JP2011082259A - Led element mounting member and method for manufacturing the same, and led element package and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED element-mounting member having high heat dissipation characteristics and high reflectance characteristics, and a method of manufacturing the LED element-mounting member; and to provide an LED element package, and a method of manufacturing the LED element package. <P>SOLUTION: An LED element-mounting member 20 includes: a first metal substrate 21; an insulating layer 22 provided on the first metal substrate 21; and a second metal substrate 23 provided on the insulating layer 22. A plurality of recessed first LED mounting spaces 24 opening on the surface side of the first metal substrate 21 are formed by partially removing the first metal substrate 21 and the insulating layer 22. A plurality of recessed second LED mounting spaces 25 opening on the surface side of the second metal substrate 23 are formed by partially removing the second metal substrate 23 and the insulating layer 22. Each of the second LED mounting spaces 25 is located between adjacent first LED mounting spaces 24. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an LED element mounting member and a manufacturing method thereof, and an LED element package and a manufacturing method thereof, and in particular, can be made thin and can control a reflection direction of light from the LED element. The present invention relates to an LED element mounting member and a manufacturing method thereof, and an LED element package and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, lighting devices that use LED (light emitting diode) elements as light sources have been used for various home appliances, OA equipment, display lights for vehicle equipment, general lighting, in-vehicle lighting, displays, and the like. Some such lighting devices include an LED element package having LED elements.

  Among such LED element packages, those using a lead frame include, for example, those having a PLCC structure (see Patent Document 1) and those having an SON structure (see Patent Document 2).

JP 2007-49167 A JP 2007-197627 A

  Conventionally, in order to obtain high-luminance light, high-luminance LEDs are used as LED elements, and a plurality of LED element packages including such high-luminance LEDs are mounted on a substrate.

  In this case, since a high-intensity LED that emits a lot of heat is used as the LED element, the LED element package is required to have a structure that efficiently releases heat (high heat dissipation). However, in the conventional LED element package, since the heat dissipation is not sufficient, the life of the LED element is shortened. Alternatively, since heat dissipation is not sufficient, a large amount of current cannot be passed through the LED element, and thus the problem is that the brightness of light from the LED element package cannot be increased.

  In general, in an LED element package, it is necessary to provide a reflector in order to extract light efficiently. In the LED element package, when a metal substrate or a lead frame is used, the reflector is generally formed of a resin. However, the reflector made of resin does not have sufficient reflectivity, and a decrease in reflectivity due to resin deterioration becomes a problem. Further, when a resin reflector is used, secondary processing is required, which causes an increase in cost.

  On the other hand, there is a system in which LED elements are directly mounted on a substrate. However, in this case, it is difficult to provide a reflector that reflects light from the LED element.

  The present invention has been made in view of such points, and an object thereof is to provide an LED element mounting member having high heat dissipation and high reflection characteristics, a manufacturing method thereof, an LED element package, and a manufacturing method thereof. And

  The present invention provides an LED element mounting member for mounting a plurality of LED elements, a first metal substrate, an insulating layer provided on the first metal substrate, and a second metal provided on the insulating layer. A plurality of concave first LED mounting spaces opened on the surface side of the first metal substrate are formed by partially removing the first metal substrate and the insulating layer. By partially removing the insulating layer, a plurality of concave second LED mounting spaces opened on the surface side of the second metal substrate are formed, and the second LED mounting spaces are adjacent to each other between the adjacent first LED mounting spaces. It is an LED element mounting member characterized by being located between.

  According to the present invention, in each first LED mounting space, one side wall of the first metal substrate is formed thin to form a stepped portion, and in each second LED mounting space, one side wall of the second metal substrate is formed thin. It is an LED element mounting member characterized by forming a step part.

  The present invention provides an LED element mounting member for mounting a plurality of LED elements, a first metal substrate, an insulating layer provided on the first metal substrate, and a second metal provided on the insulating layer. A plurality of concave LED mounting spaces opened on the surface side of the second metal substrate are formed by partially removing the second metal substrate and the insulating layer. It is a LED element mounting member.

  The present invention is the LED element mounting member, wherein in each LED mounting space, one side wall of the second metal substrate is formed thin to form a stepped portion.

  The present invention provides an LED element package comprising: an LED element mounting member; and an LED element mounted in each first LED mounting space and each second LED mounting space of the LED element mounting member. The LED elements in one LED mounting space are connected to the first metal substrate and the second metal substrate of the LED element mounting member, and the LED elements in each second LED mounting space are the first metal of the LED element mounting member. An LED element package connected to a substrate and a second metal substrate, wherein each first LED mounting space and each second LED mounting space are sealed with a sealing resin portion.

  The present invention is an LED element package in which a plurality of LED elements are mounted in each first LED mounting space and each second LED mounting space of the LED element mounting member.

  The present invention is an LED element package, comprising an LED element mounting member and an LED element mounted in each LED mounting space of the LED element mounting member, the LED elements in each LED mounting space, The LED element package is connected to the first metal substrate and the second metal substrate of the LED element mounting member, and each LED mounting space is sealed with a sealing resin portion.

  The present invention is an LED element package characterized in that a plurality of LED elements are mounted in each LED mounting space of the LED element mounting member.

