conductivity of copper, aluminum, silver, aluminum alloy, iron, iron alloy, stainless steel, or the like. It is preferably formed of a metal having a high rust resistance or high rust resistance (or durability). In addition, it is also preferable that at least a part of the surface of the first pillar portion 8 (particularly a part or the whole of the surface exposed to the internal space 4) is subjected to metal plating. This is because the metal plating is applied to modify the surface and promote the movement of the refrigerant. The metal plating may be selected from metals such as gold, silver, copper, aluminum, nickel, cobalt, and alloys thereof. Of course, any of single layer plating, multilayer plating, electrolytic plating, and non-electrolytic plating may be used.

  The first region 5 includes the plurality of first passages 9 as described above, and distributes the refrigerant (vaporized refrigerant and condensed refrigerant) to the plurality of paths between the boundary 12 and the boundary 13 while supplying the refrigerant. Move. That is, the first region 5 can transport the heat of the heating element 20 between the boundary 12 and the boundary 13. The first region 5 has a function of transporting heat from the heating element 20 in the X-axis direction by efficiently using the width direction in the Y-axis direction.

(Second area)
Next, the second area will be described.

  The second regions 6 and 7 are provided in the remaining part of the first region 5 in the internal space 4. For this reason, the internal space 4 has a first region 5 and second regions 6 and 7. The first region 5 and the second regions 6 and 7 are spaces having different functions, and the internal space 4 is a region other than the first region 5 and the second regions 6 and 7. Does not exclude inclusion. The first region and the second region are elements indicating that the respective functions in the internal space 4 are exhibited, and are not terms indicating that the internal space 4 is physically separated.

  The second regions 6 and 7 include a plurality of second pillar portions 10 that form a plurality of second passages 11 along the X-axis direction and the Y-axis direction. The plurality of second pillar portions 10 are provided along the X-axis direction. At this time, in the second regions 6 and 7, a plurality of second pillar portions 10 are provided in a certain column in the X-axis direction. For example, in FIG. 2, in the second region 6, two second pillar portions 10 are provided in a certain row along the X-axis direction. In the second region 7, four second pillar portions 10 are provided in a certain row along the X-axis direction. In addition, the plurality of second pillar portions 10 provided in a certain row in the X-axis direction are arranged in a plurality of rows along the Y-axis direction.

  As described above, the plurality of second column portions 10 are provided in each of the X-axis direction and the Y-axis direction, so that the plurality of second column portions 10 form gaps in each of the X-axis direction and the Y-axis direction. it can. The respective gaps in the X-axis direction and the Y-axis direction form a plurality of second passages 11 along the X-axis direction and the Y-axis direction. In the second passage 11, the vaporized refrigerant or the condensed refrigerant moves along the X-axis direction and the Y-axis direction according to the gap between the second column parts 10.

  The second column portion 10 is a protruding three-dimensional member provided on at least one of the upper plate 2 and the lower plate 3, and when the upper plate 2 and the lower plate 3 are thermally bonded, the opposing member (the upper plate 2 or It is joined to the lower plate 3) and becomes a three-dimensional member that reaches the lower plate 3 from the upper plate 2 inside the internal space 4. As a result, the inner space 4 is reinforced.

  As another configuration, the second column portion 10 is provided on one of the upper plate 2 and the lower plate 3, and the upper plate 2 and the lower plate 3 are joined to each other in the internal space 4 from the upper plate 2 to the lower plate. It may be a three-dimensional member that reaches 3. Alternatively, only a part of the necessary second pillar portion 10 is provided on each of the upper plate 2 and the lower plate 3, and the upper plate 2 and the lower plate 3 are joined to each other, so that all necessary second parts are provided. The column part 10 may be provided in the internal space 4. Alternatively, each of the upper plate 2 and the lower plate 3 is provided with a part of the second column part 10 at the same opposing position, and a part of the second column part 10 provided on the upper plate 2 and the lower plate 3 are provided. A part of the provided second pillar portion 10 may be joined and integrated to form the necessary second pillar portion 10.

  Similar to the upper plate 2 and the lower plate 3, the second column portion 10 is formed of metal, resin, or the like, but has high thermal conductivity such as copper, aluminum, silver, aluminum alloy, iron, iron alloy, and stainless steel. Or it is preferable to form with a metal with high rust prevention (or durability). In addition, it is also preferable that at least a part of the surface of the second column part 10 (particularly a part or all of the surface exposed to the internal space 4) is subjected to metal plating. This is because the metal plating is applied to improve the surface and promote the movement of the refrigerant. The metal plating may be selected from metals such as gold, silver, copper, aluminum, nickel, cobalt, and alloys thereof. Of course, any of single layer plating, multilayer plating, electrolytic plating, and non-electrolytic plating may be used.

  The second regions 6 and 7 are provided with the plurality of second passages 11 as described above, so that the boundary 12 and the boundary 13 are uniformly distributed in the plurality of first passages 9 arranged in the Y-axis direction, and the evaporated refrigerant or the condensed refrigerant. Move while sorting.

