JP2011101327A5 - - Google Patents

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Publication number
JP2011101327A5
JP2011101327A5 JP2009256545A JP2009256545A JP2011101327A5 JP 2011101327 A5 JP2011101327 A5 JP 2011101327A5 JP 2009256545 A JP2009256545 A JP 2009256545A JP 2009256545 A JP2009256545 A JP 2009256545A JP 2011101327 A5 JP2011101327 A5 JP 2011101327A5
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JP
Japan
Prior art keywords
signal transmission
transmission path
conductor foil
housing
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009256545A
Other languages
English (en)
Japanese (ja)
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JP2011101327A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009256545A priority Critical patent/JP2011101327A/ja
Priority claimed from JP2009256545A external-priority patent/JP2011101327A/ja
Priority to US12/907,950 priority patent/US20110109407A1/en
Publication of JP2011101327A publication Critical patent/JP2011101327A/ja
Publication of JP2011101327A5 publication Critical patent/JP2011101327A5/ja
Pending legal-status Critical Current

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JP2009256545A 2009-11-09 2009-11-09 信号伝送路 Pending JP2011101327A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009256545A JP2011101327A (ja) 2009-11-09 2009-11-09 信号伝送路
US12/907,950 US20110109407A1 (en) 2009-11-09 2010-10-19 Signal transmission line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009256545A JP2011101327A (ja) 2009-11-09 2009-11-09 信号伝送路

Publications (2)

Publication Number Publication Date
JP2011101327A JP2011101327A (ja) 2011-05-19
JP2011101327A5 true JP2011101327A5 (enExample) 2012-12-20

Family

ID=43973727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009256545A Pending JP2011101327A (ja) 2009-11-09 2009-11-09 信号伝送路

Country Status (2)

Country Link
US (1) US20110109407A1 (enExample)
JP (1) JP2011101327A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011113575A (ja) * 2009-11-24 2011-06-09 Hitachi Consumer Electronics Co Ltd フレキシブルプリント基板、並びにそれを用いた電子機器及び光ディスク記録装置
CN104412448B (zh) * 2012-06-28 2017-08-01 株式会社村田制作所 高频传输线路及电子设备
JP5958122B2 (ja) * 2012-06-29 2016-07-27 株式会社村田製作所 高周波信号線路及び信号線路付き基材層の製造方法
KR102096038B1 (ko) * 2013-07-16 2020-04-02 삼성디스플레이 주식회사 전원 전달 배선을 포함하는 백라이트 유닛
JP6226116B2 (ja) * 2013-07-24 2017-11-08 住友電工デバイス・イノベーション株式会社 フレキシブル基板
CN104810613B (zh) * 2014-01-26 2018-06-26 华为终端（东莞）有限公司 一种终端天线结构和终端
US9722307B2 (en) 2014-01-26 2017-08-01 Huawei Device Co., Ltd. Terminal antenna structure and terminal
US20160173055A1 (en) * 2014-12-15 2016-06-16 Intel Corporation Impedance matching in a transmission line
US10349565B2 (en) * 2016-09-06 2019-07-09 Apple Inc. Electronic assembly architectures using multi-cable assemblies
JP6802688B2 (ja) * 2016-11-02 2020-12-16 日東電工株式会社 配線回路基板
CN115603129B (zh) * 2022-10-10 2025-12-16 青岛海信激光显示股份有限公司 投影设备

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283824A (ja) * 1992-04-06 1993-10-29 Hitachi Ltd 回路基板
JPH0615310U (ja) * 1992-07-28 1994-02-25 株式会社東芝 高周波回路基板
JP3351613B2 (ja) * 1994-03-15 2002-12-03 株式会社東芝 マイクロ波集積回路
JPH0964602A (ja) * 1995-08-23 1997-03-07 Mitsubishi Electric Corp 伝送線路
JPH1140915A (ja) * 1997-05-22 1999-02-12 Nec Corp プリント配線板
JP2000323907A (ja) * 1999-05-07 2000-11-24 Nec Corp マイクロ波ｉｃ接続線路
JP2001068906A (ja) * 1999-08-27 2001-03-16 Matsushita Electric Ind Co Ltd 高周波装置
JP2001313504A (ja) * 2000-04-14 2001-11-09 Internatl Business Mach Corp <Ibm> 信号伝送線路接続用コネクタ、信号伝送線路、及び基板
JP2005100708A (ja) * 2003-09-22 2005-04-14 Yazaki Corp フラット配索体及びこれを用いた回転コネクタ
JP2006211070A (ja) * 2005-01-26 2006-08-10 Hirose Electric Co Ltd 多層配線基板
JP2006222263A (ja) * 2005-02-10 2006-08-24 Mitsubishi Electric Corp 光半導体装置
JP2006287619A (ja) * 2005-03-31 2006-10-19 Tdk Corp 分布定数回路及びインピーダンス調整方法
JP2006287560A (ja) * 2005-03-31 2006-10-19 Tdk Corp 電子回路
JP2008219476A (ja) * 2007-03-05 2008-09-18 Mitsubishi Electric Corp 伝送線路変換部並びにこれを有する高周波回路及び高周波モジュール
KR100893936B1 (ko) * 2007-08-24 2009-04-21 포항공과대학교 산학협력단 수신단 누화잡음을 줄이는 수직 돌기가 형성된 마이크로스트립 전송선을 갖는 채널
KR100923928B1 (ko) * 2007-10-29 2009-10-28 포항공과대학교 산학협력단 서펜타인 형태의 마이크로 스트립 전송선 구조
JP4959617B2 (ja) * 2008-03-28 2012-06-27 日本オプネクスト株式会社 光送信回路
JPWO2009128193A1 (ja) * 2008-04-14 2011-08-04 パナソニック株式会社 マイクロストリップ線路
US8058954B2 (en) * 2009-03-05 2011-11-15 Apple Inc. Transmission line with a cross-hatched ground plane that is either filled with conductive paint or covered by a conductive foil

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