  The present invention provides a first metal substrate, an insulating layer provided on the first metal substrate, and an insulating layer provided on the LED element mounting member manufacturing method for mounting a plurality of LED elements. A step of preparing a laminated material having a second metal substrate, and etching the first metal substrate and the second metal substrate of the laminated material, thereby forming a plurality of first recesses on the surface side of the first metal substrate. Forming a plurality of second recesses on the surface side of the second metal substrate, and etching each first recess and the insulating layer in each second recess, thereby forming the first metal substrate A plurality of concave first LED mounting spaces that are open on the front surface side and a plurality of concave second LED mounting spaces that are open on the front surface side of the second metal substrate and are positioned between adjacent first LED mounting spaces. And a process of forming a space It is a manufacturing method of LED element mounting member, wherein.

  The present invention provides a first metal substrate, an insulating layer provided on the first metal substrate, and an insulating layer provided on the LED element mounting member manufacturing method for mounting a plurality of LED elements. A step of preparing a laminate having a second metal substrate, a step of forming a plurality of recesses on the surface side of the second metal substrate by etching the second metal substrate of the laminate, and each recess And a step of forming a plurality of concave LED mounting spaces opened on the surface side of the first metal substrate by etching the insulating layer inside the LED element mounting member. It is a manufacturing method.

  The present invention relates to a method of manufacturing an LED element package, the step of manufacturing an LED element mounting member by the method of manufacturing an LED element mounting member, the first LED mounting space of the LED element mounting member, and the second LED mounting. A step of placing each LED element in the placement space, a step of connecting the LED elements in each first LED placement space to the first metal substrate and the second metal substrate of the LED element placement member, respectively, The step of connecting the LED elements in the 2LED mounting space to the first metal substrate and the second metal substrate of the LED element mounting member, respectively, and sealing each first LED mounting space and each second LED mounting space And a step of resin-sealing with a resin portion.

  The present invention relates to a method of manufacturing an LED element package, the step of manufacturing the LED element mounting member by the method of manufacturing the LED element mounting member, and mounting the LED element in each LED mounting space of the LED element mounting member. A step of connecting the LED elements in each LED mounting space to the first metal substrate and the second metal substrate of the LED element mounting member, respectively, and a sealing resin portion in each LED mounting space And a step of sealing with resin.

  According to the present invention, heat from the LED elements placed in each LED placement space (first LED placement space, second LED placement space) is externally transmitted via the first metal substrate or the second metal substrate. Therefore, the heat dissipation of the LED element package can be improved.

  Moreover, according to this invention, since each LED mounting space (1st LED mounting space, 2nd LED mounting space) plays the role of a reflector, the reflective characteristic of the light of an LED element package can be improved.

The top view which shows the LED element package by the 1st Embodiment of this invention. Sectional drawing which shows the LED element package by the 1st Embodiment of this invention (II-II sectional view taken on the line of FIG. 1). The figure which shows the manufacturing method of the LED element mounting member by the 1st Embodiment of this invention. The figure which shows the manufacturing method of the LED element package by the 1st Embodiment of this invention. Sectional drawing which shows the modification of the LED element package by the 1st Embodiment of this invention. The top view which shows the LED element package by the 2nd Embodiment of this invention. Sectional drawing which shows the LED element package by the 2nd Embodiment of this invention (VII-VII sectional view taken on the line of FIG. 6). The figure which shows the manufacturing method of the LED element mounting member by the 2nd Embodiment of this invention. The figure which shows the manufacturing method of the LED element package by the 2nd Embodiment of this invention.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 5 are diagrams showing a first embodiment of the present invention.

  First, an outline of the LED element mounting member and the LED element package according to the present embodiment will be described with reference to FIGS. 1 and 2.

  The LED element package 10 shown in FIGS. 1 and 2 includes an LED element mounting member 20 and a plurality of LED elements 11 mounted on the LED element mounting member 20.

  The LED element mounting member 20 includes a rectangular first metal substrate 21, a rectangular insulating layer 22 provided on the first metal substrate 21, and a rectangular first metal substrate 21 provided on the insulating layer 22. 2 metal substrate 23.

  As shown in FIG. 2, the first metal substrate 21 and the insulating layer 22 are partially removed to form a plurality of concave first LED mounting spaces 24 opened on the surface side of the first metal substrate 21. Has been. On the other hand, by partially removing the second metal substrate 23 and the insulating layer 22, a plurality of concave second LED mounting spaces 25 opened on the surface side of the second metal substrate 23 are formed.

  The first LED mounting spaces 24 are arranged at intervals from each other along the longitudinal direction of the first metal substrate 21, and are positioned between the adjacent second LED mounting spaces 25. A first mounting surface 26 is formed on the bottom surface of each first LED mounting space 24 by removing the insulating layer 22 and exposing the second metal substrate 23. Further, in each first LED mounting space 24, a side wall 30 and a side wall 31 are formed on the first metal substrate 21. Of these, one side wall 30 is formed thin to form a stepped portion 28.

  Similarly, each 2nd LED mounting space 25 is arrange | positioned at intervals along the longitudinal direction of the 2nd metal substrate 23, and is located between adjacent 1st LED mounting space 24 comrades. . A second mounting surface 27 is formed on the bottom surface of each second LED mounting space 25 by removing the insulating layer 22 and exposing the first metal substrate 21. Further, in each second LED mounting space 25, a side wall 32 and a side wall 33 are formed on the second metal substrate 23. Of these, one side wall 32 is formed thin to form a stepped portion 29.

