JP2011213069A - Metal mask for printing - Google Patents
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- JP2011213069A JP2011213069A JP2010085735A JP2010085735A JP2011213069A JP 2011213069 A JP2011213069 A JP 2011213069A JP 2010085735 A JP2010085735 A JP 2010085735A JP 2010085735 A JP2010085735 A JP 2010085735A JP 2011213069 A JP2011213069 A JP 2011213069A
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- 239000002184 metal Substances 0.000 title claims abstract description 77
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 77
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000012546 transfer Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 description 33
- 235000019589 hardness Nutrition 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 238000004132 cross linking Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002508 contact lithography Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本発明は、ペースト印刷に用いられる印刷用メタルマスクに関するものである。 The present invention relates to a printing metal mask used for paste printing.
現在、プリント配線基板等の基板回路形成のためのペースト印刷には、ポリエステルやステンレスのメッシュに塗布された感光性乳剤上に印刷パターンが形成されたスクリーンメッシュマスクや、金属の板に印刷パターンが開口されたメタルマスクが一般的に用いられている。このメタルマスクの製造はめっき（電鋳法、無電解めっき法）、レーザ加工又はエッチング法などで行われるのが一般的であるが、微細な印刷パターンを形成するためには電鋳法を用いるのが好ましい。 Currently, paste printing for the formation of printed circuit boards and other circuit boards uses screen mesh masks in which a printed pattern is formed on a photosensitive emulsion coated on a polyester or stainless steel mesh, or a printed pattern on a metal plate. An opened metal mask is generally used. The metal mask is generally manufactured by plating (electroforming method, electroless plating method), laser processing, etching method, or the like, but electroforming is used to form a fine printed pattern. Is preferred.
メタルマスクを用いて基板上に導電性ペーストを印刷する場合には、金属ないし硬質樹脂等の外枠（以下、「枠」という。）にメタルマスクを張設した所謂メタルマスク版と呼ばれる形態で印刷装置にセットして用いられるのが一般的である。 When a conductive paste is printed on a substrate using a metal mask, a so-called metal mask plate in which a metal mask is stretched on an outer frame (hereinafter referred to as “frame”) such as metal or hard resin is used. Generally, it is used by being set in a printing apparatus.
当該メタルマスク版を用いた印刷方法としては、オフコンタクト印刷と、オンコンタクト印刷がある。オフコンタクト印刷とは、メタルマスク版を基板から離して水平に載置しメタルマスク上に印刷するペーストを置き、メタルマスク上でスキージを基板方向に押し付けながら移動させることにより開口部内にペーストを充填し、スキージが通り過ぎた時点で版離れが発生し、基板接触部にペーストが載せられてゆく印刷方法である。オンコンタクト印刷とは、メタルマスク版を基板に密着させ、メタルマスク上に印刷するペーストを置き、メタルマスク上でスキージを水平方向に移動させることにより開口部内にペーストを充填し、ペースト印刷後に版を基板から剥離して、基板接触部にペーストを転写する印刷方法である。 As printing methods using the metal mask plate, there are off-contact printing and on-contact printing. With off-contact printing, the metal mask plate is placed horizontally and placed on the metal mask, and the paste to be printed is placed on the metal mask. The squeegee is moved toward the substrate on the metal mask and moved to fill the opening. However, this is a printing method in which separation of the plate occurs when the squeegee passes and the paste is placed on the substrate contact portion. On-contact printing means that the metal mask plate is brought into close contact with the substrate, the paste to be printed is placed on the metal mask, the squeegee is moved in the horizontal direction on the metal mask, and the paste is filled in the opening. Is a printing method in which the paste is transferred to the substrate contact portion.
メタルマスク版は構造的に、枠に直接メタルマスクを張設したフルメタル版と、スクリーンメッシュ（紗）を張設した枠（以下、「スクリーン枠」という。）にメタルマスクを張設したコンビネーション版がある。前記ペースト印刷において、印刷後に基板からメタルマスクを剥離する際にペーストの抜けを良くするために、メタルマスクには張力がかけられた状態で張設されている必要がある。 Structurally, the metal mask plate is a combination of a full metal plate with a metal mask stretched directly on the frame and a frame with a screen mesh (枠) stretched (hereinafter referred to as “screen frame”). There is. In the paste printing, the metal mask needs to be stretched in a tensioned state in order to improve the removal of the paste when peeling the metal mask from the substrate after printing.
