JP2014532172A5 - - Google Patents
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- Publication number
- JP2014532172A5 JP2014532172A5 JP2014532060A JP2014532060A JP2014532172A5 JP 2014532172 A5 JP2014532172 A5 JP 2014532172A5 JP 2014532060 A JP2014532060 A JP 2014532060A JP 2014532060 A JP2014532060 A JP 2014532060A JP 2014532172 A5 JP2014532172 A5 JP 2014532172A5
- Authority
- JP
- Japan
- Prior art keywords
- finger sensing
- finger
- sensing device
- semiconductor
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/244,559 | 2011-09-25 | ||
| US13/244,559 US8836478B2 (en) | 2011-09-25 | 2011-09-25 | Electronic device including finger sensor and related methods |
| PCT/US2012/056804 WO2013044198A1 (en) | 2011-09-25 | 2012-09-24 | Electronic device including finger sensor and related methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014532172A JP2014532172A (ja) | 2014-12-04 |
| JP2014532172A5 true JP2014532172A5 (enExample) | 2015-10-29 |
Family
ID=47073511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014532060A Pending JP2014532172A (ja) | 2011-09-25 | 2012-09-24 | 指センサを含む電子デバイス及び関連方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8836478B2 (enExample) |
| EP (1) | EP2758914A1 (enExample) |
| JP (1) | JP2014532172A (enExample) |
| KR (1) | KR101763994B1 (enExample) |
| CN (1) | CN103827890B (enExample) |
| AU (1) | AU2012312082B2 (enExample) |
| WO (1) | WO2013044198A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101160681B1 (ko) | 2011-10-19 | 2012-06-28 | 배경덕 | 이동 통신 단말기의 활성화 시에 특정 동작이 수행되도록 하기 위한 방법, 이동 통신 단말기 및 컴퓨터 판독 가능 기록 매체 |
| US9489559B2 (en) * | 2014-05-28 | 2016-11-08 | Fingerprint Cards Ab | Electronic device with fingerprint sensing system and conducting housing |
| US9576177B2 (en) * | 2014-12-11 | 2017-02-21 | Fingerprint Cards Ab | Fingerprint sensing device |
| CN104915652A (zh) * | 2015-06-09 | 2015-09-16 | 迪安杰科技无锡有限公司 | 指纹图像的修复方法和装置 |
| TWI602129B (zh) * | 2015-09-17 | 2017-10-11 | 速博思股份有限公司 | 多指指紋辨識裝置、具有多指指紋辨識功能之電子裝置及其操作方法 |
| CN111699490B (zh) | 2018-02-16 | 2023-11-24 | 指纹卡安娜卡敦知识产权有限公司 | 用于电子装置的认证方法 |
| TWI712910B (zh) * | 2018-04-26 | 2020-12-11 | 仁寶電腦工業股份有限公司 | 具有指紋驗證功能的電子裝置及其操作方法 |
| JP6600829B1 (ja) * | 2018-11-25 | 2019-11-06 | 株式会社テクノグローバル | 指紋センサモジュール |
| FR3095285B1 (fr) * | 2019-04-19 | 2022-11-11 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2985484B2 (ja) * | 1992-03-19 | 1999-11-29 | 株式会社日立製作所 | 半導体装置とその製造方法 |
| US4814296A (en) * | 1987-08-28 | 1989-03-21 | Xerox Corporation | Method of fabricating image sensor dies for use in assembling arrays |
| US5491303A (en) | 1994-03-21 | 1996-02-13 | Motorola, Inc. | Surface mount interposer |
| US5907627A (en) * | 1995-11-06 | 1999-05-25 | Dew Engineering And Development Limited | Contact imaging device |
| US6114862A (en) * | 1996-02-14 | 2000-09-05 | Stmicroelectronics, Inc. | Capacitive distance sensor |
| US5778089A (en) | 1996-03-04 | 1998-07-07 | Dew Engineering And Development Limited | Driver circuit for a contact imaging array |
| FR2749955B1 (fr) | 1996-06-14 | 1998-09-11 | Thomson Csf | Systeme de lecture d'empreintes digitales |
| US5953441A (en) | 1997-05-16 | 1999-09-14 | Harris Corporation | Fingerprint sensor having spoof reduction features and related methods |
| JP4379939B2 (ja) * | 1999-01-27 | 2009-12-09 | ソニー株式会社 | 指紋画像取得装置及び指紋照合装置 |
