TW201130095A - Semiconductor chip assembly with post/base heat spreader and signal post - Google Patents

Semiconductor chip assembly with post/base heat spreader and signal post

Info

Publication number
TW201130095A
TW201130095A TW099142570A TW99142570A TW201130095A TW 201130095 A TW201130095 A TW 201130095A TW 099142570 A TW099142570 A TW 099142570A TW 99142570 A TW99142570 A TW 99142570A TW 201130095 A TW201130095 A TW 201130095A
Authority
TW
Taiwan
Prior art keywords
post
heat spreader
semiconductor chip
chip assembly
signal
Prior art date
Application number
TW099142570A
Other languages
Chinese (zh)
Other versions
TWI419272B (en
Inventor
Charles W C Lin
Chia-Chung Wang
Original Assignee
Bridge Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/642,795 external-priority patent/US8269336B2/en
Application filed by Bridge Semiconductor Corp filed Critical Bridge Semiconductor Corp
Publication of TW201130095A publication Critical patent/TW201130095A/en
Application granted granted Critical
Publication of TWI419272B publication Critical patent/TWI419272B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader includes a thermal post and a base. The thermal post extends upwardly from the base into a first opening in the adhesive, and the base extends laterally from the thermal post. The conductive trace includes a pad, a terminal and a signal post. The signal post extends upwardly from the terminal into a second opening in the adhesive.
TW099142570A 2009-12-19 2010-12-07 Semiconductor chip assembly with post/base heat spreader and signal post TWI419272B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/642,795 US8269336B2 (en) 2008-03-25 2009-12-19 Semiconductor chip assembly with post/base heat spreader and signal post

Publications (2)

Publication Number Publication Date
TW201130095A true TW201130095A (en) 2011-09-01
TWI419272B TWI419272B (en) 2013-12-11

Family

ID=44268098

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099142570A TWI419272B (en) 2009-12-19 2010-12-07 Semiconductor chip assembly with post/base heat spreader and signal post

Country Status (2)

Country Link
CN (1) CN102130084B (en)
TW (1) TWI419272B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676778B (en) * 2016-02-19 2019-11-11 德商賀利氏德國有限兩合公司 Heat spreader plate with at least one cooling fin, method for producing a heat spreader plate with at least one cooling fin, electronic module
TWI714679B (en) * 2015-12-02 2021-01-01 荷蘭商露明控股公司 Led metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103325931B (en) * 2012-03-23 2015-07-15 新谱光科技股份有限公司 SMD light-emitting diode structure and display panel improved structure using same
TWI539872B (en) * 2013-01-09 2016-06-21 聯京光電股份有限公司 Substrate, semiconductor construction, and manufacturing method thereof
TW201507556A (en) * 2013-08-08 2015-02-16 Bridge Semiconductor Corp Thermally enhanced wiring board with thermal pad and electrical post
US10024530B2 (en) 2014-07-03 2018-07-17 Sansi Led Lighting Inc. Lighting device and LED luminaire
TWI599003B (en) * 2015-09-07 2017-09-11 鈺橋半導體股份有限公司 Thermally enhanced wiring board having metal slug and moisture inhibiting cap incorporated therein and method of making the same
TWI611541B (en) * 2015-09-07 2018-01-11 鈺橋半導體股份有限公司 Method of making wiring board having electrical isolator and moisture inhibiting cap incorporated therein and semiconductor assembly thereof
CN108400118A (en) * 2017-02-06 2018-08-14 钰桥半导体股份有限公司 The semiconductor subassembly and preparation method thereof that three-dimensional is integrated
CN108400117A (en) * 2017-02-06 2018-08-14 钰桥半导体股份有限公司 The heat-dissipating gain-type semiconductor subassembly and preparation method thereof that three-dimensional is integrated

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376908B1 (en) * 1997-12-10 2002-04-23 Mitsubishi Gas Chemical Company, Inc. Semiconductor plastic package and process for the production thereof
CN1131553C (en) * 1999-10-29 2003-12-17 华通电脑股份有限公司 Plastic substrate with heat dissipation function for package and its making method
US6867493B2 (en) * 2000-11-15 2005-03-15 Skyworks Solutions, Inc. Structure and method for fabrication of a leadless multi-die carrier
US7109573B2 (en) * 2003-06-10 2006-09-19 Nokia Corporation Thermally enhanced component substrate
JP2005166775A (en) * 2003-12-01 2005-06-23 Osram-Melco Ltd Light emitting diode module and its manufacturing method
TWI279175B (en) * 2005-07-21 2007-04-11 Phoenix Prec Technology Corp Circuit board structure and method for fabricating the same
EP1928026A1 (en) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI714679B (en) * 2015-12-02 2021-01-01 荷蘭商露明控股公司 Led metal pad configuration for optimized thermal resistance, solder reliability, and smt processing yields
TWI676778B (en) * 2016-02-19 2019-11-11 德商賀利氏德國有限兩合公司 Heat spreader plate with at least one cooling fin, method for producing a heat spreader plate with at least one cooling fin, electronic module

Also Published As

Publication number Publication date
CN102130084A (en) 2011-07-20
CN102130084B (en) 2013-01-16
TWI419272B (en) 2013-12-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees