JP2011097009A - 複合型積層チップパッケージおよびその製造方法 - Google Patents
複合型積層チップパッケージおよびその製造方法 Download PDFInfo
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- JP2011097009A JP2011097009A JP2010109889A JP2010109889A JP2011097009A JP 2011097009 A JP2011097009 A JP 2011097009A JP 2010109889 A JP2010109889 A JP 2010109889A JP 2010109889 A JP2010109889 A JP 2010109889A JP 2011097009 A JP2011097009 A JP 2011097009A
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- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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Abstract
【解決手段】複合型積層チップパッケージ1は、積層されたサブパッケージ1A,1Bを備えている。サブパッケージ1A,1Bは、本体2と、本体2の側面に配置された配線3を備えている。本体2は、少なくとも1つの第1の種類の階層部分10Aを含む主要部分2Mを有している。下側のサブパッケージの本体2は、主要部分2Mの上面に配置された複数の第1の端子4を有し、上側のサブパッケージの本体2は、主要部分2Mの下面に配置された複数の第2の端子を有している。少なくとも1つのサブパッケージにおける主要部分2Mは、少なくとも1つの第2の種類の階層部分10Bを含んでいる。階層部分10Aは良品の半導体チップを含み、階層部分10Bは不良の半導体チップを含んでいる。
【選択図】図1
Description
Claims (14)
- 積層された複数のサブパッケージを備え、上下に隣接する2つのサブパッケージが電気的に接続された複合型積層チップパッケージであって、
前記複数のサブパッケージの各々は、上面、下面および4つの側面を有する本体と、前記本体の少なくとも1つの側面に配置された配線とを備え、
前記本体は、少なくとも1つの第1の種類の階層部分を含むと共に上面と下面を有する主要部分を有し、
上下に隣接する任意の2つのサブパッケージにおいて、下側のサブパッケージの前記本体は、更に、前記主要部分の上面に配置され、前記配線に電気的に接続された複数の第1の端子を有し、上側のサブパッケージの前記本体は、更に、前記主要部分の下面に配置され、前記配線に電気的に接続された複数の第2の端子を有し、上側のサブパッケージの本体における複数の第2の端子は、下側のサブパッケージの本体における複数の第1の端子に電気的に接続され、
前記複数のサブパッケージのうちの少なくとも1つにおける前記本体の前記主要部分は、更に、少なくとも1つの第2の種類の階層部分を含み、
前記第1の種類の階層部分と前記第2の種類の階層部分は、いずれも、半導体チップを含み、
前記第1の種類の階層部分は、更に、それぞれ前記半導体チップに電気的に接続され、前記配線が配置された前記本体の前記少なくとも1つの側面に配置された端面を有する複数の電極を含むが、前記第2の種類の階層部分は、前記複数の電極を含まず、前記配線は、前記複数の電極の端面に電気的に接続されていることを特徴とする複合型積層チップパッケージ。 - 前記第1の種類の階層部分における半導体チップは正常に動作するものであり、前記第2の種類の階層部分における半導体チップは正常に動作しないものであることを特徴とする請求項1記載の複合型積層チップパッケージ。
- 最も下に位置するサブパッケージの前記本体は、更に、前記複数の第2の端子を有していることを請求項1記載の複合型積層チップパッケージ。
- 最も上に位置するサブパッケージの前記本体は、更に、前記複数の第1の端子を有していることを請求項1記載の複合型積層チップパッケージ。
- 前記複数のサブパッケージの全ての前記本体は、前記複数の第1の端子および前記複数の第2の端子を有していることを請求項1記載の複合型積層チップパッケージ。
- 前記半導体チップは、4つの側面を有し、
前記第1の種類の階層部分と第2の種類の階層部分は、いずれも、更に、前記半導体チップの4つの側面のうちの少なくとも1つの側面を覆う絶縁部を含み、
前記絶縁部は、前記配線が配置された前記本体の前記少なくとも1つの側面に配置された少なくとも1つの端面を有することを特徴とする請求項1記載の複合型積層チップパッケージ。 - 請求項1記載の複合型積層チップパッケージを製造する方法であって、
前記複数のサブパッケージを作製する工程と、
前記複数のサブパッケージを積層し、上下に隣接する任意の2つのサブパッケージにおいて、上側のサブパッケージの複数の第2の端子を下側のサブパッケージの複数の第1の端子に電気的に接続する工程と
を備えたことを特徴とする複合型積層チップパッケージの製造方法。 - 前記第1の種類の階層部分における半導体チップは正常に動作するものであり、前記第2の種類の階層部分における半導体チップは正常に動作しないものであることを特徴とする請求項7記載の複合型積層チップパッケージの製造方法。
- 前記複数のサブパッケージを作製する工程は、各サブパッケージを作製するための一連の工程として、
各々が前記主要部分に含まれる階層部分のいずれかとなる予定の、配列された複数の予備階層部分を含み、後に隣接する予備階層部分の境界位置で切断される少なくとも1つの基礎構造物を作製する工程と、
前記少なくとも1つの基礎構造物を用いて、前記サブパッケージを作製する工程とを備え、
前記少なくとも1つの基礎構造物を作製する工程は、
それぞれ前記半導体チップとなる予定の、配列された複数の半導体チップ予定部を含む基礎構造物前ウェハを作製する工程と、
前記基礎構造物前ウェハに含まれる複数の半導体チップ予定部について、正常に動作する半導体チップ予定部と正常に動作しない半導体チップ予定部とを判別する工程と、
前記基礎構造物前ウェハが前記基礎構造物になるように、正常に動作しない半導体チップ予定部では前記複数の電極を形成することなく、正常に動作する半導体チップ予定部では前記複数の電極を形成する工程とを含むことを特徴とする請求項8記載の複合型積層チップパッケージの製造方法。 - 前記複数の電極を形成する工程は、
前記複数の電極を形成するために用いられ、全ての半導体チップ予定部に対応する複数の部分を含むフォトレジスト層を形成する工程と、
フォトリソグラフィにより前記フォトレジスト層をパターニングすることによって、後に前記複数の電極が収容される複数の開口部を有するフレームを形成する工程と、
前記フレームの複数の開口部内に前記複数の電極を形成する工程とを含むことを特徴とする請求項9記載の複合型積層チップパッケージの製造方法。 - 最も下に位置するサブパッケージの前記本体は、更に、前記複数の第2の端子を有していることを請求項7記載の複合型積層チップパッケージの製造方法。
- 最も上に位置するサブパッケージの前記本体は、更に、前記複数の第1の端子を有していることを請求項7記載の複合型積層チップパッケージの製造方法。
- 前記複数のサブパッケージの全ての前記本体は、前記複数の第1の端子および前記複数の第2の端子を有していることを請求項7記載の複合型積層チップパッケージの製造方法。
- 前記半導体チップは、4つの側面を有し、
前記第1の種類の階層部分と第2の種類の階層部分は、いずれも、更に、前記半導体チップの4つの側面のうちの少なくとも1つの側面を覆う絶縁部を含み、
前記絶縁部は、前記配線が配置された前記本体の前記少なくとも1つの側面に配置された少なくとも1つの端面を有することを特徴とする請求項7記載の複合型積層チップパッケージの製造方法。
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