JP2011203343A5 - - Google Patents

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Publication number
JP2011203343A5
JP2011203343A5 JP2010068432A JP2010068432A JP2011203343A5 JP 2011203343 A5 JP2011203343 A5 JP 2011203343A5 JP 2010068432 A JP2010068432 A JP 2010068432A JP 2010068432 A JP2010068432 A JP 2010068432A JP 2011203343 A5 JP2011203343 A5 JP 2011203343A5
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JP
Japan
Prior art keywords
pattern
illumination
inspection method
inspection
data
Prior art date
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Pending
Application number
JP2010068432A
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English (en)
Japanese (ja)
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JP2011203343A (ja
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Publication date
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Priority to JP2010068432A priority Critical patent/JP2011203343A/ja
Priority claimed from JP2010068432A external-priority patent/JP2011203343A/ja
Priority to US13/051,654 priority patent/US20110237087A1/en
Publication of JP2011203343A publication Critical patent/JP2011203343A/ja
Publication of JP2011203343A5 publication Critical patent/JP2011203343A5/ja
Pending legal-status Critical Current

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JP2010068432A 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法 Pending JP2011203343A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010068432A JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法
US13/051,654 US20110237087A1 (en) 2010-03-24 2011-03-18 Pattern inspection method and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010068432A JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2011203343A JP2011203343A (ja) 2011-10-13
JP2011203343A5 true JP2011203343A5 (https=) 2012-04-19

Family

ID=44656970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010068432A Pending JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法

Country Status (2)

Country Link
US (1) US20110237087A1 (https=)
JP (1) JP2011203343A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011247957A (ja) * 2010-05-24 2011-12-08 Toshiba Corp パターン検査方法および半導体装置の製造方法
US9361533B2 (en) * 2011-11-16 2016-06-07 Dcg Systems, Inc. Apparatus and method for polarization diversity imaging and alignment
JP5826707B2 (ja) * 2012-05-31 2015-12-02 株式会社Ｓｃｒｅｅｎホールディングス 基板検査装置および基板検査方法
US9726617B2 (en) * 2013-06-04 2017-08-08 Kla-Tencor Corporation Apparatus and methods for finding a best aperture and mode to enhance defect detection
CN110609439B (zh) * 2018-06-15 2023-01-17 夏普株式会社 检查装置
JP2020144340A (ja) 2019-03-08 2020-09-10 キオクシア株式会社 像取得装置及び像取得方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08254816A (ja) * 1995-03-17 1996-10-01 Toshiba Corp パターン欠陥検査方法およびその装置
JP2002107309A (ja) * 2000-09-28 2002-04-10 Toshiba Corp 欠陥検査装置及び欠陥検査方法
JP2005148320A (ja) * 2003-11-13 2005-06-09 Htl:Kk 参照画像の生成方法及び位相シフトフォトマスク検査装置
JP4018642B2 (ja) * 2004-01-05 2007-12-05 株式会社東芝 参照データ生成方法、パターン欠陥検査装置、パターン欠陥検査方法、及び参照データ生成プログラム
JP2008009339A (ja) * 2006-06-30 2008-01-17 Toshiba Corp パターンの検査装置、パターンの検査方法および半導体装置の製造方法
JP2008112178A (ja) * 2007-11-22 2008-05-15 Advanced Mask Inspection Technology Kk マスク検査装置

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