JP2011076086A - 導波路結合された表面プラズモンポラリトン光検出器 - Google Patents
導波路結合された表面プラズモンポラリトン光検出器 Download PDFInfo
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- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 13
- 230000010287 polarization Effects 0.000 claims description 15
- 238000005253 cladding Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 229910052732 germanium Inorganic materials 0.000 claims description 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000000969 carrier Substances 0.000 abstract description 5
- 230000031700 light absorption Effects 0.000 abstract description 2
- 230000004044 response Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1226—Basic optical elements, e.g. light-guiding paths involving surface plasmon interaction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/105—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the PIN type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/10—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier
- H01L31/108—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the Schottky type
- H01L31/1085—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier the potential barrier being of the Schottky type the devices being of the Metal-Semiconductor-Metal [MSM] Schottky barrier type
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Abstract
導波路に結合された表面プラズモンポラリトン光検出器を提供する。
【解決手段】
金属−半導体−金属(MSM)デバイスは、導波路内の光モードからの光を、当該MSMデバイスの電極表面の表面プラズモンポラリトン(SPP)モードに結合する。SPPモードにおいては、半導体内での光の吸収は、非常に小さい領域で発生することができる。これは、活性な検出器領域の縮小を可能にし、電気的なキャリアに関して低容量(キャパシタンス)で非常に短い移送距離を可能にし、非常に低電圧なデバイス及び/又は非常に高い周波数を可能にし得る。
【選択図】 図1
Description
102 クラッド
104、106 金属電極
108 半導体層
200 光
500 導波路
502 検出器
504 底部電極
506 頂部電極
508 ゲルマニウム層
Claims (17)
- 導波路モードにて光信号を運ぶ導波路;
金属−半導体−金属(MSM)光検出器であり:
第1の電極;
第2の電極;及び
前記第1の電極と前記第2の電極との間に挟まれた半導体材料;
を有するMSM光検出器;
を有し、
前記MSM光検出器は、前記光信号を導波路モードから表面プラズモンポラリトン(SPP)モードへと変換する、
装置。 - 前記半導体材料はゲルマニウム(Ge)を有する、請求項1に記載の装置。
- 前記第1の電極及び前記第2の電極は銅(Cu)を有する、請求項2に記載の装置。
- 前記導波路は窒化シリコンを有する、請求項1に記載の装置。
- 前記導波路より低い屈折率を有するクラッド、を更に有する請求項4に記載の装置。
- 前記光検出器は偏光に対して感度を有する、請求項1に記載の装置。
- 前記光検出器は前記光信号の偏光に基づいて光論理信号を検出する、請求項6に記載の装置。
- 前記導波路及び前記光検出器は隣り合って配置される、請求項1に記載の装置。
- 前記光検出器は前記導波路の上方に積み重ねられている、請求項1に記載の装置。
- 導波路に光信号を入射するステップであり、該光信号は導波路モードにあるステップ;
金属−半導体−金属(MSM)デバイスの近傍で前記導波路を経路付けるステップ;及び
前記光信号を検出する前記MSMデバイスを用いて、前記光信号を導波路モードから表面プラズモンポラリトン(SPP)モードへと変換するステップ;
を有する、光信号を検出する方法。 - 半導体層を間に備えた第1の電極及び第2の電極から前記MSMデバイスを形成するステップ、を更に有する請求項10に記載の方法。
- 前記半導体層はゲルマニウム(Ge)を有する、請求項11に記載の方法。
- 前記第1の電極及び前記第2の電極は銅(Cu)を有する、請求項12に記載の方法。
- 前記MSMデバイスは偏光に対して感度を有する、請求項10に記載の方法。
- 窒化シリコンから前記導波路を形成するステップ、を更に有する請求項14に記載の方法。
- 前記窒化シリコンより低い屈折率を有するクラッドで前記導波路を囲むステップ、を更に有する請求項15に記載の方法。
- 前記MSMデバイスを用いて、前記光信号の偏光に基づいて光論理信号を検出するステップ、を更に有する請求項14に記載の方法。
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US12/571,128 US8417070B2 (en) | 2009-09-30 | 2009-09-30 | Waveguide coupled surface plasmon polarition photo detector |
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JP2014120373A Division JP2014160881A (ja) | 2009-09-30 | 2014-06-11 | 導波路結合された表面プラズモンポラリトン光検出器 |
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JP2010206463A Pending JP2011076086A (ja) | 2009-09-30 | 2010-09-15 | 導波路結合された表面プラズモンポラリトン光検出器 |
JP2014120373A Pending JP2014160881A (ja) | 2009-09-30 | 2014-06-11 | 導波路結合された表面プラズモンポラリトン光検出器 |
