JP2011138845A - Wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board where a pair of belt-like wiring conductors can be shielded successfully from outside by forming through conductors for shielding at predetermined intervals along both sides of the pair of belt-like wiring conductors. <P>SOLUTION: This invention relates to the wiring board, wherein first to third grounding or power supply conductor layers 94, 95 and 96 have projection portions 94b, 95b and 96b protruding to inner sides of center portions in long-hole shapes of first to third opening portions 94a, 95b and 96a or an island portion 95c, and the through conductors 54c and 55c connecting the first to third grounding or power-supply conductor layers 94, 95 and 96 are connected to both sides of the pair 72 of belt-like wiring conductors at the protrusion portions 94b, 95b and 96b and/or island portion 95c. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a wiring board for mounting a semiconductor element such as a semiconductor integrated circuit element.

  A small-sized wiring board for mounting a semiconductor element has a plurality of conductor layers for wiring conductors disposed inside and on the surface of an insulating substrate formed by laminating a plurality of insulating layers, and a through conductor that penetrates the insulating layer Thus, a multilayer wiring structure in which the upper and lower wiring conductors are connected to each other is formed. A plurality of semiconductor element connection pads are formed in the central portion of the upper surface of the insulating substrate, to which the electrodes of the semiconductor element are electrically connected via solder bumps, etc. The wiring conductor of the external electric circuit substrate is formed on the lower surface of the insulating substrate. External connection pads are formed which are electrically connected to each other via solder balls or the like. These semiconductor element connection pads and external connection pads are electrically connected to each other by wiring conductors and through conductors disposed on the surface and inside of the insulating substrate.

  Recently, a wiring board for mounting a semiconductor element is required to have a form with less electrical loss in high-frequency transmission. Therefore, a wiring board having a pair transmission line that functions as a differential line is used as a transmission line for signals. The pair transmission line is provided with two strip-shaped wiring conductors extending in parallel with each other at a predetermined interval on the surface or inside of the insulating substrate as a pair, and for grounding or power supply above, below, left and right of the two strip-shaped wiring conductors forming the pair The conductors are formed by providing impedance matching at predetermined intervals. Further, the through conductors used for connecting the pair of strip-shaped wiring conductors and the upper and lower conductor layers are also provided so as to be adjacent to each other in pairs at a predetermined interval.

  FIG. 4 shows a conventional example of a wiring board having a pair transmission line as described above. As shown in FIG. 4, the conventional wiring board 200 includes build-up insulating layers 112 and 111 laminated on the upper surface of the core insulating layer 113 and build-up insulating layers 114 and 111 on the lower surface of the insulating layer 113. Conductive layers 121, 122, 123, 124, 125, 126 for wiring conductors are arranged between the upper and lower surfaces of the insulating substrate 110 formed by laminating 115 and the insulating layers 111, 112, 113, 114, 115. A semiconductor element connection pad 130 that is electrically connected to an electrode terminal of the semiconductor element S via a solder bump B1 is formed at the center of the upper surface of the insulating substrate 110. An external electric circuit board is formed on the lower surface of the insulating substrate 110. External connection pads 140 that are electrically connected to the wiring conductors via solder balls are formed. These semiconductor element connection pads 130 and external connection pads 140 are wiring conductors formed in the conductor layers 121 to 126 and through conductors 151, 152, 153 penetrating through the insulating layers 111, 112, 113, 114, 115, respectively. , 154, 155 are electrically connected to each other. Furthermore, a solder resist layer 161 having an opening exposing the central portion of the semiconductor element connection pad 130 is deposited on the surfaces of the uppermost insulating layer 111 and the conductor layer 121, and the lowermost insulating layer 115 and the conductor layer are exposed. A solder resist layer 162 having an opening exposing the central portion of the external connection pad 140 is deposited on the surface of the layer 126.

