JP2011151167A5 - - Google Patents
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- Publication number
- JP2011151167A5 JP2011151167A5 JP2010010665A JP2010010665A JP2011151167A5 JP 2011151167 A5 JP2011151167 A5 JP 2011151167A5 JP 2010010665 A JP2010010665 A JP 2010010665A JP 2010010665 A JP2010010665 A JP 2010010665A JP 2011151167 A5 JP2011151167 A5 JP 2011151167A5
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- wafer
- holding
- state
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 claims description 276
- 239000007788 liquid Substances 0.000 claims description 58
- 238000000034 method Methods 0.000 claims description 31
- 238000010586 diagram Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010010665A JP5502503B2 (ja) | 2010-01-21 | 2010-01-21 | ウエハ搬送装置およびウエハ搬送方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010010665A JP5502503B2 (ja) | 2010-01-21 | 2010-01-21 | ウエハ搬送装置およびウエハ搬送方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011151167A JP2011151167A (ja) | 2011-08-04 |
| JP2011151167A5 true JP2011151167A5 (https=) | 2013-03-07 |
| JP5502503B2 JP5502503B2 (ja) | 2014-05-28 |
Family
ID=44537897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010010665A Expired - Fee Related JP5502503B2 (ja) | 2010-01-21 | 2010-01-21 | ウエハ搬送装置およびウエハ搬送方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5502503B2 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014207250A (ja) * | 2011-08-12 | 2014-10-30 | 株式会社安永 | ウェハ分離装置及びこれを用いたウェハの製造方法 |
| CN102956530A (zh) * | 2011-08-31 | 2013-03-06 | 日本麦可罗尼克斯股份有限公司 | 晶片的分离方法及分离装置 |
| JP2013149706A (ja) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | ウエハ搬送装置およびウエハ搬送方法 |
| JP5600692B2 (ja) * | 2012-01-18 | 2014-10-01 | 日鉄住金ファインテック株式会社 | ウエハ搬送装置 |
| JP2013149703A (ja) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | ウエハ搬送装置 |
| JP2013149704A (ja) * | 2012-01-18 | 2013-08-01 | Nippon Steel & Sumikin Fine Technology Co Ltd | カセット保持機構およびウエハ格納ユニット |
| CN114750057B (zh) * | 2022-06-13 | 2022-09-02 | 富芯微电子有限公司 | 一种复合快恢复二极管生产用的背面减薄设备及工艺 |
| CN117038548B (zh) * | 2023-10-08 | 2024-02-13 | 内蒙古晶环电子材料有限公司 | 晶片分片装置及晶片检测方法 |
| CN118431128B (zh) * | 2024-04-22 | 2025-02-28 | 博纳半导体设备(浙江)有限公司 | 一种高洁净度半导体晶圆自动装载设备 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2580212B2 (ja) * | 1987-11-24 | 1997-02-12 | 住友シチックス株式会社 | ウエーハの枚葉化装置 |
| JP3668336B2 (ja) * | 1996-08-13 | 2005-07-06 | 三菱住友シリコン株式会社 | 半導体ウェーハの搬送装置 |
| JPH10114426A (ja) * | 1996-10-11 | 1998-05-06 | Tokyo Seimitsu Co Ltd | ウェーハ取出装置 |
| JP3449455B2 (ja) * | 1997-01-31 | 2003-09-22 | 株式会社日平トヤマ | ウエハの搬送装置 |
| JP2002254378A (ja) * | 2001-02-22 | 2002-09-10 | Hiroshi Akashi | 液中ワーク取り出し装置 |
| DE102007061410A1 (de) * | 2007-12-11 | 2009-06-18 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel |
-
2010
- 2010-01-21 JP JP2010010665A patent/JP5502503B2/ja not_active Expired - Fee Related
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