さて、メタルマスクの開口部は、円形、正方形又は長方形のような単純な形状が一般的であるが、図２に示すような複雑な印刷パターンの場合、前記張力による開口部の変形のため開口部は固有の形状を保持することができない。また図３に示すように、開口部内に非印刷部が存在するような印刷パターンの場合は、従来のメタルマスクでは印刷パターンを保持できない。そのため、仮に前記印刷パターンをメタルマスクを用いて印刷するとすれば、印刷パターンを複数に分割し、複数回印刷することになる。現状ではこの手間を省くために、専ら開口内のメッシュにより印刷パターンの保持が可能であり、印刷回数が１回で済むスクリーンメッシュマスクを用いた印刷が行われている。 The opening portion of the metal mask is generally a simple shape such as a circle, a square, or a rectangle. However, in the case of a complicated print pattern as shown in FIG. 2, the opening is caused by the deformation of the opening due to the tension. The part cannot hold a unique shape. Further, as shown in FIG. 3, in the case of a printing pattern in which a non-printing portion exists in the opening, the conventional metal mask cannot hold the printing pattern. Therefore, if the print pattern is printed using a metal mask, the print pattern is divided into a plurality of prints. At present, in order to save this labor, printing using a screen mesh mask that can hold a printing pattern exclusively by a mesh in an opening and only requires one printing is performed.
しかしながら、スクリーンメッシュマスクは開口内のメッシュによりペーストの転写が阻害されるため、印刷転写量が十分確保できないという問題がある。この点、メタルマスクの印刷転写量はスクリーンメッシュマスクに比べ優れているため、前記特殊形状の印刷パターンの印刷にもメタルマスクが使われることが理想とされる。 However, the screen mesh mask has a problem in that a sufficient amount of print transfer cannot be secured because the transfer of the paste is hindered by the mesh in the opening. In this respect, since the printing transfer amount of the metal mask is superior to that of the screen mesh mask, it is ideal that the metal mask is also used for printing the special-shaped printing pattern.
そこで、この問題を解決するために印刷パターンを保持する目的で印刷パターン形状の開口内に架橋部を一体形成した構造とした所謂一体型メタルマスクが開示されている。
ここで、印刷するペーストの厚みはメタルマスクの厚みに依存するため、ペーストを厚く印刷したい場合はメタルマスクの厚みを十分厚く設計する必要があるが、こうした開口内に架橋部が存在する一体型メタルマスクの場合、ペーストの厚みを増やすために架橋部以外のマスク厚みを増加させると、図６に示すように印刷時のスキージからかかる圧力ため、架橋部が開口内に押し込まれやすくなり、架橋部の変形や断線が発生してメタルマスクが破損しやすくなる。一方、架橋部の強度を高めるために、架橋部の幅や厚みを大きくするとペースト印刷時に架橋部がペーストの充填を阻害し、架橋部分でのペースト転写性が低下する問題があった。 Here, since the thickness of the paste to be printed depends on the thickness of the metal mask, it is necessary to design the thickness of the metal mask to be sufficiently thick if you want to print thick paste. In the case of a metal mask, if the thickness of the mask other than the cross-linked portion is increased in order to increase the paste thickness, the cross-linked portion is easily pushed into the opening due to pressure applied from the squeegee at the time of printing as shown in FIG. The metal mask is easily damaged due to deformation or disconnection of the portion. On the other hand, if the width and thickness of the cross-linked part are increased in order to increase the strength of the cross-linked part, there is a problem that the cross-linked part impedes the filling of the paste during paste printing and paste transferability at the cross-linked part is lowered.
その問題を解決するために、一体型メタルマスクの架橋部をスキージ面と面一に設け、架橋部の被印刷面側にポスト（支柱）を設けることにより強度を向上したメタルマスクが開示されている。
しかしながら、この発明は、メタルマスク開口内のポストを設けた場所にはペーストが充填できないため、設計どおりのペースト転写量が確保できない問題がある。 However, the present invention has a problem that the paste transfer amount as designed cannot be secured because the paste cannot be filled in the place where the post in the metal mask opening is provided.