  On the other hand, a plurality (three in this case) of LED elements 11 are arranged in each first LED mounting space 24. The LED elements 11 are connected to the first metal substrate 21 and the second metal substrate 23, respectively. That is, each LED element 11 in the first LED mounting space 24 is connected to the step portion 28 of the first metal substrate 21 and the first mounting surface 26 of the second metal substrate 23 by the bonding wire (conductive member) 12. ing.

  Similarly, a plurality (three in this case) of LED elements 11 are also arranged in each second LED mounting space 25. The LED elements 11 are connected to the first metal substrate 21 and the second metal substrate 23, respectively. That is, each LED element 11 in the second LED mounting space 25 is connected to the second mounting surface 27 of the first metal substrate 21 and the stepped portion 29 of the second metal substrate 23 by bonding wires (conductive members) 12. ing.

  Further, the inside of each first LED mounting space 24 and the inside of each second LED mounting space 25 are sealed with a sealing resin portion 13. That is, the LED element 11 and the bonding wire 12 disposed in each first LED mounting space 24 are sealed by the sealing resin portion 13. Further, the LED element 11 and the bonding wire 12 disposed in each second LED mounting space 25 are sealed by the sealing resin portion 13.

  Incidentally, as shown in FIG. 1, gaps 35 are formed by removing the second metal substrate 23 on both sides of each second LED mounting space 25 in the second metal substrate 23. The gap 35 is filled with the sealing resin portion 13. Thereby, the step parts 29 in the 2nd LED mounting space 25 adjacent to each other are not short-circuited. Similarly, a gap 34 is formed on both sides of each first LED mounting space 24 in the first metal substrate 21 by removing the first metal substrate 21.

  Hereinafter, each component which comprises such an LED element package 10 is demonstrated sequentially.

  The first metal substrate 21 and the second metal substrate 23 of the LED element mounting member 20 are made of a metal material such as copper, copper alloy, 42 alloy (Ni 41% Fe alloy), for example. The thicknesses of the first metal substrate 21 and the second metal substrate 23 can be set to 0.005 mm to 0.4 mm, for example. The materials and thicknesses of the first metal substrate 21 and the second metal substrate 23 may be the same or different from each other.

  The insulating layer 22 of the LED element mounting member 20 can be made of a synthetic resin material such as a polyester resin, a phenol resin, a polyimide resin, a polycarbonate resin, a polysulfone resin, a melamine resin, or an epoxy resin. Preferably it consists of. The insulating layer 22 can have a thickness of, for example, 0.005 mm to 0.1 mm.

  The planar shapes of the first LED mounting space 24 and the second LED mounting space 25 of the LED element mounting member 20 can be variously realized by etching. In the present embodiment, the planar shape of the first LED mounting space 24 and the second LED mounting space 25 is substantially rectangular (see FIG. 1), but is not limited to this, for example, circular, elliptical, polygonal, etc. It is also possible to have a shape.

  The step 28 of the first metal substrate 21 and the step 29 of the second metal substrate 23 are formed by half-etching the first metal substrate 21 and the second metal substrate 23, respectively. The thickness of the stepped portion 28 and the stepped portion 29 can be 20% to 50% of the thickness of the first metal substrate 21 and the second metal substrate 23, respectively.

  Further, the side walls 30 and 31 formed in the first LED mounting space 24 and the side walls 32 and 33 formed in the second LED mounting space 25 are each formed of an inclined surface that expands outward. Thereby, the light from the LED element 11 can be effectively reflected. In addition, the cross-sectional shape of the side walls 30 and 31 and the side walls 32 and 33 may be comprised from the straight line like FIG. 2, or may be comprised from the curve.

  On the other hand, as the LED elements 11 placed in the first LED placement spaces 24 and the second LED placement spaces 25, those conventionally used in general can be used. For the light emitting layer of the LED element 11, for example, by appropriately selecting a material made of a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, AlInGaP, or InGaN, a light emission wavelength ranging from ultraviolet light to infrared light is selected. be able to.

  The LED element 11 is fixed on the first placement surface 26 of each first LED placement space 24 and the second placement surface 27 of each second LED placement space 25 by solder or die bonding paste. As such a die bonding paste, it is possible to select a die bonding paste made of a light-resistant epoxy resin or silicone resin.

  The bonding wire 12 can be made of a material having good conductivity such as gold.

  As the sealing resin portion 13, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the LED element 11 in order to improve the light extraction efficiency. Therefore, it is possible to select an epoxy resin or a silicone resin as a resin that satisfies the characteristics of high heat resistance, weather resistance, and mechanical strength. The shape of the sealing resin portion 13 can be variously realized. In the present embodiment, the shape of the sealing resin portion 13 is a substantially dome shape (see FIG. 2). However, the shape is not limited thereto, and may be a rectangular parallelepiped shape, a hemispherical shape, a conical shape, or the like. .

