JP5500298B2 - 温度検出装置の製造方法 - Google Patents
温度検出装置の製造方法 Download PDFInfo
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- JP5500298B2 JP5500298B2 JP2013124872A JP2013124872A JP5500298B2 JP 5500298 B2 JP5500298 B2 JP 5500298B2 JP 2013124872 A JP2013124872 A JP 2013124872A JP 2013124872 A JP2013124872 A JP 2013124872A JP 5500298 B2 JP5500298 B2 JP 5500298B2
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- silicon wafer
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- temperature detection
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- 238000001514 detection method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 235000012431 wafers Nutrition 0.000 claims description 127
- 125000006850 spacer group Chemical group 0.000 claims description 64
- 238000005304 joining Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 112
- 229910052710 silicon Inorganic materials 0.000 description 112
- 239000010703 silicon Substances 0.000 description 112
- 238000000034 method Methods 0.000 description 23
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000009826 distribution Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
Claims (1)
- 温度センサと、2つのワークウェハと、スペーサウェハとを備える温度検出装置の製造方法であって、
前記スペーサウェハを前記2つのワークウェハで挟み込んで接合する接合工程と、
前記接合工程の前および後の少なくとも一方で実行され、前記2枚のワークウェハのうち少なくとも一方の前記ワークウェハと前記スペーサウェハとの間に形成された空間に前記温度センサを収容する収容工程と
を含む温度検出装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013124872A JP5500298B2 (ja) | 2013-06-13 | 2013-06-13 | 温度検出装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2013124872A JP5500298B2 (ja) | 2013-06-13 | 2013-06-13 | 温度検出装置の製造方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009265487A Division JP5299236B2 (ja) | 2009-11-20 | 2009-11-20 | 温度検出装置、及び温度検出装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013178279A JP2013178279A (ja) | 2013-09-09 |
JP2013178279A5 JP2013178279A5 (ja) | 2013-12-05 |
JP5500298B2 true JP5500298B2 (ja) | 2014-05-21 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013124872A Active JP5500298B2 (ja) | 2013-06-13 | 2013-06-13 | 温度検出装置の製造方法 |
Country Status (1)
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JP (1) | JP5500298B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7348877B2 (ja) * | 2020-04-20 | 2023-09-21 | 日本碍子株式会社 | セラミックヒータ及びその製法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0415844U (ja) * | 1990-05-30 | 1992-02-07 | ||
JP4473404B2 (ja) * | 2000-03-24 | 2010-06-02 | 日本フェンオール株式会社 | 温度測定板 |
JP2002188966A (ja) * | 2000-12-22 | 2002-07-05 | Ngk Spark Plug Co Ltd | 温度センサ及びその製造方法並びに製造管理方法 |
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- 2013-06-13 JP JP2013124872A patent/JP5500298B2/ja active Active
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JP2013178279A (ja) | 2013-09-09 |
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