  FIG. 5 is a perspective view in which only a part of the conductor layers 121, 122, 123, 124, 125, 126 and a part of the through conductors 151, 152, 153, 154, 155 are extracted from the wiring board 200 described above. is there. Some of the semiconductor element connection pads 130 are adjacent to each other to form a pair 131 and 132. One pair of semiconductor element connection pads 131 is connected to a pair of strip-like wiring conductors 171 formed by the conductor layer 121. The strip-like wiring conductor pair 171 extends in parallel with each other at a predetermined interval except for its end portion, and the other end portion is a pair 141 of external connection pads via the through conductors 151a, 152a, 153a, 154a, 155a and the land. Is electrically connected. On the other hand, a pair of semiconductor element connection pads 132 is connected to a pair of strip-like wiring conductors 172 formed of a conductor layer 123 through through conductors 151b, 152b, 153b, 154b and lands. The pair of strip-shaped wiring conductors 172 extend in parallel with each other at a predetermined interval except for the ends thereof, like the pair of strip-shaped wiring conductors 171, and the other end is a pair of external connection pads via the through conductor 155 b and the land. 142 is electrically connected.

  Here, the semiconductor element connection pad pair 131, 132, the strip-like wiring conductor pair 171, 172, the external connection pad pair 141, 142, and a part of the land shown in FIG. FIG. 6A to FIG. 6F are shown in plan views for 124, 125, and 126, respectively. As shown in FIG. 6A, in the conductor layer 121, a pair of semiconductor element connection pads 131, 132, a pair of strip-like wiring conductors 171, a land 181a, and a ground or power source conductor layer 191 are formed. A predetermined distance is formed between the pair of semiconductor element connection pads 131 and 132, the pair of strip-like wiring conductors 171 and the land 181a and the ground or conductor layer 191.

  As shown in FIG. 6B, in the conductor layer 122, lands 182a and 182b and a ground or power source conductor layer 192 are formed. The land 182a is connected to the upper land 181a via a through conductor 151a (not shown). The land 182b is connected to a pair 132 of upper-layer semiconductor element connection pads via a through conductor 151b (not shown).

  As shown in FIG. 6C, in the conductor layer 123, lands 183a and 183b and a ground or power source conductor layer 193 are formed. The land 183a is connected to the upper land 182a through a through conductor 152a (not shown). The land 183b is connected to the upper land 182b via a through conductor 152b (not shown).

  As shown in FIG. 6D, in the conductor layer 124, lands 184a and 184b and a ground or power source conductor layer 194 are formed. The land 184a is connected to the upper land 183a via a through conductor 153a (not shown). The land 184b is connected to the upper land 183b via a through conductor 153b (not shown).

  As shown in FIG. 6E, in the conductor layer 125, a pair of strip-shaped wiring conductors 172, lands 185a, 185b, and 185c and a ground or power source conductor layer 195 are formed. The land 185a is connected to the upper land 184a via a through conductor 154a (not shown). The land 185b is connected to the upper land 184b through a through conductor 154b (not shown).

  As shown in FIG. 6 (f), in the conductor layer 126, a pair of external connection pads 141, 142, lands 186 a, 186 b, and a ground or power source conductor layer 196 are formed. The land 186a is connected to the upper land 185a via a through conductor 155a (not shown). The land 186b is connected to an upper land 185c through a through conductor 155b (not shown).

  By the way, in the wiring board 200 having a pair transmission path through which such a high-speed signal is transmitted, the positions facing the external connection pad pairs 141 and 142 connected to the strip-like wiring conductor pairs 171 and 172 of the pair transmission path. Are provided with oval openings 191 a, 192 a, 193 a, 194 a, 195 a, 196 a in the grounding or power conductor layers 191, 192, 193, 194, 195, 196. By providing such openings 191a, 192a, 193a, 194a, 195a, 196a, a pair 171, 172 of the ground or power conductor layers 191, 192, 193, 194, 195, 196 and the pair transmission line strip-shaped wiring conductors The capacitance between the external connection pad pair 141 and 142 connected to the external connection pad is reduced, thereby suppressing the reflection of the signal in the external connection pad pair 141 and 142 and efficiently transmitting a high-frequency signal to the outside. It becomes possible to do.