  Next, the operation of the present embodiment having such a configuration will be described. When the LED element package 10 according to the present embodiment is used, first, the one end portion 23a and the other end portion 23b of the second metal substrate 23 are electrically connected (see FIG. 2). Any means may be used for this electrical connection. For example, the LED element package 10 is mounted in a socket (not shown), and the one end 23a and the other end 23b of the second metal substrate 23 are brought into contact with the electrodes in the socket. Anyway. In this case, the LED element package 10 can be detached from the socket so as to replace the light bulb.

  Thus, when the one end part 23a and the other end part 23b of the 2nd metal substrate 23 are electrically connected, an electric current flows in the 1st LED mounting space 24 from the one end part 23a of the 2nd metal substrate 23. The LED element 11 and the LED elements 11 in each second LED mounting space 25 sequentially flow to the other end 23b of the second metal substrate 23. That is, the LED element 11 in each first LED mounting space 24 and the LED element 11 in each second LED mounting space 25 are connected in series. In this way, current is applied to the LED elements 11 in each first LED mounting space 24 and the LED elements 11 in each second LED mounting space 25, and all the LED elements 11 are lit.

  At this time, the light from the LED elements 11 in each first LED mounting space 24 is reflected by the first mounting surface 26, the stepped portion 28, the side wall 30, and the side wall 31 that are reflecting surfaces. Or the light from the LED element 11 in each 2nd LED mounting space 25 reflects in the 2nd mounting surface 27, the step part 29, the side wall 32, and the side wall 33. FIG. Thereby, the light from the LED element 11 is irradiated outward from both sides of the first metal substrate 21 and the second metal substrate 23.

  On the other hand, the heat generated from the LED element 11 is released to the outside through the first metal substrate 21 or the second metal substrate 23. Therefore, the heat from the LED element 11 does not accumulate in the sealing resin portion 13, and the LED element 11 can be prevented from being destroyed by the heat.

  Next, the manufacturing method of the LED element mounting member and the LED element package according to the present embodiment will be described with reference to FIGS. Among these, FIGS. 3A to 3E are views showing a process of manufacturing the LED element mounting member 20 according to the present embodiment, and FIGS. 4A to 4D are such LED elements. FIG. 5 is a diagram illustrating a process of manufacturing an LED element package 10 using a mounting member 20.

  First, as shown in FIG. 3A, a laminate having a first metal substrate 21, an insulating layer 22 provided on the first metal substrate 21, and a second metal substrate 23 provided on the insulating layer 22. A material (three-layer material) 40 is prepared. Here, the first metal substrate 21 and the insulating layer 22 are fixed to each other by an adhesive, and the insulating layer 22, the second metal substrate 23, and the adhesive are fixed to each other. As described above, the first metal substrate 21 and the second metal substrate 23 are made of a metal material such as copper, copper alloy, 42 alloy (Ni 41% Fe alloy), and the insulating layer 22 is made of, for example, a polyester resin or phenol. It consists of synthetic resin materials such as resin, polyimide resin, polycarbonate resin, polysulfone resin, melamine resin, and epoxy resin.

  Next, resist layers 41 and 42 each having a desired pattern are provided on the surfaces of the first metal substrate 21 and the second metal substrate 23 of the laminate 40 (FIG. 3B). The resist layers 41 and 42 are made of a resin that can be peeled off by an alkali, an acid, a solvent, or the like.

  As shown in FIG. 3B, an opening 41 a is formed in the resist layer 41 on the first metal substrate 21 side in the resist layers 41 and 42 at locations corresponding to the formation sites of the respective first LED mounting spaces 24. The first metal substrate 21 is exposed from the opening 41a. In this case, a resist layer 41 is provided on the entire surface of the first metal substrate 21, the resist layer 41 is exposed through a photomask, and then developed to form an opening 41 a in the resist layer 41.

  On the other hand, in the resist layer 42 on the second metal substrate 23 side, an opening 42a is formed at a position corresponding to the formation site of each second LED mounting space 25, and the second metal substrate 23 is exposed from the opening 42a. ing. In this case, a resist layer 42 is provided on the entire surface of the second metal substrate 23, the resist layer 42 is exposed through a photomask, and then developed to form an opening 42 a in the resist layer 42.

  Next, the first metal substrate 21 and the second metal substrate 23 are etched. As a result, a plurality of first recesses 44 are formed in the openings 41a of the resist layer 41 on the surface side of the first metal substrate 21, and a plurality of openings are formed in the openings 42a of the resist layer 42 on the surface side of the second metal substrate 23. A second recess 45 is formed (FIG. 3C).

  The first recess 44 corresponds to the first LED mounting space 24, and side walls 30 and 31 made of inclined surfaces are formed therein. At this time, the side wall 30 of the first metal substrate 21 is formed thin by half etching, and the stepped portion 28 is formed. On the other hand, the 2nd recessed part 45 respond | corresponds to the 2nd LED mounting space 25, and the side walls 32 and 33 which consist of an inclined surface are formed in the inside. At this time, the side wall 32 of the second metal substrate 23 is thinly formed by half etching to form the stepped portion 29. In this case, each 2nd recessed part 45 is located between the 1st recessed parts 44 which adjoin each other.

  In addition, when the 1st metal substrate 21 and the 2nd metal substrate 23 consist of copper, as etching liquid used by this etching, the aqueous solution containing ferric chloride, the cupric chloride aqueous solution, and the alkali aqueous solution containing a copper ammonium complex ion Etc.