本発明は、複雑な印刷パターンや開口部内に非印刷部が存在するような印刷パターンを印刷する場合であっても、充分なペースト転写量が確保でき、さらにメタルマスクの短寿命化を防ぐことを可能とするペースト印刷用メタルマスクを得るという課題を解決することを目的とする。 The present invention can secure a sufficient amount of paste transfer even when printing a complicated printing pattern or a printing pattern in which a non-printing portion exists in the opening, and further prevents a short life of the metal mask. An object of the present invention is to solve the problem of obtaining a metal mask for paste printing that enables the above.
本発明者らは上記問題を解決するために検討した結果、本発明に至った。
すなわち、印刷パターン形状の開口内に架橋部が存在するメタルマスクであって、
少なくとも架橋部の硬度が、印刷パターン形状の開口を有する層の硬度よりも高いことを特徴とするペースト印刷用メタルマスク、
または架橋部を有する層と、印刷パターン形状の開口を有する層からなり、
印刷パターン形状の開口を有する層よりも架橋部を有する層の硬度が高いことを特徴とする上記記載のペースト印刷用メタルマスクであり、
少なくとも架橋部に撥水・撥油性を持たせたことを特徴とする上記のペースト印刷用メタルマスクである。
As a result of investigations to solve the above problems, the present inventors have reached the present invention.
That is, a metal mask having a bridging portion in the opening of the printed pattern shape,
A metal mask for paste printing, characterized in that the hardness of at least the cross-linked part is higher than the hardness of the layer having the opening of the printed pattern shape;
Or a layer having a cross-linked portion and a layer having a printed pattern-shaped opening,
The metal mask for paste printing according to the above, characterized in that the hardness of the layer having a cross-linking portion is higher than the layer having an opening having a printed pattern shape,
The metal mask for paste printing described above, wherein at least a crosslinked portion has water repellency and oil repellency.
本発明の印刷用メタルマスクによれば、架橋部が開口内に押し込まれることによるメタルマスクの短寿命化を防止でき、かつペースト転写量を確保できる。 According to the printing metal mask of the present invention, it is possible to prevent the life of the metal mask from being shortened due to the bridging portion being pushed into the opening, and to secure the paste transfer amount.
以下、本発明のメタルマスクについて説明する。
本発明のメタルマスクの製造方法としては、図４に示すような２段構造の積層めっき法により製造する方法や、図５に示すようなステンレス等の導電材を母材として表面に印刷パターン形状のめっきを行った後、母材上の印刷パターン内にレーザで架橋部を形成することにより母材ごとメタルマスクとする製造方法などが挙げられる。
Hereinafter, the metal mask of the present invention will be described.
As a manufacturing method of the metal mask of the present invention, a method of manufacturing by a two-layer laminated plating method as shown in FIG. 4 or a printed pattern shape on the surface using a conductive material such as stainless steel as shown in FIG. After the plating is performed, a manufacturing method of forming a metal mask together with the base material by forming a cross-linking portion with a laser in a printed pattern on the base material can be used.
めっき法の種類としては、皮膜硬度の調整が可能であることが望ましく、具体的にはニッケルめっきやニッケル合金めっきが挙げられる。
また、ペースト転写性をより向上させる目的でメタルマスク表面に撥水・撥油処理を施すことができる。具体的にはメタルマスク表面へフッ素樹脂系またはシリコン樹脂系コーティング剤等による皮膜形成や撥水・撥油性を有するめっき皮膜形成等、従来使用されていた方法を用いることができる。
As the type of plating method, it is desirable that the film hardness can be adjusted, and specifically, nickel plating and nickel alloy plating can be mentioned.
In addition, the surface of the metal mask can be subjected to water / oil repellent treatment for the purpose of further improving paste transferability. Specifically, a conventionally used method such as film formation with a fluororesin-based or silicon resin-based coating agent or a plating film having water / oil repellency can be used on the metal mask surface.
本発明のメタルマスク開口内に存在する架橋部はスキージ面と面一に設けられることが望ましく、架橋部の厚みは印刷時に架橋部が破損しない強度を保持できればよく、具体的には２０ミクロン以上であることが望ましく、また硬度は、印刷時にスキージ圧に耐えられれば制限はないが、印刷時に撓まない程度の強度を考慮すると、４００ＨＶ以上の硬度が望ましい。
また、架橋部の形状はメッシュ状や千鳥状や幾何学模様等、印刷パターンが保持できれば制限はない。
The bridging portion present in the opening of the metal mask of the present invention is desirably provided flush with the squeegee surface, and the thickness of the bridging portion only needs to be strong enough to prevent the bridging portion from being damaged during printing, specifically 20 microns or more. Further, the hardness is not limited as long as it can withstand the squeegee pressure during printing, but considering the strength that does not bend during printing, a hardness of 400 HV or higher is desirable.
