JP2008294102A - Manufacturing method of wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board which has excellent heat dissipation characteristics without complicating works. <P>SOLUTION: A manufacturing method includes a fixation stage of fixing a metal plate 2 and a support 4 for supporting the metal plate 2 across an adhesion layer 3 having adhesive property; a projection portion formation stage of forming a recessed portion where the metal plate 2 is broken by etching away a portion of the metal plate 2 and leaving the remaining portion of the metal plate 2 as a projection portion; a charging stage of charging the whole or a portion of the recessed portion with a prepreg 7 as an insulator and fixing the projection portion 5 and prepreg 7 by pressing accompanied by heating to form a fixed body 9; a wiring layer formation stage of forming a wiring layer 11 on the fixed body 9; and a peeling stage of removing the adhesion layer 3 and support 4 from the fixed body 9. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring board.

  For high-density mounting of highly heat-generating components such as light emitting diodes, a high heat dissipation property is required for the wiring board on which the components are mounted. Therefore, as a means of obtaining a wiring board with good heat dissipation, a metal clad material laminated in two or more layers is used, and a columnar portion that becomes a convex portion is formed by etching the metal plate on the surface. There has been proposed a technique for manufacturing a wiring board in which an insulating layer is formed around (see Patent Document 1). Since the wiring board obtained by this manufacturing technique can use the columnar part as a heat sink, the heat dissipation is good.

International Publication No. 2007/037075 Pamphlet

  However, the metal clad material can be manufactured by processing in a vacuum, but the operation is complicated.

  Therefore, the problem to be solved by the present invention is to provide a wiring board with good heat dissipation without complicating work.

  In order to solve the above problems, a method of manufacturing a wiring board according to the present invention includes a fixing step of fixing a metal plate and a support that supports the metal plate via an adhesive layer having adhesiveness, A convex part forming step in which a part is removed to form a concave part that is not connected to the metal plate, and the remaining part of the metal plate is a convex part, and all or part of the concave part is filled with an insulator, and the convex part and the insulator There are a filling step for forming a fixed object to which the material is fixed, a wiring layer forming step for forming a wiring layer on the surface of the fixed object, and a peeling step for removing the adhesive layer and the support from the fixed object.

  According to the method for manufacturing a wiring board according to the present invention, since the metal plate remaining as the convex portion serves as a heat sink, it is possible to provide a wiring board with good heat dissipation. Further, in the work of manufacturing the wiring board, the metal plate is processed into a convex portion with the metal plate fixed by the support and the adhesive layer, and the insulator and the convex portion are fixed by filling the insulator. After forming the fixed object, a peeling step for removing the adhesive layer and the support from the fixed object is performed. Thus, the work of fixing and peeling the metal plate and the support through the adhesive layer can be performed in the air, so that workability is improved.

  In another wiring board manufacturing method according to the present invention, in addition to the above-described invention, the wiring layer forming step includes forming a front wiring layer on the surface of the fixed object opposite to the surface facing the adhesive layer. A layer forming step; By adopting this method, if the etching method is adopted to remove a part of the metal plate and the convex portion is exposed on the surface opposite to the surface facing the adhesive layer, the convex portion is exposed. Is smaller than the exposed area of the convex portion of the surface facing the adhesive layer. Therefore, it becomes easy to pattern the wiring layer avoiding the exposed surface on the exposed surface having a small convex portion.

  In addition to the above-described invention, another method of manufacturing a wiring board according to the present invention includes placing a copper foil on an insulator or a fixed object in a wiring layer forming step, and pressing the copper on the convex part and the fixed object with a press. A step of fixing the foil. By adopting this method, the adhesion strength between the wiring layer and the fixed object on the insulator can be increased.

  In addition to the above-described invention, another method for manufacturing a wiring board according to the present invention includes: a wiring layer forming step in which powder is applied to the exposed adhesive layer after the convex portion forming step and before the filling step; After the deposition step and the peeling step, a roughening step for removing the powder to roughen the surface of the fixed object, a plating step for forming an electroless plating layer on the surface of the roughened insulator, A back side wiring layer forming step of removing a part of the electroless plating layer and forming a back side wiring layer on the side of the surface facing the adhesive layer of the fixed object using the remaining electroless plating layer. By adopting this method, the back wiring layer can be formed on the surface of the fixed object facing the adhesive layer. Therefore, when it also has a front side wiring layer, a wiring layer can be formed on both surfaces of a fixed thing.