  Note that the gap 34 of the first metal substrate 21 and the gap 35 of the second metal substrate 23 are also formed in this etching step.

  Next, the insulating layer 22 in each first recess 44 and each second recess 45 is etched. As a result, the insulating layer 22 in each first recess 44 is removed to expose the first mounting surface 26, thereby forming a plurality of concave first LED mounting spaces 24 opened on the surface side of the first metal substrate 21. Is done. Further, the insulating layer 22 in each second recess 45 is removed to expose the second mounting surface 27, and a plurality of concave second LED mounting spaces 25 opened on the surface side of the second metal substrate 23 are formed. (FIG. 3D). In addition, as shown in FIG.3 (d), each 2nd LED mounting space 25 is located between adjacent 1st LED mounting space 24 mutually.

In this etching step, when the insulating layer 22 is made of polyimide resin, dry etching using a corrosive gas such as CF ₄ or wet etching using an etching solution can be used. Examples of the etching solution used in the wet etching include chemical solutions in which water or an organic polar solvent is mixed with hydrazine, inorganic alkali, organic alkali, aliphatic amine (diamine), or aliphatic alcohol as a solvent.

  Next, the resist layer 41 is peeled off from the surface of the first metal substrate 21 and the resist layer 42 is peeled off from the surface of the second metal substrate 23 (FIG. 3E). Thus, the LED element mounting member 20 according to the present embodiment is obtained.

  Next, a method for manufacturing the LED element package according to the present embodiment will be described with reference to FIGS.

  First, a plurality of concave first LED mounting spaces 24 are formed on the surface side of the first metal substrate 21 and the surface side of the second metal substrate 23 is formed by the steps shown in FIGS. An LED element mounting member 20 in which a plurality of concave second LED mounting spaces 25 are formed is prepared (FIG. 4A).

  Next, the LED elements 11 are respectively placed in the first LED placement spaces 24 and the second LED placement spaces 25 of the LED element placement member 20 (FIG. 4B). That is, the LED element 11 is mounted and fixed on the first mounting surface 26 in each first LED mounting space 24 via a die bonding paste. Further, the LED element 11 is mounted and fixed on the second mounting surface 27 in each second LED mounting space 25 via a die bonding paste. As this die bonding paste, a die bonding paste made of light-resistant epoxy resin or silicone resin can be used. As another method for mounting the LED element 11, after the LED element 11 is mounted on the mounting surfaces 26 and 27 via a solder paste or a solder vapor deposition film, the entire LED mounting member 20 is heated to the melting temperature of the solder. Solder connection may be used.

  Next, the LED elements 11 in each first LED mounting space 24 are connected to the first metal substrate 21 and the second metal substrate 23 of the LED element mounting member 20, respectively (FIG. 4C). That is, one terminal portion of the LED element 11 and the step portion 28 of the first metal substrate 21 are electrically connected by the bonding wire 12, and the other terminal portion of the LED element 11 and the first metal substrate 23 are first mounted. The mounting surface 26 is electrically connected by the bonding wire 12 (wire bonding).

  Further, the LED elements 11 in each second LED mounting space 25 are connected to the first metal substrate 21 and the second metal substrate 23 of the LED element mounting member 20, respectively (FIG. 4C). That is, one terminal portion of the LED element 11 and the second mounting surface 27 of the first metal substrate 21 are electrically connected by the bonding wire 12, and the other terminal portion of the LED element 11 and the second metal substrate 23 are connected to each other. The stepped portion 29 is electrically connected by the bonding wire 12 (wire bonding).

  Then, the inside of each 1st LED mounting space 24 and the inside of each 2nd LED mounting space 25 are resin-sealed with the sealing resin part 13 (FIG.4 (d)). That is, the LED element 11 and the bonding wire 12 disposed in each first LED mounting space 24 are sealed by the sealing resin portion 13, and the LED element 11 and the bonding wire disposed in each second LED mounting space 25. 12 is sealed with a sealing resin portion 13.

  As described above, according to the present embodiment, the heat from the LED elements 11 placed in the first LED placement spaces 24 and the LED elements 11 placed in the second LED placement spaces 25 is reduced. Since it can escape to the outside through the first metal substrate 21 or the second metal substrate 23, the heat dissipation of the LED element package 10 can be improved.

  Moreover, according to this Embodiment, the 1st mounting surface 26 in each 1st LED mounting space 24, the step part 28, the side wall 30, and the side wall 31, and the 2nd mounting surface of each 2nd LED mounting space 25 27, the step part 29, the side wall 32, and the side wall 33 play a role of a reflector, so that the light reflection characteristics of the LED element package 10 can be enhanced. Moreover, since it is not necessary to provide a reflector separately, the manufacturing cost of the LED element package 10 can be suppressed.

  Further, according to the present embodiment, since the plurality of LED elements 11 are accommodated in the respective first LED mounting spaces 24 and the respective second LED mounting spaces 25, the thickness of the entire LED element package 10 is reduced. can do. Specifically, the thickness of the LED element package 10 can be 0.3 mm to 1 mm.

