JP2010531425A5 - - Google Patents

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Publication number
JP2010531425A5
JP2010531425A5 JP2010512235A JP2010512235A JP2010531425A5 JP 2010531425 A5 JP2010531425 A5 JP 2010531425A5 JP 2010512235 A JP2010512235 A JP 2010512235A JP 2010512235 A JP2010512235 A JP 2010512235A JP 2010531425 A5 JP2010531425 A5 JP 2010531425A5
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JP
Japan
Prior art keywords
porous
microgrooves
walls
heat source
sets
Prior art date
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Application number
JP2010512235A
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English (en)
Japanese (ja)
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JP2010531425A (ja
JP5681487B2 (ja
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Publication date
Priority claimed from US11/762,422 external-priority patent/US8356410B2/en
Application filed filed Critical
Publication of JP2010531425A publication Critical patent/JP2010531425A/ja
Publication of JP2010531425A5 publication Critical patent/JP2010531425A5/ja
Application granted granted Critical
Publication of JP5681487B2 publication Critical patent/JP5681487B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010512235A 2007-06-13 2008-05-16 ヒートパイプの放散システムと方法 Active JP5681487B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/762,422 2007-06-13
US11/762,422 US8356410B2 (en) 2007-06-13 2007-06-13 Heat pipe dissipating system and method
PCT/US2008/063942 WO2008156940A1 (en) 2007-06-13 2008-05-16 Heat pipe dissipating system and method

Publications (3)

Publication Number Publication Date
JP2010531425A JP2010531425A (ja) 2010-09-24
JP2010531425A5 true JP2010531425A5 (enExample) 2011-06-30
JP5681487B2 JP5681487B2 (ja) 2015-03-11

Family

ID=39708804

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010512235A Active JP5681487B2 (ja) 2007-06-13 2008-05-16 ヒートパイプの放散システムと方法

Country Status (4)

Country Link
US (2) US8356410B2 (enExample)
EP (1) EP2174087A1 (enExample)
JP (1) JP5681487B2 (enExample)
WO (1) WO2008156940A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865718B1 (ko) * 2007-03-27 2008-10-28 김훈철 장거리 열량수송용 히트파이프
US20100071880A1 (en) * 2008-09-22 2010-03-25 Chul-Ju Kim Evaporator for looped heat pipe system
CN101754653A (zh) * 2008-12-08 2010-06-23 富准精密工业(深圳)有限公司 散热器
US20120148967A1 (en) * 2010-12-13 2012-06-14 Thomas Thomas J Candle wick including slotted wick members
US9382013B2 (en) 2011-11-04 2016-07-05 The Boeing Company Variably extending heat transfer devices
TWI572842B (zh) * 2012-03-16 2017-03-01 鴻準精密工業股份有限公司 熱管製造方法及熱管
CN103317137B (zh) * 2012-03-19 2016-10-19 富瑞精密组件（昆山）有限公司 热管制造方法及热管
US20160305715A1 (en) * 2015-04-14 2016-10-20 Celsia Technologies Taiwan, Inc. Phase-changing heat dissipater and manufacturing method thereof
EP3115728B1 (en) * 2015-07-09 2019-05-01 ABB Schweiz AG Cooling apparatus and method
JP6805438B2 (ja) * 2016-10-19 2020-12-23 国立大学法人東海国立大学機構 熱交換器、蒸発体、および装置
US10451356B2 (en) * 2016-12-08 2019-10-22 Microsoft Technology Licensing, Llc Lost wax cast vapor chamber device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3613778A (en) 1969-03-03 1971-10-19 Northrop Corp Flat plate heat pipe with structural wicks
US3598180A (en) 1970-07-06 1971-08-10 Robert David Moore Jr Heat transfer surface structure
JPS5043553A (enExample) * 1973-08-22 1975-04-19
JPH0613955B2 (ja) * 1984-10-11 1994-02-23 三菱重工業株式会社 交差エレメントの製造方法
US4929414A (en) * 1988-10-24 1990-05-29 The United States Of America As Represented By The Secretary Of The Air Force Method of manufacturing heat pipe wicks and arteries
US5598632A (en) * 1994-10-06 1997-02-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method for producing micro heat panels
JPH0987707A (ja) * 1995-09-27 1997-03-31 Mitsubishi Materials Corp 多孔質焼結金属接合体の製造方法
US5642776A (en) 1996-02-27 1997-07-01 Thermacore, Inc. Electrically insulated envelope heat pipe
US6167948B1 (en) 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US6242075B1 (en) * 1998-11-20 2001-06-05 Hewlett-Packard Company Planar multilayer ceramic structures with near surface channels
US6639799B2 (en) 2000-12-22 2003-10-28 Intel Corporation Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US20020139516A1 (en) * 2001-03-27 2002-10-03 Jon Zuo Heat pipe with a secondary wick for supplying subcooled liquid to high heat flux areas
US7556086B2 (en) 2001-04-06 2009-07-07 University Of Maryland, College Park Orientation-independent thermosyphon heat spreader
JP2003193114A (ja) * 2001-08-28 2003-07-09 Advanced Materials Technologies Pte Ltd ヒートパイプ及びその製造方法
US6679318B2 (en) * 2002-01-19 2004-01-20 Allan P Bakke Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability
US6760222B1 (en) 2002-05-21 2004-07-06 Ncr Corporation Dissipating heat using a heat conduit
US6880626B2 (en) 2002-08-28 2005-04-19 Thermal Corp. Vapor chamber with sintered grooved wick
JP2004225954A (ja) * 2003-01-21 2004-08-12 Mitsubishi Materials Corp 乾燥装置
US6945317B2 (en) 2003-04-24 2005-09-20 Thermal Corp. Sintered grooved wick with particle web
TWI260387B (en) * 2005-04-01 2006-08-21 Foxconn Tech Co Ltd Sintered heat pipe and manufacturing method thereof
CN100413064C (zh) 2005-07-22 2008-08-20 富准精密工业(深圳)有限公司 气密性腔体散热结构及其制造方法
TWI285251B (en) * 2005-09-15 2007-08-11 Univ Tsinghua Flat-plate heat pipe containing channels
JP2007078325A (ja) * 2005-09-16 2007-03-29 Hitachi Densen Mekutekku Kk 熱交換用多穴管及びその製造方法

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