  In addition to the above-described invention, another method for manufacturing a wiring board according to the present invention includes a step of forming a conductive layer on the exposed adhesive layer after the convex portion forming step and before the filling step. After the layer forming step and the peeling step, a part of the exposed conductive layer is removed, and the back side wiring layer forming step for forming the back side wiring layer on the side facing the adhesive layer of the fixed object using the remaining conductive layer And having. By adopting this method, the back wiring layer can be formed on the surface of the fixed object facing the adhesive layer. Therefore, when it also has a front side wiring layer, a wiring layer can be formed on both surfaces of a fixed thing.

  In addition to the above-described invention, another method for manufacturing a wiring board according to the present invention includes a step of depositing conductive powder on the adhesive layer. By adopting this method, the conductive layer forming step can be performed by an easy method such as spraying conductive powder.

  In addition to the above-described invention, another method for manufacturing a wiring board according to the present invention is a conductive resist layer that is not removed when a part of the metal plate is removed on the surface facing the adhesive layer of the metal plate. A conductive layer forming step for forming a conductive layer on the exposed resist layer by electrolytic plating after the convex forming step and before the filling step; and after the peeling step, the exposed resist layer is removed and further conductive A backside wiring layer forming step of removing a part of the layer and forming a backside wiring layer on the surface facing the adhesive layer of the fixed object using the remaining conductive layer. By adopting this method, the back wiring layer can be formed on the surface of the fixed object facing the adhesive layer. Therefore, when it also has a front side wiring layer, a wiring layer can be formed on both surfaces of a fixed thing.

  Moreover, in addition to the above-mentioned invention, the manufacturing method of the wiring board which concerns on another this invention has the wiring layer and the convex part contacting. By adopting this method, the heat accumulated in the wiring board is efficiently transmitted to the convex portion serving as a heat sink through the wiring layer.

  In addition to the above-described invention, a method for manufacturing a wiring board according to another aspect of the present invention forms a plurality of wiring layers, and the plurality of wiring layers are connected by convex portions. By adopting this method, the convex portion can also serve to connect the wirings of a plurality of wiring layers. In particular, when the wiring layers are formed on both surfaces of the fixed object, the wiring layers can be electrically connected to both surfaces of the fixed object by the convex portions.

  In addition to the above-described invention, the method for manufacturing a wiring board according to the present invention includes a base material and first and second sheet-like sheets having adhesiveness formed on both sides of the base material. The pressure-sensitive adhesive force of the second pressure-sensitive adhesive layer facing the support is stronger than that of the first pressure-sensitive adhesive layer on the opposite side across the substrate. By adopting this method, when stress is applied so as to peel off the fixed object and the support in the peeling process, the adhesive layer is peeled off in a state of being bonded to the support. Therefore, the operation of peeling only the adhesive layer from the fixed object is not required without the adhesive layer adhering to the fixed object side.

  In addition to the above-described invention, another method for manufacturing a wiring board according to the present invention is such that the adhesive layer and the support are used repeatedly. By adopting this method, the manufacturing cost of the wiring board can be reduced.

  According to the present invention, a wiring board with good heat dissipation can be provided without complicating work.

(First embodiment)
A method for manufacturing the wiring board 1 according to the first embodiment will be described with reference to the drawings. FIG. 1 and FIG. 2 are diagrams showing each process of manufacturing the wiring board 1 as a work in progress of the wiring board 1 and a longitudinal sectional view of the wiring board 1. As the process proceeds from (A) to (H) in FIG. 1 and then from (A) to (C) in FIG. 2, the manufacture of the wiring board 1 proceeds.

  In the method of manufacturing the wiring board 1 of the first embodiment, as shown in FIG. 1A, first, a metal plate 2, an adhesive layer 3, and a support 4 that supports the metal plate 2 are prepared. Here, the metal plate 2 is a copper plate.

  For the adhesive layer 3, the product name “TACSIL F20” manufactured by TACONIC is used. The adhesive layer 3 uses a sheet in which glass cloth is mixed into polytetrafluoroethylene (PTFE) as a base material. And the sheet-like 1st adhesion layer (illustration omitted) which has adhesiveness formed in one side of the substrate consists of a silicon compound. And the sheet-like 2nd adhesion layer (illustration omitted) which has adhesiveness formed in the other side of the substrate is a high heat-resistant silicon adhesive. The second adhesive layer has an adhesive force that is five times or more that of the first adhesive layer. The first and second adhesive layers and the substrate have heat resistance, acid resistance and alkali resistance. And even if the adhesive strength of the first adhesive layer decreases due to repeated use of the support 4, the adhesive strength is restored by washing with an alcohol-based organic solvent such as ethyl alcohol or isopropyl alcohol. it can.

  A stainless steel plate is used for the support 4. Then, as shown in FIG. 1B, the metal plate 2 and the support 4 are fixed via the adhesive layer 3. At this time, the first adhesive layer of the adhesive layer 3 is fixed to the metal plate 2, and the second adhesive layer of the adhesive layer 3 is fixed to the support 4. This completes the fixing process.