  As described above, the second regions 6 and 7 are arranged in the Y-axis direction while exhibiting a function of moving the evaporated refrigerant and the condensed refrigerant in the X-axis direction and the Y-axis direction inside the second regions 6 and 7. The function of uniformly exchanging refrigerant with each of the plurality of first passages 9 is exhibited. Of course, the 2nd pillar part 10 provided in the 2nd fields 6 and 7 also exhibits the function which reinforces internal space 4. As shown in FIG.

  As described above, the heat transport unit 1 according to the first embodiment can transport the heat from the heating element 20 along the X-axis direction after diffusing in the X-axis direction and the Y-axis direction. The heat transport unit 1 is intended to transport the heat of the heating element 20 along the X-axis direction (transports heat along the X-axis direction from the portion that receives the heating element 20 toward the far end. It is required to transport in the X-axis direction while utilizing the entire width of the heat transport unit 1 in the Y-axis direction. For this reason, the second region 6 that is in thermal contact with the heating element 20 diffuses heat from the heating element 20 in the X-axis direction and the Y-axis direction, and uses the entire width in the Y-axis direction. Move heat to the. Since the first region 5 can transport heat along the X-axis direction, as a result, the heat transport unit 1 uses the entire width in the Y-axis direction to transfer the heat of the heating element 20 along the X-axis direction. Can be transported.

  At this time, the 1st pillar part 8 and the 2nd pillar part 10 can ensure the intensity | strength of the internal space 4 (namely, heat transport unit 1).

  Thus, by devising the structure of the pillar portion for reinforcing the internal space 4 in the region of the internal space 4, the heat transport unit 1 in Embodiment 1 ensures both strength and improved heat transport efficiency. it can.

(Embodiment 2)
Next, a second embodiment will be described.

  In the second embodiment, various modifications of the heat transport unit 1 will be described.

(Modification of the second pillar)
FIG. 5 is an internal perspective view of the heat transport unit according to Embodiment 2 of the present invention. FIG. 5 shows a part of the inside of the heat transport unit 1 in a visible state. The second region 6 includes a second column portion 10, and a gap along the X-axis direction and the Y-axis direction is generated by the second column portion 10, and this gap forms a second passage 11. In the second passage 11, the vaporized refrigerant is moved in the X-axis direction and the Y-axis direction, and the condensed refrigerant is moved in the X-axis direction and the Y-axis direction.

  Here, as shown in FIG. 5, the second column portion 10 preferably includes a large column member 30 and a small column member 31 smaller than the large column member 30. In the second region 6, the large column member 30 is disposed as shown in FIG. 5, and the small column member 31 is disposed in a portion other than the large column member 30. The large column member 30 only needs to have a size larger than that of the small column member 31, but the large column member 30 and the small column member 31 may be aligned and arranged at random.

  Since the second column part 10 is configured by the mixture of the large column member 30 and the small column member 31, the shape of the second passage 11 becomes more complicated. In particular, the plurality of second passages 11 are adjacent to each other in the X-axis direction and the Y-axis direction. Since the large column member 30 and the small column member 31 are mixed to form a plurality of gaps, the adjacent distance between the gaps is reduced and the intersections of the gaps are also increased. The second passage 11 formed by the combination of such complicated gaps has a high capillary force.

  By this high capillary force, the second passage 11 can move the condensed refrigerant efficiently and at high speed.

  Further, the second passage 11 formed by a combination of complicated gaps can retain the liquid refrigerant in the second region 6 over a wide range. For this reason, it receives the heat of the heat generating body 20, and the 2nd area | region 6 becomes easy to vaporize a refrigerant | coolant in a short time. Naturally, in the second passage 11, the vaporized refrigerant can move at a high speed and in a wide range.

  Moreover, the 2nd pillar part 10 is comprised by the large sized column member 30 and the small sized column member 31, and the intensity | strength of the 2nd area | region 6 further improves. Since the second region 6 is in thermal contact with the heating element 20, expansion and contraction due to a temperature change are increased. Therefore, since higher strength is required, it is preferable that the strength is improved.

  The large column member 30 and the small column member 31 define the difference in size depending on the difference in the cross-sectional area in the direction perpendicular to the standing direction. For this reason, the terms “large” and “small” of the large column member 30 and the small column member 31 can be defined both when the cross-sectional areas are different due to different shapes, and when the cross-sectional areas are the same but different. .

(Modification in which the first passage and the second passage have grooves)
It is also preferable that at least a part of the first pillar portion 8, the second pillar portion 10, the upper plate 2 and the lower plate 3 is provided with a groove on the surface exposed to the internal space 4.

  FIG. 6 is a cross-sectional view of the end portion of the heat transport unit according to Embodiment 2 of the present invention. FIG. 6 shows a state in which the exposed surface of the heat transport unit 1 to the internal space 4 includes grooves 40 to 42. In FIG. 6, only the second region 6 is shown for convenience of showing in a cross section, but the grooves are also provided in the first region 5 and the first pillar portion 8.

  The upper plate 2 includes a groove 40 on the exposed surface of the internal space 4. The groove 40 may be formed by cutting or grinding the surface of the upper plate 2, or the groove 40 may be formed in advance when the upper plate 2 is molded. The lower plate 3 includes a groove 42 on the exposed surface of the internal space 4. Similar to the groove 40 in the upper plate 2, the groove 42 may be formed.