  However, in such a wiring board 200, as shown in FIG. 6 (e), a pair of strip-shaped wiring conductors 172 may extend so as to pass through between openings 195a provided adjacent to each other. is there. Thus, when the strip-shaped wiring conductor pair 172 extends so as to pass through the openings 195 a provided adjacent to each other, the gap between the openings 195 a and the strip-shaped wiring conductor pair 172 is sufficient. It is difficult to provide a ground or power source conductor layer 195 having a wide width, and in some cases, it becomes impossible to provide the ground or power source conductor layer 195 between the opening 195a and the strip-like wiring conductor pair 172. Therefore, when a plurality of through conductors 154c and 155c for grounding or power supply are arranged at predetermined intervals along both sides of the pair 172 of the strip-shaped wiring conductors, an attempt is made to shield the pair 172 of the strip-shaped wiring conductors from the outside. In the part passing through between the openings 195a, the grounding or power supply through conductors 154c and 155c cannot be provided on both sides of the pair of strip-like wiring conductors 172, and the shield through conductors 154c and 155c have a wide interval. As a result, it becomes difficult to shield the strip-shaped wiring conductor pair 172 well.

JP 2003-249760 A JP 2003-273525 A

  An object of the present invention is to correspond to two pairs of external connection pads arranged adjacent to each other so as to face each other, and has an elongated hole-shaped opening part surrounding each pair of external connection pads in a top view. In a wiring board having grounding or power supply conductor layers formed adjacent to each other, when the band-shaped wiring conductor pair extends between the adjacent openings, the pair of band-shaped wiring conductors is opened. Even in the portion that passes between the two portions, shield grounding or power supply penetrating conductors can be provided on both sides of the pair of strip wiring conductors, whereby the shield penetrating conductors are formed along both sides of the strip wiring conductor pairs. It is an object of the present invention to provide a wiring board capable of forming a pair of strip-shaped wiring conductors at a predetermined interval and satisfactorily shielding a pair of strip-shaped wiring conductors from outside.

  The wiring board of the present invention includes an insulating substrate formed by laminating a plurality of insulating layers including at least a first insulating layer and a second insulating layer stacked on the first insulating layer, A plurality of external connection pads arranged in pairs so as to be adjacent to each other and in pairs are attached to the lower surface and the lower surface of the first insulating layer. A first grounding or power supply conductor layer formed with a first opening having a long hole shape surrounding each pair of the external connection pads in a top view at a position corresponding to the pair of external connection pads; A long hole that is deposited between the first insulating layer and the second insulating layer and surrounds the pair of external connection pads in a top view at a position corresponding to the pair of external connection pads. A second ground or electricity formed with a shaped second opening. A third conductor having a long hole shape that is attached to the upper surface of the conductive layer and the second insulating layer and surrounds the pair of external connection pads in a top view at a position corresponding to the pair of external connection pads. A third ground or power supply conductor layer having an opening formed between the first insulating layer and the second insulating layer, and a gap between the second openings. A wiring board comprising a pair of strip-like wiring conductors extending in parallel with each other at a predetermined interval so as to come out, wherein the first to third ground or power supply conductor layers are the first to third layers. The third opening has a projecting portion or an island portion projecting inside a long hole-shaped central portion, and the first to third sides on both sides of the pair of strip-shaped wiring conductors in the projecting portion and / or the island portion. Make sure that the through conductor that connects the grounding or power supply conductor layer is connected. It is an butterfly.

