CN102095314B - 延伸塞冷却板 - Google Patents
延伸塞冷却板 Download PDFInfo
- Publication number
- CN102095314B CN102095314B CN201010578282.5A CN201010578282A CN102095314B CN 102095314 B CN102095314 B CN 102095314B CN 201010578282 A CN201010578282 A CN 201010578282A CN 102095314 B CN102095314 B CN 102095314B
- Authority
- CN
- China
- Prior art keywords
- heat
- foamed ceramics
- exchange apparatus
- shell
- ceramics parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 161
- 238000000034 method Methods 0.000 claims abstract description 39
- 239000002826 coolant Substances 0.000 claims description 156
- 239000000463 material Substances 0.000 claims description 47
- 229910017083 AlN Inorganic materials 0.000 claims description 17
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
- 239000007767 bonding agent Substances 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 230000001788 irregular Effects 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000004458 analytical method Methods 0.000 claims description 2
- 239000006260 foam Substances 0.000 abstract description 12
- 239000011148 porous material Substances 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 58
- 238000012546 transfer Methods 0.000 description 12
- 230000004907 flux Effects 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- HHUIAYDQMNHELC-UHFFFAOYSA-N [O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O HHUIAYDQMNHELC-UHFFFAOYSA-N 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- YAIQCYZCSGLAAN-UHFFFAOYSA-N [Si+4].[O-2].[Al+3] Chemical compound [Si+4].[O-2].[Al+3] YAIQCYZCSGLAAN-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 239000004078 cryogenic material Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002990 reinforced plastic Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002937 thermal insulation foam Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D13/00—Arrangements or adaptations of air-treatment apparatus for aircraft crew or passengers, or freight space
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0021—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for aircrafts or cosmonautics
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/630,699 | 2009-12-03 | ||
| US12/630,699 US8720828B2 (en) | 2009-12-03 | 2009-12-03 | Extended plug cold plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102095314A CN102095314A (zh) | 2011-06-15 |
| CN102095314B true CN102095314B (zh) | 2014-07-16 |
Family
ID=43587122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010578282.5A Expired - Fee Related CN102095314B (zh) | 2009-12-03 | 2010-12-03 | 延伸塞冷却板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8720828B2 (enExample) |
| EP (1) | EP2333475B1 (enExample) |
| JP (1) | JP5730552B2 (enExample) |
| CN (1) | CN102095314B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2481255C2 (ru) * | 2011-08-05 | 2013-05-10 | Открытое акционерное общество "Информационные спутниковые системы" имени академика М.Ф. Решетнева" | Способ изготовления системы терморегулирования космического аппарата |
| JP5953206B2 (ja) * | 2011-11-11 | 2016-07-20 | 昭和電工株式会社 | 液冷式冷却装置およびその製造方法 |
| US9182175B2 (en) | 2011-12-01 | 2015-11-10 | The Boeing Company | Anti-icing heat exchanger |
| US9074829B2 (en) | 2011-12-01 | 2015-07-07 | The Boeing Company | Lightweight high temperature heat exchanger |
| US9403600B2 (en) | 2012-05-01 | 2016-08-02 | Lockheed Martin Corporation | Integrated thermal protection and leakage reduction in a supersonic air intake system |
| JP6447630B2 (ja) | 2014-08-13 | 2019-01-09 | 株式会社Ihi | 航空機の電子機器を冷却する冷却装置 |
| CN106570252B (zh) * | 2016-10-26 | 2019-05-24 | 中国运载火箭技术研究院 | 一种基于概率技术的热防护系统设计方法 |
| US12319117B2 (en) | 2023-04-27 | 2025-06-03 | Pratt & Whitney Canada Corp. | Heat exchanger and method of operation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4222434A (en) * | 1978-04-27 | 1980-09-16 | Clyde Robert A | Ceramic sponge heat-exchanger member |
| CN2768388Y (zh) * | 2004-12-29 | 2006-03-29 | 中兴通讯股份有限公司 | 一种具有热交换装置的印制板 |
| CN101060768A (zh) * | 2006-04-20 | 2007-10-24 | 波音公司 | 混合陶瓷芯的冷却板 |
Family Cites Families (61)
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| CH427118A (de) | 1963-11-28 | 1966-12-31 | Bbc Brown Boveri & Cie | Verfahren zum Schützen von durch heisse Medien überstrichenen Oberflächenteilen eines hitzebeständigen Körpers |
| US3452553A (en) | 1967-03-17 | 1969-07-01 | Gen Dynamics Corp | Transpiration cooled window |
| US3880969A (en) | 1973-11-05 | 1975-04-29 | Universal Oil Prod Co | Method of preparing an open-celled aromic foam |