  The second column part 10 includes a groove 41 on the surface exposed to the internal space 4. The groove 41 may be formed by cutting or grinding the surface of the second column part 10, or the groove 41 may be formed in advance when the second column part 10 is molded. Although not shown in FIG. 6, a groove is similarly formed on the exposed surface of the first pillar portion 8 to the internal space 4.

  As described above, grooves are formed in at least a part of the upper plate 2, the lower plate 3, the first pillar portion 8, and the second pillar portion 10, so that the first passage 9 and the second passage 11 include grooves. become. Since the first passage 9 and the second passage 11 are provided with grooves, the capillary force can be improved, and the condensed refrigerant can be easily moved along the grooves. Since the first passage 9 and the second passage 11 move the condensed refrigerant and the vaporized refrigerant, when the condensed refrigerant can be moved along the groove, the first passage 9 and The 2nd channel | path 11 becomes easy to move the vaporized refrigerant | coolant using spaces other than a groove | channel.

  As a result, the first passage 9 and the second passage 11 can move and move each refrigerant while suppressing interference between the vaporized refrigerant and the condensed refrigerant. In other words, the first passage 9 changes the vaporized refrigerant from the second region 6 to the second region 7 along the X-axis direction. On the other hand, the first passage 9 moves the condensed refrigerant from the second region 7 to the second region 6 along the X-axis direction. At this time, the first passage 9 can reduce interference between the vaporized refrigerant and the condensed refrigerant by the groove.

  As described above, at least a part of the upper plate 2, the lower plate 3, the first column portion 8, and the second column portion 10 includes a groove, so that the heat transport unit 1 moves the vaporized refrigerant and the condensed refrigerant. Cycles can be accelerated and heat can be transported faster.

(Modification example of the first pillar by notch)
Next, a modification in which the first pillar portion 8 includes a notch will be described.

  The plurality of first pillar portions 8 form a plurality of first passages 9 by gaps formed between adjacent first pillar portions 8. In each of the plurality of first passages 9, the refrigerant moves in the X-axis direction, so that a passage is formed in the first region 5 along the X-axis direction. This will be described with reference to FIG. In FIG. 7, a notch 35 is provided in the middle of the first pillar portion 8 to allow the adjacent first passages 9 to communicate with each other. FIG. 7 is an internal schematic diagram of the heat transport unit 1 according to Embodiment 2 of the present invention.

  Since the notch 35 communicates between the adjacent first passages 9, the vaporized refrigerant or condensed refrigerant passing through a certain first passage 9 can move to another first passage 9 through the notch 35.

  For example, when the heating element 20 is very small (for example, when the light emitting diode element (hereinafter referred to as “LED”) is the heating element 20), the second passage 11 generates heat in the second region 6. Even when the heat from the body 20 is diffused, the diffusion may be insufficient. In this case, among the plurality of first passages 9, the first passage 9 at a position close to the position where the heating element 20 is arranged needs to transport a lot of heat, and the other first passages 9 There is no need to transport much heat. In this case, the first passage 9 at a position close to the heating element 20 requires more refrigerant or needs to move the refrigerant beyond its capacity.

  When a certain first passage 9 communicates with another first passage 9 by the notch 35, the first passage 9 is connected to the other first passage 9 via the notch 35. Necessary and unnecessary refrigerants can be exchanged.

  FIG. 7 further shows a state in which a certain first passage 9 </ b> A exchanges refrigerant with another first passage 9. In FIG. 7, a very small heating element 20 is disposed on the bottom surface of the second region 6 and substantially at the center in the Y-axis direction. The second region 6 takes heat from the heating element 20, the refrigerant is vaporized, and the vaporized refrigerant moves in the X-axis direction and the Y-axis direction through the second passage 11. Here, since the heating element 20 is very small, the diffusion force of the vaporized refrigerant in the Y-axis direction in the second passage 11 tends to be smaller than the diffusion force in the X-axis direction. For this reason, when the vaporized refrigerant moves from the second region 6 to the first region 5, it becomes easy to move to the first passage 9A, which is close to the position where the heating element 20 is disposed.

  On the other hand, more refrigerant is required to transport more heat. In the state of FIG. 7, the first passage 9 </ b> A is the main body in the heat transport (however, the other first passage 9 does not transport the heat, and the second passage 11 does not transfer the heat in the Y-axis direction. The heat diffused in the X direction is transported in the X-axis direction through most of the plurality of first passages 9. The fact that the first passage 9A is mainly used is a situation at a comparative level) One passage 9A requires more refrigerant than the other first passages 9. Since the vaporized refrigerant has moved from the second passage 11 to each of the plurality of first passages 9, the first passage 9 </ b> A can obtain the first vaporized refrigerant from the other first passages 9. The passage 9A can transport more heat. As indicated by an arrow N, the first passage 9A transports (heat) the refrigerant vaporized in the X-axis direction. Here, as indicated by arrows K and M, the refrigerant can be received from the other first passage 9 through the notch 35. By receiving the refrigerant, the first passage 9A can transport heat using more refrigerant. Further, the first passage 9A needs to transport a large amount of vaporized refrigerant in order to transport a large amount of heat. However, the volume of the first passage 9A is limited, and the transport capacity of the vaporized refrigerant in the first passage 9A is also limited. In this case, as indicated by arrows J and L, the first passage 9 </ b> A can move the vaporized refrigerant to the other first passage 9 through the notch 35. As a result, the vaporized refrigerant transporting heat is efficiently moved to the X axis through the plurality of first passages 9.