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JP (2) | JP2011076086A (ja) |
CN (1) | CN102032945A (ja) |
DE (1) | DE102010045195B4 (ja) |
Cited By (3)
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JP2014160881A (ja) * | 2009-09-30 | 2014-09-04 | Intel Corp | 導波路結合された表面プラズモンポラリトン光検出器 |
JP2017032901A (ja) * | 2015-08-05 | 2017-02-09 | 富士通オプティカルコンポーネンツ株式会社 | 光通信装置、及び、光モジュール |
KR20220101133A (ko) * | 2020-01-14 | 2022-07-19 | 김훈 | 플라즈모닉 전계증강 포토디텍터 및 이미지센서 |
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FR2953607B1 (fr) * | 2009-12-09 | 2012-05-18 | Commissariat Energie Atomique | Dispositif de couplage d'une onde electromagnetique entre un guide d'onde et un guide metallique a fente, procede de fabrication dudit dispositif |
US8829633B2 (en) | 2012-05-03 | 2014-09-09 | The Board Of Trustees Of The Leland Stanford Junior University | Self-aligned semiconductor ridges in metallic slits as a platform for planar tunable nanoscale resonant photodetectors |
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JP6470122B2 (ja) * | 2015-06-17 | 2019-02-13 | 日本電信電話株式会社 | 光検出器 |
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CN106653930B (zh) * | 2016-09-13 | 2018-09-25 | 北京大学 | 基于半导体纳米材料的等离激元增强光电探测器及其制备方法 |
CN106784121B (zh) * | 2016-11-30 | 2018-09-14 | 天津大学 | 表面等离子激元光电探测器及其制备方法 |
KR102246017B1 (ko) * | 2017-04-11 | 2021-04-30 | 한국전자통신연구원 | 편광 조절기 |
CN109742183B (zh) * | 2018-11-29 | 2022-04-26 | 中国科学院微电子研究所 | 一种光电探测器及其制作方法 |
WO2020180630A1 (en) * | 2019-03-01 | 2020-09-10 | California Institute Of Technology | Waveguide integrated plasmon assisted field emission detector |
CN117289407A (zh) * | 2022-06-17 | 2023-12-26 | 苏州旭创科技有限公司 | 光芯片以及光模块 |
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2009
- 2009-09-30 US US12/571,128 patent/US8417070B2/en not_active Expired - Fee Related
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- 2010-09-13 DE DE102010045195.9A patent/DE102010045195B4/de active Active
- 2010-09-15 JP JP2010206463A patent/JP2011076086A/ja active Pending
- 2010-09-25 CN CN2010105068784A patent/CN102032945A/zh active Pending
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- 2013-04-03 US US13/856,063 patent/US9063254B2/en not_active Expired - Fee Related
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- 2014-06-11 JP JP2014120373A patent/JP2014160881A/ja active Pending
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WO2007105593A1 (ja) * | 2006-03-13 | 2007-09-20 | Nec Corporation | フォトダイオード、およびその製造方法、ならびに光通信デバイスおよび光インタコネクションモジュール |
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JP2014160881A (ja) * | 2009-09-30 | 2014-09-04 | Intel Corp | 導波路結合された表面プラズモンポラリトン光検出器 |
JP2017032901A (ja) * | 2015-08-05 | 2017-02-09 | 富士通オプティカルコンポーネンツ株式会社 | 光通信装置、及び、光モジュール |
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KR102668936B1 (ko) | 2020-01-14 | 2024-05-23 | 김훈 | 플라즈모닉 전계증강 포토디텍터 및 이미지센서 |
Also Published As
Publication number | Publication date |
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DE102010045195B4 (de) | 2016-10-27 |
US20130287333A1 (en) | 2013-10-31 |
US9063254B2 (en) | 2015-06-23 |
CN102032945A (zh) | 2011-04-27 |
JP2014160881A (ja) | 2014-09-04 |
US20110075962A1 (en) | 2011-03-31 |
US8417070B2 (en) | 2013-04-09 |
DE102010045195A1 (de) | 2011-04-28 |
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