| US6333989B1 (en) | 1999-03-29 | 2001-12-25 | Dew Engineering And Development Limited | Contact imaging device |
| US6414384B1 (en) * | 2000-12-22 | 2002-07-02 | Silicon Precision Industries Co., Ltd. | Package structure stacking chips on front surface and back surface of substrate |
| AT413939B (de) | 2001-06-11 | 2006-07-15 | Siemens Ag Oesterreich | Sensor, insbesondere fingerabdrucksensor |
| US6927581B2 (en) | 2001-11-27 | 2005-08-09 | Upek, Inc. | Sensing element arrangement for a fingerprint sensor |
| US6653723B2 (en) * | 2002-03-09 | 2003-11-25 | Fujitsu Limited | System for providing an open-cavity low profile encapsulated semiconductor package |
| JP4160851B2 (ja) | 2003-03-31 | 2008-10-08 | 富士通株式会社 | 指紋認識用半導体装置 |
| JP2004319678A (ja) * | 2003-04-15 | 2004-11-11 | Fujitsu Ltd | 指紋センサ装置及びその製造方法 |
| US7915601B2 (en) | 2003-09-05 | 2011-03-29 | Authentec, Inc. | Electronic device including optical dispersion finger sensor and associated methods |
| US7028893B2 (en) | 2003-12-17 | 2006-04-18 | Motorola, Inc. | Fingerprint based smartcard |
| JP2005198843A (ja) * | 2004-01-15 | 2005-07-28 | Mitsumi Electric Co Ltd | 画像検出装置 |
| US8229184B2 (en) * | 2004-04-16 | 2012-07-24 | Validity Sensors, Inc. | Method and algorithm for accurate finger motion tracking |
| US8358815B2 (en) | 2004-04-16 | 2013-01-22 | Validity Sensors, Inc. | Method and apparatus for two-dimensional finger motion tracking and control |
| JP4441927B2 (ja) * | 2004-10-12 | 2010-03-31 | セイコーエプソン株式会社 | 静電容量検出装置 |
| TWI251886B (en) * | 2004-11-03 | 2006-03-21 | Advanced Semiconductor Eng | Sensor chip for defining molding exposed region and method for manufacturing the same |
| JP4731191B2 (ja) | 2005-03-28 | 2011-07-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP4881387B2 (ja) * | 2005-10-18 | 2012-02-22 | オーセンテック,インコーポレイテッド | フレキシブル回路を備えた指センサおよびそれに関連する方法 |
| US20080069412A1 (en) | 2006-09-15 | 2008-03-20 | Champagne Katrina S | Contoured biometric sensor |
| US7417310B2 (en) * | 2006-11-02 | 2008-08-26 | Entorian Technologies, Lp | Circuit module having force resistant construction |
| CN101517612B (zh) * | 2007-01-24 | 2012-05-30 | 富士通株式会社 | 图像读取装置和图像读取方法 |
| US8161299B2 (en) * | 2007-12-20 | 2012-04-17 | Intel Corporation | Location based policy system and method for changing computing environments |
| US8073204B2 (en) * | 2007-12-31 | 2011-12-06 | Authentec, Inc. | Hybrid multi-sensor biometric identification device |
| JP2010131180A (ja) * | 2008-12-04 | 2010-06-17 | Hitachi Maxell Ltd | 生体情報取得装置及び生体認証装置 |
| US8618910B2 (en) * | 2009-08-07 | 2013-12-31 | Authentec, Inc. | Finger biometric sensor including laterally adjacent piezoelectric transducer layer and associated methods |
| JP5367523B2 (ja) * | 2009-09-25 | 2013-12-11 | 新光電気工業株式会社 | 配線基板及び配線基板の製造方法 |
-
2011
- 2011-09-25 US US13/244,559 patent/US8836478B2/en not_active Expired - Fee Related
-
2012
- 2012-09-24 WO PCT/US2012/056804 patent/WO2013044198A1/en not_active Ceased
- 2012-09-24 CN CN201280046343.0A patent/CN103827890B/zh not_active Expired - Fee Related
- 2012-09-24 KR KR1020147008868A patent/KR101763994B1/ko not_active Expired - Fee Related
- 2012-09-24 AU AU2012312082A patent/AU2012312082B2/en not_active Ceased
- 2012-09-24 EP EP12777978.3A patent/EP2758914A1/en not_active Withdrawn
- 2012-09-24 JP JP2014532060A patent/JP2014532172A/ja active Pending
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