  In order to retain more condensed refrigerant in the vicinity of the heating element 20, it is necessary to efficiently move the condensed refrigerant to the vicinity of the heating element 20. Since the refrigerant is vaporized by the heat of the heating element 20, the condensed refrigerant in the vicinity of the heating element 20 is constantly in a small state. Therefore, more condensed refrigerant than the other first passage 9 moves to the vicinity of the heating element 20 along the first passage 9A by capillary force. At that time, the refrigerant in the vicinity of the heating element 20 that generates higher heat than other regions is likely to be vaporized, and the possibility that the amount of the condensed refrigerant becomes insufficient is increased. Here, by providing the notch 35, the first passage 9 </ b> A can receive the shortage of the condensed refrigerant from the other first passage 9 through the notch 35. By receiving the refrigerant, the first passage 9A can move more refrigerant to the vicinity of the heating element 20, and as a result, can transport a lot of heat.

  As described above, by providing the notch 35, the heat transport unit 1 can further improve the heat transport efficiency of the heating element 20.

(Modification of the second passage)
Next, a modified example of the second passage will be described.

  The heat transport unit 1 further includes an intermediate plate stacked between the upper plate 2 and the lower plate 3, and the second regions 6 and 7 are stacked in different positions in the Z-axis direction, thereby It is also preferable that the passage has a structure along the Z-axis direction.

  FIG. 8 is an enlarged view of the vicinity of the second region of the heat transport unit according to Embodiment 2 of the present invention. In FIG. 8, the heat transport unit 1 has an intermediate plate 50 stacked between an upper plate 2 and a lower plate 3.

  The lower plate 3 includes a large column member 30 and a small column member 31 that constitute the second column part 10. The upper plate 2 includes a large column member 51 and a small column member 52 that constitute the second column portion 54. Further, the intermediate plate 50 includes an opening 53 for communicating gaps formed by the second column portion 10 formed on the lower plate 3 and the second column portion 54 formed on the upper plate 2. .

  The lower plate 3 forms a second passage 11 by the second pillar portion 10. Further, the upper plate 2 forms a second passage 55 by the second pillar portion 54. The second column portion 10 and the second column portion 54 (that is, the large column member 30 and the large column member 51, and the small column member 31 and the small column member 52) face each other at different positions on the basis of the Z-axis direction. It is provided as follows. For this reason, when the upper plate 2, the intermediate plate 50, and the lower plate 3 are laminated, the second passage 11 and the second passage 55 are communicated with each other while being slightly shifted. The opening 53 connects the second passage 11 and the second passage 55 that communicate with each other while being slightly shifted.

  As a result, the entire second passage (the passage combining the second passage 11 and the second passage 55) has a structure along the Z-axis direction in addition to the X-axis direction and the Y-axis direction. For this reason, in the whole 2nd channel | path, the vaporized refrigerant | coolant moves to the X-axis direction, the Y-axis direction, and the Z-axis direction, and the condensed refrigerant | coolant can move.

  Since the entire second passage can diffuse heat in the X-axis direction, the Y-axis direction, and the Z-axis direction, the second region 6 can three-dimensionally diffuse the heat taken from the heating element 20. If the second region 6 can three-dimensionally diffuse the heat of the heating element 20, the second region 6 can move the heat to the first region 5 over a wider range. As a result, the first region 5 can move the vaporized refrigerant (can transport heat) using the plurality of first passages 9 uniformly.

  In addition, the second region 7 condenses the vaporized refrigerant received from the first passage 5, but since the entire second passage can diffuse the refrigerant three-dimensionally, the second region 7 has the vaporized refrigerant 3 It is possible to efficiently condense the refrigerant that has been cooled and vaporized while being diffused dimensionally. In addition, since the condensed refrigerant can move three-dimensionally in the second region 7, the condensed refrigerant can move to the first region 5 at high speed. Further, since the refrigerant condensed over a wider range can move to the first region 5 in the entire second passage in the second region 7, the first region 5 moves the condensed refrigerant using the plurality of first passages 9 uniformly. it can.

  Further, the intermediate plate 50 is laminated between the upper plate 2 and the lower plate 3, but by providing the intermediate plate 50, the strength of the heat transport unit 1 is further improved, and the first passage 9, the second plate 2 are provided. The section between the passages 11 and 55 becomes clearer, and the first passage 9 and the second passages 11 and 55 can transport heat more reliably.

(Modification of positional relationship between first area and second area)
Next, modified examples of the first region 5 and the second regions 6 and 7 will be described.

  The internal space 4 includes a first region and a second region that have different functions in heat transport. The first area is provided in any area of the internal space 4, and the second area is provided in the remaining part of the first area. The arrangement of the first area and the second area may be variously determined.