  Next, as shown in FIG. 1C, a resist 6 made of nickel is disposed on the exposed surface of the metal plate 2 at a location where the convex portion 5 serving as a heat sink is to be formed. When ammonia alkaline etching is performed, as shown in FIG. 1D, the metal plate 2 other than the portion where the resist 6 is disposed dissolves, and the metal plate 2 is partially removed and the metal plate is not connected. And the remaining convex part 5 is formed. This completes the convex portion forming step. In addition, since the adhesive layer 3 has the alkali-resistant first pressure-sensitive adhesive layer, the adhesive layer 3 is not dissolved even by ammonia alkali etching, and is in an exposed state without substantially reducing the pressure-sensitive adhesive force of the first pressure-sensitive adhesive layer. Then, when the resist 6 is removed using a nickel release agent, only the convex portion 5 is fixed to the adhesive layer 3 and the support 4 as shown in FIG.

  Next, as shown in FIG. 1 (F), three prepregs 7 in which a glass fiber sheet is impregnated with an epoxy resin are overlapped and placed on the adhesive layer 3. For that purpose, a hole is made in the portion of the prepreg 7 corresponding to the position of the convex portion 5, and the convex portion 5 is passed through the hole. Then, the prepreg 7 is not disposed in a portion corresponding to the metal plate 2 removed by etching to form the top portion of the convex portion 5. This prepreg 7 corresponds to an insulator. That is, a part of the recess is filled with an insulator. And the copper foil 8 is arrange | positioned over the convex part 5 and the whole upper surface of the prepreg 7. FIG.

  And the copper foil 8, the convex part 5, and the prepreg 7 are pressed from upper direction, heating. Then, as shown in FIG. 1 (G), the three prepregs 7 are melted and hardened, and the protrusions 5 and the copper foil 8 are fixed together to form a fixed object 9. Further, the copper foil 8 is firmly fixed to the convex portion 5 and the fixed object 9. This completes the filling process. In FIG. 1 (G), only the portion where the prepreg 7 is integrated by a press with heating is denoted by the symbol “9” of the fixed object 9, but the fixed object 9 is heated by the prepreg 7. It is a member in which both the part integrated by pressing and the convex part 5 are integrated.

  Next, the surface of the copper foil 8 is polished. This polishing is performed until the upper surface of the convex portion 5 is exposed as shown in FIG. As a result of this polishing, the upper surfaces of the copper foil 8 and the convex portion 5 are roughened. Copper plating is applied to the roughened surface as shown in FIG. 2A to form a copper plating layer 10. The plating method executed here is an electrolytic plating method.

  Next, a resist having a shape corresponding to the wiring pattern is disposed on the upper surface of the copper plating layer 10 and alkali etching is performed. Then, the resist is removed, and the remaining copper foil 8 and copper plating layer 10 remain as a wiring pattern shape, and a wiring layer 11 is formed as shown in FIG. This completes the wiring layer forming step (front side wiring layer forming step). The wiring layer 11 becomes a front wiring layer. Here, the front side means a surface opposite to the surface of the fixed object 9 facing the adhesive layer 3, and the back side means the surface side of the fixed object 9 facing the adhesive layer 3. The back is a temporary name. Further, the wiring layer 11 and the convex portion 5 are in contact with each other.

  Next, stress is applied to both in the direction in which the support 4 and the fixed object 9 are peeled off. Then, as shown in FIG. 2C, the interface between the fixed object 9 and the first adhesive layer of the adhesive layer 3 is peeled off. However, the interface between the support 4 and the adhesive layer 3, that is, the adhesion between the support 4 and the second adhesive layer is maintained. This completes the peeling process and the production of the wiring board 1 according to the first embodiment. As a result, the wiring board 1 according to the present embodiment can be obtained. Further, the support 4 and the adhesive layer 3 can be repeatedly used in the production of the next wiring board 1 in a state where the support 4 and the adhesive layer 3 are adhered to each other.

(Second Embodiment)
A method of manufacturing the wiring board 1A according to the second embodiment will be described with reference to the drawings. 3 and 4 are diagrams showing each process of manufacturing the wiring board 1A according to the second embodiment as a work in progress of the wiring board 1A and a longitudinal sectional view of the wiring board 1A. As the process proceeds from (A) to (H) in FIG. 3 and then from (A) to (E) in FIG. 4, the manufacture of the wiring board 1A proceeds. In addition, the same code | symbol as the code | symbol in FIG. 1 and FIG. 2 is attached | subjected and demonstrated to the member same as the wiring board 1 which concerns on 1st Embodiment, and the member which has the same function.

