JP2011202915A - 熱処理装置 - Google Patents
熱処理装置 Download PDFInfo
- Publication number
- JP2011202915A JP2011202915A JP2010072293A JP2010072293A JP2011202915A JP 2011202915 A JP2011202915 A JP 2011202915A JP 2010072293 A JP2010072293 A JP 2010072293A JP 2010072293 A JP2010072293 A JP 2010072293A JP 2011202915 A JP2011202915 A JP 2011202915A
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- Prior art keywords
- boat
- process tube
- opening
- disposed
- heat treatment
- Prior art date
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Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 52
- 230000003028 elevating effect Effects 0.000 claims abstract description 6
- 238000004904 shortening Methods 0.000 abstract description 2
- 239000007789 gas Substances 0.000 description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 10
- 229910010271 silicon carbide Inorganic materials 0.000 description 10
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Charging Or Discharging (AREA)
- Furnace Details (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】 縦型炉10は、ボート22および昇降機構26を少なくとも備える。昇降機構26は、ワーク20がプロセスチューブ16の内部に配置される第1の位置、およびワーク20がプロセスチューブ16の外部に配置される第2の位置を含む複数の位置にボート22を移動させるように構成される。ボート22は、その上部に設けられ、かつ、開口部188を通過可能に構成された閉塞板224を備える。閉塞板224は、ボート22が第2の位置に配置された際に、開口部188を塞ぐように開口部188内に配置される。
【選択図】 図3
Description
16−プロセスチューブ
18−マニホールド
20−ワーク
22−ボート
24−昇降アーム
26−昇降機構
222−底部
224−閉塞板
Claims (3)
- ワークを搬入および搬出するための開口部を有する有底筒状のプロセスチューブを備えた熱処理装置であって、
前記ワークを支持するように構成されたボートと、
前記ボートを昇降させる昇降機構であって、前記ワークが前記プロセスチューブの内部に配置される第1の位置、および前記ワークが前記プロセスチューブの外部に配置される第2の位置を含む複数の位置に前記ボートを移動させるように構成された昇降機構と、
を備え、
前記ボートは、上部に設けられ、かつ、前記開口部を通過可能に構成された閉塞板であって、前記第2の位置に配置された際に、前記開口部を塞ぐように前記開口部内に配置される閉塞板を備えた熱処理装置。 - 前記閉塞板は、その上面が、前記ボートが前記第2の位置に配置された際に、前記開口部の上端と同一平面上に配置される請求項1に記載の熱処理装置。
- 前記閉塞板は、不透明部材で構成された請求項1または2に記載の熱処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010072293A JP5583443B2 (ja) | 2010-03-26 | 2010-03-26 | 熱処理装置 |
KR1020100109155A KR101745970B1 (ko) | 2010-03-26 | 2010-11-04 | 열처리장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010072293A JP5583443B2 (ja) | 2010-03-26 | 2010-03-26 | 熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011202915A true JP2011202915A (ja) | 2011-10-13 |
JP5583443B2 JP5583443B2 (ja) | 2014-09-03 |
Family
ID=44879755
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010072293A Active JP5583443B2 (ja) | 2010-03-26 | 2010-03-26 | 熱処理装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5583443B2 (ja) |
KR (1) | KR101745970B1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105274570A (zh) * | 2015-11-04 | 2016-01-27 | 内蒙古风光源节能环保科技有限公司 | 一种先进的阴极炭块与钢棒预热装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661163A (ja) * | 1992-08-05 | 1994-03-04 | Hitachi Ltd | 縦型熱処理炉および熱処理方法 |
JP2001176812A (ja) * | 1999-12-17 | 2001-06-29 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2001250787A (ja) * | 2000-03-06 | 2001-09-14 | Hitachi Kokusai Electric Inc | 基板処理装置および基板処理方法 |
JP2002289600A (ja) * | 2001-03-28 | 2002-10-04 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
JP2003031512A (ja) * | 2001-07-18 | 2003-01-31 | Rohm Co Ltd | 入出制御装置を備える拡散炉 |
JP2003314963A (ja) * | 2002-04-23 | 2003-11-06 | Koyo Thermo System Kk | 熱風循環式オーブン |
JP2009236367A (ja) * | 2008-03-26 | 2009-10-15 | Koyo Thermo System Kk | 熱処理装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050098107A1 (en) * | 2003-09-24 | 2005-05-12 | Du Bois Dale R. | Thermal processing system with cross-flow liner |
-
2010
- 2010-03-26 JP JP2010072293A patent/JP5583443B2/ja active Active
- 2010-11-04 KR KR1020100109155A patent/KR101745970B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0661163A (ja) * | 1992-08-05 | 1994-03-04 | Hitachi Ltd | 縦型熱処理炉および熱処理方法 |
JP2001176812A (ja) * | 1999-12-17 | 2001-06-29 | Tokyo Electron Ltd | 縦型熱処理装置 |
JP2001250787A (ja) * | 2000-03-06 | 2001-09-14 | Hitachi Kokusai Electric Inc | 基板処理装置および基板処理方法 |
JP2002289600A (ja) * | 2001-03-28 | 2002-10-04 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
JP2003031512A (ja) * | 2001-07-18 | 2003-01-31 | Rohm Co Ltd | 入出制御装置を備える拡散炉 |
JP2003314963A (ja) * | 2002-04-23 | 2003-11-06 | Koyo Thermo System Kk | 熱風循環式オーブン |
JP2009236367A (ja) * | 2008-03-26 | 2009-10-15 | Koyo Thermo System Kk | 熱処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105274570A (zh) * | 2015-11-04 | 2016-01-27 | 内蒙古风光源节能环保科技有限公司 | 一种先进的阴极炭块与钢棒预热装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20110108233A (ko) | 2011-10-05 |
JP5583443B2 (ja) | 2014-09-03 |
KR101745970B1 (ko) | 2017-06-12 |
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