  In FIG. 2 used in the first embodiment, a second region 6 and a second region 7 are provided at both ends of the internal space 4, and the first region is sandwiched between the second region 6 and the second region 7. The heat transport unit 1 in which the area | region 5 is provided is shown.

  In the heat transport unit 1 having such a configuration, the heat of the heating element disposed facing the second region 6 is received by the second region 6 and the X-axis direction and the Y-axis direction (and also the Z-axis direction). ). Furthermore, the second region 6 transfers heat to the first region 5.

  Next, the first region 5 receiving the heat from the second region 6 transports in the X-axis direction. The first region 5 moves the heat transported in the X-axis direction to the second region 7. Furthermore, the second region 7 that has received heat from the first region 5 cools while diffusing the heat in the X-axis direction and the Y-axis direction (and also in the Z-axis direction). The refrigerant is condensed by being cooled, and the second region 7 moves the refrigerant to the second region 6 via the first region 5.

  As described above, the heat transport unit 1 having the configuration in which the second regions 6 and 7 are provided at both ends and the first region 5 is provided between the second regions 6 and 7 is configured to dissipate heat and transport heat. The three roles of heat cooling can be assigned to each region. As a result, the heat transport unit 1 having such a configuration can efficiently transport heat.

  The second region 6 may be provided at one end of the internal space 4, and the first region 5 may be provided in a region other than the second region 6. That is, as shown in FIG. 9, the heat transport unit 1 may have a configuration in which the second region 6 is provided only at one end of the internal space 4 and the remaining portion is provided as the first region 5.

  FIG. 9 is a front view of the heat transport unit according to Embodiment 2 of the present invention. FIG. 9 shows the inside of the heat transport unit 1 as a visible state. The heat transport unit 1 shown in FIG. 9 has the second region 6 only at one end of the internal space 4, and has the first region 5 in a region other than the second region 6. The heating element 20 is disposed to face the second region 6. The second region 6 includes the second pillar portion 10 and the second passage 11 as described in the first and second embodiments.

  The second region 6 diffuses heat taken from the heating element 20 in the X-axis direction and the Y-axis direction (and further in the Z-axis direction) using the second passage 11. In addition, the second region 6 moves the diffused heat to the first region 5. Specifically, the vaporized refrigerant is moved to the first region 5.

  The first region 5 uses the first passage 9 to transport heat in the X-axis direction. Since the first region 5 includes the first passage 9 along the longitudinal direction (X-axis direction), the first region 5 uses the long first passage 9 to transport the heat. Can be cooled. As the heat is cooled in the first passage 9, the vaporized refrigerant is condensed. Since the first passage 9 has a capillary force, the condensed refrigerant moves toward the second region 6 along the X-axis direction. This is because, in the vicinity of the second region 6, the refrigerant evaporated and condensed by the heat of the heating element 20 is small, so that the condensed refrigerant easily moves to the second region 6 by capillary force.

  Thus, the heat transport unit 1 in which the second region 6 is provided only in one of the internal spaces 4 has a simple configuration and can reduce manufacturing costs. When the difference between the width of the heating element 20 in the Y-axis direction and the width of the heat transport unit 1 in the Y-axis direction (length in the short direction) is small, the second region 6 is sufficiently large in the Y-axis direction. The evaporated refrigerant can be transferred to all the first passages 9 by diffusing the evaporated refrigerant. For this reason, in the 1st channel | path 9, since the vaporized refrigerant | coolant becomes easy to cool during a movement, the 2nd area | region 7 is not required. From this point, it is also preferable that the heat transport unit 1 has the configuration as shown in FIG.

  Next, modified examples of the first region and the second region will be described. A configuration in which the second region is provided at the center of the internal space 4 and the first region is provided at both ends of the internal space 4 will be described.

  FIG. 10 is a perspective view of the heat transport unit according to Embodiment 2 of the present invention. FIG. 10 shows the internal structure in a visible state. In the heat transport unit 1 shown in FIG. 10, the second region 60 is provided in the center of the internal space 4, and the first regions 61 and 62 are provided at both ends of the second region 60 (that is, both ends of the internal space 4). It has a configuration to be provided. The second area 60 has the same configuration and function as the second areas 6 and 7 described in the first and second embodiments. In other words, the second pillar portion 10 is provided, and the second passage 11 formed by the second pillar portion 10 is provided. The first areas 61 and 62 have the same configuration and function as the first area 5 described in the first and second embodiments. That is, the first pillar portion 8 is provided, and the first passage 9 formed by the first pillar portion 8 is provided.

