JP2011203343A - パターン検査方法及び半導体装置の製造方法 - Google Patents

パターン検査方法及び半導体装置の製造方法 Download PDF

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Publication number
JP2011203343A
JP2011203343A JP2010068432A JP2010068432A JP2011203343A JP 2011203343 A JP2011203343 A JP 2011203343A JP 2010068432 A JP2010068432 A JP 2010068432A JP 2010068432 A JP2010068432 A JP 2010068432A JP 2011203343 A JP2011203343 A JP 2011203343A
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JP
Japan
Prior art keywords
pattern
inspection
data
illumination
inspection method
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JP2010068432A
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English (en)
Japanese (ja)
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JP2011203343A5 (https=
Inventor
Ryoji Yoshikawa
綾司 吉川
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Toshiba Corp
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Toshiba Corp
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2010068432A priority Critical patent/JP2011203343A/ja
Priority to US13/051,654 priority patent/US20110237087A1/en
Publication of JP2011203343A publication Critical patent/JP2011203343A/ja
Publication of JP2011203343A5 publication Critical patent/JP2011203343A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8883—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges involving the calculation of gauges, generating models
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2010068432A 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法 Pending JP2011203343A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010068432A JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法
US13/051,654 US20110237087A1 (en) 2010-03-24 2011-03-18 Pattern inspection method and semiconductor device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010068432A JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2011203343A true JP2011203343A (ja) 2011-10-13
JP2011203343A5 JP2011203343A5 (https=) 2012-04-19

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ID=44656970

Family Applications (1)

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JP2010068432A Pending JP2011203343A (ja) 2010-03-24 2010-03-24 パターン検査方法及び半導体装置の製造方法

Country Status (2)

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US (1) US20110237087A1 (https=)
JP (1) JP2011203343A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101473091B1 (ko) * 2012-05-31 2014-12-15 가부시키가이샤 스크린 홀딩스 기판 검사 장치 및 기판 검사 방법
JP2015500505A (ja) * 2011-11-16 2015-01-05 ディーシージー システムズ、 インコーポライテッドDcg Systems Inc. 偏光ダイバーシティ撮像およびアライメントのための装置および方法
JP2019117930A (ja) * 2013-06-04 2019-07-18 ケーエルエー−テンカー コーポレイション 欠陥検出を強化するための最良の開口及びモードを発見するためのシステム及び方法
US11054625B2 (en) 2019-03-08 2021-07-06 Toshiba Memory Corporation Image acquisition apparatus and image acquisition method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011247957A (ja) * 2010-05-24 2011-12-08 Toshiba Corp パターン検査方法および半導体装置の製造方法
CN110609439B (zh) * 2018-06-15 2023-01-17 夏普株式会社 检查装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08254816A (ja) * 1995-03-17 1996-10-01 Toshiba Corp パターン欠陥検査方法およびその装置
JP2002107309A (ja) * 2000-09-28 2002-04-10 Toshiba Corp 欠陥検査装置及び欠陥検査方法
JP2005148320A (ja) * 2003-11-13 2005-06-09 Htl:Kk 参照画像の生成方法及び位相シフトフォトマスク検査装置
JP2008009339A (ja) * 2006-06-30 2008-01-17 Toshiba Corp パターンの検査装置、パターンの検査方法および半導体装置の製造方法
JP2008112178A (ja) * 2007-11-22 2008-05-15 Advanced Mask Inspection Technology Kk マスク検査装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4018642B2 (ja) * 2004-01-05 2007-12-05 株式会社東芝 参照データ生成方法、パターン欠陥検査装置、パターン欠陥検査方法、及び参照データ生成プログラム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08254816A (ja) * 1995-03-17 1996-10-01 Toshiba Corp パターン欠陥検査方法およびその装置
JP2002107309A (ja) * 2000-09-28 2002-04-10 Toshiba Corp 欠陥検査装置及び欠陥検査方法
JP2005148320A (ja) * 2003-11-13 2005-06-09 Htl:Kk 参照画像の生成方法及び位相シフトフォトマスク検査装置
JP2008009339A (ja) * 2006-06-30 2008-01-17 Toshiba Corp パターンの検査装置、パターンの検査方法および半導体装置の製造方法
JP2008112178A (ja) * 2007-11-22 2008-05-15 Advanced Mask Inspection Technology Kk マスク検査装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015500505A (ja) * 2011-11-16 2015-01-05 ディーシージー システムズ、 インコーポライテッドDcg Systems Inc. 偏光ダイバーシティ撮像およびアライメントのための装置および方法
KR101473091B1 (ko) * 2012-05-31 2014-12-15 가부시키가이샤 스크린 홀딩스 기판 검사 장치 및 기판 검사 방법
JP2019117930A (ja) * 2013-06-04 2019-07-18 ケーエルエー−テンカー コーポレイション 欠陥検出を強化するための最良の開口及びモードを発見するためのシステム及び方法
US11054625B2 (en) 2019-03-08 2021-07-06 Toshiba Memory Corporation Image acquisition apparatus and image acquisition method

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US20110237087A1 (en) 2011-09-29

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