  Further, according to the present embodiment, in each first LED mounting space 24, one side wall 30 of the first metal substrate 21 is formed thin to form the stepped portion 28, and in each second LED mounting space 25, One side wall 32 of the second metal substrate 23 is formed thin to form a stepped portion 29. As a result, the bonding wires 12 can be accommodated in the first LED mounting space 24 (second LED mounting space 25), so that the thickness of the LED element package 10 can be further reduced.

  Further, according to the present embodiment, since the LED element package 10 is mainly composed of the first metal substrate 21 and the second metal substrate 23 made of metal, the rigidity is enhanced and the moisture absorption resistance is also excellent. Yes.

  In addition, according to the present embodiment, the first metal substrate 21 and the second metal substrate 23 of the laminated material 40 are etched to form a plurality of first recesses 44 and a plurality of second recesses 45 at the same time. be able to. That is, since the first metal substrate 21 and the second metal substrate 23 of the laminated material 40 are etched in one step, the manufacturing cost can be suppressed.

  In addition, in the embodiment mentioned above, various deformation | transformation are possible within the range of the summary of this invention.

  That is, in the present embodiment, the inside of each first LED mounting space 24 is individually sealed with the sealing resin portion 13 and the inside of each second LED mounting space 25 is individually sealed with each sealing resin portion 13. It has stopped. However, the present invention is not limited to this, and as shown in FIG. 5, the sealing resin portion 13 is sealed so as to cover the entire surface of the first metal substrate 21, and the sealing is performed so as to cover the entire surface of the second metal substrate 23. You may seal with the resin part 13. FIG.

  In the present embodiment, three LED elements 11 are arranged in each first LED placement space 24 and each second LED placement space 25. However, the number of LED elements 11 placed in each first LED placement space 24 and each second LED placement space 25 may be one or more, and is not limited thereto.

  In the present embodiment, the first mounting surface 26 in the first LED mounting space 24 is a surface from which the second metal substrate 23 (for example, copper) is exposed, and the second mounting surface 25 in the second LED mounting space 25 is exposed. The mounting surface 27 is a surface from which the first metal substrate 21 (for example, copper) is exposed. However, the present invention is not limited thereto, and a reflective plating layer is formed on the first placement surface 26 in the first LED placement space 24 and on the second placement surface 27 in the second LED placement space 25, The light may be efficiently reflected. Similarly, a plating layer for reflection is formed on the step 28, the side wall 30, and the side wall 31 in the first LED mounting space 24, or on the step 29, the side wall 32, and the side wall 33 in the second LED mounting space 25. Also good. Examples of such a reflective plating layer include silver (Ag), gold (Au), palladium (Pd), and the like.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 6 to 9 are diagrams showing a second embodiment of the present invention. The second embodiment shown in FIGS. 6 to 9 is different in that the LED mounting space 65 is provided only on the second metal substrate 23 side, and other configurations are the same as those of the first embodiment described above. The form is substantially the same. 6 to 9, the same parts as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  First, an outline of the LED element mounting member and the LED element package according to the present embodiment will be described with reference to FIGS.

  The LED element package 50 shown in FIGS. 6 and 7 includes an LED element mounting member 60 and a plurality of LED elements 11 mounted on the LED element mounting member 60.

  The LED element mounting member 60 includes a rectangular first metal substrate 21, a rectangular insulating layer 22 provided on the first metal substrate 21, and a rectangular first metal substrate 21 provided on the insulating layer 22. 2 metal substrate 23.

  Further, as shown in FIG. 7, by partially removing the second metal substrate 23 and the insulating layer 22, a plurality of concave LED mounting spaces 65 opened on the surface side of the second metal substrate 23 are formed. ing. On the other hand, such a concave portion is not formed on the first metal substrate 21.

  The LED placement spaces 65 are arranged at intervals from each other along the longitudinal direction of the second metal substrate 23. Further, the second mounting surface 27 is formed on the bottom surface of each LED mounting space 65 by removing the insulating layer 22 and exposing the first metal substrate 21. Further, in each LED mounting space 65, a side wall 32 and a side wall 33 are formed on the second metal substrate 23. Of these, one side wall 32 is formed thin to form a stepped portion 29.

  On the other hand, a plurality (three in this case) of LED elements 11 are arranged in each LED mounting space 65. The LED elements 11 are connected to the first metal substrate 21 and the second metal substrate 23, respectively. That is, each LED element 11 in the LED mounting space 65 is connected to the second mounting surface 27 of the first metal substrate 21 and the step portion 29 of the second metal substrate 23 by bonding wires (conductive members) 12, respectively. Yes.

  Furthermore, the inside of each LED mounting space 65 is sealed with the sealing resin portion 13. That is, the LED element 11 and the bonding wire 12 arranged in each LED mounting space 65 are sealed by the sealing resin portion 13.

  Next, the operation of the present embodiment having such a configuration will be described. When the LED element package 50 according to the present embodiment is used, first, the one end portion 23a of the second metal substrate 23 and the other end portion 21b of the first metal substrate 21 are electrically connected (see FIG. 7). In this case, the current flows from the one end portion 23 a of the second metal substrate 23 to the other end portion 21 b of the first metal substrate 21 via the LED elements 11 in each LED mounting space 65. That is, the LED elements 11 in each LED mounting space 65 are connected in parallel. In this way, current is applied to the LED elements 11 in each LED mounting space 65, and all the LED elements 11 are lit.

