JP2011091261A - 基板処理装置、基板処理方法及びこの方法によって処理された基板 - Google Patents

基板処理装置、基板処理方法及びこの方法によって処理された基板 Download PDF

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Publication number
JP2011091261A
JP2011091261A JP2009244535A JP2009244535A JP2011091261A JP 2011091261 A JP2011091261 A JP 2011091261A JP 2009244535 A JP2009244535 A JP 2009244535A JP 2009244535 A JP2009244535 A JP 2009244535A JP 2011091261 A JP2011091261 A JP 2011091261A
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JP
Japan
Prior art keywords
substrate
substrate processing
particles
processing apparatus
etching
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JP2009244535A
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Japanese (ja)
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JP2011091261A5 (https=
Inventor
Susumu Sakio
進 崎尾
Shinsuke Iguchi
真介 井口
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Ulvac Inc
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Ulvac Inc
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Priority to JP2009244535A priority Critical patent/JP2011091261A/ja
Publication of JP2011091261A publication Critical patent/JP2011091261A/ja
Publication of JP2011091261A5 publication Critical patent/JP2011091261A5/ja
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Photovoltaic Devices (AREA)
JP2009244535A 2009-10-23 2009-10-23 基板処理装置、基板処理方法及びこの方法によって処理された基板 Pending JP2011091261A (ja)

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JP2009244535A JP2011091261A (ja) 2009-10-23 2009-10-23 基板処理装置、基板処理方法及びこの方法によって処理された基板

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JP2009244535A JP2011091261A (ja) 2009-10-23 2009-10-23 基板処理装置、基板処理方法及びこの方法によって処理された基板

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JP2011091261A true JP2011091261A (ja) 2011-05-06
JP2011091261A5 JP2011091261A5 (https=) 2012-08-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904107A (zh) * 2019-03-27 2019-06-18 韩进龙 一种微型器件补充装置、补充系统及补充方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10280170A (ja) * 1997-04-11 1998-10-20 Omron Corp エッチングマスクの形成方法及び装置
JP2000261008A (ja) * 1999-03-10 2000-09-22 Mitsubishi Electric Corp 太陽電池用シリコン基板の粗面化方法
JP2002040687A (ja) * 2000-07-28 2002-02-06 Sharp Corp 電子写真感光体、プロセスカートリッジ及び電子写真装置
JP2006210394A (ja) * 2005-01-25 2006-08-10 Canon Inc シリコン基体表面の凹凸形成方法
JP2007059715A (ja) * 2005-08-25 2007-03-08 Sumitomo Heavy Ind Ltd パターン作製方法及びパターン作製装置
WO2009063954A1 (ja) * 2007-11-16 2009-05-22 Ulvac, Inc. 基板処理方法及びこの方法によって処理された基板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10280170A (ja) * 1997-04-11 1998-10-20 Omron Corp エッチングマスクの形成方法及び装置
JP2000261008A (ja) * 1999-03-10 2000-09-22 Mitsubishi Electric Corp 太陽電池用シリコン基板の粗面化方法
JP2002040687A (ja) * 2000-07-28 2002-02-06 Sharp Corp 電子写真感光体、プロセスカートリッジ及び電子写真装置
JP2006210394A (ja) * 2005-01-25 2006-08-10 Canon Inc シリコン基体表面の凹凸形成方法
JP2007059715A (ja) * 2005-08-25 2007-03-08 Sumitomo Heavy Ind Ltd パターン作製方法及びパターン作製装置
WO2009063954A1 (ja) * 2007-11-16 2009-05-22 Ulvac, Inc. 基板処理方法及びこの方法によって処理された基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109904107A (zh) * 2019-03-27 2019-06-18 韩进龙 一种微型器件补充装置、补充系统及补充方法

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