  In the method of manufacturing the wiring board 1A of the second embodiment, the method and the members used until the convex part 5 shown in FIGS. 3A to 3E is formed are the wiring board 1 of the first embodiment. Since the manufacturing method is the same as that shown in FIGS. 1A to 1E, the description thereof will be omitted.

  FIG. 3F shows a state in which a part of the conductive layer is formed on the exposed first adhesive layer of the adhesive layer 3. A part of this conductive layer is a layer formed of a copper powder layer 12 made of copper powder that becomes conductive powder. The copper powder layer 12 is formed by collecting an excess amount on the first adhesive layer by a powder spraying method (sprinkling method) and collecting the portion not deposited on the first adhesive layer. Therefore, the thickness of the copper powder layer 12 is substantially uniform on the first adhesive layer. This completes a part of the conductive layer forming step.

  Next, as shown in FIG. 3G, an electrolytic copper plating layer 13 is formed on the copper powder layer 12 by an electrolytic plating method. This electrolytic copper plating layer 13 becomes a part of the conductive layer. The copper powder layer 12 and the electrolytic copper plating layer 13 constitute a conductive layer. This completes the entire conductive layer forming step.

  3H, FIG. 4A, and FIG. 4B are substantially the same as the descriptions of FIG. 1F, FIG. 1G, and FIG. 2C, respectively. Omitted. Here, the fixed object 9A shown in FIG. 4 (A) and FIG. 4 (B) is a copper powder to the fixed object 9 shown in FIG. 1 (G), FIG. 1 (H) and FIG. 2 (A) to (C). Since the layer 12 and the electrolytic copper plating layer 13 are added, it is referred to as “fixed matter 9A” in order to distinguish it from the fixed matter 9. In the second embodiment, the support 4 is peeled off from the fixed object 9A before the wiring layer 11 is formed.

  FIG. 4C shows a state in which the surface of the copper foil 8 of the fixed object 9A after the peeling process has been polished. This polishing is performed until the upper surface of the convex portion 5 is exposed. The copper powder layer 12 is also polished. As a result of this polishing, the upper surfaces of the copper foil 8 and the convex portion 5 are roughened. Moreover, a part or all of the copper powder layer 12 is removed, the electrolytic copper plating layer 13 is exposed, and the surface of the electrolytic copper plating layer 13 is also roughened. Hereinafter, the fixed object from which the copper powder layer 12 is partially or entirely removed from the state of the fixed object 9A is referred to as a fixed object 9B.

  Copper plating is performed on those roughened surfaces as shown in FIG. 4 (D), a copper plating layer 10 is formed on the upper surfaces of the copper foil 8 and the protrusions 5, and the surface of the electrolytic copper plating layer 13 is formed. The copper plating layer 10A is also formed. The plating method performed here is an electrolytic plating method performed using the electrolytic copper plating layer 13 which is a part of the conductive layer.

  Next, a resist having a shape corresponding to the wiring pattern is disposed on the upper surfaces of the copper plating layer 10 and the copper plating layer 10A, alkali etching is performed, and then the resist is removed to leave the remaining copper foil 8, the convex portion 5, Electrolytic copper plating layer 13 and copper plating layer 10A remain as the wiring pattern shape, and as shown in FIG. 4E, wiring layers 11 and 11A are formed on both surfaces of fixed object 9B. This completes the wiring layer forming step (front side wiring layer forming step, back side wiring layer forming step) and the manufacturing of the wiring board 1A according to the second embodiment. As a result, the wiring board 1A according to the present embodiment can be obtained.

  Similar to the wiring layer 11 shown in FIG. 2C, the wiring layer 11 is a wiring layer formed on the surface opposite to the surface of the fixed object 9B facing the adhesive layer 2. The wiring layer 11 </ b> A is a wiring layer formed on the surface of the fixed object 9 </ b> B facing the adhesive layer 2. The wiring layer 11A is composed of an electrolytic copper plating layer 13 and a copper plating layer 10A. Here, the wiring layer 11 is a front side wiring layer, and the wiring layer 11A is a back side wiring layer. Further, part or all of the wiring layers 11 and 11A are in contact with the convex portion 5. Further, a plurality of wiring layers 11 and 11A are formed on both surfaces of the fixed object 9B, and the plurality of wiring layers 11 and 11A are connected by the convex portion 5.