  According to the wiring board of the present invention, the first to third grounding or power supply conductor layers have protrusions or islands projecting inside the central portion of the long hole shape in the first to third openings. In addition, since the through conductors connecting the first to third grounding or power supply conductor layers are connected to both sides of the pair of strip-like wiring conductors in these protrusions or islands, the pair of strip-like wiring conductors is the first. Even in the portion that passes between the two openings, shield grounding or power supply through conductors can be provided on both sides of the pair of strip-shaped wiring conductors, thereby shielding along the both sides of the pair of strip-shaped wiring conductors. Thus, it becomes possible to shield the pair of strip-shaped wiring conductors from the outside satisfactorily.

FIG. 1 is a schematic cross-sectional view showing an example of an embodiment of a wiring board according to the present invention. FIG. 2 is a perspective view showing only a part of the conductor layer and part of the through conductor of the wiring board shown in FIG. FIG. 3 is a plan view showing a part of each conductor layer of the wiring board shown in FIGS. 1 and 2 for each conductor layer. FIG. 4 is a schematic cross-sectional view showing a conventional wiring board. FIG. 5 is a perspective view showing only a part of the conductor layer and a part of the through conductor of the wiring board shown in FIG. FIG. 6 is a plan view showing a part of each conductor layer of the wiring board shown in FIGS. 4 and 5 for each conductor layer.

  Next, an example of an embodiment of the wiring board of the present invention will be described. FIG. 1 is a schematic sectional view showing a wiring board 100 of this example, in which 10 is an insulating board in which insulating layers 11, 12, 13, 14, and 15 are laminated, 21, 22, 23, 24, 25 and 26 are conductor layers, 30 is a semiconductor element connection pad, 40 is an external connection pad, 51, 52, 53, 54 and 55 are through conductors, and 61 and 62 are solder resist layers. The wiring board 100 of this example is formed by laminating build-up insulating layers 12 and 11 on the upper surface of a core insulating layer 13 and laminating build-up insulating layers 14 and 15 on the lower surface of the insulating layer 13. Conductor layers 21, 22, 23, 24, 25, 26 for wiring conductors are arranged between the upper and lower surfaces of the insulating substrate 10 and the insulating layers 11, 12, 13, 14, 15. A semiconductor element connection pad 30 that is electrically connected to the electrode terminal of the semiconductor element S via the solder bump B1 is formed at the center of the upper surface of the insulating substrate 10, and an external electric circuit board is formed on the lower surface of the insulating substrate 10. External connection pads 40 that are electrically connected to the wiring conductors via solder balls are formed. The semiconductor element connection pad 30 and the external connection pad 40 penetrate through the wiring conductors formed in the conductor layers 21, 22, 23, 24, 25, and 26 and the insulating layers 11, 12, 13, 14, and 15, respectively. The through conductors 51, 52, 53, 54 and 55 are electrically connected to each other. Furthermore, a solder resist layer 61 having an opening exposing the central portion of the semiconductor element connection pad 30 is deposited on the surfaces of the uppermost insulating layer 11 and the conductor layer 21, and the lowermost insulating layer 15 and the conductor are exposed. A solder resist layer 62 having an opening that exposes the central portion of the external connection pad 40 is deposited on the surface of the layer 26.

  The insulating layer 13 is a member that becomes a core substrate of the wiring substrate 100, and is formed by impregnating a glass fabric in which glass fiber bundles are woven vertically and horizontally with a thermosetting resin such as epoxy resin or bismaleimide triazine resin. It has a plurality of through holes 13a having a diameter of about 0.1 to 0.3 mm from the upper surface to the lower surface. The conductor layers 23 and 24 are attached to the upper and lower surfaces, and the through conductor 53 is attached to the inner surface of the through hole 13a. In addition, the inside of the through hole 13a to which the through conductor 53 is attached is filled with resin.

