JP2011091029A5 - - Google Patents

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Publication number
JP2011091029A5
JP2011091029A5 JP2010201497A JP2010201497A JP2011091029A5 JP 2011091029 A5 JP2011091029 A5 JP 2011091029A5 JP 2010201497 A JP2010201497 A JP 2010201497A JP 2010201497 A JP2010201497 A JP 2010201497A JP 2011091029 A5 JP2011091029 A5 JP 2011091029A5
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JP
Japan
Prior art keywords
conductive element
contact
metallic material
circuit
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010201497A
Other languages
English (en)
Japanese (ja)
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JP2011091029A (ja
Filing date
Publication date
Priority claimed from US12/565,127 external-priority patent/US8354899B2/en
Application filed filed Critical
Publication of JP2011091029A publication Critical patent/JP2011091029A/ja
Publication of JP2011091029A5 publication Critical patent/JP2011091029A5/ja
Pending legal-status Critical Current

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JP2010201497A 2009-09-23 2010-09-09 スイッチ構造及び方法 Pending JP2011091029A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/565,127 US8354899B2 (en) 2009-09-23 2009-09-23 Switch structure and method

Publications (2)

Publication Number Publication Date
JP2011091029A JP2011091029A (ja) 2011-05-06
JP2011091029A5 true JP2011091029A5 (https=) 2013-10-10

Family

ID=43303797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010201497A Pending JP2011091029A (ja) 2009-09-23 2010-09-09 スイッチ構造及び方法

Country Status (5)

Country Link
US (1) US8354899B2 (https=)
EP (1) EP2315221B1 (https=)
JP (1) JP2011091029A (https=)
KR (1) KR101734547B1 (https=)
CN (1) CN102034648B (https=)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
KR102236803B1 (ko) * 2014-06-27 2021-04-06 인텔 코포레이션 정지마찰 보상을 위한 자기 나노기계적 디바이스들
FR3027448B1 (fr) * 2014-10-21 2016-10-28 Airmems Commutateur microelectromecanique robuste
US9362608B1 (en) 2014-12-03 2016-06-07 General Electric Company Multichannel relay assembly with in line MEMS switches
US9663347B2 (en) * 2015-03-02 2017-05-30 General Electric Company Electromechanical system substrate attachment for reduced thermal deformation
FR3034567B1 (fr) 2015-03-31 2017-04-28 St Microelectronics Rousset Dispositif metallique a piece(s) mobile(s) ameliore loge dans une cavite de la partie d'interconnexion (" beol ") d'un circuit integre
US9466452B1 (en) 2015-03-31 2016-10-11 Stmicroelectronics, Inc. Integrated cantilever switch
US9845235B2 (en) * 2015-09-03 2017-12-19 General Electric Company Refractory seed metal for electroplated MEMS structures
KR101885996B1 (ko) * 2017-04-18 2018-08-07 국민대학교산학협력단 3-d 프린터로 제작되는 mems 칸틸레버 스위치의 제조방법
GB2564434B (en) 2017-07-10 2020-08-26 Ge Aviat Systems Ltd Power distribution switch for a power distribution system
US20230068451A1 (en) * 2021-08-30 2023-03-02 Texas Instruments Incorporated Methods and apparatus to thermally actuate microelectromechanical structures devices
DE102022200337A1 (de) * 2022-01-13 2023-07-13 Robert Bosch Gesellschaft mit beschränkter Haftung MEMS-Relais

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Publication number Priority date Publication date Assignee Title
US5258591A (en) * 1991-10-18 1993-11-02 Westinghouse Electric Corp. Low inductance cantilever switch
JP3612081B2 (ja) * 1992-01-31 2005-01-19 株式会社東芝 導電コネクタ及び高強度ばね
ATE156934T1 (de) * 1993-02-18 1997-08-15 Siemens Ag Mikromechanisches relais mit hybridantrieb
US6153839A (en) * 1998-10-22 2000-11-28 Northeastern University Micromechanical switching devices
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US20030016417A1 (en) * 2001-07-17 2003-01-23 Cruise Lee Wireless pointing and remote-controlling device for briefing
US6876047B2 (en) 2001-11-09 2005-04-05 Turnstone Systems, Inc. MEMS device having a trilayered beam and related methods
US6624003B1 (en) * 2002-02-06 2003-09-23 Teravicta Technologies, Inc. Integrated MEMS device and package
US6686820B1 (en) * 2002-07-11 2004-02-03 Intel Corporation Microelectromechanical (MEMS) switching apparatus
AU2002324639A1 (en) * 2002-08-08 2004-02-25 Xcom Wireless, Inc. Microfabricated relay with multimorph actuator and electrostatic latch mechanism
US6699379B1 (en) * 2002-11-25 2004-03-02 Industrial Technology Research Institute Method for reducing stress in nickel-based alloy plating
US20040154925A1 (en) * 2003-02-11 2004-08-12 Podlaha Elizabeth J. Composite metal and composite metal alloy microstructures
JP2005113189A (ja) * 2003-10-07 2005-04-28 Yoshihiko Yokoyama ナノ組織化合金
ATE382188T1 (de) * 2003-10-31 2008-01-15 Nxp Bv Mikroelektromechanische hochfrequenz-systeme und verfahren zur herstellung solcher systeme
JP2005146405A (ja) * 2003-11-14 2005-06-09 Toru Yamazaki 電析積層合金薄板とその製造方法
JP4366310B2 (ja) * 2004-12-24 2009-11-18 シャープ株式会社 マイクロ接点開閉器および無線通信機器
DK1705676T3 (da) * 2005-03-21 2008-02-18 Delfmems RF MEMS omskifter med en fleksibel og fri omskiftermembran
US7663456B2 (en) * 2005-12-15 2010-02-16 General Electric Company Micro-electromechanical system (MEMS) switch arrays
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