(Main effects of the first and second embodiments)
As described above, the method for manufacturing the wiring boards 1 and 1A according to the first and second embodiments includes the fixing step of fixing the metal plate 2 and the support 4 via the adhesive layer 3. And it has the convex part formation process which removes a part of metal plate 2 by etching, forms a recessed part, and makes the remainder of the metal plate 2 the convex part 5. FIG. And it has the filling process which fills a part of recessed part with the prepreg 7 as an insulator, and forms the fixed thing 9 which fixed the convex part 5 and the prepreg 7 with the press with a heating. And it has the wiring layer formation process which forms the wiring layer 11 in the surface of the adhering thing 9. FIG. And it has the peeling process which removes the contact bonding layer 3 and the support body 4 from the fixed thing 9. FIG. As a result, the manufactured wiring boards 1 and 1A are provided with the convex portions 5 serving as heat sinks, and the wiring boards 1 and 1A having good heat dissipation can be provided. In addition, since the work for fixing and peeling the metal plate 2 and the support 4 through the adhesive layer 3 can be performed in the air, workability is improved.

  Further, in the wiring layer forming step according to the first and second embodiments, the front side wiring layer forming step of forming the front side wiring layer 11 on the surface of the fixed object 9 opposite to the surface facing the adhesive layer 3. It is carried out. In this embodiment, an etching method is employed to remove a part of the metal plate 2, and the convex portion 5 is exposed on the surface opposite to the surface facing the adhesive layer 3. Then, the exposed area of the convex portion 5 on the surface opposite to the surface facing the adhesive layer 3 is smaller than the exposed area of the convex portion 5 on the surface facing the adhesive layer. Therefore, it becomes easy to pattern the front side wiring layer 11 while avoiding the exposed surface of the convex portion 5 with the small exposed surface of the convex portion 5. Further, in the wiring layer forming process according to the first embodiment, the front-side wiring layer 11 can be formed while the fixed object 9 is fixed to the support body 4, and the work can be performed in a state in which the fixed object 9 is easy to handle. Can do.

  Further, in the front side wiring layer forming step according to the first and second embodiments, the copper foil 8 is placed on the prepreg 7 and the convex portion 5, and the convex portion is pressed by a press accompanied by heating from above. The copper foil 8 is fixed to 5 and the fixed objects 9 and 9A. As a result, the adhesion strength between the front wiring layer 11 and the adherents 9 and 9A can be increased. In particular, the epoxy resin part once melts when the press is heated. Since the melt in this state plays the role of an adhesive, the adhesion strength between the front-side wiring layer 11 and the fixed substances 9 and 9A can be further increased after it has solidified.

  In the backside wiring layer forming step according to the second embodiment, the copper powder layer 12 and the electrolytic copper plating layer 13 are formed in this order on the exposed adhesive layer 3 to form a conductive layer, and the backside is formed after the peeling step. A wiring layer 11A is formed. Thus, the back wiring layer 11A can be formed on the surface of the fixed object 9A facing the adhesive layer 3. Therefore, when it also has the front side wiring layer 11, the wiring layers 11 and 11A can be formed on both surfaces of the fixed object 9A. The electrolytic copper plating layer 13 has an advantage that it is easy to perform fine patterning.

  Moreover, the conductive layer forming step according to the second embodiment includes a step of depositing copper powder on the adhesive layer 3. Thereby, the conductive layer forming step can be performed by an easy method such as a powder dispersion method.

  Further, in the wiring boards 1 and 1A according to the first and second embodiments, a part or all of the wiring layers 11 and 11A and the convex portion 5 are in contact with each other. As a result, the heat accumulated in the wiring boards 1 and 1A can be efficiently transmitted to the convex portion 5 serving as a heat sink via the wiring layers 11 and 11A.

  Further, the wiring board 1A according to the second embodiment includes a plurality of wiring layers 11 and 11A, and the plurality of wiring layers 11 and 11A are connected by the convex portion 5. Thus, the front wiring layer 11 and the wiring layer 11A formed on both surfaces of the fixed object 9B can be electrically connected by the convex portion 5.

  In addition, the adhesive layer 3 according to the first and second embodiments includes a base material and first and second adhesive layers in the form of adhesive sheets formed on both surfaces of the base material. . And the adhesive force of the 1st adhesive layer facing the support body 4 shall be stronger than the adhesive force of the 2nd adhesive layer on the opposite side across the base material. By this, when a stress is applied in the peeling process in a direction in which the fixed objects 9, 9A and the support 4 are peeled off, the adhesive layer 3 can be peeled off in a state of being bonded to the support. Therefore, the adhesive layer 3 does not adhere to the fixed objects 9 and 9A, and the work of peeling only the adhesive layer 3 from the fixed objects 9 and 9A is not required.

  Further, the adhesive layer 3 and the support 4 according to the first and second embodiments are repeatedly used. Moreover, even if the adhesive strength of the first adhesive layer is reduced by use, the adhesive strength is restored by washing with an alcohol-based organic solvent. This can reduce the manufacturing cost of the wiring boards 1 and 1A.