  At this time, light from the LED elements 11 in each LED mounting space 65 is reflected by the second mounting surface 27, the stepped portion 29, the side wall 32, and the side wall 33 that are reflecting surfaces. Thereby, the light from the LED element 11 is irradiated outward from the second metal substrate 23 side.

  On the other hand, heat generated from the LED element 11 is released to the outside mainly through the first metal substrate 21. Therefore, the heat from the LED element 11 does not accumulate in the sealing resin portion 13, and the LED element 11 can be prevented from being destroyed by the heat.

  Next, a method for manufacturing the LED element mounting member and the LED element package according to the present embodiment will be described with reference to FIGS. Among these, FIGS. 8A to 8E are diagrams showing a process of manufacturing the LED element mounting member 60 according to the present embodiment, and FIGS. 9A to 9D are such LED elements. It is a figure which shows the process of producing the LED element package 50 using the mounting member 60. FIG.

  First, as shown in FIG. 8A, a laminate having a first metal substrate 21, an insulating layer 22 provided on the first metal substrate 21, and a second metal substrate 23 provided on the insulating layer 22. A material (three-layer material) 40 is prepared.

  Next, resist layers 41 and 42 are respectively provided on the surfaces of the first metal substrate 21 and the second metal substrate 23 of the laminate 40 (FIG. 8B). The resist layers 41 and 42 are made of, for example, a resin that can be peeled off by alkali, acid, solvent, or the like.

  Of the resist layers 41 and 42, the resist layer 41 on the first metal substrate 21 side is provided on the entire surface of the first metal substrate 21. On the other hand, in the resist layer 42 on the second metal substrate 23 side, an opening 42a is formed at a position corresponding to the formation site of each LED mounting space 65, and the second metal substrate 23 is exposed from the opening 42a. Yes. In this case, a resist layer 42 is provided on the entire surface of the second metal substrate 23, the resist layer 42 is exposed through a photomask, and then developed to form an opening 42 a in the resist layer 42.

  Next, the second metal substrate 23 is etched. Thereby, a plurality of recesses 45 are formed in the opening 42a of the resist layer 42 on the surface side of the second metal substrate 23 (FIG. 8C).

  The recess 45 corresponds to the LED mounting space 65, and side walls 32 and 33 made of inclined surfaces are formed therein. At this time, the side wall 32 of the second metal substrate 23 is thinly formed by half etching to form the stepped portion 29.

  Next, the insulating layer 22 in each recess 45 is etched. Thereby, the insulating layer 22 in each recess 45 is removed to expose the second mounting surface 27, and a plurality of concave LED mounting spaces 65 opened on the surface side of the second metal substrate 23 are formed ( FIG. 8D).

  Next, the resist layer 41 is peeled off from the surface of the first metal substrate 21 and the resist layer 42 is peeled off from the surface of the second metal substrate 23 (FIG. 8E). Thus, the LED element mounting member 60 according to the present embodiment is obtained.

  Next, a method for manufacturing the LED element package according to the present embodiment will be described with reference to FIGS.

  First, the LED element mounting member 60 in which a plurality of concave LED mounting spaces 65 are formed on the surface side of the second metal substrate 23 is prepared by the steps shown in FIGS. FIG. 9A).

  Next, the LED element 11 is mounted in each LED mounting space 65 of the LED element mounting member 60 (FIG. 9B). That is, the LED element 11 is mounted and fixed on the second mounting surface 27 in each LED mounting space 65 via a die bonding paste. As this die bonding paste, a die bonding paste made of light-resistant epoxy resin or silicone resin can be used. As another method for mounting the LED element 11, the LED element 11 is mounted on the mounting surface 27 via a solder paste or a solder vapor deposition film, and then the entire LED mounting member 20 is heated to the melting temperature of the solder. You may connect.

  Next, the LED elements 11 in each LED mounting space 65 are connected to the first metal substrate 21 and the second metal substrate 23 of the LED element mounting member 60, respectively (FIG. 9C). That is, one terminal portion of the LED element 11 and the second mounting surface 27 of the first metal substrate 21 are electrically connected by the bonding wire 12, and the other terminal portion of the LED element 11 and the second metal substrate 23 are connected to each other. The stepped portion 29 is electrically connected by the bonding wire 12 (wire bonding).

  Thereafter, the inside of each LED mounting space 65 is resin-sealed with the sealing resin portion 13 (FIG. 9D). That is, the LED element 11 and the bonding wire 12 arranged in each LED mounting space 65 are sealed by the sealing resin portion 13.

  Also in the present embodiment, it is possible to obtain substantially the same operational effects as in the first embodiment described above.

  Also in the present embodiment, various modifications similar to those described in the first embodiment are possible.

  In addition, in the figure explaining 1st Embodiment and 2nd Embodiment, although the external shape of LED mounting member 20 and 60 was shown by the elongate rectangle, it is not limited to these shapes. The shape of the LED mounting member may be any shape. For example, in the case of a square shape, the LED mounting spaces (24, 25, 65) are arranged in an equidistant grid, and electrical connection is parallel. By appropriately combining the connection and the series connection, the element can be connected to light up. In 1st Embodiment, it has the advantage that LED can be light-emitted on both surfaces of a LED mounting member. In the second embodiment, all LED elements 11 can be electrically connected in parallel. In this case, there is no restriction on the electrical connection, and the LED is mounted at an arbitrary position. A placement space 65 can be arranged.