| US4420462A (en) | 1982-03-22 | 1983-12-13 | Clyde Robert A | Catalytic heat exchanger |
| JPS6078143U (ja) * | 1983-10-31 | 1985-05-31 | 三菱電機株式会社 | 液冷装置 |
| US4884168A (en) | 1988-12-14 | 1989-11-28 | Cray Research, Inc. | Cooling plate with interboard connector apertures for circuit board assemblies |
| US4884169A (en) | 1989-01-23 | 1989-11-28 | Technology Enterprises Company | Bubble generation in condensation wells for cooling high density integrated circuit chips |
| US5744252A (en) | 1989-09-21 | 1998-04-28 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Flexible ceramic-metal insulation composite and method of making |
| JPH07114250B2 (ja) | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 熱伝達システム |
| ATE163474T1 (de) * | 1991-04-15 | 1998-03-15 | Scient Ecology Group Inc | Wärmetauscher für sehr hohe temperatur |
| JPH0731028B2 (ja) * | 1991-05-24 | 1995-04-10 | 株式会社ヒラノテクシード | 熱風供給方法、及び放熱装置 |
| JP2995590B2 (ja) | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | 半導体冷却装置 |
| JPH05136305A (ja) | 1991-11-08 | 1993-06-01 | Hitachi Ltd | 発熱体の冷却装置 |
| US6006824A (en) * | 1994-03-28 | 1999-12-28 | Ngk Insulators, Ltd. | Ceramic shell-and-tube type heat exchanger, and method for manufacturing it |
| JPH09253945A (ja) * | 1996-03-25 | 1997-09-30 | Ngk Insulators Ltd | フィン付きセラミック製シェルアンドチューブ型熱交換器及びその製造方法 |
| DE19643717A1 (de) | 1996-10-23 | 1998-04-30 | Asea Brown Boveri | Flüssigkeits-Kühlvorrichtung für ein Hochleistungshalbleitermodul |
| JPH10148120A (ja) | 1996-11-18 | 1998-06-02 | Isuzu Ceramics Kenkyusho:Kk | 給電用エンジンの熱回収装置 |
| US6089505A (en) | 1997-07-22 | 2000-07-18 | Mcdonnell Douglas Corporation | Mission adaptive inlet |
| JPH11254047A (ja) * | 1998-03-12 | 1999-09-21 | Konica Corp | 熱交換器に使用する薄板の曲げ方法及び熱交換器 |
| JP4067165B2 (ja) * | 1998-03-23 | 2008-03-26 | 電気化学工業株式会社 | 複合体とそれを用いたヒートシンク |
| WO1999052838A1 (en) | 1998-04-13 | 1999-10-21 | Minnesota Mining And Manufacturing Company | Tough, low permeable ceramic composite material |
| US6196307B1 (en) | 1998-06-17 | 2001-03-06 | Intersil Americas Inc. | High performance heat exchanger and method |
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| US20060068205A1 (en) | 2004-09-24 | 2006-03-30 | Carbone Lorraine Composants | Composite material used for manufacturing heat exchanger fins with high thermal conductivity |
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| US7705342B2 (en) | 2005-09-16 | 2010-04-27 | University Of Cincinnati | Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes |
| US8505616B2 (en) | 2006-04-20 | 2013-08-13 | The Boeing Company | Hybrid ceramic core cold plate |
| US7742297B2 (en) | 2006-04-20 | 2010-06-22 | The Boeing Company | Ceramic foam electronic component cooling |
| US8162035B2 (en) | 2006-04-20 | 2012-04-24 | The Boeing Company | High conductivity ceramic foam cold plate |
| US7485354B2 (en) | 2006-06-20 | 2009-02-03 | Northrop Grumman Corporation | Thermal protection system for a vehicle |
| JP5148079B2 (ja) | 2006-07-25 | 2013-02-20 | 富士通株式会社 | 液冷ユニット用熱交換器および液冷ユニット並びに電子機器 |
| US7501111B2 (en) | 2006-08-25 | 2009-03-10 | Conoco Phillips Company | Increased capacity sulfur recovery plant and process for recovering elemental sulfur |
| US8240361B2 (en) | 2006-11-02 | 2012-08-14 | The Boeing Company | Combined thermal protection and surface temperature control system |
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-
2009
- 2009-12-03 US US12/630,699 patent/US8720828B2/en not_active Expired - Fee Related
-
2010
- 2010-12-01 EP EP10193280.4A patent/EP2333475B1/en not_active Not-in-force
- 2010-12-02 JP JP2010269044A patent/JP5730552B2/ja not_active Expired - Fee Related
- 2010-12-03 CN CN201010578282.5A patent/CN102095314B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4222434A (en) * | 1978-04-27 | 1980-09-16 | Clyde Robert A | Ceramic sponge heat-exchanger member |
| CN2768388Y (zh) * | 2004-12-29 | 2006-03-29 | 中兴通讯股份有限公司 | 一种具有热交换装置的印制板 |
| CN101060768A (zh) * | 2006-04-20 | 2007-10-24 | 波音公司 | 混合陶瓷芯的冷却板 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2333475B1 (en) | 2018-09-12 |
| EP2333475A2 (en) | 2011-06-15 |
| JP2011122815A (ja) | 2011-06-23 |
| JP5730552B2 (ja) | 2015-06-10 |
| CN102095314A (zh) | 2011-06-15 |
| US8720828B2 (en) | 2014-05-13 |
| US20110133026A1 (en) | 2011-06-09 |
| EP2333475A3 (en) | 2013-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140716 Termination date: 20211203 |
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| CF01 | Termination of patent right due to non-payment of annual fee |