(Other forms)
The above-described first and second embodiments are examples of preferred embodiments of the present invention, but the present invention is not limited thereto, and various modifications can be made without departing from the scope of the present invention.

  In the first and second embodiments described above, the front wiring layer 11 is formed on the surface of the fixed object 9, 9A opposite to the surface facing the adhesive layer 3. However, a wiring layer such as the back-side wiring layer 11A may be formed only on the surface of the fixed objects 9, 9A facing the adhesive layer 3. The wiring layer can also be formed on the inner layer of the wiring board, and can be a multilayer wiring board such as a four-layer board or an eight-layer board.

  In the second embodiment described above, the back wiring layer 11 </ b> A is formed on the surface of the fixed object 9 </ b> A that faces the adhesive layer 3. However, the method of forming the wiring layer on the surface of the fixed objects 9 and 9A facing the adhesive layer 3 is not limited to the method in the second embodiment.

  For example, as another method for manufacturing a wiring board, the above-described fixing step, convex portion forming step, filling step, wiring layer forming step, and peeling step are included. And in a wiring layer formation process, it is made to have the powder application | coating process which adheres powder to the exposed contact bonding layer 3 after a convex part formation process and before a filling process. And after a peeling process, it is made to have a roughening process which removes powder and roughens the surface of a fixed thing. And it has a plating process which forms an electroless plating layer on the surface of the roughened fixed object. Then, a part of the electroless plating layer is removed, and a back side wiring layer forming step of forming a back side wiring layer using the remaining electroless plating layer is provided. By passing through such a process, a back side wiring layer can be formed on the surface of the fixed object facing the adhesive layer 3.

  Here, the powder used in the above-described powder deposition step is preferably one that can be removed by acid treatment or the like. For example, calcium carbonate powder is suitable. By performing the roughening process using such a powder, the adhesion between the electroless plating layer formed in the plating process and the fixed substance is improved.

  Further, for example, as another method for manufacturing a wiring board, the above-described fixing step, convex portion forming step, filling step, wiring layer forming step, and peeling step are included. Then, a conductive resist layer that is not removed when part of the metal plate is removed is provided on the side of the metal plate facing the adhesive layer. And after a convex part formation process and before a filling process, it is made to have the conductive layer formation process which forms a conductive layer by the electroplating method to the exposed resist layer. Then, after the peeling process, the exposed resist layer is removed, a part of the conductive layer is further removed, and a back side wiring layer is formed on the side of the surface facing the adhesive layer of the fixed object using the remaining conductive layer. A wiring layer forming step is included. By passing through such a process, a back side wiring layer can be formed on the surface of the fixed object facing the adhesive layer 3.

  Here, as the resist layer, for example, a nickel foil or the like that is not removed by ammonia alkali etching for forming the convex portion 5 in the convex portion forming step is used. Then, using the conductivity of the resist layer, a plating layer (conductive layer) such as copper is formed on the surface of the resist layer by electrolytic plating. Thereafter, the resist layer is removed with a release agent. Then, the conductive layer is used as a back side wiring layer by a method such as etching. This plated layer of copper or the like has an advantage that it is easy to perform fine patterning. Note that the resist 6 may be disposed on the surface of the metal plate 2 in advance on the surface of the metal plate 2 opposite to the resist layer.

  In the first and second embodiments described above, the product name “TACSIL F20” manufactured by TACONIC is used as the adhesive layer 3. However, the adhesive layer 3 can be made of a material other than this material. For example, the product name “TACSIL F20-L” manufactured by TACONIC may be used.

  In the first and second embodiments described above, the adhesive layer 3 is a sheet having a base material and first and second adhesive layers formed on both surfaces of the base material, and is supported. The adhesive strength of the second adhesive layer facing the body 4 is 5 times or more stronger than the adhesive strength of the first adhesive layer on the opposite side across the substrate. However, the base material is not an essential component of the adhesive layer 3. The adhesive layer 3 may have a base material, and the same and the same adhesive layer may be provided on both surfaces of the base material. Moreover, the adhesive layer which consists of another material may be distribute | arranged on both surfaces of a base material, and the adhesive force may be varied. Furthermore, it is good also as the same, without making the adhesive force of those adhesive layers differ. Moreover, when making the adhesive force of another adhesive layer arrange | positioned on both surfaces of the base material of the adhesive layer 3 differ, the adhesive force of the adhesive layer facing the support body 4 is set to the adhesive force of the adhesive layer on the opposite side across the base material. It may be weaker than. Further, even if the adhesive force of the second adhesive layer facing the support 4 is stronger than the adhesive force of the first adhesive layer on the opposite side across the substrate, the adhesive force of the second adhesive layer is used. A force having a strength of 1.5 times, 2 times, 3 times, 4 times, 6 times, 10 times, or the like may be used instead of the force that is 5 times stronger than the adhesive strength of the first adhesive layer. Furthermore, it is good also as what uses the adhesive force of a 2nd adhesion layer 10 times or more stronger than the adhesive force of a 1st adhesion layer.