  Such an insulating layer 13 is manufactured by thermally curing an insulating sheet in which a glass fabric is impregnated with an uncured thermosetting resin, and then drilling through holes 13a from the upper surface to the lower surface. The conductor layers 23 and 24 on the upper and lower surfaces of the insulating layer 13 have a copper foil having a thickness of about 3 to 50 μm adhered to the entire upper and lower surfaces of the insulating sheet for the insulating layer 13, and the copper foil is cured on the sheet. A predetermined pattern is formed by etching later. The through conductor 53 on the inner surface of the through hole 13a is formed by depositing a copper plating film having a thickness of about 3 to 50 μm on the inner surface of the through hole 13a by an electroless plating method and an electrolytic plating method. In order to fill the through hole 13a with a resin, an uncured paste-like thermosetting resin is filled into the through hole 13a in which the through conductors 53 are formed by a screen printing method, and then the filled resin is filled. A method of thermally curing is adopted.

  Each of the insulating layers 11, 12, 14, and 15 laminated on the upper and lower surfaces of the insulating layer 13 is a build-up insulating layer, and an inorganic insulating filler such as silicon oxide powder is added to a thermosetting resin such as an epoxy resin 30 to 30. It is made of an insulating material dispersed by about 70% by mass. The insulating layers 11, 12, 14, and 15 each have a thickness of about 20 to 60 μm, and have a plurality of via holes 11a, 12a, 14a, and 15a having a diameter of about 30 to 100 μm from the upper surface to the lower surface of each layer. . The via holes 11a, 12a, 14a, and 15a are filled with penetrating conductors 51, 52, 54, and 55, respectively, and the conductor layers 21, 22, 23, and 23 are inserted through the penetrating conductors 51, 52, 54, and 55, respectively. By electrically connecting predetermined wiring patterns 24, 25, and 26, high-density wiring can be formed in three dimensions. Each of the insulating layers 11, 12, 14, and 15 has an insulating film made of an uncured thermosetting resin having a thickness of about 20 to 60 μm attached to the upper and lower surfaces of the insulating layer 13 and thermally cured. At the same time, the via holes 12a and 14a are formed by laser processing, and the next insulating layers 11 and 15 are sequentially stacked thereon in the same manner. The conductor layers 21, 22, 25, 26 deposited on the surfaces of the insulating layers 11, 12, 14, 15 and the through conductors 51, 52, 54, filled in the via holes 11a, 12a, 14a, 15a, 55 is a copper plating having a thickness of about 5 to 50 μm in the surface of each insulating layer 11, 12, 14, 15 and in the via holes 11 a, 12 a, 14 a, 15 a every time each insulating layer 11, 12, 14, 15 is formed. The film is formed by depositing a film in a predetermined pattern by a pattern forming method such as a known semi-additive method.

    In addition, the solder resist layers 61 and 62 are formed by adding a filler such as silica or talc to a thermosetting resin such as an acrylic-modified epoxy resin. If the solder resist layer 61 is on the upper surface side, the semiconductor element connection pad 30 is used. In addition, the solder resist layer 62 on the lower surface side has an opening for exposing the central portion of the external connection pad 40. The solder resist layers 61 and 62 have a thickness of about 10 to 50 μm, and the uncured resin paste for the solder resist layers 61 and 62 having photosensitivity is insulated by adopting a roll coater method or a screen printing method. After coating on the layers 11 and 15 and drying them, exposure and development are performed to form openings that expose the central portions of the semiconductor element connection pads 30 and the external connection pads 40, and then this is heated. It is formed by curing.

