JP2011109040A5 - - Google Patents

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Publication number
JP2011109040A5
JP2011109040A5 JP2009265502A JP2009265502A JP2011109040A5 JP 2011109040 A5 JP2011109040 A5 JP 2011109040A5 JP 2009265502 A JP2009265502 A JP 2009265502A JP 2009265502 A JP2009265502 A JP 2009265502A JP 2011109040 A5 JP2011109040 A5 JP 2011109040A5
Authority
JP
Japan
Prior art keywords
semiconductor substrate
substrate holder
detection device
temperature detection
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009265502A
Other languages
English (en)
Japanese (ja)
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JP2011109040A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009265502A priority Critical patent/JP2011109040A/ja
Priority claimed from JP2009265502A external-priority patent/JP2011109040A/ja
Publication of JP2011109040A publication Critical patent/JP2011109040A/ja
Publication of JP2011109040A5 publication Critical patent/JP2011109040A5/ja
Pending legal-status Critical Current

Links

JP2009265502A 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置 Pending JP2011109040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Publications (2)

Publication Number Publication Date
JP2011109040A JP2011109040A (ja) 2011-06-02
JP2011109040A5 true JP2011109040A5 (enExample) 2013-02-14

Family

ID=44232171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009265502A Pending JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Country Status (1)

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JP (1) JP2011109040A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5824886B2 (ja) * 2011-06-07 2015-12-02 株式会社ニコン 基板貼り合わせ方法および温度検出装置
KR101772546B1 (ko) * 2012-05-28 2017-08-29 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 온도 계측 시스템, 처리 장치의 온도 계측 방법, 반송 장치 및 기록 매체
JP5959111B2 (ja) * 2013-03-21 2016-08-02 Ｓｅｍｉｔｅｃ株式会社 熱流センサ
JP7052770B2 (ja) * 2019-04-15 2022-04-12 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法
DE102020007791A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249911B2 (ja) * 1996-01-08 2002-01-28 東京エレクトロン株式会社 温度測定装置、処理装置及び処理方法
JP2000091390A (ja) * 1998-09-14 2000-03-31 Tokyo Electron Ltd ウエハ一括試験装置
JP2004251789A (ja) * 2003-02-20 2004-09-09 Komatsu Ltd 温度測定装置及び被処理基板

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