KR101763994B1 - 손가락 센서를 포함하는 전자 장치 및 관련 방법들 - Google Patents

손가락 센서를 포함하는 전자 장치 및 관련 방법들 Download PDF

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Publication number
KR101763994B1
KR101763994B1 KR1020147008868A KR20147008868A KR101763994B1 KR 101763994 B1 KR101763994 B1 KR 101763994B1 KR 1020147008868 A KR1020147008868 A KR 1020147008868A KR 20147008868 A KR20147008868 A KR 20147008868A KR 101763994 B1 KR101763994 B1 KR 101763994B1
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South Korea
Prior art keywords
semiconductor
finger sensing
finger
pixels
dies
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Expired - Fee Related
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KR1020147008868A
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English (en)
Korean (ko)
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KR20140053408A (ko
Inventor
로버트 에이치. 본드
지오반니 고치니
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애플 인크.
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
KR1020147008868A 2011-09-25 2012-09-24 손가락 센서를 포함하는 전자 장치 및 관련 방법들 Expired - Fee Related KR101763994B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/244,559 US8836478B2 (en) 2011-09-25 2011-09-25 Electronic device including finger sensor and related methods
US13/244,559 2011-09-25
PCT/US2012/056804 WO2013044198A1 (en) 2011-09-25 2012-09-24 Electronic device including finger sensor and related methods

Publications (2)

Publication Number Publication Date
KR20140053408A KR20140053408A (ko) 2014-05-07
KR101763994B1 true KR101763994B1 (ko) 2017-08-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147008868A Expired - Fee Related KR101763994B1 (ko) 2011-09-25 2012-09-24 손가락 센서를 포함하는 전자 장치 및 관련 방법들

Country Status (7)

Country Link
US (1) US8836478B2 (enExample)
EP (1) EP2758914A1 (enExample)
JP (1) JP2014532172A (enExample)
KR (1) KR101763994B1 (enExample)
CN (1) CN103827890B (enExample)
AU (1) AU2012312082B2 (enExample)
WO (1) WO2013044198A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101160681B1 (ko) 2011-10-19 2012-06-28 배경덕 이동 통신 단말기의 활성화 시에 특정 동작이 수행되도록 하기 위한 방법, 이동 통신 단말기 및 컴퓨터 판독 가능 기록 매체
US9489559B2 (en) * 2014-05-28 2016-11-08 Fingerprint Cards Ab Electronic device with fingerprint sensing system and conducting housing
US9576177B2 (en) * 2014-12-11 2017-02-21 Fingerprint Cards Ab Fingerprint sensing device
CN104915652A (zh) * 2015-06-09 2015-09-16 迪安杰科技无锡有限公司 指纹图像的修复方法和装置
TWI602129B (zh) * 2015-09-17 2017-10-11 速博思股份有限公司 多指指紋辨識裝置、具有多指指紋辨識功能之電子裝置及其操作方法
CN111699490B (zh) 2018-02-16 2023-11-24 指纹卡安娜卡敦知识产权有限公司 用于电子装置的认证方法
US20190332845A1 (en) * 2018-04-26 2019-10-31 Compal Electronics, Inc. Electronic device with fingerprint verification function and operation method thereof
JP6600829B1 (ja) * 2018-11-25 2019-11-06 株式会社テクノグローバル 指紋センサモジュール
FR3095285B1 (fr) * 2019-04-19 2022-11-11 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module

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JP2000513839A (ja) * 1995-11-06 2000-10-17 デュー・エンジニアリング・アンド・デヴェロップメント・リミテッド 接触撮像装置

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JP4379939B2 (ja) * 1999-01-27 2009-12-09 ソニー株式会社 指紋画像取得装置及び指紋照合装置
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Also Published As

Publication number Publication date
CN103827890B (zh) 2017-07-28
KR20140053408A (ko) 2014-05-07
WO2013044198A1 (en) 2013-03-28
US8836478B2 (en) 2014-09-16
CN103827890A (zh) 2014-05-28
US20130076486A1 (en) 2013-03-28
AU2012312082B2 (en) 2015-10-22
JP2014532172A (ja) 2014-12-04
EP2758914A1 (en) 2014-07-30

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