In addition, the shape of the bridging portion is not limited as long as it can hold a printing pattern such as a mesh shape, a staggered shape, or a geometric pattern.
なお、本発明のメタルマスクの印刷パターン形状の開口を有する層の硬度は、印刷時にメタルマスクが変形しない程度の硬度であれば制限はないが、ペーストの転写性を考慮すると２５０〜３５０ＨＶ程度が望ましい。 In addition, the hardness of the layer having the opening of the printed pattern shape of the metal mask of the present invention is not limited as long as the hardness of the metal mask is not deformed at the time of printing, but is about 250 to 350 HV in consideration of the transferability of the paste. desirable.
架橋部と印刷パターン形状の開口を有する層を形成する方法としては、皮膜硬度の違うめっき液を用いて積層めっきを行う方法や、電流密度によって皮膜硬度が変化するめっき液を用い、同一面内においてパターンの密集度の差を利用して架橋部と印刷パターン形状の開口を有する層の硬度が違うめっき皮膜とする方法等を用いることができる。 As a method of forming a layer having an opening having a cross-linked portion and a printed pattern shape, a method of performing multi-layer plating using plating solutions having different film hardnesses, or a plating solution whose film hardness changes depending on current density is used. In this method, a method of using a plating film in which the hardness of the cross-linked portion and the layer having the opening of the printed pattern shape is different by using the difference in pattern density can be used.
本発明のメタルマスクで使用可能なペーストとしては従来使用されていた銀ペースト、はんだペースト、銅ペースト、のように回路パターンを印刷するのに用いられる導電性ペースト、さらに放熱用シリコーンペースト、接着剤等の機能性ペースト等が挙げられる。 As a paste that can be used in the metal mask of the present invention, a conductive paste used for printing a circuit pattern, such as a silver paste, a solder paste, and a copper paste, which have been conventionally used, a silicone paste for heat dissipation, and an adhesive. And functional pastes.
〔実施例１〕
以下、本発明の実施例について具体的に説明する。
表面処理したステンレスの母材に２０μｍ厚の感光性ドライフィルム（以下ドライフィルム）をラミネートし、開口中に架橋を導入した印刷パターンを露光し、アルカリ現像液により現像を行った。この際、露光した印刷パターンは横長形状の棒状パターンと縦長形状の帯状パターンが合わさった形状の図２の印刷パターンを使用した。
[Example 1]
Examples of the present invention will be specifically described below.
A 20 μm-thick photosensitive dry film (hereinafter referred to as dry film) was laminated on the surface-treated stainless steel base material, and a printed pattern in which crosslinking was introduced into the opening was exposed and developed with an alkali developer. At this time, the exposed print pattern used was the print pattern of FIG. 2 in which a horizontally long bar-shaped pattern and a vertically long strip-shaped pattern were combined.
皮膜硬度を４５０ＨＶとなるように添加剤を調整したスルファミン酸ニッケルめっき浴にて２０μｍめっきを行い、第１層目のめっき層を形成した。
なお、スルファミン酸ニッケルめっきの基本条件は以下の設定で行った。
＜めっき浴組成＞
スルファミン酸ニッケル：５５０ｇ／Ｌ、塩化ニッケル６水和物：９０ｇ／Ｌ、ホウ酸：３０ｇ／Ｌ、ピット防止剤及び光沢剤：少量
＜その他めっき条件＞
ｐＨ：４．５〜４．６、循環液流量：４０Ｌ／ｍｉｎ、浴温度：５５℃
20 μm plating was performed in a nickel sulfamate plating bath in which additives were adjusted so that the film hardness was 450 HV to form a first plating layer.
The basic conditions for nickel sulfamate plating were as follows.
<Plating bath composition>
Nickel sulfamate: 550 g / L, nickel chloride hexahydrate: 90 g / L, boric acid: 30 g / L, pit inhibitor and brightener: small amount <other plating conditions>
pH: 4.5 to 4.6, circulating fluid flow rate: 40 L / min, bath temperature: 55 ° C
水洗、水切りを行い、さらに厚み４０μｍ厚のドライフィルムを積層し８０μｍ厚とした。印刷パターンを露光し、アルカリ現像液にて現像を行った。 Water washing and draining were performed, and a dry film having a thickness of 40 μm was further laminated to a thickness of 80 μm. The printed pattern was exposed and developed with an alkaline developer.