  The heating element 20 (not shown, the same applies in FIG. 10 below) is disposed to face the bottom surface of the second region 60. The second region 60 takes heat from the heating element 20. Since the second region 60 includes the second passage 11 along the X-axis direction and the Y-axis direction (and also the Z-axis direction), the refrigerant vaporized by the heat of the heating element 20 is reduced in the X-axis direction and the Y-axis direction ( Further, it can move in the Z-axis direction). Further, the second region 60 moves the vaporized refrigerant to the first regions 61 and 62. The first regions 61 and 62 are provided on both sides of the second region 60, and the second region 60 moves the vaporized refrigerant also in the X-axis direction. The vaporized refrigerant is moved to both the region 62 and the region 62. Moreover, since the 2nd area | region 60 moves the refrigerant | coolant vaporized also to the Y-axis direction, the vaporized refrigerant is moved uniformly from the 2nd area | region 60 to the width direction of the 1st area | regions 61 and 62 at the Y-axis direction. That is, each of the first regions 61 and 62 can move the vaporized refrigerant in the X-axis direction by uniformly using the plurality of first passages 9 provided.

  The vaporized refrigerant that has moved to both the first region 61 and the first region 62 moves in the X-axis direction by the plurality of first passages 9 in each of the first region 61 and the first region 62.

  At this time, each of the first region 61 and the first region 62 moves the vaporized refrigerant toward the respective end portions so as to move away from the second region 60. Each of the first regions 61 and 62 cools the refrigerant while moving the vaporized refrigerant toward the end portion. By cooling, the refrigerant condenses. Each of the first regions 61 and 62 moves the condensed refrigerant along the X-axis direction by the capillary force of the first passage 9. At this time, each of the first regions 61 and 62 moves the condensed refrigerant toward the second region 60.

  As described above, the heat transport unit 1 shown in FIG. 10 transports the heat of the heating element 20 disposed in the center toward both ends. For example, when heat generated by a certain electronic component or mechanical component is to be discharged to the surroundings, the heat transport unit 1 having the configuration shown in FIG. 10 is preferably used.

  The heat transport unit 1 according to the second embodiment can transport and discharge the heat of the heating element while variously corresponding to the structure, shape, size, mounting position, and the like of the target heating element.

(Embodiment 3)
Next, Embodiment 3 will be described.

  In the third embodiment, various relationships between the arrangement position of the heating elements and the heat transport unit will be described.

  FIG. 11 is an exploded perspective view of the heat transport unit according to Embodiment 3 of the present invention. FIG. 11 shows a state in which the upper plate 2 is down and the lower plate 3 is up, and the outer surface is removed from the lower plate 3 in order to make the inside visible.

  The heat transport unit 1 includes at least one of the upper plate 2 and the lower plate 3 with a heat receiving unit 70 that is in thermal contact with the heating element. The heat transport unit 1 in FIG. 11 includes a heat receiving portion 70 on the lower plate 3.

  The heat receiving unit 70 is a position where the heating element is disposed, and the heat transport unit 1 takes heat from the heating element through the heat receiving unit 70. Thereafter, the heat transport unit 1 transports the heat of the heating element in the X-axis direction from the second region 6 through the first region 5.

  The heat receiving part 70 may be provided as a member for disposing the heating element as shown in FIG. In this case, the heat receiving unit 70 may have a flat plate shape or a frame shape made of a material having high thermal conductivity such as a metal or an alloy. Or the heat transport unit 1 does not need to be provided with an individual raw material and member as the heat receiving part 70, and should just be provided with the heat receiving part 70 as a target position which arrange | positions a heat generating body. That is, the heat receiving part 70 does not need to be explicitly provided on the surface of the lower plate 3, and may be regarded as a position, a region, and a part where the heating element 20 is disposed. In order for the user using the heat transport unit 1 to utilize the performance of the heat transport unit 1, it is only necessary to grasp the region or part of the position selected as the position where the heating element 20 is disposed as the heat receiving unit 70. In this regard, the recommendation of the arrangement position of the heating element 20 by the provider of the heat transport unit 1 is synonymous with the recommendation of the heat receiving unit 70.

  This is because the heat transport unit 1 includes the heat receiving unit 70, so that it is easy to set the target of the arrangement position of the heating elements, and it becomes easier to realize more effective cooling of the heating elements as will be described later.

    (Experimental result)

  Here, the heat receiving portion 70 is preferably provided across the boundary 12 between the first region 5 and the second region 6 from the viewpoint of the heat transport efficiency of the heat transport unit 1.

  Since this inventor experimented about this point, an experimental result is demonstrated. FIG. 12 is an explanatory diagram in which examples and comparative examples are arranged.

(Example)
In the embodiment, the heating element 20 (that is, the heat receiving portion 70) is provided across the boundary 12 between the second region 6 and the first region 5.

(Comparative Example 1)
In Comparative Example 1, the heating element 20 (that is, the heat receiving unit 70) is provided on the bottom surface of the second region 6, and the heating element 20 is substantially included in the bottom surface of the second region 6.

(Comparative Example 2)
In Comparative Example 2, the heating element 20 (that is, the heat receiving portion 70) is provided on the bottom surface of the second region 6, and the heating element 20 is further included on the bottom surface of the second region 6 than in Comparative Example 1, The heating element 20 is covered with the second region 6 more widely than the case.

Based on these three configurations, heat was actually applied to the heating element 20 and the surface temperature of the heating element 20 was measured.
FIG. 13 is a graph showing measurement results of Examples and Comparative Examples. As apparent from the graph of FIG. 13, in the example, the surface temperature of the heating element 20 is 73.4 ° C. In Comparative Example 1, the surface temperature of the heating element 20 is 73.8 ° C. In Comparative Example 2, the surface temperature of the heating element 20 is 76.0 ° C.

