JP2011109040A - 半導体基板ホルダ及び温度検出装置 - Google Patents

半導体基板ホルダ及び温度検出装置 Download PDF

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Publication number
JP2011109040A
JP2011109040A JP2009265502A JP2009265502A JP2011109040A JP 2011109040 A JP2011109040 A JP 2011109040A JP 2009265502 A JP2009265502 A JP 2009265502A JP 2009265502 A JP2009265502 A JP 2009265502A JP 2011109040 A JP2011109040 A JP 2011109040A
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Japan
Prior art keywords
temperature detection
wafer
detection device
temperature
semiconductor substrate
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JP2009265502A
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English (en)
Japanese (ja)
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JP2011109040A5 (enrdf_load_stackoverflow
Inventor
Isao Sugaya
功 菅谷
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Nikon Corp
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Nikon Corp
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Priority to JP2009265502A priority Critical patent/JP2011109040A/ja
Publication of JP2011109040A publication Critical patent/JP2011109040A/ja
Publication of JP2011109040A5 publication Critical patent/JP2011109040A5/ja
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009265502A 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置 Pending JP2011109040A (ja)

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JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

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JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Publications (2)

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JP2011109040A true JP2011109040A (ja) 2011-06-02
JP2011109040A5 JP2011109040A5 (enrdf_load_stackoverflow) 2013-02-14

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JP2009265502A Pending JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012251964A (ja) * 2011-06-07 2012-12-20 Nikon Corp 温度検出方法、基板貼り合わせ方法、重ね合わせ基板、及び、温度検出装置
JP2014182073A (ja) * 2013-03-21 2014-09-29 Semitec Corp 熱流センサ
KR101772546B1 (ko) * 2012-05-28 2017-08-29 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 온도 계측 시스템, 처리 장치의 온도 계측 방법, 반송 장치 및 기록 매체
JP2020175450A (ja) * 2019-04-15 2020-10-29 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法
WO2022129527A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares wafer-chuck-system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09189613A (ja) * 1996-01-08 1997-07-22 Tokyo Electron Ltd 温度測定装置、処理装置及び処理方法
JP2000091390A (ja) * 1998-09-14 2000-03-31 Tokyo Electron Ltd ウエハ一括試験装置
JP2004251789A (ja) * 2003-02-20 2004-09-09 Komatsu Ltd 温度測定装置及び被処理基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09189613A (ja) * 1996-01-08 1997-07-22 Tokyo Electron Ltd 温度測定装置、処理装置及び処理方法
JP2000091390A (ja) * 1998-09-14 2000-03-31 Tokyo Electron Ltd ウエハ一括試験装置
JP2004251789A (ja) * 2003-02-20 2004-09-09 Komatsu Ltd 温度測定装置及び被処理基板

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012251964A (ja) * 2011-06-07 2012-12-20 Nikon Corp 温度検出方法、基板貼り合わせ方法、重ね合わせ基板、及び、温度検出装置
KR101772546B1 (ko) * 2012-05-28 2017-08-29 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 온도 계측 시스템, 처리 장치의 온도 계측 방법, 반송 장치 및 기록 매체
US10340164B2 (en) 2012-05-28 2019-07-02 Hitachi Kokusai Electric, Inc. Substrate processing apparatus, method of measuring temperature of substrate processing apparatus and non-transitory computer-readable recording medium
JP2014182073A (ja) * 2013-03-21 2014-09-29 Semitec Corp 熱流センサ
JP2020175450A (ja) * 2019-04-15 2020-10-29 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法
JP7052770B2 (ja) 2019-04-15 2022-04-12 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法
WO2022129527A1 (de) * 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares wafer-chuck-system

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