|
CH427118A
(de)
|
1963-11-28 |
1966-12-31 |
Bbc Brown Boveri & Cie |
Verfahren zum Schützen von durch heisse Medien überstrichenen Oberflächenteilen eines hitzebeständigen Körpers
|
|
US3452553A
(en)
|
1967-03-17 |
1969-07-01 |
Gen Dynamics Corp |
Transpiration cooled window
|
|
US3880969A
(en)
|
1973-11-05 |
1975-04-29 |
Universal Oil Prod Co |
Method of preparing an open-celled aromic foam
|
|
US4222434A
(en)
*
|
1978-04-27 |
1980-09-16 |
Clyde Robert A |
Ceramic sponge heat-exchanger member
|
|
US4420462A
(en)
|
1982-03-22 |
1983-12-13 |
Clyde Robert A |
Catalytic heat exchanger
|
|
JPS6078143U
(ja)
*
|
1983-10-31 |
1985-05-31 |
三菱電機株式会社 |
液冷装置
|
|
US4884168A
(en)
|
1988-12-14 |
1989-11-28 |
Cray Research, Inc. |
Cooling plate with interboard connector apertures for circuit board assemblies
|
|
US4884169A
(en)
|
1989-01-23 |
1989-11-28 |
Technology Enterprises Company |
Bubble generation in condensation wells for cooling high density integrated circuit chips
|
|
US5744252A
(en)
|
1989-09-21 |
1998-04-28 |
The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration |
Flexible ceramic-metal insulation composite and method of making
|
|
JPH07114250B2
(ja)
|
1990-04-27 |
1995-12-06 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
熱伝達システム
|
|
ATE163474T1
(de)
*
|
1991-04-15 |
1998-03-15 |
Scient Ecology Group Inc |
Wärmetauscher für sehr hohe temperatur
|
|
JPH0731028B2
(ja)
*
|
1991-05-24 |
1995-04-10 |
株式会社ヒラノテクシード |
熱風供給方法、及び放熱装置
|
|
JP2995590B2
(ja)
|
1991-06-26 |
1999-12-27 |
株式会社日立製作所 |
半導体冷却装置
|
|
JPH05136305A
(ja)
|
1991-11-08 |
1993-06-01 |
Hitachi Ltd |
発熱体の冷却装置
|
|
US6006824A
(en)
*
|
1994-03-28 |
1999-12-28 |
Ngk Insulators, Ltd. |
Ceramic shell-and-tube type heat exchanger, and method for manufacturing it
|
|
JPH09253945A
(ja)
*
|
1996-03-25 |
1997-09-30 |
Ngk Insulators Ltd |
フィン付きセラミック製シェルアンドチューブ型熱交換器及びその製造方法
|
|
DE19643717A1
(de)
|
1996-10-23 |
1998-04-30 |
Asea Brown Boveri |
Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul
|
|
JPH10148120A
(ja)
|
1996-11-18 |
1998-06-02 |
Isuzu Ceramics Kenkyusho:Kk |
給電用エンジンの熱回収装置
|
|
US6089505A
(en)
|
1997-07-22 |
2000-07-18 |
Mcdonnell Douglas Corporation |
Mission adaptive inlet
|
|
JPH11254047A
(ja)
*
|
1998-03-12 |
1999-09-21 |
Konica Corp |
熱交換器に使用する薄板の曲げ方法及び熱交換器
|
|
JP4067165B2
(ja)
*
|
1998-03-23 |
2008-03-26 |
電気化学工業株式会社 |
複合体とそれを用いたヒートシンク
|
|
WO1999052838A1
(en)
|
1998-04-13 |
1999-10-21 |
Minnesota Mining And Manufacturing Company |
Tough, low permeable ceramic composite material
|
|
US6196307B1
(en)
|
1998-06-17 |
2001-03-06 |
Intersil Americas Inc. |
High performance heat exchanger and method
|
|
AU4687799A
(en)
|
1998-06-19 |
2000-01-05 |
Zess Technologies, Inc. |
Micro-channel heat exchanger
|
|
KR20010076991A
(ko)
|
2000-01-29 |
2001-08-17 |
박호군 |
발포금속 방열기
|
|
US6761211B2
(en)
|
2000-03-14 |
2004-07-13 |
Delphi Technologies, Inc. |
High-performance heat sink for electronics cooling
|
|
US6840307B2
(en)
|
2000-03-14 |
2005-01-11 |
Delphi Technologies, Inc. |
High performance heat exchange assembly
|
|
US6478082B1
(en)
|
2000-05-22 |
2002-11-12 |
Jia Hao Li |
Heat dissipating apparatus with nest wind duct
|
|
KR100468217B1
(ko)
*
|
2001-12-31 |
2005-01-26 |
한국과학기술연구원 |
다공성 금속물질을 이용한 축방열 시스템
|
|
JP2005516425A
(ja)
*
|
2002-01-30 |
2005-06-02 |
エレル,デイビット |
フィン対空気の接触面積が大きいヒートシンク
|
|
US6888720B2
(en)
|
2002-06-18 |
2005-05-03 |
Sun Microsystems, Inc. |
Distributed graphitic foam heat exchanger system
|
|
US6988534B2
(en)
|
2002-11-01 |
2006-01-24 |
Cooligy, Inc. |
Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
|
|
US6757170B2
(en)
|
2002-07-26 |
2004-06-29 |
Intel Corporation |
Heat sink and package surface design
|
|
US6735083B2
(en)
|
2002-08-07 |
2004-05-11 |
Inventec Corporation |
Porous CPU cooler
|
|
KR100917042B1
(ko)
*
|
2002-08-14 |
2009-09-10 |
엘지전자 주식회사 |
무선 이동통신 시스템의 방송 및 멀티캐스트 데이터의전송 방법
|
|
GB0220652D0
(en)
*
|
2002-09-05 |
2002-10-16 |
Chart Heat Exchangers Ltd |
Heat exchanger
|
|
US7156159B2
(en)
|
2003-03-17 |
2007-01-02 |
Cooligy, Inc. |
Multi-level microchannel heat exchangers
|
|
EP1581463B1
(en)
|
2003-01-08 |
2007-07-11 |
3M Innovative Properties Company |
Ceramic fiber composite and method for making the same
|
|
US7055781B2
(en)
|
2003-06-05 |
2006-06-06 |
The Boeing Company |
Cooled insulation surface temperature control system
|
|
US7275720B2
(en)
|
2003-06-09 |
2007-10-02 |
The Boeing Company |
Actively cooled ceramic thermal protection system
|
|
JP4239077B2
(ja)
*
|
2003-08-20 |
2009-03-18 |
独立行政法人 日本原子力研究開発機構 |
高温耐食性セラミックス製コンパクト熱交換器
|
|
US7044199B2
(en)
|
2003-10-20 |
2006-05-16 |
Thermal Corp. |
Porous media cold plate
|
|
US6969546B2
(en)
|
2003-10-20 |
2005-11-29 |
The Boeing Company |
Thermal insulation system employing oxide ceramic matrix composites
|
|
US6958912B2
(en)
|
2003-11-18 |
2005-10-25 |
Intel Corporation |
Enhanced heat exchanger
|
|
US20050111188A1
(en)
|
2003-11-26 |
2005-05-26 |
Anandaroop Bhattacharya |
Thermal management device for an integrated circuit
|
|
US20050111966A1
(en)
|
2003-11-26 |
2005-05-26 |
Metheny Alfred P. |
Construction of static structures for gas turbine engines
|
|
WO2005117917A2
(en)
|
2004-04-07 |
2005-12-15 |
Thermonix Llc |
Thermal management system and computer arrangement
|
|
US7188662B2
(en)
|
2004-06-04 |
2007-03-13 |
Cooligy, Inc. |
Apparatus and method of efficient fluid delivery for cooling a heat producing device
|
|
US20060068205A1
(en)
|
2004-09-24 |
2006-03-30 |
Carbone Lorraine Composants |
Composite material used for manufacturing heat exchanger fins with high thermal conductivity
|
|
US20060141413A1
(en)
|
2004-12-27 |
2006-06-29 |
Masten James H |
Burner plate and burner assembly
|
|
CN2768388Y
(zh)
*
|
2004-12-29 |
2006-03-29 |
中兴通讯股份有限公司 |
一种具有热交换装置的印制板
|
|
US20060157225A1
(en)
|
2005-01-18 |
2006-07-20 |
Yves Martin |
High turbulence heat exchanger
|
|
US7705342B2
(en)
|
2005-09-16 |
2010-04-27 |
University Of Cincinnati |
Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes
|
|
US8505616B2
(en)
|
2006-04-20 |
2013-08-13 |
The Boeing Company |
Hybrid ceramic core cold plate
|
|
US7905275B2
(en)
*
|
2006-04-20 |
2011-03-15 |
The Boeing Company |
Ceramic foam cold plate
|
|
US7742297B2
(en)
|
2006-04-20 |
2010-06-22 |
The Boeing Company |
Ceramic foam electronic component cooling
|
|
US8162035B2
(en)
|
2006-04-20 |
2012-04-24 |
The Boeing Company |
High conductivity ceramic foam cold plate
|
|
US7485354B2
(en)
|
2006-06-20 |
2009-02-03 |
Northrop Grumman Corporation |
Thermal protection system for a vehicle
|
|
JP5148079B2
(ja)
|
2006-07-25 |
2013-02-20 |
富士通株式会社 |
液冷ユニット用熱交換器および液冷ユニット並びに電子機器
|
|
US7501111B2
(en)
|
2006-08-25 |
2009-03-10 |
Conoco Phillips Company |
Increased capacity sulfur recovery plant and process for recovering elemental sulfur
|
|
US8240361B2
(en)
|
2006-11-02 |
2012-08-14 |
The Boeing Company |
Combined thermal protection and surface temperature control system
|
|
US8191616B2
(en)
|
2006-11-02 |
2012-06-05 |
The Boeing Company |
Combined thermal protection and surface temperature control system
|
|
US8047235B2
(en)
|
2006-11-30 |
2011-11-01 |
Alcatel Lucent |
Fluid-permeable body having a superhydrophobic surface
|
|
US20090288814A1
(en)
|
2008-05-20 |
2009-11-26 |
The Boeing Company. |
Mixed Carbon Foam/Metallic Heat Exchanger
|