  As can be seen from these results, the configuration of the example can cool (i.e., transport) the heat of the heating element most. That is, the heat receiving unit 70 is preferably provided across the boundary 12 between the first region 5 and the second region 6.

  The arrangement position of the heat receiving unit 70 does not depend only on such a cooling effect of the heating element, and may be determined according to parameters such as the size, shape, and mounting position of the heating element 20, for example. In the third embodiment, the arrangement position of the heat receiving unit 70 is not particularly limited. Furthermore, the surface temperature obtained from the measurement result is an example, and it goes without saying that the surface temperature varies depending on all parameters such as the size, shape, mounting position, measurement environment condition, and type of refrigerant.

  As described above, the heat transport unit 1 according to Embodiment 3 can transport the heat of the heating element more efficiently by specifying the arrangement position of the heating element.

(Embodiment 4)
Next, a fourth embodiment will be described.

  In the fourth embodiment, a case will be described in which the heat transport unit further includes a heat radiating unit that releases the transported heat.

  FIG. 14 is a side view of the heat transport unit according to Embodiment 4 of the present invention. The heat transport unit 1 includes a first region 5, a second region 6, and a second region 7 in the internal space 4 as described with reference to FIG. 2. The heating element 20 is disposed in the vicinity of the boundary between the second region 6 and the first region 5, and the second region 6 diffuses the heat taken from the heating element 20.

  The heat diffused by the second region 6 moves to the first region 5, and the first region 5 transports the heat toward the second region 7. The heat that has reached the second region 7 diffuses inside the second region 7.

  As an example of the heat radiating unit, a cooling fan 80 is shown in FIG. The cooling fan 80 cools the second region 7. In the second region 7, the heat transported from the heating element 20 has reached, and the refrigerant evaporated by being cooled condenses. The cooling fan 80 promotes the condensation of the refrigerant. The condensed refrigerant moves from the second region 7 to the second region 6. Due to this movement, the heat transport unit 1 can realize a heat circulation cycle and efficiently transport and cool the heat of the heating element 20.

  The heat transport efficiency of the heat transport unit 1 is that the heat of the heating element 20 is transported (that is, the vaporized refrigerant is moved), and the cooled heat is transported in the opposite direction (that is, the condensed refrigerant is transported). (Moving) improves. For this reason, the moving speed and efficiency of the condensed refrigerant are improved by the heat radiating section, and the heat transport efficiency of the heat transport unit 1 is improved.

  Thus, the heat transport unit 1 can transport heat with high efficiency by further including the heat radiating section.

  14 shows a cooling fan as an example of the heat radiating unit, but various members that can dissipate heat such as a liquid cooling jacket, a Peltier element, and a heat sink are also applied as the heat radiating unit. .

  The heat transport unit 1 is replaced with a heat radiating fin or a liquid cooling device mounted on a notebook computer, portable terminal, computer terminal or the like, or mounted on a cooling device mounted on an industrial device or a control computer unit. It can be replaced with a heat dissipating frame or a cooling device. Since the heat transport unit 1 can transport heat at a higher speed than a conventionally used heat pipe, the cooling capacity is increased. Furthermore, it is possible to flexibly handle the heating element, and various electronic components can be cooled. As a result, the heat transport unit 1 has a wide application range.

  The heat transport unit 1 according to Embodiment 4 can more efficiently transport the heat of the heating element.

  (Embodiment 5)

  The heat transport unit 1 described in the first to fourth embodiments and the heating element 20 that is in thermal contact with at least part of the surface of the heat transport unit 1 (even if it contacts the heat receiving unit described in the third embodiment) It is also preferable that the heat transport unit 1 be applied to an electronic device including an electronic board on which the heat generating body 20 is mounted and a housing for storing the electronic board.

  FIG. 15 is a schematic diagram of an electronic device according to Embodiment 5 of the present invention. The electronic device 90 stores the heat transport unit 1 that cools the electronic substrate 92 and the heating element 20 mounted thereon in the housing 91. Since various electronic components are mounted on the electronic board 92, the heat transport unit 1 transports heat using the electronic components that need to transport heat among these electronic components as the heating element 20.

  Further, the heat transport unit 1 may include a heat radiating unit represented by the cooling fan 80 as necessary.

  Since such an electronic device 90 can be cooled after transporting the heat of the heating element in a predetermined direction, malfunction and failure of the electronic device can be prevented and high performance can be exhibited.

  Electronic devices are portable terminals that are required to be thin and small, such as car TVs and personal monitors. Alternatively, the electronic device includes a mobile phone, a portable music player, a portable mail terminal, a PDA, a digital camera, a digital video camera, a portable recorder, a smartphone, and a portable video shooting device.

  Since the electronic device 90 according to the fifth embodiment can efficiently transport the heat of electronic parts and mechanical parts that generate high heat to the surroundings, it is possible to prevent malfunction and failure of the electronic equipment 90 in advance.