  In the first and second embodiments described above, the adhesive layer 3 and the support 4 are repeatedly used. However, the adhesive layer 3 or the support 4 that can be used only once may be used.

  In the manufacturing process of the first and second embodiments described above, the convex portion 5 on the side not facing the adhesive layer 3 is exposed. Further, a part of the recess is filled with an insulator. However, the entire recess can be filled with an insulator. Furthermore, the convex part 5 on the side not facing the adhesive layer 3 may be covered with an insulator such as the prepreg 7 so that the concave part and the area other than the concave part are filled with an insulator so as not to be exposed. Thus, even if the convex part 5 on the side not facing the adhesive layer 3 is not exposed, the convex part 5 can serve as a heat sink. Further, by insulating without exposing the convex portion 5 on the side not facing the adhesive layer 3, the area of the insulator on the surfaces of the fixed objects 9 and 9 B not facing the adhesive layer 3 is increased. The degree of freedom of patterning can be increased.

  In the second embodiment described above, the wiring board 1 </ b> A has the front-side wiring layer 11 and the back-side wiring layer 11 </ b> A, and these wiring layers 11 and 11 </ b> A are connected by the convex portion 5. However, the wiring layers 11 and 11A may not be connected by the convex portion 5. Further, even when a plurality of wiring layers are connected by the convex portion 5, such a configuration may be realized on one side of the fixed object 9B. For example, a plurality of front side wiring layers 11 can be brought into contact with the same convex portion 5. The configuration in which the plurality of front-side wiring layers 11 are brought into contact with the same convex portion 5 can also be realized on the surface on which the front-side wiring layer 11 of the fixed object 9 of the first embodiment described above is formed.

  In the first and second embodiments described above, the metal plate 2 is a copper plate, and the support 4 is a stainless plate. However, the materials of the metal plate 2 and the support 4 are not limited to these, and the metal plate 2 and the support 4 of other materials can be used as appropriate. For example, the metal plate 2 can be made of etchable stainless steel, aluminum, chromium, gold, iron, or the like. However, copper is preferable as a material of the metal plate 2 (convex portion 5) because it is inexpensive and excellent in thermal conductivity. In addition to the metal such as aluminum, the support 4 can be made of resin or resin mixed with glass fiber.

  Moreover, in 2nd Embodiment mentioned above, the copper powder is made to adhere to the contact bonding layer 3 at a conductive layer formation process. However, metal foil such as copper foil may be attached to the adhesive layer 3 instead of metal powder such as copper powder. In the case of using a metal foil, there is a possibility that the subsequent step of forming the electrolytic copper plating layer 13 can be omitted if a metal foil having a sufficiently thick thickness is used.

  In the first and second embodiments described above, in the front side wiring layer forming step, the copper foil 8 is placed on the prepreg 7, and the convex portion 5 and the fixed objects 9, 9A are pressed by a press with heating. A copper foil 8 is fixed to the surface. However, when an adhesive or the like that cures at room temperature is used as the insulator, heating is not necessary. Moreover, if the adhesive etc. which harden | cure at normal temperature are used as an insulator, and the electroless plating is given to the surface of the convex part 5 and the fixed thing after that, the copper foil 8 and a press are not required. Moreover, in 2nd Embodiment, it is good also as performing the press which adheres the electrolytic copper plating layer 13 and the fixed thing 9B after a peeling process.

  In the first and second embodiments described above, the electrolytic plating method is employed for forming the copper plating layer 10 and the electrolytic copper plating layer 13. However, an electroless plating method may be employed instead of the electrolytic plating method. Moreover, you may employ | adopt methods, such as sticking metal foil, such as copper foil, irrespective of an electrolytic plating method.

  In the first and second embodiments described above, when forming the front-side wiring layer 11, the resist 6 made of nickel is formed on the exposed surface of the metal plate 2 at a place where the convex portion 5 is to be formed. Arranged after the fixing step. However, the resist 6 may be arranged on the surface of the metal plate 2 in advance. The resist 6 may be made of copper, tin, solder or the like instead of nickel, or a dry film made of resin.