  FIG. 2 is a perspective view in which only a part of the conductor layers 21, 22, 23, 24, 25, and 26 and a part of the through conductors 51, 52, 53, 54, and 55 are extracted from the wiring board 100 described above. Some of the semiconductor element connection pads 30 are adjacent to each other to form pairs 31 and 32. One pair of semiconductor element connection pads 31 is connected to a pair 71 of band-shaped wiring conductors of a pair transmission path formed by the conductor layer 21. The strip-like wiring conductor pair 71 extends in parallel with each other at a predetermined interval except for its end portion, and the other end portion is connected to the pair 41 of external connection pads via the through conductors 51a, 52a, 53a, 54a, 55a and lands. Is electrically connected. On the other hand, the pair of semiconductor element connection pads 32 is connected to a pair 72 of band-shaped wiring conductors that form a band-shaped wiring conductor of a pair transmission path formed by the conductor layer 25 through through conductors 51b, 52b, 53b, 54b and lands. Has been. The pair of strip-shaped wiring conductors 72 extend in parallel with each other at a predetermined interval except for the end portions thereof, like the pair of strip-shaped wiring conductors 71, and the other end portion is a pair of external connection pads via the through conductor 55b and the land. 42 is electrically connected.

  Here, the semiconductor element connection pad pair 31, 32, the strip-like wiring conductor pair 71, 72, the external connection pad pair 41, 42 and a part of the land shown in FIG. 24, 25, and 26 are shown in plan views in FIGS. As shown in FIG. 3A, in the conductor layer 21, a pair 31 and 32 of semiconductor element connection pads, a pair 71 of strip-like wiring conductors, a land 81a, and a ground or power source conductor layer 91 are formed. A predetermined gap is formed between the pair 31 and 32 of semiconductor element connection pads, the pair 71 of strip-like wiring conductors, and the land 81 a and the ground or conductor layer 91.

  As shown in FIG. 3B, in the conductor layer 22, lands 82a and 82b and a ground or power source conductor layer 92 are formed. The land 82a is connected to the upper land 81a via a through conductor 51a (not shown). The land 82b is connected to the pair 32 of upper-layer semiconductor element connection pads via a through conductor 51b (not shown).

  As shown in FIG. 3C, in the conductor layer 23, lands 83a and lands 83b and a ground or power source conductor layer 93 are formed. The land 83a is connected to the upper land 82a through a through conductor 52a (not shown). The land 83b is connected to the upper land 82b via a through conductor 52b (not shown).

  As shown in FIG. 3D, in the conductor layer 24, lands 84a and lands 84b and a ground or power source conductor layer 94 are formed. The land 84a is connected to an upper land 83a via a through conductor 53a (not shown). The land 84b is connected to the upper land 83b via a through conductor 53b (not shown).

  As shown in FIG. 3 (e), in the conductor layer 25, a strip-like wiring conductor pair 72, lands 85a, 85b, 85c, and a ground or power source conductor layer 95 are formed. The land 85a is connected to the upper land 84a through a through conductor 54a (not shown). The land 85b is connected to the upper land 84b through a through conductor 54b (not shown).

  As shown in FIG. 3F, in the conductor layer 26, external connection pad pairs 41, 42, lands 86a, 86b, and a ground or power source conductor layer 96 are formed. The land 86a is connected to an upper land 85a through a through conductor 55a (not shown). The land 86b is connected to an upper land 85c through a through conductor 55b (not shown).

  In this wiring board 100, grounding or power supply conductor layers 91, 92, 93, which are opposed to the external connection pad pairs 41, 42 connected to the strip wiring conductor pairs 71, 72 of the pair transmission line, 94, 95, 96 are provided with elongated hole-shaped openings 91a, 92a, 93a, 94a, 95a, 96a. By providing such openings 91 a, 92 a, 93 a, 94 a, 95 a, 96 a, grounding or power supply conductor layers 91, 92, 93, 94, 95, 96 and a pair 71 of band-shaped wiring conductors in a pair transmission path are provided. , 72 is reduced in electrostatic capacitance between the pair of external connection pads 41 and 42, thereby suppressing the reflection of signals in the pair 41 and 42 of external connection pads, thereby efficiently externalizing high frequency signals. Can be transmitted.