  In the embodiment of the present invention, the heating element is thermally connected to one of the upper plate and the lower plate, but may be thermally connected to both the upper plate and the lower plate. Furthermore, the heating element may be thermally connected to the upper plate and / or the lower plate via a heat receiving member that is a separate member and has high thermal conductivity. By providing the heat receiving member, it can be used as a positioning or fixing member when the heating elements are thermally connected.

  The heat transport unit and the electronic device described in the above first to fifth embodiments are examples for explaining the gist of the present invention, and include modifications and alterations without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Heat transport unit 2 Upper board 3 Lower board 4 Internal space 5, 60 1st area | region 6, 7, 61, 62 2nd area | region 8 1st pillar part 9, 9A 1st channel | path 10, 54 2nd pillar part 11, 55 Second passage 12, 13 Boundary 20 Heating element 30, 51 Large column member 31, 52 Small column member 35 Notch 40, 41, 42 Groove 50 Intermediate plate 70 Heat receiving portion 80 Cooling fan 90 Electronic device 91 Housing 92 Electronic substrate

Claims (18)

A space is defined by the X, Y, and Z axes orthogonal to each other.
An upper plate,
A lower plate facing the upper plate;
An internal space formed by the upper plate and the lower plate and capable of enclosing a refrigerant;
A first region including a first pillar portion that is a partial region of the internal space and forms a plurality of first passages along the X-axis direction;
A second region including a second pillar portion that is a region other than the first region in the internal space and forms a plurality of second passages along the X-axis direction and the Y-axis direction,
A heat transport unit in which the first passage and the second passage communicate with each other at a boundary between the first region and the second region. In the first passage, the vaporized refrigerant moves and the condensed refrigerant moves along the X-axis direction,
The heat transport unit according to claim 1, wherein in the second passage, the vaporized refrigerant moves and the condensed refrigerant moves along the X-axis direction and the Y-axis direction.   The heat transport unit according to claim 1 or 2, wherein the vaporized refrigerant moves with each other and the condensed refrigerant moves with each other at a boundary between the first passage and the second passage.   The said 2nd area | region is provided in at least one edge part of the both ends of the said internal space, The said 1st area | region is provided in areas other than the said 2nd area | region in the said internal space, Any one of Claim 1 to 3 Or a heat transport unit.   5. The heat transport unit according to claim 1, wherein the second region is provided in a central portion of the internal space, and the first region is provided in a region other than the second region in the internal space. . The second region diffuses heat received from the heating element in the X-axis direction and the Y-axis direction and moves to the first region,
The heat transport unit according to any one of claims 1 to 5, wherein the first region transports heat moved from the second region in the X-axis direction. When the second region is provided at the first end of the internal space and the second end opposite to the first end,
The second region on the first end side diffuses heat received from the heating element in the X-axis direction and the Y-axis direction and moves to the first region,
The first region transports heat transferred from the second region on the first end side in the X-axis direction,
The heat transport unit according to claim 6, wherein the second region on the second end side diffuses heat transported by the first region in the X-axis direction and the Y-axis direction. When the second region is provided at the center of the internal space, and the first region is provided at the first end of the internal space and the second end opposite to the first end,
The second region diffuses heat received from the heating element in the X-axis direction and the Y-axis direction and moves to the first region,
The heat transport unit according to claim 6, wherein the first region transports heat transferred from the second region in the X-axis direction. At least one of the upper plate and the lower plate further includes a heat receiving portion that is in thermal contact with the heating element,
The heat transport unit according to claim 1, wherein the heat receiving unit is provided across a boundary between the first region and the second region.   The heat transport unit according to any one of claims 1 to 9, wherein the first pillar portion has a notch that communicates adjacent first passages among the plurality of first passages. The second region has one or more intermediate plates stacked in the Z-axis direction,
The intermediate plate forms the second pillar portion laminated in the Z-axis direction,
11. The heat transport unit according to claim 1, wherein the second column portion forms the second passage along the X-axis direction, the Y-axis direction, and the Z-axis direction.   The heat transport unit according to any one of claims 1 to 11, wherein the second column part includes a large column member and a small column member smaller than the large column member.   The heat transport unit according to any one of claims 1 to 12, wherein at least a part of the first passage and the second passage has a capillary force that moves the condensed refrigerant.   14. The heat transport unit according to claim 1, wherein at least a part of the upper plate, the lower plate, the first pillar portion, and the second pillar portion has a groove on a surface exposed to the internal space. .   The at least one of the said upper board and the said lower board is further equipped with the thermal radiation part which discharge | releases the transported heat in the area | region which opposes at least one part of the said 1st area | region and the said 2nd area | region. Any one of the heat transport units.   The at least part of the upper plate, the lower plate, the first pillar portion, and the second pillar portion has metal plating on a surface exposed to the internal space. Heat transport unit.   The heat transport unit according to any one of claims 1 to 16, wherein a width of the first region in the Y-axis direction and a width of the second region in the Y-axis direction are substantially the same. A heat transport unit according to any of claims 1 to 17,
A heating element in thermal contact with at least a portion of the surface of the heat transport unit;
An electronic board on which the heating element is mounted;
An electronic device comprising a housing for storing the electronic substrate.