It is a figure which shows the manufacturing method of the wiring board which concerns on the 1st Embodiment of this invention, and is a figure which shows each process as a work-in-process of a wiring board and a longitudinal cross-sectional view of a wiring board, and progresses from (A) to (H) It is a figure which shows the condition where manufacture of a wiring board advances according to. FIG. 3 is a diagram showing a method for manufacturing a wiring board according to the first embodiment of the present invention, wherein each step of manufacturing the wiring board after the step (H) of FIG. It is a figure shown as a top view, and is a figure which shows the condition where manufacture of a wiring board advances as it progresses from (A) to (C). It is a figure which shows the manufacturing method of the wiring board which concerns on the 2nd Embodiment of this invention, and is a figure which shows each process as a work piece of a wiring board and a longitudinal cross-sectional view of a wiring board, and progresses from (A) to (H) It is a figure which shows the condition where manufacture of a wiring board advances according to. It is a figure which shows the manufacturing method of the wiring board which concerns on the 2nd Embodiment of this invention, and each process of the manufacturing of the wiring board after the process of (H) of FIG. It is a figure shown as a top view, and is a figure which shows the condition where manufacture of a wiring board advances as it progresses from (A) to (E).

Explanation of symbols

1,1A Wiring board 2 Metal plate 3 Adhesive layer 4 Support 5 Protrusion 7 Prepreg (insulator)
8 Copper foil 9, 9A, 9B Fixed object 11 Wiring layer (front side wiring layer)
11A Wiring layer (Back side wiring layer)
12 Copper powder layer (part of conductive layer, conductive powder)
13 Electrolytic copper plating layer (part of conductive layer)

Claims (11)

A fixing step of fixing the metal plate and the support that supports the metal plate via an adhesive layer having adhesiveness;
A convex portion forming step in which a part of the metal plate is removed to form a concave portion where the metal plate is not connected, and the remaining portion of the metal plate is a convex portion;
A filling step of filling all or part of the concave portion with an insulating material to form a fixed material in which the convex portion and the insulating material are fixed;
A wiring layer forming step of forming a wiring layer on the fixed matter;
A peeling step of removing the adhesive layer and the support from the fixed matter;
A method for producing a wiring board, comprising: The wiring layer forming step includes
2. The method of manufacturing a wiring board according to claim 1, further comprising a front side wiring layer forming step of forming a front side wiring layer on a surface opposite to the surface facing the adhesive layer of the fixed matter.   2. The wiring layer forming step includes a step of placing a copper foil on the insulator or the fixed object, and fixing the copper foil to the convex portion and the fixed object with a press. Or the manufacturing method of the wiring board of 2. The wiring layer forming step includes
A powder deposition step of depositing powder on the exposed adhesive layer after the convex portion forming step and before the filling step;
After the peeling step, a roughening step of removing the powder and roughening the surface of the fixed object,
A plating step of forming an electroless plating layer on the surface of the roughened insulator;
Removing a part of the electroless plating layer, and using the remaining electroless plating layer, a back side wiring layer forming step of forming a back side wiring layer on the side of the fixed object facing the adhesive layer;
The method for producing a wiring board according to claim 1, wherein: The wiring layer forming step includes
A conductive layer forming step of forming a conductive layer on the exposed adhesive layer after the convex portion forming step and before the filling step;
After the peeling step, a part of the exposed conductive layer is removed, and a back side wiring layer forming step is formed using the remaining conductive layer to form a back side wiring layer on the side of the fixed object facing the adhesive layer. When,
The method for producing a wiring board according to claim 1, wherein:   6. The method of manufacturing a wiring board according to claim 5, wherein the conductive layer forming step includes a step of depositing conductive powder on the adhesive layer. On the side of the metal plate facing the adhesive layer, a conductive resist layer that is not removed when removing a part of the metal plate is provided.
A conductive layer forming step of forming a conductive layer by electrolytic plating on the exposed resist layer after the convex portion forming step and before the filling step;
After the peeling step, the exposed resist layer is removed, a part of the conductive layer is further removed, and a backside wiring layer is formed on the surface of the fixed object facing the adhesive layer using the remaining conductive layer. Forming a backside wiring layer,
The method for producing a wiring board according to claim 1, wherein:   The method for manufacturing a wiring board according to claim 1, wherein the wiring layer and the convex portion are in contact with each other.   The method for manufacturing a wiring board according to claim 1, wherein a plurality of the wiring layers are formed, and the plurality of wiring layers are connected by the convex portions. The adhesive layer includes a base material and adhesive first and second adhesive layers formed on both surfaces of the base material,
The adhesive force of the second adhesive layer facing the support is stronger than the adhesive force of the first adhesive layer on the opposite side across the base material. The manufacturing method of the wiring board of Claim 1.   The method for manufacturing a wiring board according to any one of claims 1 to 10, wherein the adhesive layer and the support are used repeatedly.

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