３５０ＨＶの硬度の皮膜ができる様に添加剤を調節したスルファミン酸ニッケルめっき浴にて８０μｍのめっきを行い第２層目のめっき層を形成した。 A second plating layer was formed by plating at 80 μm in a nickel sulfamate plating bath whose additives were adjusted so that a film having a hardness of 350 HV could be formed.
母材をめっき浴より取り出し、水洗の後、アルカリ剥離液にてドライフィルムを除去し、めっきを母材より剥離し、開口内に架橋構造のあるメタルマスクを得た。 The base material was taken out from the plating bath, washed with water, the dry film was removed with an alkaline stripping solution, the plating was stripped from the base material, and a metal mask having a crosslinked structure in the opening was obtained.
ポリエステル製のスクリーンメッシュが張設されているスクリーン枠に、前記メタルマスクを張設し、メタルマスク版を得た。 The metal mask was stretched on a screen frame on which a polyester screen mesh was stretched to obtain a metal mask plate.
この様にして作製したメタルマスク版を用いて、印刷試験を行った。当該試験は、手刷り印刷機の金属スキージを用いて、約１５ｍｍ／秒の印刷速度で銀ペースト（粒径８〜１０μｍ、粘度２０５Ｐａ．ｓ）を印刷した。結果としては、部分的に架橋に対応した箇所の印刷パターンに欠けや断線がみられた。しかし、架橋部の破損は認められなかった。 A printing test was performed using the metal mask plate thus produced. In this test, a silver paste (particle size: 8 to 10 μm, viscosity: 205 Pa.s) was printed at a printing speed of about 15 mm / second using a metal squeegee of a hand-printed printing press. As a result, chipping or disconnection was observed in the printed pattern in a part corresponding to the crosslinking partially. However, no breakage of the crosslinked part was observed.
〔実施例２〕
第１層目に４５０ＨＶのめっき皮膜硬度となるように添加剤を調整したスルファミン酸ニッケルめっき浴を用い、２層目は実施例１と同じめっき浴を用いて作成し、３５０ＨＶのめっき皮膜を積層させ、開口内のドライフィルムを除去した後、開口及び表面に撥水・撥油性を付与する目的でＰＴＦＥ（ポリテトラフルオロエチレン）が１０％程度皮膜中に共析される様調整された無電解ニッケル共析めっき浴（ニムフロン（登録商標）、上村工業株式会社製）を用いて２μｍ程度の複合めっき皮膜を被印刷面側にコーティングしたメタルマスクを作製し、実施例１と同様にスクリーン枠に張設し、メタルマスク版を得た。この際の印刷パターンは実施例１と同様に図２のパターンを使用した。
[Example 2]
A nickel sulfamate plating bath with additives adjusted to 450 HV plating film hardness was used for the first layer, and the second layer was prepared using the same plating bath as in Example 1, and a 350 HV plating film was laminated. After removing the dry film in the opening, the electroless was adjusted so that about 10% of PTFE (polytetrafluoroethylene) was co-deposited in the film for the purpose of imparting water and oil repellency to the opening and the surface. Using a nickel eutectoid plating bath (Nimflon (registered trademark), manufactured by Uemura Kogyo Co., Ltd.), a metal mask having a composite plating film of about 2 μm coated on the printed surface side was prepared. It was stretched to obtain a metal mask version. As the printing pattern at this time, the pattern of FIG.
得られたメタルマスク版を用いて実施例１と同様に銀ペーストの印刷を行った所、欠けや断線のない印刷パターンが得られた。また、マスク架橋部の破壊も認められなかった。 When the silver paste was printed using the obtained metal mask plate in the same manner as in Example 1, a printed pattern free from chipping or disconnection was obtained. Moreover, the destruction of the mask cross-linking portion was not observed.