10, 50 LED element package 11 LED element 12 Bonding wire (conductive member)
DESCRIPTION OF SYMBOLS 13 Sealing resin part 20, 60 LED element mounting member 21 1st metal substrate 22 Insulating layer 23 2nd metal substrate 24 1st LED mounting space 25 2nd LED mounting space 28, 29 Step part 40 Laminating material 44 1st recessed part 45 Second recess (recess)
65 LED mounting space

Claims (12)

In the LED element mounting member for mounting a plurality of LED elements,
A first metal substrate;
An insulating layer provided on the first metal substrate;
A second metal substrate provided on the insulating layer,
By partially removing the first metal substrate and the insulating layer, a plurality of concave first LED mounting spaces opened on the surface side of the first metal substrate are formed,
By partially removing the second metal substrate and the insulating layer, a plurality of concave second LED mounting spaces opened on the surface side of the second metal substrate are formed,
2nd LED mounting space is located between adjacent 1st LED mounting space, The LED element mounting member characterized by the above-mentioned.   In each first LED mounting space, one side wall of the first metal substrate is formed thin to form a stepped portion, and in each second LED mounting space, one side wall of the second metal substrate is formed thinly to form a stepped portion. The LED element mounting member according to claim 1, wherein the LED element mounting member is formed. In the LED element mounting member for mounting a plurality of LED elements,
A first metal substrate;
An insulating layer provided on the first metal substrate;
A second metal substrate provided on the insulating layer,
A plurality of concave LED placement spaces opened on the surface side of the second metal substrate are formed by partially removing the second metal substrate and the insulating layer, and an LED element placement member characterized in that .   The LED element mounting member according to claim 3, wherein in each LED mounting space, one side wall of the second metal substrate is formed thin to form a stepped portion. In LED element package,
The LED element mounting member according to claim 1 or 2,
LED elements placed in each first LED placement space and each second LED placement space of the LED element placement member,
LED elements in each first LED mounting space are connected to the first metal substrate and the second metal substrate of the LED element mounting member,
LED elements in each second LED mounting space are connected to the first metal substrate and the second metal substrate of the LED element mounting member,
An LED element package, wherein each first LED mounting space and each second LED mounting space are sealed with a sealing resin portion.   6. The LED element package according to claim 5, wherein a plurality of LED elements are placed in each of the first LED placement spaces and each of the second LED placement spaces of the LED element placement member. In LED element package,
The LED element mounting member according to claim 3 or 4,
LED elements mounted in each LED mounting space of the LED element mounting member,
The LED elements in each LED mounting space are connected to the first metal substrate and the second metal substrate of the LED element mounting member,
An LED element package, wherein each LED mounting space is sealed with a sealing resin portion.   The LED element package according to claim 7, wherein a plurality of LED elements are mounted in each LED mounting space of the LED element mounting member. In the manufacturing method of the LED element mounting member for mounting a plurality of LED elements,
Preparing a laminate having a first metal substrate, an insulating layer provided on the first metal substrate, and a second metal substrate provided on the insulating layer;
By etching the first metal substrate and the second metal substrate of the laminated material, a plurality of first recesses are formed on the surface side of the first metal substrate, and a plurality of first recesses are formed on the surface side of the second metal substrate. 2 forming a recess;
By etching the insulating layer in each first recess and each second recess, a plurality of concave first LED mounting spaces opened on the surface side of the first metal substrate and the surface side of the second metal substrate And a step of forming a plurality of concave second LED mounting spaces positioned between adjacent first LED mounting spaces, respectively, and a method for manufacturing an LED element mounting member . In the manufacturing method of the LED element mounting member for mounting a plurality of LED elements,
Preparing a laminate having a first metal substrate, an insulating layer provided on the first metal substrate, and a second metal substrate provided on the insulating layer;
Forming a plurality of recesses on the surface side of the second metal substrate by etching the second metal substrate of the laminated material; and
And a step of forming a plurality of concave LED mounting spaces opened on the surface side of the first metal substrate by etching the insulating layer in each concave portion. Manufacturing method of member. In the manufacturing method of the LED element package,
The step of manufacturing the LED element mounting member by the method for manufacturing the LED element mounting member according to claim 9,
A step of placing LED elements in each first LED placement space and each second LED placement space of the LED element placement member; and
Connecting the LED elements in each first LED mounting space to the first metal substrate and the second metal substrate of the LED element mounting member, respectively;
Connecting the LED elements in each second LED mounting space to the first metal substrate and the second metal substrate of the LED element mounting member, respectively;
And a step of resin-sealing each first LED mounting space and each second LED mounting space with a sealing resin portion. In the manufacturing method of the LED element package,
A step of manufacturing an LED element mounting member by the method for manufacturing an LED element mounting member according to claim 10;
A step of placing the LED element in each LED placement space of the LED element placement member;
Connecting the LED elements in each LED mounting space to the first metal substrate and the second metal substrate of the LED element mounting member, respectively;
And a step of resin-sealing each LED mounting space with a sealing resin portion.

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