  The openings 91a, 92a, and 93a have a generally elliptical long hole shape, and are large enough to surround the external connection pad pairs 41 and 42, respectively, when viewed from above. The openings 94a, 95a, and 96a have a generally iron array long hole shape, and are sized to surround the external connection pad pairs 41 and 42 in a top view. The ground or power conductor layer 94 has protrusions 94b projecting inside the center of the opening 94a on both sides of each opening 94a, and the ground or power conductor layer 95 is located at the center of the opening 95a. Each of the openings 95a has protrusions 95b or islands 95c projecting on the inner side of the opening, and the ground or power conductor layer 96 has the protrusions 96b projecting on the inner side of the central part of the opening 96a. It has on both sides of the part 96a.

  Further, shield insulating through conductors 54c and 55c connecting the upper and lower grounding or power supply conductor layers 94, 95 and 96 along the both sides of the strip-like wiring conductor pair 72 are formed on the insulating layers 14 and 15 at a predetermined interval. Are arranged side by side. By providing such shielding through conductors 54c and 55c, it is possible to prevent noise from entering the signal transmitted through the strip-shaped wiring conductor pair 72 or from leaking from the strip-shaped wiring conductor pair 72 to the outside. Effectively preventing. In the wiring substrate 100 of this example, shield through conductors 54c and 55c are provided on both sides of the pair of strip-like wiring conductors 72 in the protrusions 94b, 95b, and 96b and the island portion 95c. Therefore, even in a portion where the pair of strip-shaped wiring conductors 72 passes between the openings 95a, the shielding through conductors 54c and 55c can be provided on both sides of the pair of strip-shaped wiring conductors 72, thereby forming the pair of strip-shaped wiring conductors. The shield through conductors 54c and 55c are formed at predetermined intervals along both sides of the 72, so that the pair 72 of the strip-shaped wiring conductors can be well shielded from the outside. Note that the length and width of the protrusions 94b, 95b, 96b and the island part 95c projecting inside the central part of the openings 94a, 95a, 96a are shielded by the protrusions 94b, 95b, 96b and the island part 95c. As long as the through conductors 54c and 55c can be connected at a predetermined interval.

DESCRIPTION OF SYMBOLS 10 ... Insulating substrate 11, 12, 13, 14, 15 ... Insulating layer 41, 42 ... Pair of external connection pads 71, 72 ... Pair of strip-shaped wiring conductors 91, 92, 93, 94, 95: Conductive layer for grounding or power supply 91a, 92a, 93a, 94a, 95a, 96a ... Opening 94b, 95b, 96b ... Projection 95c ... Island 54c, 55c ... For shielding Through conductor 100 ... wiring board

Claims (1)

  An insulating substrate formed by laminating a plurality of insulating layers including at least a first insulating layer and a second insulating layer stacked on the first insulating layer; and is attached to a lower surface of the insulating substrate. A plurality of external connection pads arranged adjacent to each other so as to form a pair, and attached to the lower surface of the first insulating layer, and the external connection pads A first grounding or power supply conductor layer in which a first opening having a long hole shape surrounding each pair of the external connection pads in a top view is formed at a position corresponding to the pair of the first and second insulating layers; A second opening having a long hole shape that is attached between the first and second insulating layers and surrounds the pair of external connection pads in a top view at a position corresponding to the pair of external connection pads. A second ground or power source conductor layer formed with A third opening having a long hole shape is formed at a position corresponding to the pair of external connection pads, and surrounds the pair of external connection pads in a top view, at a position corresponding to the pair of external connection pads. 3 and a conductor layer for grounding or power, and the first insulating layer and the second insulating layer, and are spaced from each other at predetermined intervals so as to pass through the second openings. A pair of strip-shaped wiring conductors extending in parallel, wherein the first to third grounding or power supply conductor layers are elongated holes in the first to third openings. A projecting portion or an island portion projecting inside the central portion of the shape, and the first to third grounding or power supply conductor layers are provided on both sides of the strip-like wiring conductor pair in the projecting portion and / or the island portion. A wiring board characterized in that a connecting through conductor is connected.

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