〔実施例３〕
２Ａ／ｄｍ２の電流密度の場合は約３５０ＨＶ、４Ａ／ｄｍ２の場合は約４５０ＨＶと、電流密度が高くなると硬度が高くなるように添加剤を調整したスルファミン酸ニッケルめっき浴を用い、第１層および第２層のめっきを各々４０Ａの電流で行い、印刷パターン内の電流密度の差異により架橋部は４２０ＨＶ,周辺部位は３２０ＨＶのメタルマスクを得た。
この際の印刷パターンは実施例１と同様に図２のパターンを使用した。
Example 3
2A / dm when a current density of 2 to about 350 HV, 4A / and about 450HV For dm 2, using a nickel sulfamate plating bath was adjusted additives such hardness the current density is high is increased, the first The plating of the layer and the second layer was performed at a current of 40 A, and a metal mask having a bridge portion of 420 HV and a peripheral portion of 320 HV was obtained due to the difference in current density in the printed pattern.
As the printing pattern at this time, the pattern of FIG.
ドライフィルムを除去の後、続いて印刷基板面側に撥水・撥油処理を行い、実施例１と同様にスクリーン枠に張設し、メタルマスク版を得た。 After removing the dry film, water and oil repellency treatments were subsequently performed on the printed substrate surface side, and stretched on the screen frame in the same manner as in Example 1 to obtain a metal mask plate.
得られたメタルマスク版を用いて実施例１、２と同様に銀ペーストの印刷を行った所、欠けや断線のない印刷パターンが得られた。また、マスク架橋部の破壊も認められなかった。 When the obtained metal mask plate was used to print a silver paste in the same manner as in Examples 1 and 2, a printed pattern free from chipping or disconnection was obtained. Moreover, the destruction of the mask cross-linking portion was not observed.
〔比較例１〕
第１層と２層目のめっきを３２０ＨＶとなるように添加剤を調整したスルファミン酸ニッケルめっき浴を用いて作成する以外は、実施例１と同様の方法で作成したメタルマスクを用い、実施例１と同様に銀ペーストの印刷を行ったところ、マスク開口内の架橋に対応した部分に部分的に印刷パターンに欠けや断線がみられ、マスク架橋部の破壊が認められた。
[Comparative Example 1]
Example 1 Using the metal mask prepared in the same manner as in Example 1 except that the first layer and the second layer were prepared using a nickel sulfamate plating bath whose additive was adjusted to 320 HV. When silver paste was printed in the same manner as in No. 1, the printed pattern was partially chipped or disconnected at the portion corresponding to the crosslinking in the mask opening, and the destruction of the mask crosslinking portion was observed.
〔比較例２〕
比較例１のメタルマスク架橋部の印刷基板面側にポスト（支柱）を設けた以外は比較例１と同様に作製したメタルマスクを用い、実施例１と同様に銀ペースト印刷を行ったところ、マスク架橋部の破壊は認められなかったが、印刷パターンにマスク開口内のポストに対応した部分に欠けや断線が認められた。
[Comparative Example 2]
Using a metal mask produced in the same manner as in Comparative Example 1 except that a post (support) was provided on the printed substrate surface side of the metal mask bridging part in Comparative Example 1, and silver paste printing was performed in the same manner as in Example 1, Although the destruction of the mask cross-linking portion was not observed, the printed pattern was found to be chipped or broken at the portion corresponding to the post in the mask opening.
１、４１ 第１層目のめっき層
２ 第２層目のめっき層
３、２３、４３ 架橋部
４、２４、４４ 印刷パターン形状の開口
２５ ペースト
２６ 基板
９ 印刷パターン
２２ スキージ
７、２１、４７ メタルマスク
５、４５ 母材
６，４６ 感光性ドライフィルム
DESCRIPTION OF SYMBOLS 1,41 1st layer plating layer 2 2nd layer plating layer 3, 23, 43 Bridge part 4, 24, 44 Print pattern shape opening 25 Paste 26 Substrate 9 Print pattern 22 Squeegee 7, 21, 47 Metal Mask 5, 45 Base material 6, 46 Photosensitive dry film
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013146958A (en) * | 2012-01-20 | 2013-08-01 | Mitsubishi Electric Corp | Metal mask and method for manufacturing solar cell |
| KR101792667B1 (en) | 2017-04-07 | 2017-11-02 | 크레아퓨쳐 주식회사 | Manufacturing method of fine metal mask |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2013146958A (en) * | 2012-01-20 | 2013-08-01 | Mitsubishi Electric Corp | Metal mask and method for manufacturing solar cell |
| KR101792667B1 (en) | 2017-04-07 | 2017-11-02 | 크레아퓨쳐 주식회사 | Manufacturing method of fine metal mask |
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