JP2011076087A5 - - Google Patents

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Publication number
JP2011076087A5
JP2011076087A5 JP2010214346A JP2010214346A JP2011076087A5 JP 2011076087 A5 JP2011076087 A5 JP 2011076087A5 JP 2010214346 A JP2010214346 A JP 2010214346A JP 2010214346 A JP2010214346 A JP 2010214346A JP 2011076087 A5 JP2011076087 A5 JP 2011076087A5
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JP
Japan
Prior art keywords
openings
photosensors
photosensor
photosensitive chip
opening
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JP2010214346A
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English (en)
Japanese (ja)
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JP5612416B2 (ja
JP2011076087A (ja
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Priority claimed from US12/569,596 external-priority patent/US7990528B2/en
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Publication of JP2011076087A publication Critical patent/JP2011076087A/ja
Publication of JP2011076087A5 publication Critical patent/JP2011076087A5/ja
Application granted granted Critical
Publication of JP5612416B2 publication Critical patent/JP5612416B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010214346A 2009-09-29 2010-09-24 材料のシートのエッジを検出するための方法 Expired - Fee Related JP5612416B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/569,596 2009-09-29
US12/569,596 US7990528B2 (en) 2009-09-29 2009-09-29 High resolution linear image sensing using multi-row low resolution image sensor

Publications (3)

Publication Number Publication Date
JP2011076087A JP2011076087A (ja) 2011-04-14
JP2011076087A5 true JP2011076087A5 (enExample) 2013-10-10
JP5612416B2 JP5612416B2 (ja) 2014-10-22

Family

ID=43780031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010214346A Expired - Fee Related JP5612416B2 (ja) 2009-09-29 2010-09-24 材料のシートのエッジを検出するための方法

Country Status (2)

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US (1) US7990528B2 (enExample)
JP (1) JP5612416B2 (enExample)

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US20110220624A1 (en) * 2010-03-10 2011-09-15 Marketech International Corp. Method for use of a device for cutting the peripheral isolation lines of solar panels
KR102196929B1 (ko) * 2013-11-26 2020-12-30 엘지전자 주식회사 태양 전지 모듈 및 이에 사용되는 후면 기판
US11025796B2 (en) 2019-01-14 2021-06-01 Xerox Corporation Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays
US10943895B2 (en) 2019-01-14 2021-03-09 Xerox Corporation Method of fabricating a plurality of linear arrays with submicron y-axis alignment
CN114783310B (zh) * 2022-04-18 2024-04-09 武汉精立电子技术有限公司 一种用于立方体三色合光棱镜与微显示屏贴合的贴合机构、方法和系统

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US4172664A (en) * 1977-12-30 1979-10-30 International Business Machines Corporation High precision pattern registration and overlay measurement system and process
JPS5672575A (en) * 1979-11-19 1981-06-16 Toshiba Corp Picture input unit
JPS5698968A (en) * 1980-01-10 1981-08-08 Toshiba Corp Picture input device
US4735495A (en) * 1986-12-12 1988-04-05 General Electric Co. Light source for liquid crystal display panels utilizing internally reflecting light pipes and integrating sphere
JPS63193678A (ja) * 1987-02-05 1988-08-10 Fujitsu Ltd 二次元固体撮像装置
JPH0790945B2 (ja) * 1987-03-30 1995-10-04 凸版印刷株式会社 折不良検査装置
US4767933A (en) * 1987-07-21 1988-08-30 Storage Technology Corporation Optical ribbon edge sensor having means for adjusting the switch sensitivity to the selected ink color
JPH0427264A (ja) * 1990-05-22 1992-01-30 Nidek Co Ltd イメージセンサ
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JPH05155515A (ja) * 1991-12-02 1993-06-22 Ishida Scales Mfg Co Ltd 長尺フィルムのエッヂ検出装置
US5221976A (en) * 1991-05-03 1993-06-22 Xerox Corporation Hybrid slow scan resolution conversion
JP3400485B2 (ja) * 1993-03-23 2003-04-28 株式会社ワコム 光学式位置検出装置および光学式座標入力装置
US5543838A (en) * 1993-08-31 1996-08-06 Xerox Corporation Signal multiplexing system for an image sensor array
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